CN108429825A

CN108429825A - Electronic building brick and electronic equipment

Info

Publication number: CN108429825A
Application number: CN201810153322.8A
Authority: CN
Inventors: 王世超
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-02-14
Filing date: 2018-02-14
Publication date: 2018-08-21
Anticipated expiration: 2038-02-14
Also published as: CN108429825B

Abstract

The embodiment of the present application provides a kind of electronic building brick, including sensor, flexible PCB, sealing element, receiver and radiating subassembly, flexible PCB includes the first face and the second face being disposed opposite to each other, sensor is set on the first face of flexible PCB, the sealed part of receiver is set on the second face of flexible PCB, sealing element has the inner cavity for the vibration section for being connected to receiver, flexible PCB opens up called hole, the vibration section of receiver to the channel between the called hole of flexible PCB forms the sound channel of the voice signal of output receiver, radiating subassembly is located on the side of sealing element.Electronic building brick provided by the embodiments of the present application is located on the side of sealing element by radiating subassembly, can effectively radiate the heat in stack assemblies outward, reliability is preferable.In addition, the embodiment of the present application also provides a kind of electronic equipment.

Description

Electronic building brick and electronic equipment

Technical field

This application involves a kind of electronic equipment field more particularly to a kind of electronic building bricks and electronic equipment.

Background technology

With the development increasingly of electronic device technology, the demand to mobile phone is lightening is higher and higher.The prior art, mobile phone etc. In order to realize that more and more functions, interior of mobile phone integrate more and more devices, the position between each device in electronic equipment The relationship of setting becomes increasingly complex, and with also increasing to the lightening influence of mobile phone, is unfavorable for the appearance design of mobile phone.

Invention content

This application provides a kind of electronic building brick and electronic equipments.

The embodiment of the present application provides a kind of electronic building brick, including sensor, flexible PCB, sealing element, receiver and Radiating subassembly, the flexible PCB include the first face and the second face being disposed opposite to each other, and the sensor is set to the flexibility On first face of circuit board, the receiver is set to through the sealing element on the second face of the flexible PCB, described close There is sealing the inner cavity for the vibration section for being connected to the receiver, the flexible PCB to open up called hole, the receiver The sound that vibration section to the channel between the called hole of the flexible PCB forms the voice signal for exporting the receiver is logical Road, the radiating subassembly are located on the side of the sealing element, and the radiating subassembly is outside to the heat that will be transmitted to itself Radiation.

On the other hand, the embodiment of the present application also provides a kind of electronic equipment, including center and electronic building brick, the heat dissipations Component will be transmitted to the heat of itself and be externally radiated on the center.

Electronic building brick and electronic equipment provided by the embodiments of the present application are in by making sensor, flexible PCB and receiver Stacked forms stack assemblies, the stack assemblies be capable of the X of limited saving electronic building brick and electronic equipment to size, and dissipate Hot component is located on the side of sealing element, can effectively radiate the heat in stack assemblies outward, reliability is preferable.

Description of the drawings

In order to illustrate more clearly of the technical solution of the application, attached drawing needed in embodiment will be made below Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the application, general for this field For logical technical staff, without having to pay creative labor, other drawings may also be obtained based on these drawings.

Fig. 1 is the schematic diagram of a kind of electronic equipment provided by the embodiments of the present application；

Fig. 2 is the schematic diagram of the electronic building brick of electronic equipment shown in FIG. 1；

Fig. 3 is a kind of schematic diagram of electronic building brick shown in Fig. 2；

Fig. 4 is the decomposition diagram of sealing element shown in Fig. 3；

Fig. 5 is the vertical view of the radiating subassembly in Fig. 2；

Fig. 6 is the schematic diagram of another radiating subassembly in Fig. 1；

Fig. 7 is the schematic diagram of another angle of the radiating subassembly in Fig. 5；

Fig. 8 is the sectional view of the radiating subassembly in Fig. 7；

Fig. 9 is a kind of sectional view of inner cavity surface of the foam in Fig. 5；

Figure 10 is the sectional view of another inner cavity surface of the foam in Fig. 5；

Figure 11 is the schematic diagram of the sensor of electronic building brick shown in Fig. 2 and the relativeness of receiver；

Figure 12 is the schematic diagram of the sensor of the electronic building brick in other embodiments and another relativeness of receiver；

Figure 13 is the schematic diagram of the sensor of the electronic building brick in other embodiments and another relativeness of receiver；

Figure 14 is the schematic diagram in the called hole of electronic building brick shown in Fig. 2 and the relativeness of vibration section；

Figure 15 is the schematic diagram in the called hole of the electronic building brick in other embodiments and another relativeness of vibration section；

Figure 16 is the sensor and the non-schematic diagram arranged side by side of receiver of the electronic building brick in other embodiments；

Figure 17 is the schematic diagram that electronic equipment has center；

Figure 18 is decomposition diagram of the electronic equipment in Figure 17 with center；

Figure 19 is the schematic diagram of the display module of electronic equipment shown in FIG. 1；

Figure 20 is the schematic diagram of the screen assembly of the display module of Figure 19

Specific implementation mode

Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear Chu is fully described by.

It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that the above objects, features, and advantages of the application Mode is applied the application is described in detail.It should be noted that in the absence of conflict, presently filed embodiment and reality The feature applied in mode can be combined with each other.

Many details are elaborated in the following description in order to fully understand the application, described embodiment Only a part of embodiment of the application, rather than whole embodiments.Based on the embodiment in the application, this field The every other embodiment that those of ordinary skill is obtained without making creative work belongs to the application guarantor The range of shield.

In addition, the explanation of following embodiment is referred to the additional illustration, to illustrate the spy that the application can be used to implement Determine embodiment.The direction term being previously mentioned in the application, for example, " length ", " width ", " thickness " etc., are only to refer to appended drawings The direction of formula, therefore, the direction term used be in order to it is more preferable, be illustrated more clearly that and understand the application, rather than indicate or It implies signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as Limitation to the application.Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, Can also be detachably connected, or be integrally connected for example, it may be being fixedly connected；It can be mechanical connection；Can be It is connected directly, can also can be indirectly connected through an intermediary the connection inside two elements.For the common of this field For technical staff, it can understand that the tool of above-mentioned term in the present invention illustrates body meaning with concrete condition.

Fig. 1 is please referred to, Fig. 1 is the first visual angle schematic diagram of electronic equipment 100.Electronic equipment 100 includes electronic building brick 1. Electronic building brick 1 is contained in the inside of electronic equipment 100, to realize the functions such as called of electronic equipment 100.The electronic equipment 100 can be any equipment for having electronic building brick, such as：Tablet computer, mobile phone, camera, personal computer, notebook electricity The smart machines such as brain, mobile unit, wearable device.Wherein, for ease of description, the first visual angle is in electronic equipment 100 For with reference to being defined, the width direction of electronic equipment 100 be defined as X to, the length direction of electronic equipment 100 is defined as Y-direction, The thickness direction of electronic equipment is defined as Z-direction.

Referring to Fig.1 and 2, electronic building brick 1 includes sensor 11, receiver 13, sealing element 14,12 and of flexible PCB Radiating subassembly 15, the flexible PCB 12 include that the first face 121 being disposed opposite to each other and the second face 122, the sensor 11 are set It is placed on the first face 121 of the flexible PCB 12, the receiver 13 is set to the flexible electrical through the sealing element 14 On second face 122 of road plate 12, the sealing element 14 has the inner cavity for the vibration section 132 for being connected to the receiver 13, described Flexible PCB 12 opens up called hole 123, vibration section 132 to the called hole of the flexible PCB 12 of the receiver 13 Channel between 123 forms the sound channel 131 for the voice signal for exporting the receiver 13, and the radiating subassembly 14 is located on The side of the sealing element 14, the radiating subassembly 14 is will be transmitted to the heat of itself to external radiation.

When the electronic building brick 1 of the structure is set in electronic equipment 100, sensor 11, flexible PCB 12 and receiver 13 stack along the Z-direction of electronic equipment 100 successively, save the X of electronic building brick 1 and electronic equipment 100 to size.And it dissipates Hot component 15 is located on the side of sealing element, can effectively radiate the heat in stack assemblies outward, avoid stacking Component makes heat concentrate and not distribute not go out because of more device stack, influences the service life of electronic building brick 1, reliability is preferable.

Please with reference to Fig. 2 and Fig. 3, the first face 121 and the second face 122 in flexible PCB 12 are respectively flexible circuit The plate face that plate 12 is disposed opposite to each other, plate face area is larger, can carry component.It is corresponding, the side of the plate face of flexible PCB 12 Edge be respectively then be disposed opposite to each other first in S1 and second S2, the third that is disposed opposite to each other S4, the third in S3 and the 4th While S3 and it is described 4th while S4 be connected to described first while S1 and it is described second while S2 between, the second side S2 is towards remote Direction from the first side S1 extends, so that the flexible PCB 12 and circuit board electrical connection.That is, flexible PCB 12 is big It causes to be in long rectangle.First in S1 and second S2 compared to third the S4 in S3 and the 4th, be flexible PCB 12 in it is shorter Side.That is, when flexible PCB 12 is set in electronic equipment 100, along the substantially elongated arrangement of the Y-direction of electronic equipment 100, In order to extend and circuit board electrical connection.

In one embodiment, as shown in Fig. 2, sensor 11 is set on the first face 121 of flexible PCB 12, and it is described Sensor 11 is electrically connected to the flexible PCB 12.

It should be understood that sensor 11 includes at least one of range sensor, light sensor or photoelectric sensor. In the present embodiment, sensor 11 is light sensor.Light sensor 11 is arranged close to the screen of electronic equipment 100, in order to The brightness of the screen of electronic equipment 100 is adjusted according to the light of 100 local environment of electronic equipment.What light sensor 11 incuded Medium is light, and electronic equipment 100 is simultaneously not required to especially to be drilled or be arranged special structure and comes through light, by electronic building brick Sensor 11 in 1 is set as light sensor 11, is stacked together in Z-direction with receiver 13, has advanced optimized electronic equipment 100 structure, be conducive to electronic equipment 100 X to direction.

In one embodiment, Fig. 2 is please referred to, 13 sealed part 14 of the receiver is set to the flexible PCB 12 On second face 122, the flexible PCB 12 opens up called hole 123, with the vibration section 132 of the receiver 13 to the flexibility Channel between the called hole 123 of circuit board 12 forms the sound channel 131 for the voice signal for exporting the receiver 13.

Wherein, the area in the second face 122 of flexible PCB 12 is slightly larger than the area of receiver 13, i.e., not because of flexible circuit Plate 12 oversized and occupy space excessive in electronic equipment 100, receiver 13 can also be made to be set to flexible PCB When on 12 the second face 122, receiver 13 is located at the of flexible PCB 12 in the region of the orthographic projection on flexible PCB 12 In region occupied by two faces 122, i.e., flexible PCB 12 entirely covers receiver 13.Certainly, in other embodiments, soft Property circuit board 12 size can also be much larger than receiver 13 area.

In one embodiment, Fig. 2 and Fig. 4 are please referred to, flexible PCB 12 to be sealingly connected on receiver 13 Sealing element 14 has the inner cavity 14a for the vibration section 132 for being connected to receiver 13, so that 12 sealed part 14 of flexible PCB is close After envelope is set on receiver 13, the voice signal on the vibration section 132 of receiver 13 can pass through the inner cavity of sealing element 14 14a, to be exported from the called hole 123 of flexible PCB 12.

Please refer to Fig. 2 and Fig. 4, sealing element 14 is hollow ring-type, be set to the second face 122 of flexible PCB 12 with by Between talking about device 13, and sealing element 14 just encloses the edge for the vibration section 132 for being connected to receiver 13, such flexible PCB 12 with It is receiver 13 that cavity is formed after receiver 13 is tightly connected, between the vibration section 132 and flexible PCB 12 of receiver 13 then Sound channel 131 a part, for the ease of the voice signal of receiver 13 is transferred to outside, on flexible PCB 12 Called hole 123 is opened up, which is connected to the chamber formed between the vibration section 132 of receiver 13 and flexible PCB 12 Body, to form sound channel 131.

After receiver 13 receives audio signal, the vibration of vibration section 132 of receiver 13 forms voice signal, voice signal Self-excited oscillation chamber is transferred to called hole 123, and outside is transferred to through called hole 123, you can realizes the called function of receiver 13.

The structure of sealing element 14 specifically can be as follows：

In a kind of optional embodiment, Fig. 4 is please referred to, the sealing element 14 includes foam 141 and glue-line 142, the bubble 141 hollow out of cotton forms the inner cavity 14a, and the glue-line 142 is respectively arranged on the two sides that the foam 141 is disposed opposite to each other, institute Sealing element 14 is stated to be adhered between the flexible PCB 12 and the receiver 13.

When electronic building brick 1 is installed in electronic equipment 100, since foam 141 has elasticity, electronic building brick 1 is in Z-direction Space can carry out adaptability adjusting, and its sealing performance is preferable as sealing element 14 for foam 141, the sound letter of receiver 13 It number is not easy to leak out from foam, influences the output of the voice signal of receiver 13.

Fig. 2 and Fig. 5 are please referred to, radiating subassembly 15 is located on sealing element 14, is radiated for electronic building brick 1.Wherein, by There is certain height in sealing element 14, radiating subassembly 15 is located on sealing element 14, then the height of sealing element 14 is utilized, Avoid additionally increasing electronic building brick 1 in the size of Z-direction.Also, flexible PCB 12 due to mainly carry sensor 11 and by Device 13 is talked about, the heat concentrated is larger, and radiating subassembly 15 is located on is sealedly connected on one by flexible PCB 12 and receiver 13 On the sealing element 14 risen, can a heat dissipation effectively be done to the heat on flexible PCB 12.

Radiating subassembly 15 is located on sealing element 14.It should be understood that radiating subassembly 15 can be cyclic structure, it is sheathed on The side of foam 141.The side for circularizing and being set to foam 141 it should be understood that radiating subassembly 15 can also arrange.

Specifically, radiating subassembly 15 is substantially annular in shape, there is in-between hollow out hollow-out parts 15a, radiating subassembly 15 to be sheathed on When on the foam 141 in sealing element 14, the hole wall of hollow-out parts 15a is close to the side of foam 141.

The structure of radiating subassembly includes but not limited to following embodiment：

In the present embodiment, Fig. 5 is please referred to, the radiating subassembly 15 includes radiating part 151 and is connected to the radiating part 151 Circumferential surface 151d at least one heat conducting pipe 152, the radiating part 151 is located on the side of the sealing element 14, it is described extremely One end of a few heat conducting pipe 152 extends away from the direction of the sealing element 14.Certainly, in other embodiments, described Radiating part is graphite annulus.Certainly, in other embodiments, Fig. 6 is please referred to, 14 side of the sealing element opens up multiple groove U, institute It includes the heat bulge that multiple circumferential surface ring-types along the sealing element 14 are arranged, a heat bulge to state radiating subassembly 15 It is embedded in a groove U of the sealing element, and the end of the heat bulge T is prolonged away from the direction of sealing element 14 It stretches.

The radiating subassembly 15 is made up of radiating part 151 and heat conducting pipe 152, can effectively will be close by radiating part 151 Heat absorption itself on sealing 14, flexible PCB 12 and receiver 13, then conduct to heat conducting pipe 152, and effectively by electronics The heat of component 1 conducts.

Specifically, please referring to Fig. 5, radiating part 151 is substantially annular in shape, and in-between hollow out has hollow-out parts 151a, radiating part 151 when being sheathed on the foam 141 in sealing element 14, and the hole wall of hollow-out parts 151a is close to the side of foam 141.

Fig. 5 is please referred to, radiating part 151 has the first bearing surface 151b being disposed opposite to each other and the second bearing surface 151c and connects The circumferential surface 151d being connected between the first bearing surface 151b and the second bearing surface 151c.

It should be understood that please referring to Fig. 2, the second face 122 of the first bearing surface 151b and flexible PCB 12 are in close contact, In order to which by the heat transfer on flexible PCB 12, to itself, the second bearing surface 151c is in close contact with receiver 13, so as to , to itself, heat is distributed conducive to radiating part 15 in by the heat transfer on receiver 13.

Further, Fig. 5 is please referred to, the circumferential surface 151d of the radiating part 151 is along the receiver 13 to the flexibility The perimeter in 12 direction of circuit board becomes larger.Specifically, the edge of the first bearing surface 151b and the flexible PCB 12 Edge it is concordant.

Specifically, please referring to Fig. 5, the peripheral surface of radiating part 151 is tapered.First bearing surface 151b of radiating part 151 will The region of 12 unsealed part 14 of flexible PCB covering all covers, to absorb the heat on flexible PCB 12 as far as possible Amount, to further increase the reliability of electronic building brick 1.

In the present embodiment, please refer to Fig. 5, one end of heat conducting pipe 152 is connected on radiating part 151, heat conducting pipe 152 it is another The direction away from electronic building brick 1 is held to extend, and the other end of heat conducting pipe 152 can connect with the other structures in electronic equipment Such as center or rear cover are touched, the conduction of radiating part 151 to the heat on itself is conducted to outside, to reduce on electronic building brick 1 Heat.

The process of the heat dissipation of the radiating subassembly 15 is：By radiating part 151 by sealing element 14, flexible PCB 12 and called Heat absorption itself on device 13, then conduct to heat conducting pipe 152, and effectively conduct the heat of electronic building brick 1.

Electronic building brick 1 and electronic equipment 100 provided by the embodiments of the present application are by making sensor 11,12 and of flexible PCB Receiver 13 forms stack assemblies in stacked, which is capable of the X of limited saving electronic building brick 1 and electronic equipment 100 To size, and radiating subassembly 15 is located on the side of sealing element 14, can be effectively outside by the heat in stack assemblies It radiate, reliability is preferable.

Further, Fig. 7 and Fig. 8 are please referred to, the radiating part 151 includes the elastic ring being sheathed on the sealing element 14 1511 and the becket 1512 that is sheathed in the elastic portion 1511, and there are one notch 1512a for tool on the becket 1512 With at least one emptiness avoiding hole 1512b, one heat conducting pipe 152 is connected to the elastic ring through an emptiness avoiding hole 1512b On 1511.

By the way that radiating part 151 is arranged to the structure that elastic ring 1511 and becket 1512 are compounded to form, elastic ring 1511 It can preferably be fixed on foam 141, the stabilization that radiating part 1511 is installed is ensured by the close contact with foam 141 Property.And elastic ring 1511 can carry out elastic deformation, and the suitability of installation is preferable, and becket 1512 is then rigid structure, It can play the role of support while heat dissipation.

Please refer to Fig. 7, be convexly equipped with heat conducting pipe 152 on elastic ring 1511, i.e., heat conducting pipe 152 and 1511 one of elastic ring at Type.Heat conducting pipe 152 is elastically deformable structure so that flexibility of the heat conducting pipe 152 when being extended is larger.

Please refer to Fig. 8, becket 1512 is due to notch 1512a, therefore becket 1512 is sheathed on elastic ring 1511 Afterwards, the size of 1512a can be adjusted relatively according to the size of elastic ring 1511, so that becket 1512 and elastic ring 1511 It is tightly fastened.

Empty avoiding mouth 1512b on becket 1512 is identical as the quantity of heat conducting pipe 152.Empty avoiding mouth 1512b be mainly used for by Heat conducting pipe 152 on elastic ring 1511 passes through.

It should be understood that the material of elastic ring 1511 is silica gel, heat conductivility is preferable.The material of becket 1512 is aluminium, Heat conductivility is preferable.

Further, Fig. 9 is please referred to, the inner cavity 14a of the foam 141 is wrapped in the region of the orthographic projection of the receiver 13 Region where vibration section 132 containing the receiver 13.That is opening the shaking more than receiver 13 of the inner cavity 14a of foam 141 The size in dynamic portion 132, ensure that the voice signal of vibration section 132 can be all by the inner cavity 14a of foam 141.Certainly, at it In its embodiment, the inner cavity 14a of foam 141 can also be with the receiver 13 in the region of the orthographic projection of the receiver 13 Region overlapping where vibration section 132.

Optionally, Fig. 9 is please referred to, the foam 141 has inner cavity surface 141a, the inner cavity surface 141a described around being formed Inner cavity 14a, the inner cavity surface 14a are the conical surface.That is the inner cavity surface 14a of foam 141 is the conical surface, and the foam 141 has opposite to each other The first opening 1411 being arranged and the second opening 1412, first opening 1411 is close to the receiver 13, the inner cavity surface The bore of 14a gradually increases along the direction of first opening 1411 to second opening 1412.The foam of such structure 141 have the function of amplifying, and enable to the voice signal of receiver 13 from the first opening 1411 to second opening 1412 When, voice signal expands because of the influence of the inner cavity surface 141a of the taper of foam 141, and the voice signal after expansion passes through flexibility again Called hole 123 on circuit board 12 exports.

Optionally, Figure 10 is please referred to, the foam 141 surround with inner cavity surface 141b, the inner cavity surface 141b and forms institute Inner cavity is stated, the inner cavity surface 141b is curved surface.The inner cavity surface 141b has the circles of sequentially connected first arc section q1 and second It is the inner cavity surface that the junction of segmental arc q2, the first arc section q1 and the second arc section q2, which surround the bore formed, The bore of 141b minimums.That is the inner cavity surface 141b of foam 141 is in the drum that the central axis direction towards the inner cavity of foam 141 protrudes Face.When the inner cavity surface 141b of the drum surface enables to the voice signal of receiver 13 to pass through the inner cavity of foam 141, first reduces and increase afterwards Greatly, then by the called hole 123 on flexible PCB 12 it exports.

The inner cavity surface 141b structures of above-mentioned foam 141 replace in the prior art by the vibration section 132 to receiver 13 into Row adjustment with the voice signal to receiver 13 it is various needed for control, more conducively improve receiver 13 sound performance.

It should be understood that please refer to Fig. 9 and Figure 10, the lateral surface of above two foam 141 can recessed groove 1413, The groove 1413 can coordinate with radiating part 151 to be embedded together.

Further, Figure 11 is please referred to, the sensor 11 is in the region D1 of the orthographic projection on the flexible PCB 12 Positioned at the receiver 13 in the region D2 of the orthographic projection on the flexible PCB 12.Sensor 11 is with receiver 13 in Z To overlapping, reduce the size for the flexible PCB 12 being carried between sensor 11 and receiver 13 so that electronic building brick 1 fills When assigned in circuit board, save electronic building brick 1 X to size, advanced optimized the structure of electronic equipment 100.Certainly, In other embodiments, as shown in figure 12, sensor 11 may be used also with receiver 13 in the region of the orthographic projection on flexible PCB 12 To partly overlap, i.e., the described sensor 11 in the orthographic projection on the flexible PCB 12 region D1 and the receiver 13 in The region D2 of orthographic projection on the flexible PCB 12 partly overlaps；Or as shown in figure 13, the sensor 11 is in described soft The region D1 of orthographic projection on property circuit board 12 is located at the receiver 13 in the area of the orthographic projection on the flexible PCB 12 Domain D2 is mutually staggered, etc..

It should be understood that please referring to Figure 11, the sensor 11 is close to the first side S1 of the flexible PCB 12 and institute State the junction setting of third side S3.Sensor 11 is set to the corner of flexible PCB 12, and from flexible PCB 12 and electricity The junction of road plate is farther out so that when electronic building brick 1 is set on electronic equipment 100, sensor 11 is close to electronic equipment 100 Top, to reduce electronic equipment 100 non-display area size.

It should be understood that refer to Figure 14, the sound channel 131 and the sensor 11 along the third side S3 extremely The direction of the 4th side S4 is arranged side by side.

Wherein, as shown in figure 14, the called hole 123 in the region of the orthographic projection on the receiver 13 be located at it is described Range overlapping on receiver 13 where the vibration section 132 of part.I.e. it is last to be directed at the receiver 13 for the called hole 123 The vibration section 132 divided.I.e. the size in called hole 123 is less than the size of the vibration section 132 of receiver 13.It is corresponding, called hole 123 It is located at the vibration section 132 of receiver 13 in the positive throwing on flexible PCB 12 in the region D3 of the orthographic projection on flexible PCB 12 In the region D4 of shadow.It can additionally be covered on called hole 123 and connect sound-guiding structure, ensure the sound output of receiver 13.It is i.e. called 123 hole of hole is located at the vibration section 132 of receiver 13 in flexible PCB 12 in the region D3 of the orthographic projection on flexible PCB 12 Orthographic projection region D4 in.Called hole 123 close to first in S1 and the 4th S4 corner, realize sound channel 131 with pass Sensor 11 is arranged side by side.Called hole 123 and sensor 11 are side by side, it is possible to reduce to the need of the non-display area of electronic equipment 100 It asks, improves the screen accounting of electronic equipment 100.Certainly, in other embodiments, Figure 15 is please referred to, the size in called hole 123 may be used also Think the half of the vibration section 132 of receiver 13, alternatively, Figure 16 is please referred to, the row's setting different from sensor 11 of called hole 123.

Further, Figure 17 and Figure 18 are please referred to, electronic equipment 100 further includes center 3, and center 3, which has, to be disposed opposite to each other First center face 3a and the second center face 3b, the first center face 3a are used for towards display module 2, are formed and are held on the second center face 3b Receive portion 31, receiving portion 31 is being arranged electronic building brick 1.

Sensor 11 in electronic building brick 1 is attached on the second center face 3b, corresponding, and running through on the second center face 3b has For wide aperture in the first center hole 3c of alignment sensor 11 and second for being directed at the called hole 123 on flexible PCB 12 3d；To ensure still to be able to work normally after electronic building brick 1 is set on center 3.Heat conducting pipe in radiating subassembly 15 is connected to appearance It receives in portion 31, by the heat transfer to center on electronic building brick 1, to improve the reliability of electronic building brick 1.

Further, Fig. 1 and Figure 17 are please referred to, the electronic equipment 100 further includes display module 2, and display module 2 is arranged In on the first center face 3a of center 3.

There is the display module 2 non-display area Z2, the non-display area Z2 to open up called window 21a, the electronics group Part 1 is set on the non-display area Z2, and the sound channel 131 of the electronic building brick 1 is connected to the called window 21a.

In one embodiment, please with reference to Figure 19 and Figure 20, display module 2 includes stacking gradually 21 He of cover board of connection Screen assembly 22.Display module 2 and the case lid of electronic equipment 100 connect to form 100 closed inner cavity of electronic equipment, electronic building brick 1 It is contained in the inner cavity, and called hole 123 in electronic building brick 1 and sensor 11 are all directed at the non-display area Z2 of display module 2, So that the voice signal in receiver 13 can be transmitted to called window 21a by called hole 123, allow the user to pass through Called window 21a listens to voice signal, and sensor 11 is directed at display module 2 and sensor 11 can also be enable to receive outside The light in portion works.Wherein, non-display area Z2 is the non-region for showing electronic image in electronic equipment 100.

Since sensor 11, flexible PCB 12 and receiver 13 are in stacked, therefore the electronic building brick 1 of the structure is set to When in electronic equipment 100, sensor 11, flexible PCB 12 and receiver 13 are stacked along the Z-direction of electronic equipment 100 successively, Save the X of the non-display area Z2 in electronic equipment 100 to size, the size of viewing area Z1 can be increased, improve electricity 100 screen accounting of sub- equipment.

In one embodiment, as shown in figure 19, also there is the display module 2 viewing area Z1, the viewing area Z1 to surround The non-display area Z2.

It should be understood that as shown in figure 20, the display module 2 includes stacking gradually the cover board 21 and screen assembly of connection 22, the screen assembly 22 has two short side S5 being disposed opposite to each other and two long sides S6, two long side S6 being disposed opposite to each other It is connected between two short side S5, the direction of the short side S5 towards another short side S5, which are recessed, to be formed Groove 22a, region of the display module 2 within the groove 22a be the non-display area Z2, the display module 2 in Region other than the groove 22a is the viewing area Z1, and the cover board 21 opens up the called window 21a.Certainly, other In embodiment, display module 2 can also be screen assembly 22, and the display module 2 is an edge groove 22a of screen assembly 22 Non-display area Z2 is formed, region of the display module 2 other than the non-display area Z2 is viewing area Z1.

As shown in Fig. 1 and Figure 20, i.e., the display module 2 that cover board 21 and screen assembly 22 are formed is other than groove 22a Region is all viewing area Z1.Wherein, groove 22a is opened in the centre position of a short side of screen assembly 22.It is opened up on cover board 21 Called window 21a corresponding with called hole 123.It should be understood that the called window 21a is elongated, size substantially by Talk about hole 123 2 times.The part that cover board 21 corresponds to groove 22a can be with the non-display area Z2 of printed coating formation display module 2. Since sensor 11, flexible PCB 12 and receiver 13 are stacked along the Z-direction of electronic equipment 100 successively, reduce groove 22a In the size of X-direction, the size of viewing area Z1 can be increased, improve 100 screen accounting of electronic equipment.It should be understood that described Display module 2 described in 1 face of electronic building brick is arranged, and the receiver 13 is at least partly directed at the non-display area Z2.

In one embodiment, Fig. 1 and Figure 20 are please referred to, an edge groove 22a of the display module 2 forms non-show Show that area Z2, region of the display module 2 other than the non-display area Z2 are viewing area Z1,1 face institute of the electronic building brick The setting of display module 2 is stated, and the receiver 13 is at least partly directed at the non-display area Z2 i.e. receiver 13 in described The region of at least part of orthographic projection in display module 2 is located in the non-display area Z2.So that the alignment of 13 part of receiver Non-display area Z2 further reduces non-display area Z2 in the size of Y-direction, can increase the size of viewing area Z1, further Improve 100 screen accounting of electronic equipment.

Further, the sensor 11 is located at described in at least part of orthographic projection region in the display module 2 In non-display area Z2.

The part-structure of receiver 13 and sensor 11 is set to be located in groove 22a, and receiver 13 and sensor 11 are remaining Structure in the orthographic projection in display module 2 range then be located at display module 2 viewing area Z1 in the range of, be further reduced Sizes of the non-display area Z2 in Y-direction, can increase the size of viewing area Z1, further increase 100 screen accounting of electronic equipment. Certainly, in other embodiments, Figure 20 is please referred to, entire electronic building brick 1 can all be located in groove 22a.

It should be understood that as shown in figure 20, electronic building brick 1 is located at the edge of groove 22a, in favor of groove 22a X to In continue that other components, such as camera module etc. are arranged.Certainly, in other embodiments, as shown in figure 19, electronic building brick 1 can also be positioned at the centre position of groove 22a, and other components are located at the both sides of electronic building brick 1.

When electronic equipment 100 provided by the embodiments of the present application assembles, sensor 11 is set to flexible PCB 12 first On, and be electrically connected with flexible PCB 12, then sensor 11 is set on flexible PCB 12, then receiver 13 is passed through Sealing element 14 is set on flexible PCB 12, and radiating subassembly 15 is located on to form electronic building brick 1；Electronic building brick 1 is arranged It is connected on center 3 in the heat conduction 152 on center 3, and in radiating subassembly 15；Center 3 is resisted against in display module 2 again and is carried out Assembling makes the called hole 123 of electronic building brick 1 be directed at the called window 21a on cover board 21, the part of receiver 13 and sensor 11 Structure is located in groove 22a, and receiver 13 and 11 remaining structure of sensor in the orthographic projection in display module 2 range then In the range of the viewing area Z1 of display module 2.

It is the preferred embodiment of the application above, it is noted that for those skilled in the art, Under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also considered as this Shen Protection domain please.

Claims

1. a kind of electronic building brick, which is characterized in that including sensor, flexible PCB, sealing element, receiver and radiating subassembly, The flexible PCB includes the first face and the second face being disposed opposite to each other, and the sensor is set to the of the flexible PCB On on one side, the receiver is set to through the sealing element on the second face of the flexible PCB, and the sealing element, which has, to be connected The inner cavity of the vibration section of the receiver is passed to, the flexible PCB opens up called hole, vibration section to the institute of the receiver State the sound channel that the channel between the called hole of flexible PCB forms the voice signal for exporting the receiver, the heat dissipation Component is located on the side of the sealing element, and the radiating subassembly is will be transmitted to the heat of itself to external radiation.

2. electronic building brick according to claim 1, which is characterized in that the sealing element side opens up multiple grooves, described Radiating subassembly includes the heat bulge that multiple circumferential surface ring-types along the sealing element are arranged, and a heat bulge is embedded at In one groove of the sealing element, and the end of the heat bulge extends away from the direction of sealing element.

3. electronic building brick according to claim 1, which is characterized in that the radiating subassembly includes radiating part and is connected to institute State at least one heat conducting pipe on the circumferential surface of radiating part, the radiating part is located on the side of the sealing element, and described at least one One end of a heat conducting pipe extends away from the direction of the sealing element.

4. electronic building brick according to claim 3, which is characterized in that the radiating part has be disposed opposite to each other first to abut Face and the second bearing surface, the circumferential surface are connected between first bearing surface and second bearing surface, and described first abuts Face and second bearing surface are connected to respectively on the second face and the receiver of the flexible PCB.

5. electronic building brick according to claim 4, which is characterized in that the circumferential surface of the radiating part along the receiver extremely The perimeter in the flexible PCB direction becomes larger.

6. electronic building brick according to claim 5, which is characterized in that the edge of first bearing surface and the flexible electrical The edge of road plate is concordant.

7. electronic building brick according to claim 3, which is characterized in that the radiating part includes being sheathed on the sealing element Elastic ring and the becket that is sheathed in the elastic portion, and there are one notch and at least one empty avoidings for tool on the becket Hole, one heat conducting pipe are connected to through an emptiness avoiding hole on the elastic ring.

8. electronic building brick according to claim 3, which is characterized in that the radiating part is graphite annulus.

9. according to the electronic building brick described in claim 1 to 8 any one, which is characterized in that the sealing element is glue-line, described Sealing element is applied on the flexible PCB, and the sealing element encloses the vibration section for setting the receiver, so that the sealing The occupied space that part encloses the vibration section for setting the receiver forms the inner cavity；And/or

The sealing element is glue-line, and the sealing element is applied on the receiver, and the sealing element encloses and sets the receiver Vibration section so that the occupied space that the sealing element encloses the vibration section for setting the receiver forms the inner cavity.

10. according to the electronic building brick described in claim 1 to 8 any one, which is characterized in that the sealing element include foam and Glue-line, the foam hollow out form the inner cavity, and the glue-line is respectively arranged on the two sides that the foam is disposed opposite to each other, described Sealing element is adhered between the flexible PCB and the receiver.

11. electronic building brick according to claim 10, which is characterized in that the inner cavity of the foam in the receiver just The region of projection includes the region where the vibration section of the receiver.

12. electronic building brick according to claim 10, which is characterized in that the foam has inner cavity surface, the inner cavity surface Around the inner cavity is formed, the inner cavity surface is the conical surface.

13. electronic building brick according to claim 12, which is characterized in that the foam has the first opening being disposed opposite to each other With the second opening, first opening is open along described first to described close to the receiver, the bore of the inner cavity surface The direction of second opening gradually increases.

14. according to the electronic building brick described in claim 1 to 8 any one, which is characterized in that the sensor is in the flexibility The region of orthographic projection on circuit board is located at the receiver in the region of the orthographic projection on the flexible PCB.

15. a kind of electronic equipment, which is characterized in that the electronics group including center and as described in claim 1 to 14 any one Part, the radiating subassembly will be transmitted to the heat of itself and be externally radiated on the center.