CN108428687A - A kind of graphene metal pad and preparation method thereof - Google Patents

A kind of graphene metal pad and preparation method thereof Download PDF

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Publication number
CN108428687A
CN108428687A CN201810200154.3A CN201810200154A CN108428687A CN 108428687 A CN108428687 A CN 108428687A CN 201810200154 A CN201810200154 A CN 201810200154A CN 108428687 A CN108428687 A CN 108428687A
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graphene
layer
transition zone
metal
metal pad
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CN108428687B (en
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伍连彬
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Shenzhen Tianyuan Xiwang Material Technology Co ltd
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Shenzhen Tianyuan Xiwang Material Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/03Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

The present invention discloses a kind of graphene metal pad and preparation method thereof, wherein, the graphene metal pad includes graphene layer, transition zone and metal welding disc layer, the transition zone is mixed with by silver paste and graphene, the transition zone is located at graphene layer and metal welding disc layer centre position and is fixed together graphene layer and metal welding disc layer, to facilitate grapheme material to be welded with the various metal components in electronic product, road has been paved as conductive material for graphene in electronic product.

Description

A kind of graphene metal pad and preparation method thereof
Technical field
The present invention relates to pad fields more particularly to a kind of graphene metal pad and preparation method thereof.
Background technology
Graphene-structured is highly stable, and so far, researcher does not have found there is the case where carbon atom missing in graphene yet. Connection in graphene between each carbon atom is very flexible, when applying external mechanical force, carbon atom face with regard to flexural deformation, to Make carbon atom that need not be rearranged to adapt to external force, is also maintained for stable structure.The lattice structure of this stabilization makes graphite Alkene has outstanding electric conductivity, therefore graphene is with a wide range of applications in electronic product.
In electronic product, various components must be connected to be combined together by electric welding or soldering mode, However, since graphene belongs to nonmetallic materials, and soldering and electric welding must carry out between metal material, this leads to graphene There are larger limitations in the application of electronic product.
Therefore, the existing technology needs to be improved and developed.
Invention content
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of graphene metal pad and its preparations Method, it is intended to which solving grapheme material can not cause graphene in electronics applications by larger with the welding of metal component The problem of limitation.
Technical scheme is as follows:
A kind of graphene metal pad, wherein including substrate, the graphene layer being disposed on the substrate, metal welding disc layer and transition Layer, the transition zone are located among graphene layer and metal welding disc layer and the graphene layer and metal welding disc layer are connected to one It rises, the transition zone is mixed with by silver paste and graphene.
The graphene metal pad, wherein between substrate and graphene layer, metal welding disc layer and transition zone Position is additionally provided with a silver slurry layer.
The graphene metal pad, wherein the reticular structure and be filled in institute that the transition zone is formed by silver paste State the grapheme material composition in reticular structure.
The graphene metal pad, wherein the transition zone by weight percentage include 60-90% silver paste and The graphene of 10-40%.
The graphene metal pad, wherein the metal pad layer material is selected from glass putty, zinc powder, copper powder and silver powder In it is one or more.
The graphene metal pad, wherein the graphene layer, metal welding disc layer are identical with the thickness of transition zone.
The graphene metal pad, wherein the thickness of the graphene layer, metal welding disc layer and transition zone is 0.05-2cm。
The graphene metal pad, wherein the material of the substrate is epoxy resin.
A kind of preparation method of graphene metal pad, wherein including step:
Silver slurry layer is deposited on substrate;
Graphene layer, transition zone and metal welding disc layer are deposited on silver paste layer, and graphene metal welding is made after heat treatment Graphene layer, transition zone and metal welding disc layer in same plane and are arranged in order described in disk, and the transition zone is by the graphene Layer and metal welding disc layer link together, and the transition zone is mixed with by silver paste and graphene.
The preparation method of the graphene metal pad, wherein the heat treatment temperature is 60-80 DEG C.
Advantageous effect:Graphene metal pad provided by the invention includes graphene layer, transition zone and metal welding disc layer, institute It states transition zone to be mixed with by silver paste and graphene, the transition zone is located at graphene layer and metal welding disc layer centre position And be fixed together graphene layer and metal welding disc layer, to facilitate graphene and the various metals member in electronic product Device welds, and road has been paved as conductive material in electronic product for graphene.
Description of the drawings
Fig. 1 is a kind of side schematic view of graphene metal pad preferred embodiment of the present invention.
Fig. 2 is a kind of schematic top plan view of graphene metal pad preferred embodiment of the present invention.
Fig. 3 is a kind of flow chart of the preparation method preferred embodiment of graphene metal pad of the present invention.
Specific implementation mode
The present invention provides a kind of graphene metal pads and preparation method thereof, to make the purpose of the present invention, technical solution And effect is clearer, clear, the present invention is described in more detail below.It should be appreciated that specific implementation described herein Example is not intended to limit the present invention only to explain the present invention.
Referring to Fig. 1, Fig. 1 is a kind of side schematic view of graphene metal pad preferred embodiment of the present invention, as schemed institute Show, the graphene metal pad includes a substrate 10, graphene layer 20, metal welding disc layer 40 and the mistake of setting on the substrate 10 Cross layer 30, the transition zone 30 is located among graphene layer 20 and metal welding disc layer 40 and by the graphene layer 20 and metal welding Disc layer 40 links together, and the transition zone 30 is mixed with by silver paste and graphene.
Specifically, the various components in existing electronic product are fixed together by welding, and Welding must then carry out between metal material.Due to graphene be nonmetallic materials, grapheme material can not directly with Metal component in electronic product is welded, and causes grapheme material to be received in the application of electronic product larger Limitation.
To solve the above problems, the present invention by transition zone made of being mixed with by silver paste and graphene by graphene layer It is whole it to be joined together to form a graphene metal pad with metal welding disc layer, when realizing the grapheme material application When in electronic product, then needs through soldering or be welded the metal pad in metal component and the graphene metal pad Layer welds together.Obviously, the present invention, which solves grapheme material and can not be welded with metal component, causes graphene in electronics The problem of in products application by larger limitation, has paved road in electronic product for grapheme material as conductive material.
Further, as shown in Figure 1, in order to enhance the monolithic conductive performance of graphene metal pad, the present invention preferably exists Position between substrate and graphene layer, metal welding disc layer and transition zone is additionally provided with a silver slurry layer 50.Specifically, first exist A silver slurry layer is deposited on the substrate, and the graphene layer, transition zone and metal welding disc layer are then prepared on silver paste layer.
Preferably, the thickness of silver paste layer is 50-100um.For example, for 50um, 60um, 80um etc..
In the present invention, the transition zone plays a part of being fixedly connected with metal welding disc layer and graphene layer, in order to ensure Transition zone has corresponding electric conductivity, and the transition zone is by weight percentage by the graphite of the silver paste of 60-90% and 10-40% Alkene forms.
It is further preferred that reticular structure that the transition zone is formed by silver paste and being filled in the reticular structure Grapheme material forms.Specifically, as shown in Fig. 2, reticular structure 31 is made in silver paste, the grapheme material 32 is filled out It fills in the reticular structure, this mode can increase the contact area of metal silver paste and non-metallic material graphene, to protect Demonstrate,prove silver paste and the mutual electric conductivity of graphene.
Preferably, in the present invention, the one kind of the metal pad layer material in glass putty, zinc powder, copper powder and silver powder Or it is a variety of.As a wherein specific embodiment, the metal welding disc layer is preferably mixed with by zinc powder and glass putty, by upper It states metal welding disc layer made of material preparation to be fixedly connected with other metal components more easily by the mode of scolding tin, and ensures Excellent electric conductivity.
It is further preferred that in order to enhance the electric conductivity of metal welding disc layer, the metal welding disc layer is by weight percentage Meter is mixed with by the zinc powder of 20-40% and the glass putty of 60-80%.
Preferably, in the present invention, the graphene layer, metal welding disc layer are identical with the thickness of transition zone.As wherein With specific embodiment, the thickness of the graphene layer, metal welding disc layer and transition zone is disposed as 0.05-2cm.
Preferably, in the present invention, the material of the substrate is epoxy resin.
Further, the present invention also provides a kind of preparation methods of graphene metal pad, wherein as shown in figure 3, including Step:
S10, silver slurry layer is deposited on substrate;
S20, graphene layer, transition zone and metal welding disc layer are deposited on silver paste layer, graphene gold is made after heat treatment Belong to pad, the graphene layer, transition zone and metal welding disc layer in same plane and be arranged in order, and the transition zone is by the stone Black alkene layer and metal welding disc layer link together, and the transition zone is mixed with by silver paste and graphene.
Preferably, the heat treatment temperature be 60-80 DEG C, under the temperature condition, the graphene layer, transition zone with And metal welding disc layer energy rapid draing is fixed, and complete graphene metal pad is formed.
A kind of preparation method of graphene metal pad of the present invention is further explained below by specific embodiment Explanation:
Embodiment 1
1), deposit silver slurry layer on epoxy resin base plate, the thickness of silver paste layer is 50um;
2), graphene layer, transition zone and metal welding disc layer are deposited on silver paste layer, graphene gold is made after 60 DEG C of processing 1h Belong to pad, the graphene layer, transition zone and metal welding disc layer in same plane and be arranged in order, and the transition zone is by the stone Black alkene layer and metal welding disc layer link together, and the transition zone is by weight percentage by 60% silver paste and 40% graphene It is mixed with;The metal welding disc layer is mixed with by 20% zinc powder and 80% glass putty by weight percentage.
Embodiment 2
1), deposit silver slurry layer on epoxy resin base plate, the thickness of silver paste layer is 60um;
2), graphene layer, transition zone and metal welding disc layer are deposited on silver paste layer, graphene is made after 80 DEG C of processing 0.5h Metal pad, the graphene layer, transition zone and metal welding disc layer in same plane and are arranged in order, and the transition zone will be described Graphene layer and metal welding disc layer link together, and the transition zone is by weight percentage by 90% silver paste and 10% graphite Alkene is mixed with;The metal welding disc layer be mixed with by weight percentage by 30% zinc powder and 70% glass putty and At.
Embodiment 3
1), deposit silver slurry layer on epoxy resin base plate, the thickness of silver paste layer is 80um;
2), graphene layer, transition zone and metal welding disc layer are deposited on silver paste layer, graphene is made after 70 DEG C of processing 0.5h Metal pad, the graphene layer, transition zone and metal welding disc layer in same plane and are arranged in order, and the transition zone will be described Graphene layer and metal welding disc layer link together, and the transition zone is by weight percentage by 80% silver paste and 20% graphite Alkene is mixed with;The metal welding disc layer be mixed with by weight percentage by 40% zinc powder and 60% glass putty and At.
In conclusion graphene metal pad provided by the invention includes graphene layer, transition zone and metal welding disc layer, institute It states transition zone to be mixed with by silver paste and graphene, the transition zone is located at graphene layer and metal welding disc layer centre position And be fixed together graphene layer and metal welding disc layer, to facilitate graphene and the various metals member in electronic product Device welds, and road has been paved as conductive material in electronic product for graphene.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can With improvement or transformation based on the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention Protect range.

Claims (10)

1. a kind of graphene metal pad, which is characterized in that including substrate, the graphene layer being disposed on the substrate, metal pad Layer and transition zone, the transition zone are located at graphene layer and metal welding disc layer centre and by the graphene layers and metal welding disc layer It links together, the transition zone is mixed with by silver paste and graphene.
2. graphene metal pad according to claim 1, which is characterized in that in substrate and graphene layer, metal pad Position between layer and transition zone is additionally provided with a silver slurry layer.
3. graphene metal pad according to claim 1, which is characterized in that the transition zone is formed netted by silver paste Structure and the grapheme material composition being filled in the reticular structure.
4. graphene metal pad according to claim 1, which is characterized in that the transition zone wraps by weight percentage Include the silver paste of 60-90% and the graphene of 10-40%.
5. graphene metal pad according to claim 1, which is characterized in that the metal pad layer material is selected from tin It is one or more in powder, zinc powder, copper powder and silver powder.
6. graphene metal pad according to claim 1, which is characterized in that the graphene layer, metal welding disc layer and The thickness of transition zone is identical.
7. graphene metal pad according to claim 1, which is characterized in that the graphene layer, metal welding disc layer and The thickness of transition zone is 0.05-2cm.
8. graphene metal pad according to claim 1, which is characterized in that the material of the substrate is epoxy resin.
9. a kind of preparation method of graphene metal pad, which is characterized in that including step:
Silver slurry layer is deposited on substrate;
Graphene layer, transition zone and metal welding disc layer are deposited on silver paste layer, and graphene metal welding is made after heat treatment Graphene layer, transition zone and metal welding disc layer in same plane and are arranged in order described in disk, and the transition zone is by the graphene Layer and metal welding disc layer link together, and the transition zone is mixed with by silver paste and graphene.
10. the preparation method of graphene metal pad according to claim 9, which is characterized in that the heat treatment temperature Degree is 60-80 DEG C.
CN201810200154.3A 2018-03-12 2018-03-12 Graphene metal bonding pad and preparation method thereof Active CN108428687B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115394559A (en) * 2022-09-23 2022-11-25 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) Method for reducing ESR (equivalent series resistance) of graphite silver paste process of solid electrolyte sheet type tantalum capacitor

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CN106233453A (en) * 2014-02-19 2016-12-14 三星电子株式会社 Wire structures and the electronic installation of this wire structures of employing
CN106384730A (en) * 2016-12-06 2017-02-08 江苏悦达新材料科技有限公司 High heat conduction metal foil layer/graphene metal mixed layer composite heat radiation film
JP2017152643A (en) * 2016-02-26 2017-08-31 住友電気工業株式会社 Electronic apparatus and method for manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9237646B2 (en) * 2012-05-14 2016-01-12 The Hong Kong University Of Science And Technology Electrical and thermal conductive thin film with double layer structure provided as a one-dimensional nanomaterial network with graphene/graphene oxide coating
CN106233453A (en) * 2014-02-19 2016-12-14 三星电子株式会社 Wire structures and the electronic installation of this wire structures of employing
CN103811130A (en) * 2014-03-05 2014-05-21 电子科技大学 Preparation method of graphene compound silver paste and graphene compound silver paste
CN103811130B (en) * 2014-03-05 2017-02-22 电子科技大学 Preparation method of graphene compound silver paste and graphene compound silver paste
CN105280594A (en) * 2014-06-16 2016-01-27 三星电子株式会社 Graphene-metal bonding structure, method of manufacturing the same, and semiconductor device having the graphene-metal bonding structure
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115394559A (en) * 2022-09-23 2022-11-25 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) Method for reducing ESR (equivalent series resistance) of graphite silver paste process of solid electrolyte sheet type tantalum capacitor
CN115394559B (en) * 2022-09-23 2023-06-20 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) Method for reducing ESR (equivalent series resistance) of graphite silver paste process of solid electrolyte sheet type tantalum capacitor

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