CN108417700B - A kind of LED encapsulation structure of two-sided light out - Google Patents
A kind of LED encapsulation structure of two-sided light out Download PDFInfo
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- CN108417700B CN108417700B CN201810180176.8A CN201810180176A CN108417700B CN 108417700 B CN108417700 B CN 108417700B CN 201810180176 A CN201810180176 A CN 201810180176A CN 108417700 B CN108417700 B CN 108417700B
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- led chip
- led
- fluorescent glass
- groove
- electrode
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 65
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides the LED encapsulation structure of the two-sided light out of one kind, the contraposition up and down of LED chip is carried out using upper and lower two fluorescent glass, and realizes that the mutual of LED chip is connected in series up and down using anisotropic conductive resin, and step is simple, and cost is extremely low；Anisotropic conductive resin is also used as adhesive glue to make fluorescent glass progress up and down glued, and hemispherical shrinkage pool realizes the wide-angle transmitting light of light；Electrode slice is inserted between the electrode of upper and lower LED chip, in a certain LED chip open circuit, two electrode slices are as capacitor, due to high potential difference, it realizes that the linear arrangement realization of conductive particle is connected again, avoids the problem that certain open circuit of lamp string and entire lamp string is not available.
Description
Technical field
The present invention relates to LED encapsulation fields, and in particular to a kind of LED encapsulation structure of two-sided light out.
Background technique
LED encapsulation generally requires very complicated process and material, and cost and size are all relatively large, and nowadays realize
It is also the trend that technical staff is pursued that the multi-panel of LED encapsulation, which goes out light,.
Summary of the invention
Based on solving the above problems, the present invention provides a kind of LED encapsulation structures of two-sided light out comprising the first fluorescence
Glass, the second fluorescent glass and the anisotropic conductive tree between first fluorescent glass and second fluorescent glass
Rouge layer, first fluorescent glass and second fluorescent glass is of the same size and shape, first fluorescent glass
It is stacked and placed on second fluorescent glass；Multiple first grooves are provided on first face of first fluorescent glass, it is described
It is provided with multiple second grooves on second face of the second fluorescent glass, multiple first LED are provided in the multiple first groove
Chip is provided with multiple second LED chips in the multiple second groove；The multiple first LED chip and multiple 2nd LED
Each of chip is flip LED chips, and includes a positive electrode and a negative electrode, the positive electrode and the negative electrode
It is protruded from the multiple first groove or the multiple second groove, the multiple first LED chip and the multiple second
Interlaced with each other and partly overlapping arrangement above and below LED chip, so that the positive electrode of the first LED chip and the second LED chip is negative
Electrode is electrically connected by the conductive particle in the anisotropic conductive resin layer, the negative electrode of the first LED chip and
The positive electrode of two LED chips is electrically connected by the conductive particle in the anisotropic conductive resin layer, and the portion
Divide the part of overlapping for the electrode section of the first LED chip and the second LED chip；The multiple first groove and multiple second recessed
Multiple hemispherical shrinkage pools of array arrangement are provided on the bottom surface of slot.
The present invention also provides a kind of LED encapsulation structures of two-sided light out comprising the first fluorescent glass, the second fluorescence glass
Glass and the anisotropic conductive resin layer between first fluorescent glass and second fluorescent glass, described first is glimmering
Light glass and second fluorescent glass is of the same size and shape, it is glimmering that first fluorescent glass is stacked and placed on described second
On light glass；It is provided with multiple first grooves on first face of first fluorescent glass, the of second fluorescent glass
It is provided with multiple second grooves on two faces, is provided with multiple first LED chips in the multiple first groove, the multiple second
Multiple second LED chips are provided in groove；Each of the multiple first LED chip and multiple second LED chips is
Flip LED chips, and include a positive electrode and a negative electrode, the positive electrode and the negative electrode are from the multiple first
Groove or the multiple second groove protrusion, the multiple first LED chip are handed over each other up and down with the multiple second LED chip
Wrong and partly overlapping arrangement, so that the positive electrode of the first LED chip and the negative electrode of the second LED chip are carried out by electrode slice
The positive electrode of electrical connection, the negative electrode of the first LED chip and the second LED chip is electrically connected by electrode slice, and described
Partly overlapping part is the electrode section of the first LED chip and the second LED chip；The multiple first groove and multiple second
Multiple hemispherical shrinkage pools of array arrangement are provided on the bottom surface of groove.
According to an embodiment of the invention, the length and width dimensions of the multiple first groove and multiple second grooves with it is the multiple
First LED chip is consistent with the length and width dimensions of multiple second LED chips.
According to an embodiment of the invention, the multiple first LED chip and multiple second LED chips pass through clear binder
It is fixed on the bottom surface of the multiple first groove and multiple second grooves, the clear binder fills the multiple hemispherical
Shrinkage pool.
According to an embodiment of the invention, further including the multiple first LED chip for being electrically connected end and multiple 2nd LED
The leading-out terminal of chip, the leading-out terminal are linear type, and one end is inserted into the anisotropic conductive resin layer, the other end
It stretches out outside the anisotropic conductive resin layer.
According to an embodiment of the invention, further including the multiple first LED chip for being electrically connected end and multiple 2nd LED
The leading-out terminal of chip, the leading-out terminal are L-type, short side be inserted into the anisotropic conductive resin layer and with the electricity
Pole piece is opposite, and long side is stretched out outside the anisotropic conductive resin layer.
According to an embodiment of the invention, a LED core in the multiple first LED chip and multiple second LED chips
Piece is the LED chip of damage, is formed in the anisotropic conductive resin layer of the LED chip corresponding position of the damage by conductive
The conductive path of two electrode slices on the positive and negative electrode of LED chip that grain forms, being electrically connected the damage.
Advantages of the present invention is as follows:
(1) contraposition up and down of LED chip is carried out using upper and lower two fluorescent glass, and real using anisotropic conductive resin
Now the mutual of LED chip is connected in series up and down, and step is simple, and cost is extremely low；
(2) anisotropic conductive resin is also used as adhesive glue to make fluorescent glass progress up and down glued, and hemispherical shrinkage pool is real
The wide-angle transmitting light of light is showed；
(3) it is inserted into electrode slice between the electrode of upper and lower LED chip, in a certain LED chip open circuit, two electrode slices are made
For capacitor, due to realizing that the linear arrangement realization of conductive particle is connected again, avoiding certain of lamp string disconnected with high potential difference
Road and the problem of entire lamp string is not available.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the two-sided LED encapsulation structure of light out of first embodiment；
Fig. 2 is the top view of the two-sided LED encapsulation structure of light out of first embodiment；
Fig. 3 is the cross-sectional view of the two-sided LED encapsulation structure of light out of second embodiment；
Fig. 4 is that the LED encapsulation structure of the two-sided light out of second embodiment forms the schematic diagram of conductive path.
Specific embodiment
First embodiment
Referring to Fig. 1-2, the LED encapsulation structure of the two-sided light out of first embodiment comprising the first fluorescent glass 1, second
Fluorescent glass 2 and the anisotropic conductive resin layer 7 between first fluorescent glass 1 and second fluorescent glass 2,
First fluorescent glass 1 and second fluorescent glass 2 is of the same size and shape, first fluorescent glass 1 are folded
It is placed on second fluorescent glass 2；Multiple first groove 3a, institute are provided on first face of first fluorescent glass 1
It states and is provided with multiple second groove 3b on the second face of the second fluorescent glass 2, be provided in the multiple first groove 3a multiple
Multiple second LED chip 5b are provided in first LED chip 5a, the multiple second groove 3b；The multiple first LED chip
Each of 5a and multiple second LED chip 5b are flip LED chips, and include a positive electrode 9 and a negative electrode 10, institute
Positive electrode 9 and the negative electrode 10 is stated to protrude from the multiple first groove 3a or the multiple, second groove 3b, it is described more
A first LED chip 5a and the multiple second LED chip 5b or more is interlaced with each other and partly overlapping arrangement, so that first
The negative electrode of the positive electrode of LED chip 5a and the second LED chip 5b pass through conductive in the anisotropic conductive resin layer 7
Grain 8 is electrically connected, the negative electrode of the first LED chip 5a and the positive electrode of the second LED chip 5b are led by the anisotropy
Conductive particle 8 in electric resin layer 7 is electrically connected, and the partly overlapping part is the first LED chip 5a and second
The electrode section of LED chip 5b；Array row is provided on the bottom surface of the multiple first groove 3a and multiple second groove 3b
Multiple hemispherical shrinkage pools 4 of cloth.The length and width dimensions of the multiple first groove 3a and multiple second groove 3b and the multiple the
One LED chip 5a is consistent with the length and width dimensions of multiple second LED chip 5b.
The multiple first LED chip 5a and multiple second LED chip 5b is fixed on the multiple by clear binder 6
On the bottom surface of first groove 3a and multiple second groove 3b, the clear binder 6 fills the multiple hemispherical shrinkage pool 4.
It further include the leading-out terminal for being electrically connected the multiple first LED chip 5a and multiple second LED chip 5b of end
11 and 12, the leading-out terminal 11 and 12 is linear type, and one end is inserted into the anisotropic conductive resin layer 7, the other end
It stretches out outside the anisotropic conductive resin layer 7.
Second embodiment
Referring to Fig. 3-4, the LED encapsulation structure of the two-sided light out of second embodiment comprising the first fluorescent glass 1, second
Fluorescent glass 2 and the anisotropic conductive resin layer 7 between first fluorescent glass 1 and second fluorescent glass 2,
First fluorescent glass 1 and second fluorescent glass 2 is of the same size and shape, first fluorescent glass 1 are folded
It is placed on second fluorescent glass 2；Multiple first groove 3a, institute are provided on first face of first fluorescent glass 1
It states and is provided with multiple second groove 3b on the second face of the second fluorescent glass 2, be provided in the multiple first groove 3a multiple
Multiple second LED chip 5b are provided in first LED chip 5a, the multiple second groove 3b；The multiple first LED chip
Each of 5a and multiple second LED chip 5b are flip LED chips, and include a positive electrode 9 and a negative electrode 10, institute
Positive electrode 9 and the negative electrode 10 is stated to protrude from the multiple first groove 3a or the multiple, second groove 3b, it is described more
A first LED chip 5a and the multiple second LED chip 5b or more is interlaced with each other and partly overlapping arrangement, so that first
The negative electrode of the positive electrode of LED chip 5a and the second LED chip 5b is electrically connected by electrode slice 13, the first LED chip 5a
Negative electrode and the positive electrode of the second LED chip 5b be electrically connected by electrode slice 13, and the partly overlapping part
For the electrode section of the first LED chip 5a and the second LED chip 5b；The multiple first groove 3a's and multiple second groove 3b
Multiple hemispherical shrinkage pools 4 of array arrangement are provided on bottom surface.The multiple first groove 3a's and multiple second groove 3b
Length and width dimensions are consistent with the length and width dimensions of the multiple first LED chip 5a and multiple second LED chip 5b.
The multiple first LED chip 5a and multiple second LED chip 5b is fixed on the multiple by clear binder 6
On the bottom surface of first groove 3a and multiple second groove 3b, the clear binder 6 fills the multiple hemispherical shrinkage pool 4.
According to an embodiment of the invention, further including the multiple first LED chip 5a and multiple second for being electrically connected end
The leading-out terminal 11a and 12a of LED chip 5b, the leading-out terminal 11a and 12a is L-type, and short side is inserted into the anisotropy
In conductive resin layer 7 and opposite with the electrode slice 13, long side is stretched out outside the anisotropic conductive resin layer 7.
Referring to fig. 4, when a LED chip 14 in the multiple first LED chip 5a and multiple second LED chip 5b is
The LED chip of damage is formed in the anisotropic conductive resin layer 7 of 14 corresponding position of LED chip of the damage by conductive
The conductive path 15 of two electrode slices on the positive and negative electrode of LED chip that grain 8 forms, being electrically connected the damage.
The embodiment is inserted into electrode slice between the electrode of upper and lower LED chip, in a certain LED chip open circuit, two electricity
Pole piece is as capacitor, due to realizing that the linear arrangement realization of conductive particle is connected again, avoiding certain of lamp string with high potential difference
Open circuit at one and the problem of entire lamp string is not available.
Finally, it should be noted that obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Other various forms of variations or variation out.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (7)
1. it is a kind of it is two-sided go out light LED encapsulation structure comprising the first fluorescent glass, the second fluorescent glass and between described first
Anisotropic conductive resin layer between fluorescent glass and second fluorescent glass, first fluorescent glass and described second
Fluorescent glass is of the same size and shape, and first fluorescent glass is stacked and placed on second fluorescent glass；It is described
It is provided with multiple first grooves on first face of the first fluorescent glass, is provided on the second face of second fluorescent glass multiple
Second groove is provided with multiple first LED chips in the multiple first groove, is provided in the multiple second groove multiple
Second LED chip；Each of the multiple first LED chip and multiple second LED chips are flip LED chips, and
Including a positive electrode and a negative electrode, the positive electrode and the negative electrode are from the multiple first groove or the multiple the
Two grooves protrusion, the multiple first LED chip and row interlaced with each other and partly overlapping above and below the multiple second LED chip
Cloth, so that the positive electrode of the first LED chip and the negative electrode of the second LED chip pass through in the anisotropic conductive resin layer
Conductive particle is electrically connected, the negative electrode of the first LED chip and the positive electrode of the second LED chip are led by the anisotropy
Conductive particle in electric resin layer is electrically connected, and the partly overlapping part is the first LED chip and the second LED core
The electrode section of piece；Multiple hemisphere of array arrangement are provided on the bottom surface of the multiple first groove and multiple second grooves
Shape shrinkage pool.
2. it is a kind of it is two-sided go out light LED encapsulation structure comprising the first fluorescent glass, the second fluorescent glass and between described first
Anisotropic conductive resin layer between fluorescent glass and second fluorescent glass, first fluorescent glass and described second
Fluorescent glass is of the same size and shape, and first fluorescent glass is stacked and placed on second fluorescent glass；It is described
It is provided with multiple first grooves on first face of the first fluorescent glass, is provided on the second face of second fluorescent glass multiple
Second groove is provided with multiple first LED chips in the multiple first groove, is provided in the multiple second groove multiple
Second LED chip；Each of the multiple first LED chip and multiple second LED chips are flip LED chips, and
Including a positive electrode and a negative electrode, the positive electrode and the negative electrode are from the multiple first groove or the multiple the
Two grooves protrusion, the multiple first LED chip and row interlaced with each other and partly overlapping above and below the multiple second LED chip
Cloth, so that the positive electrode of the first LED chip and the negative electrode of the second LED chip are electrically connected by electrode slice, the first LED core
The negative electrode of piece and the positive electrode of the second LED chip are electrically connected by electrode slice, and the partly overlapping part is
The electrode section of first LED chip and the second LED chip；It is arranged on the bottom surface of the multiple first groove and multiple second grooves
The multiple hemispherical shrinkage pools for thering is array to arrange.
3. the LED encapsulation structure of two-sided light out according to claim 1 or 2, it is characterised in that: the multiple first groove
It is consistent with the length and width dimensions of the multiple first LED chip and multiple second LED chips with the length and width dimensions of multiple second grooves.
4. the LED encapsulation structure of two-sided light out according to claim 3, it is characterised in that: the multiple first LED chip
It is fixed on the bottom surface of the multiple first groove and multiple second grooves with multiple second LED chips by clear binder,
The clear binder fills the multiple hemispherical shrinkage pool.
5. the LED encapsulation structure of two-sided light out according to claim 1, it is characterised in that: further include electrical connection end
The leading-out terminal of the multiple first LED chip and multiple second LED chips, the leading-out terminal are linear type, and one end is inserted
Enter in the anisotropic conductive resin layer, the other end stretches out outside the anisotropic conductive resin layer.
6. the LED encapsulation structure of two-sided light out according to claim 2, it is characterised in that: further include electrical connection end
The leading-out terminal of the multiple first LED chip and multiple second LED chips, the leading-out terminal are L-type, and short side is inserted into institute
It is interior and opposite with the electrode slice to state anisotropic conductive resin layer, long side is stretched out outside the anisotropic conductive resin layer.
7. the LED encapsulation structure of two-sided light out according to claim 2, it is characterised in that: the multiple first LED chip
With a LED chip in multiple second LED chips be damage LED chip, the LED chip corresponding position of the damage it is each to
Two be formed in anisotropic conductive resin layer on the positive and negative electrode of LED chip being made of conductive particle, being electrically connected the damage
The conductive path of a electrode slice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810180176.8A CN108417700B (en) | 2018-03-05 | 2018-03-05 | A kind of LED encapsulation structure of two-sided light out |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810180176.8A CN108417700B (en) | 2018-03-05 | 2018-03-05 | A kind of LED encapsulation structure of two-sided light out |
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| Publication Number | Publication Date |
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| CN108417700A CN108417700A (en) | 2018-08-17 |
| CN108417700B true CN108417700B (en) | 2019-10-25 |
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| CN201810180176.8A Active CN108417700B (en) | 2018-03-05 | 2018-03-05 | A kind of LED encapsulation structure of two-sided light out |
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| CN109449273A (en) * | 2018-12-11 | 2019-03-08 | 常熟理工学院 | A kind of ultraviolet LED encapsulating structure |
| CN109854978A (en) * | 2019-02-22 | 2019-06-07 | 赛创电气（铜陵）有限公司 | A kind of light source module |
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| JP2010147190A (en) * | 2008-12-17 | 2010-07-01 | Panasonic Electric Works Co Ltd | Double-sided light-emitting device |
| CN103090240A (en) * | 2013-02-25 | 2013-05-08 | 杭州杭科光电股份有限公司 | High-efficiency luminescence light emitting diode (LED) light source and LED lamp using thereof |
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| CN103748626A (en) * | 2012-07-18 | 2014-04-23 | G思玛特有限公司 | Transparent electronic display board and method for manufacturing same |
| CN104603964A (en) * | 2012-09-04 | 2015-05-06 | 株式会社则武 | Led element mounting substrate, led light source and led display |
| CN105009314A (en) * | 2013-02-27 | 2015-10-28 | 日亚化学工业株式会社 | Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements |
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2018
- 2018-03-05 CN CN201810180176.8A patent/CN108417700B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010147190A (en) * | 2008-12-17 | 2010-07-01 | Panasonic Electric Works Co Ltd | Double-sided light-emitting device |
| CN103748626A (en) * | 2012-07-18 | 2014-04-23 | G思玛特有限公司 | Transparent electronic display board and method for manufacturing same |
| CN104603964A (en) * | 2012-09-04 | 2015-05-06 | 株式会社则武 | Led element mounting substrate, led light source and led display |
| CN103090240A (en) * | 2013-02-25 | 2013-05-08 | 杭州杭科光电股份有限公司 | High-efficiency luminescence light emitting diode (LED) light source and LED lamp using thereof |
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Effective date of registration: 20190924 Address after: 518108 New Building A, B, 6 Floors, No. 1, Luorent Community, Shiyan Street, Baoan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN LIANGAN PHOTOELECTRICITY TECHNOLOGY CO.,LTD. Address before: 262500 Shandong city of Weifang province Qingzhou City Road No. 8979 Weifang yunmenshan engineering Career Academy Applicant before: Sun Aifen |
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Address after: 518000 floor 5, building B and floor 6, building B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Liangan Technology Co.,Ltd. Address before: 518108, 6th Floor, Building A and 6th Floor, Building B, New Factory Building 1, Luozhu Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN LIANGAN PHOTOELECTRICITY TECHNOLOGY CO.,LTD. |