CN108407197A - A kind of camera module packaging method - Google Patents
A kind of camera module packaging method Download PDFInfo
- Publication number
- CN108407197A CN108407197A CN201810095325.0A CN201810095325A CN108407197A CN 108407197 A CN108407197 A CN 108407197A CN 201810095325 A CN201810095325 A CN 201810095325A CN 108407197 A CN108407197 A CN 108407197A
- Authority
- CN
- China
- Prior art keywords
- chip
- plastic
- photosensitive area
- optical filter
- sensitive chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Blocking Light For Cameras (AREA)
- Studio Devices (AREA)
Abstract
The present invention proposes a kind of camera module method for filling, based on existing MOC technologies, before carrying out integral molded plastic step, optical filter is fitted on photosensitive area, it is positioned over again in the mold for molding later, the method molded using plastic packaging, injects injection moulding plastic on circuit boards and form a plastic-sealed body, the plastic-sealed body coats the non-photo-sensing area of sensitive chip, the photosensitive area of the invention that can prevent plastic cement from overflowing to chip.
Description
【Technical field】
The present invention relates to camera technical field more particularly to a kind of camera module method for filling.
【Background technology】
Camera is a kind of electronic equipment assembly being widely used, common as being applied to smart mobile phone, driving recording
Instrument, monitor etc..Camera includes at least photosensitive element, circuit board, image-forming assembly, can also include filtering assembly, optics tune
Each section component package together, is being become the CCD camera assembly that may be directly applied to electronic equipment by burnt component etc..It is common
Packaged type include COB (Chip on Board), i.e., sensitive chip is bonded to by gold thread on substrate, then camera lens and branch
Frame (or motor) is adhered on substrate；CSP (Chip Scale Package), i.e., sensitive chip is welded to by SMT on substrate,
Camera lens and holder (or motor) are adhered on substrate again；MOB (Mold on Board), i.e., sensitive chip passes through gold thread bonding
Onto substrate, then capacitance resistance is encapsulated by being molded, then camera lens and holder (or motor) are adhered to capacitance resistance
Encapsulation on；MOC (Mold on Chip), i.e., sensitive chip is bonded to by gold thread on substrate, then by being molded chip
Non-photo-sensing area and capacitance resistance be encapsulated together, then camera lens and holder (or motor) are adhered to the encapsulation of capacitance resistance
On.Presently the most common packaging technology is all based on greatly MOC packaging technologies, but in the specific implementation, we must also consider one
The thing that kind probably occurs：Plastic cement overflow；Such as Fig. 5, the MOC techniques of the prior art are to mould and die accuracy and injection molding required precision
It is very high, if mold has deviation when having deviation or injection molding, the photosensitive area that plastic cement overflows to chip may be may result in,
Sensitive chip is caused to be damaged.If mold allowance control is bad or PCB has deformation, it is easy to the case where excessive glue occur.
Once injection moulding plastic excessive glue will result in the bad of chip photosensitive area failure, and since chip is photosensitive to the photosensitive area of chip
Area is very fragile, this badness is unrepairable.
【Invention content】
In view of above-mentioned technical problem, the present invention proposes a kind of camera module method for filling, by changing camera encapsulation
In Common Component optical filter encapsulation sequence, realize prevent plastic cement overflow to chip photosensitive area purpose.
To realize that above-mentioned technique effect, the present invention adopt the following technical scheme that：
A kind of camera module method for filling, includes the following steps：
Step 1 is set according to the chip photosensitive area size of sensitive chip and the distance between the chip photosensitive area and pad
The optical filter of suitable dimension is counted out, the size of the optical filter otherwise the size less than chip photosensitive area while can not cover
To sensitive chip pad；
The optical filter is attached on the chip photosensitive area by step 2, is covered the chip photosensitive area and is not covered
The sensitive chip pad；
Step 3 binds the sensitive chip and circuit board；
Step 4 is positioned in the mold for molding, and the method molded using plastic packaging injects note on the circuit board
It moulds plastic cement and forms a plastic-sealed body, which coats the non-photo-sensing area of the sensitive chip；
Step 5 installs other assemblies on the basis of the plastic-sealed body.
More preferably, the step 3 can be placed on before the step 1 become new step one, the step 1 at
For new step two, the step 2 becomes new step three.
More preferably, the optical filter is cutoff filter.
Compared with prior art, have the advantage that for：Chip photosensitive area is protected by optical filter, injection molding
Plastic cement will not overflow to chip photosensitive area, the problem of avoiding plastic cement overflow.
【Description of the drawings】
Fig. 1 the present embodiment operation object structural schematic diagrams；
Fig. 2 the present embodiment optical filters place schematic diagram；
Structural schematic diagram after Fig. 3 the present embodiment injection moulding plastics；
Fig. 4 the present embodiment effect diagrams；
Fig. 5 general approach effect diagrams.
Reference numeral：1, circuit board；2, chip photosensitive area；3, gold thread；4, sensitive chip pad；5, sensitive chip；6, filter
Mating plate；7, injection moulding plastic.
【Specific implementation mode】
Tool is illustrated into technical scheme of the present invention according to representative specific embodiment below.
Embodiment one：A kind of camera module method for filling, includes the following steps：Step 1, according to the core of sensitive chip 5
2 size of piece photosensitive area and the distance between chip photosensitive area 2 and pad design the optical filter 6 of suitable dimension, the ruler of optical filter 6
Very little otherwise size less than chip photosensitive area 2, while sensitive chip pad 4 can not be covered；Step 2, such as Fig. 2 will filter
Piece 6 is attached on the chip photosensitive area 2 of sensitive chip 5, is covered chip photosensitive area 2 and is not covered sensitive chip pad 4；Step
Three, such as Fig. 1, sensitive chip 5 and circuit board 1 are bound；Step 4, such as Fig. 3, then the component after step 2 is positioned over for mould
In the mold of modeling, the method molded using plastic packaging is injected injection moulding plastic 7 and forms a plastic-sealed body, the plastic-sealed body packet on the circuit card 1
Cover the non-photo-sensing area of sensitive chip 5；Step 5 installs image-forming assembly, optical focusing component, aperture assemblies on the basis of plastic-sealed body
Etc. other assemblies.Specifically, optical filter 6 used herein is cutoff filter.
Embodiment two：A kind of camera module method for filling, includes the following steps：Step 1, such as Fig. 1, by sensitive chip 5
It is bound with circuit board 1；Step 2：Such as Fig. 2, according to 2 size of chip photosensitive area and chip photosensitive area 2 and pad of sensitive chip 5
The distance between design the optical filter 6 of suitable dimension, the size of optical filter 6 otherwise the size less than chip photosensitive area 2, simultaneously
Sensitive chip pad 4 can not be covered；Optical filter 6 is attached on the chip photosensitive area 2 of sensitive chip 5 by step 3, covering
Chip photosensitive area 2 and do not cover sensitive chip pad 4；Step 4, such as Fig. 3 are positioned in the mold for molding, using plastic packaging
The method of molding injects injection moulding plastic 7 and forms a plastic-sealed body on the circuit card 1, which coats the non-photo-sensing of sensitive chip 5
Area；Step 5 installs other groups such as image-forming assembly, optical focusing component, aperture assemblies, other optical filters on the basis of plastic-sealed body
Part.Specifically, optical filter 6 used herein is cutoff filter.
Embodiment three：On the basis of embodiment one or two, optical filter 6 be ultraviolet filter or spike filter, other
It is identical.
Implementation principle：Such as Fig. 5, all there are cutoff filter, prior art side inside present camera module
The cutoff filter of case is bonded on lens bracket by glue.And the present invention pass through cutoff filter is straight
It connects and is attached to 2 surface of chip photosensitive area, then carry out MOC injection moldings again, to prevent injection moulding plastic 7 to overflow to chip photosensitive area
2, such as Fig. 4.
Compared with prior art, above-described embodiment have the advantage that for：Chip photosensitive area is protected by optical filter,
Injection moulding plastic will not overflow to chip photosensitive area, the problem of avoiding plastic cement overflow.
Several preferred embodiments of the present invention have shown and described in above description, but as previously described, it should be understood that the present invention
Be not limited to form disclosed herein, be not to be taken as excluding other embodiments, and can be used for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through in the scope of the invention is set forth herein
It is modified.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be in this hair
In the protection domain of bright appended claims.
Claims (3)
1. a kind of camera module method for filling, it is characterised in that：Include the following steps：
Step 1, according to chip photosensitive area (2) size of sensitive chip (5) and the chip photosensitive area (2) between pad
Distance designs the optical filter (6) of suitable dimension, the size of the optical filter (6) otherwise less than chip photosensitive area (2) size,
Sensitive chip pad (4) can not be covered simultaneously；
The optical filter (6) is attached on the chip photosensitive area (2) by step 2, covers the chip photosensitive area (2) and not
Cover the sensitive chip pad (4)；
Step 3 binds the sensitive chip (5) and circuit board (1)；
Step 4 is positioned in the mold for molding, and the method molded using plastic packaging injects note on the circuit board (1)
It moulds plastic cement (7) and forms a plastic-sealed body, which coats the non-photo-sensing area of the sensitive chip (5)；
Step 5 installs other assemblies on the basis of the plastic-sealed body.
2. according to camera module method for filling as described in claim 1, it is characterised in that：The step 3 can be placed on institute
Stating becomes new step one before step 1, the step 1 becomes new step two, and the step 2 becomes new step
Three.
3. according to camera module method for filling as described in claim 1, it is characterised in that：The optical filter (6) is infrared
Edge filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810095325.0A CN108407197B (en) | 2018-01-31 | 2018-01-31 | Camera module packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810095325.0A CN108407197B (en) | 2018-01-31 | 2018-01-31 | Camera module packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108407197A true CN108407197A (en) | 2018-08-17 |
| CN108407197B CN108407197B (en) | 2020-10-23 |
Family
ID=63126622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810095325.0A Active CN108407197B (en) | 2018-01-31 | 2018-01-31 | Camera module packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108407197B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111371970A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN113161430A (en) * | 2021-01-22 | 2021-07-23 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, manufacturing method thereof, camera module and electronic equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106993123A (en) * | 2017-04-11 | 2017-07-28 | 昆山丘钛微电子科技有限公司 | Minimize cam device and preparation method thereof |
-
2018
- 2018-01-31 CN CN201810095325.0A patent/CN108407197B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106993123A (en) * | 2017-04-11 | 2017-07-28 | 昆山丘钛微电子科技有限公司 | Minimize cam device and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 周圣源 等: "《高工专物理学》", 31 May 1996, 高等教育出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111371970A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111371970B (en) * | 2018-12-26 | 2022-03-15 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN113161430A (en) * | 2021-01-22 | 2021-07-23 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, manufacturing method thereof, camera module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108407197B (en) | 2020-10-23 |
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