CN108401363A - Board structure of circuit - Google Patents
Board structure of circuit Download PDFInfo
- Publication number
- CN108401363A CN108401363A CN201710067629.1A CN201710067629A CN108401363A CN 108401363 A CN108401363 A CN 108401363A CN 201710067629 A CN201710067629 A CN 201710067629A CN 108401363 A CN108401363 A CN 108401363A
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- Prior art keywords
- conductive layer
- circuit
- hole structure
- angle
- layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of board structure of circuit comprising the first conductive layer, dielectric layer and through-hole structure.The dielectric layer is located on first conductive layer.The through-hole structure forms a conductive path in the dielectric layer, and the both ends of the through-hole structure connect first conductive layer.Thereby, the through-hole structure can be further utilized to save the wiring space on conductive layer.
Description
Technical field
The invention relates to a kind of circuit boards, and in particular to a kind of board structure of circuit.
Background technology
In general, multilayer circuit board includes multiple conductive layers and at least one dielectric layer, and wherein conductive layer can be used as cloth
Line use or provide earthing potential, and dielectric layer then to bond and completely cut off up and down two conductive layers.In addition, via hole
The purposes of (through hole) is to let the signal go through dielectric layer and transmitted between different conductive layers.For example, in order to allow cloth
The electronic component being located on a certain conductive layer is electrically connected to another conductive layer, and a via hole can be arranged on the two conductions
Between layer.The both ends of this via hole are respectively connected to the two conductive layers for needing to be electrically connected, and run through this to create
One conductive path of two conductive layers.If being hindered (for example, walking in addition, existing between two positions on the same conductive layer
Line or the plane of disruption), then can circuit be first directed to another conductive layer through a via hole, recycle another above-mentioned conduction
Another via hole is arranged in layer, and circuit is led back to come, to cross over the obstruction.
Invention content
The present invention provides a kind of board structure of circuit, and the through-hole structure in this board structure of circuit, which is arranged, to be further utilized to
Save the wiring space on conductive layer.
One embodiment of the invention provides a kind of board structure of circuit comprising the first conductive layer, dielectric layer and via hole knot
Structure.The dielectric layer is located on first conductive layer.The through-hole structure forms a conductive path in the dielectric layer,
And the both ends of the through-hole structure connect first conductive layer.
In one embodiment of this invention, the through-hole structure includes first connecting portion, second connecting portion and turning point.
The first end of the first connecting portion connects first conductive layer, and the first end connection described first of the second connecting portion is led
Electric layer, and the second end of the first connecting portion connects the second end of the second connecting portion via the turning point, with shape
At the conductive path.
In one embodiment of this invention, there is the first angle between the first connecting portion and first conductive layer,
There is the second angle, wherein the angle of first angle and described the between the second connecting portion and first conductive layer
The angle of two angles is smaller than 90 degree.
In one embodiment of this invention, the angle of first angle is identical to the angle of second angle.
In one embodiment of this invention, the through-hole structure is being connected in the first of first conductive layer
Electronic component and the second electronic component for being set to first conductive layer.
In one embodiment of this invention, the board structure of circuit further includes the second conductive layer.The dielectric layer is located at
Between first conductive layer and second conductive layer.The through-hole structure is not connected to second conductive layer.
In one embodiment of this invention, the board structure of circuit further includes the second conductive layer.The dielectric layer is located at
Between first conductive layer and second conductive layer.The through-hole structure is also connected with second conductive layer.
In one embodiment of this invention, the through-hole structure includes first connecting portion, second connecting portion, third connection
Portion and turning point.The first end of the first connecting portion connects first conductive layer.The first end of the second connecting portion connects
Connect first conductive layer.The first end of the third interconnecting piece connects second conductive layer.The of the first connecting portion
Two ends connect the second end of the second end and the third interconnecting piece of the second connecting portion via the turning point.
In one embodiment of this invention, the through-hole structure is being connected in the first of first conductive layer
Electronic component, the second electronic component for being set to first conductive layer and the third electronics for being set to second conductive layer
Element.
In one embodiment of this invention, first conductive layer is signals layer.
In one embodiment of this invention, first conductive layer is ground plane.
The first conductive layer, dielectric layer and through-hole structure are included at least based on above-mentioned, of the invention board structure of circuit.It is described
Dielectric layer is located on first conductive layer.The through-hole structure forms a conductive path, and institute in the dielectric layer
The both ends for stating through-hole structure connect first conductive layer.Thereby, signal can be merely by this through-hole structure and same
It is transmitted between two endpoints on a conductive layer, without being connected to another conductive layer, to save the cloth on conductive layer
Space of lines
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to coordinate attached drawing to make
Carefully it is described as follows.
Description of the drawings
Fig. 1 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 1 b are the schematic three dimensional views of the through-hole structure depicted in an embodiment according to the present invention.
Fig. 2 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 2 b and Fig. 2 c are the partial top views of the conductive layer depicted in an embodiment according to the present invention.
Fig. 2 d are the three-dimensional portion schematic diagrames of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 3 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 3 b and Fig. 3 c are the partial top views of the conductive layer depicted in an embodiment according to the present invention.
Fig. 4 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 4 b are the schematic three dimensional views of the through-hole structure depicted in an embodiment according to the present invention.
Fig. 5 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 5 b and Fig. 5 c are the partial top views of the conductive layer depicted in an embodiment according to the present invention.
Fig. 6 a are the schematic three dimensional views of the through-hole structure depicted in an embodiment according to the present invention.
Fig. 6 b are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 6 c are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Fig. 6 d are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.
Symbol description
10、20、30、40、50、60、61、62：Board structure of circuit
100、200、300、400、500、600：Through-hole structure
101、102、301、302、401、402、403、601、602、603、604：Interconnecting piece
103、303、404、605：Turning point
110、120、210、230、310、320、330、340、410、420、510、520、610、620：Conductive layer
130、220、350、430、530、630：Dielectric layer
A1、A2、A3：Angle
201、202、203：Soldered ball
204、311、312、312、511、512、513、521：Conducting wire
205、206：Via hole
207：The plane of disruption
208、209：Return flow path
641、642：Boring direction
Specific implementation mode
Fig. 1 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.Fig. 1 a are please referred to,
Board structure of circuit 10 includes through-hole structure 100, conductive layer (being also known as the first conductive layer) 110 and dielectric layer 130.Dielectric layer
130 are located on conductive layer 110.Through-hole structure 100 forms a conductive path, and through-hole structure 100 in dielectric layer 130
Both ends all connect conductive layer 110.
Fig. 1 b are the schematic three dimensional views of the through-hole structure depicted in an embodiment according to the present invention.Please refer to Fig. 1 a with
Fig. 1 b, through-hole structure 100 include interconnecting piece (being also known as first connecting portion) 101, interconnecting piece (being also known as second connecting portion) 102
And turning point 103.The first end of interconnecting piece 101 connects conductive layer 110.The first end of interconnecting piece 102 also connects conductive layer 110.
The second end of interconnecting piece 101 is connect via turning point 103 with the second end of interconnecting piece 102.100 inside of through-hole structure can be coated with
Metal or nonmetallic equal conductive materials, to form the conduction between the first end of interconnecting piece 101 and the first end of interconnecting piece 102
Path, such as the oblique line portion in Fig. 1 a and Fig. 1 b.In addition, junction between the first end and conductive layer 110 of interconnecting piece 101 with
And the junction between the first end and conductive layer 110 of interconnecting piece 102 can also be respectively arranged with weld pad (pad) or similar structures,
As shown in Figure 1 b.
In one embodiment, board structure of circuit 10 further includes conductive layer (being also known as the second conductive layer) 120.Dielectric layer 130
Between conductive layer 110 and conductive layer 120.For example, dielectric layer 130 is to bind conductive layer 110 and conductive layer 120, or
Completely cut off the electric connection of conductive layer 110 and conductive layer 120.It is noted that in this embodiment, the two of through-hole structure 100
End is all connected to conductive layer 110, and is not connected to conductive layer 120.Therefore, the conductive path formed by through-hole structure 100
Can merely by conductive layer 110, return conductive layer 110 via dielectric layer 130 (dielectric layer 130 itself is non-conductive), from
And provide the transmission path of transmission signal between two endpoints on the same conductive layer 110.
In one embodiment, there is an angle (being also known as the first angle) A1, even between interconnecting piece 101 and conductive layer 110
There is another angle (being also known as the first angle) A2, and the angle of included angle A 1 and included angle A 2 between socket part 102 and conductive layer 110
Angle is smaller than 90 degree, as shown in Figure 1a.In addition, (turning between the second end and the second end of interconnecting piece 102 of interconnecting piece 101
Folding part 103) also there are one angle (being also known as third angle) A3 for tool, and the angle of included angle A 3 is again smaller than 90 degree.Therefore, via hole
Structure 100 is the structure having similar to a V-shaped, and the sum total of included angle A 1, the angle of A2 and A3 is about 180 degree.
In one embodiment, the angle of included angle A 1 is identical to the angle of included angle A 2.In one embodiment, the angle of included angle A 1
Different from the angle of included angle A 2.In one embodiment, the angle of the angle of included angle A 1, the angle of included angle A 2 and included angle A 3 all phases
Together.In one embodiment, the angle of the angle of included angle A 1, the angle of included angle A 2 and included angle A 3 is all different.It is noted that herein
Refer to it is identical can refer to identical or substantially identical.Wherein, identical refers to that there is no errors (comprising artificial or non-
The error that human factor generates), and substantially identical then permissible nearmis exists.In addition, in one embodiment, included angle A 3
Angle can be more than the angle of included angle A 1 and/or included angle A 2.Alternatively, in one embodiment, the angle of included angle A 3 can be less than included angle A 1
And/or the angle of included angle A 2.
In one embodiment, if the distance between conductive layer 110 and conductive layer 120 are remoter, (or the width of dielectric layer 130 is got over
It is wide), then the angle of the angle of included angle A 1 and/or included angle A 2 may correspond to increase, and the angle of included angle A 3 may correspond to and subtract
It is few.Conversely, if the distance between conductive layer 110 and conductive layer 120 are nearlyr (or the width of dielectric layer 130 is narrower), included angle A 1
Angle and/or the angle of included angle A 2 may correspond to reduction, and the angle of included angle A 3 may correspond to increase.In other words, exist
In one embodiment, the angle of included angle A 1 and/or included angle A 2 can be positively correlated with the distance between conductive layer 110 and conductive layer 120, and
The angle of included angle A 3 then can negative about the distance between conductive layer 110 and conductive layer 120.Thereby, it can avoid through-hole structure
100 turning point 103 touches (or being connected to) conductive layer 120.In addition, in one embodiment, included angle A 1, the angle of A2 and A3
It may be unrelated with the distance between conductive layer 120 with conductive layer 110.
Fig. 2 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.Fig. 2 a are please referred to,
Board structure of circuit 20 includes through-hole structure 200, conductive layer 210, dielectric layer 220 and conductive layer 230.Dielectric layer 220, which is located at, leads
Between electric layer 210 and conductive layer 230.Through-hole structure 200 is arranged in dielectric layer 220 and the both ends of through-hole structure 200
It is all connected to conductive layer 210.
In the present embodiment, conductive layer 210 is ground plane, and conductive layer 230 is signals layer.Therefore, conductive layer 210 is main
To provide an earthing potential, and conductive layer 230 is then mainly used for laying the various electronic components such as conducting wire.In the present embodiment,
Conductive layer 230 is provided with soldered ball (solder ball) 201,202,203 and conducting wire 204.Via hole 205 is being situated between with 206 settings
In electric layer 220.It is noted that the both ends of via hole 205 and the both ends of via hole 206 be all separately connected conductive layer 210 with
Conductive layer 230, rather than if the both ends of through-hole structure 200 are to be connected to conductive layer 210.In addition, via hole 205 and via hole
206 are vertically installed between conductive layer 210 and conductive layer 230.
Fig. 2 b and Fig. 2 c are the partial top views of the conductive layer depicted in an embodiment according to the present invention.Please refer to Fig. 2 a
With Fig. 2 b, conducting wire 204 is laid in conductive layer 230, and the both ends of conducting wire 204 are separately connected soldered ball 201 and 202 on conductive layer 230
Tie point.In figure 2 c, there are one the planes of disruption 207 for the tool of conductive layer 210, and the both ends of through-hole structure 200 are in conductive layer 210
Across this plane of disruption 207.
Fig. 2 d are the three-dimensional portion schematic diagrames of the board structure of circuit depicted in an embodiment according to the present invention.Please join together
According to Fig. 2 b, 2c and 2d, the plane of disruption 207 positioned at conductive layer 210 is blocked on the best return flow path of signal.If conducting is not used
Pore structure 200 crosses over the plane of disruption 207, then signal will need to bypass the plane of disruption 207 from outside in the return flow path of conductive layer 210
(being similar to loop path 209), is significantly increased the length of signal return flow path.If in addition, disconnected to same using both ends
The via hole (such as via hole 205 and 206) of conductive layer flows back to attempt to create in another conductive layer (such as conductive layer 230)
Path will certainly then occupy additional wiring space to cross over the plane of disruption 207 on remaining conductive layer.If however, such as this implementation
Example crosses over the plane of disruption 207 through through-hole structure 200, then can be by close to the signal return flow path 208 of shorter (or preferably)
It establishes, and need not also occupy the wiring space of other conductive layers (such as conductive layer 230).
Fig. 3 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.Fig. 3 a are please referred to,
Board structure of circuit 30 includes through-hole structure 300, conductive layer 310, conductive layer 320, conductive layer 330, conductive layer 340 and dielectric layer
350.In the present embodiment, conductive layer 310 and conductive layer 340 are signals layer.One of conductive layer 320 and conductive layer 330
For bus plane, and conductive layer 320 is ground plane with the wherein another of conductive layer 330.In addition, dielectric layer 350 is actually three
Layer to bind conductive layer 310, conductive layer 320, conductive layer 330 and conductive layer 340, or completely cuts off conductive layer 310, leads
Electric connection between electric layer 320, conductive layer 330 and conductive layer 340.
The both ends of through-hole structure 300 are all connected to conductive layer 310 and can be respectively connected to be set to conductive layer 310
Electronic component.From the point of view of more specific, through-hole structure 300 includes interconnecting piece 301, interconnecting piece 302 and turning point 303.Interconnecting piece 301
First end be connected in the electronic component (be also known as the first electronic component) of conductive layer 310, and the of interconnecting piece 302
One end connection is similarly provided at another electronic component (being also known as the second electronic component) of conductive layer 310.In addition, interconnecting piece
301 second end connects the second end of interconnecting piece 302 via turning point 303.
It is noted that in the embodiment of figure 3a, through-hole structure 300 passes through conductive layer 320 and two layers of dielectric
Layer, and through-hole structure 300 is not electrically connected conductive layer 340.However, in another embodiment, through-hole structure 300 is also possible to
Across the dielectric layer 350 of more layers (such as three layers) or fewer layers (such as one layer), it is not passed through conductive layer 320 or further wears
Conductive layer 330 is crossed, as long as not being electrically connected with conductive layer 340.
Fig. 3 b and Fig. 3 c are the partial top views of the conductive layer depicted in an embodiment according to the present invention.Please refer to Fig. 3 a
With Fig. 3 b, through-hole structure 300 is not connected to conductive layer 340, therefore the connection of through-hole structure 300 is not present in conductive layer 340
Point.Please refer to Fig. 3 c, conductive layer 310 is laid with conducting wire 311,312,313, wherein conducting wire 311 through through-hole structure 300 in leading
One tie point of electric layer 310 is connected to through-hole structure 300, and conducting wire 311 penetrates through-hole structure 300 in conductive layer 310
Another tie point is connected to through-hole structure 300.In addition, conducting wire 313 is blocked between conducting wire 311 and conducting wire 312.Thereby, i.e.,
Make the not additional cabling on conductive layer 340 (or other conductive layers), through-hole structure 300 that can directly be created in dielectric layer 350
Make the conductive path across conducting wire 313, and using this conductive path come electrical connecting wire 311 and conducting wire 312, and not with lead
Electric layer 313 is electrically connected.
Fig. 4 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.Fig. 4 a are please referred to,
Board structure of circuit 40 includes through-hole structure 400, conductive layer 410, conductive layer 420 and dielectric layer 430.It is noted that at this
In embodiment, other than the both ends of through-hole structure 400 are connected to conductive layer 410, through-hole structure 400 is additionally coupled to conductive layer
420。
Fig. 4 b are the schematic three dimensional views of the through-hole structure depicted in an embodiment according to the present invention.Please refer to Fig. 4 a with
Fig. 4 b, through-hole structure 400 include interconnecting piece 401, interconnecting piece 402, interconnecting piece (being also known as third interconnecting piece) 403 and turning point
404.The first end of interconnecting piece 401 connects conductive layer 410.The first end of interconnecting piece 402 also connects conductive layer 410.Interconnecting piece 403
First end connect conductive layer 420.The second end of interconnecting piece 401 is electrically connected the second end of interconnecting piece 402 via turning point 404
With the second end of interconnecting piece 403.It can be coated with metal or nonmetallic equal conductive materials inside through-hole structure 400, led to be formed
Power path, such as the oblique line portion in Fig. 4 a and Fig. 4 b.In addition, the connection between the first end and conductive layer 410 of interconnecting piece 401
The first end and conductive layer 420 of junction and interconnecting piece 403 between place, the first end of interconnecting piece 402 and conductive layer 410
Between junction can also be respectively arranged with weld pad or similar structures, as shown in Figure 4 b.From the point of view of another angle, through-hole structure
400 be the structure having similar to a y font, and the angle between interconnecting piece 403 and conductive layer 420 is again smaller than 90 degree.
Fig. 5 a are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.Fig. 5 a are please referred to,
Board structure of circuit 50 includes through-hole structure 500, conductive layer 510, conductive layer 520 and dielectric layer 530.In the present embodiment, it leads
Electric layer 510 and conductive layer 520 are all signals layer, and can also have other conductive layers, the present invention not to be limited in dielectric layer 530
System.Two endpoints of through-hole structure 500 are respectively connected to be set to the electronic component of conductive layer 510, and through-hole structure 500
Third endpoint be connected to the electronic component for being set to conductive layer 520.
Fig. 5 b and Fig. 5 c are the partial top views of the conductive layer depicted in an embodiment according to the present invention.Please refer to Fig. 5 a
With Fig. 5 b, one end of through-hole structure 500 is connected to the conducting wire 521 for being set to conductive layer 520.Fig. 5 a and Fig. 5 c are please referred to, is led
The other end of through-hole structure 500 is connected to the conducting wire 511 for being set to conductive layer 510, and the another end connection of through-hole structure 500
To the conducting wire 512 for being set to conductive layer 510.In addition, the conducting wire 513 for being set to conductive layer 510 is blocked in conducting wire 511 and conducting wire
Between 512.Similar to the embodiment of Fig. 3 a to Fig. 3 c, even if the not additional cabling on conductive layer 520 (or other conductive layers), leads
Through-hole structure 500 can directly create the conductive path across conducting wire 513 in dielectric layer 530, and utilize this conductive path
Come connecting wire 511 and conducting wire 512, and is not electrically connected with conducting wire 513.
It is noted that in above-mentioned multiple embodiments, mainly existed with describing through-hole structure using conducting wire as example
The electronic component connected on conductive layer.However, in other unmentioned embodiments, electricity that through-hole structure is connected in conductive layer
Subcomponent can also include the various electronic component further connected via the conducting wire.By taking Fig. 5 b and Fig. 5 c as an example, conducting wire
511 one end is to be connected to through-hole structure 500 in a tie point of conductive layer 510, and the other end of conducting wire 511 is, for example, to connect
To a particular electrical circuit (being also known as the first circuit).One end of conducting wire 512 is connected to through-hole structure 500 in conductive layer 510
Another tie point, the other end of conducting wire 512 are, for example, to be connected to another particular electrical circuit (being also known as second circuit).In addition, conducting wire
521 one end is to be connected to through-hole structure 500 in the tie point of conductive layer 520, and the other end of conducting wire 521 is, for example, to be connected to
Another particular electrical circuit (being also known as tertiary circuit).Wherein, the first circuit and second circuit may all be disposed on conductive layer 510 or
Other conductive layers, tertiary circuit are also likely to be to be set to conductive layer 520 or other conductive layers.Through through-hole structure 500, first
Circuit, second circuit and tertiary circuit can be at the state being electrically connected to each other.In one embodiment, the first circuit, the second electricity
At least one of road and tertiary circuit (for example, tertiary circuit) are possibly used for being transmitted via through-hole structure 500
Signal (for example, the signal transmitted between the first circuit and second circuit) carries out control related with voltage, electric current or impedance.
Alternatively, in one embodiment, the electronic component being arranged in conductive layer can also be connected to through-hole structure not via conducting wire.
Fig. 6 a are the schematic three dimensional views of the through-hole structure depicted in an embodiment according to the present invention.Fig. 6 a are please referred to,
Through-hole structure 600 include interconnecting piece 601, interconnecting piece 602, interconnecting piece 603, interconnecting piece (be also known as the 4th interconnecting piece) 604 and
Turning point 605.Interconnecting piece 601, interconnecting piece 602, interconnecting piece 603 and interconnecting piece 604 are connected to each other via turning point 605.Example
Such as, through-hole structure 600 is with the structure similar to an X font.In addition, be coated with inside through-hole structure 600 metal or
Nonmetallic equal conductive materials, to form conductive path, such as the oblique line portion in Fig. 6 a.
Fig. 6 b are the partial side elevation views of the board structure of circuit depicted in an embodiment according to the present invention.Fig. 6 c are according to this
The partial side elevation view of board structure of circuit depicted in one embodiment of invention.Fig. 6 d are depicted in an embodiment according to the present invention
Board structure of circuit partial side elevation view.Fig. 6 b are please referred to, the through-hole structure needed for being formed is (for example, the via hole of Fig. 1 b
The through-hole structure 400 of structure 100 or Fig. 4 b) when, it can first be carried out in board structure of circuit 60 with 642 along boring direction 641
It drills and plates conductive material in the aperture drilled out, to which through-hole structure 600 to be configured in board structure of circuit 60.This
When, through-hole structure 600 is located in dielectric layer 630 and the both ends of through-hole structure 600 are connected to conductive layer 610.In addition, conducting
The other both ends of pore structure 600 are then connected to conductive layer 620.In an embodiment of Fig. 6 b, board structure of circuit 60 can be used.
It is connected in the embodiment of Fig. 6 b, if being intended to form the through-hole structure 100 similar to Fig. 1 b in board structure of circuit 60,
The boring bar tool of relatively large radius may be used to drill in board structure of circuit 60 with 642 again along boring direction 641, with
Destroy in through-hole structure 600 interconnecting piece 603 that is connect with conductive layer 620 and 604 and conductive material therein.And via hole
Interconnecting piece 601, interconnecting piece 602 and turning point 605 in structure 600 can be retained.After destruction, the circuit board such as Fig. 6 c can be generated
Structure 61.
In addition, the embodiment of Fig. 6 b is equally connected in, if being intended to form the conducting similar to Fig. 4 b in board structure of circuit 60
Pore structure 400, may be used the boring bar tool of above-mentioned relatively large radius again along boring direction 641 in board structure of circuit 60 into
Row drilling, to destroy the interconnecting piece 604 being connect with conductive layer 620 in through-hole structure 600 and conductive material therein.And it leads
Interconnecting piece 601, interconnecting piece 602, interconnecting piece 603 and turning point 605 in through-hole structure 600 can be retained.After destruction, it can generate
Such as the board structure of circuit 62 of Fig. 6 d.
It is noted that in an embodiment of Fig. 6 c or Fig. 6 d, along boring direction 641 for the broken of interconnecting piece 604
Bad depth can be less than the initial drilling depth for being used for creating interconnecting piece 604, and/or the embodiment in Fig. 6 d in figure 6b
In, the collapse dept of interconnecting piece 603 can be less than along boring direction 642 and be initially used for creating interconnecting piece in figure 6b
603 drilling depth.In other words, in an embodiment of Fig. 6 c, the interconnecting piece 603 and/or one that sub-fraction is not destroyed is small
The interconnecting piece 604 that part is not destroyed may be considered as the turning point being contained in finally formed through-hole structure 600
605.Alternatively, in an embodiment of Fig. 6 d, the interconnecting piece 604 that sub-fraction is not destroyed may be considered as being contained in finally
Turning point 605 in the through-hole structure 600 of formation.In one embodiment, retaining the sub-fraction of some interconnecting piece can drop
The problem of electromagnetic interference (EMI) that low high-frequency signal is generated when this through-hole structure 600 transmits is with electromagnetic compatibility (EMC), into
And signal transmitting quality can be made to increase.But, if the part that retain some interconnecting piece is not destroyed or completely to be destroyed
Demand adjustment in all visual practice of some interconnecting piece, the present invention do not limit.
In conclusion the board structure of circuit of the present invention includes at least a through-hole structure, can be formed in dielectric layer
One conductive path, and the both ends of the through-hole structure can connect the different electronic components of the same conductive layer.Thereby, signal
It can transmit between two endpoints by this through-hole structure and on the same conductive layer merely, it is another without being connected to
A conductive layer.In addition, the through-hole structure can also further connect the electronic component of another signals layer, to increase electricity
Road harden structure uses elasticity.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
Middle tool usually intellectual, without departing from the spirit and scope of the present invention, when can make some changes and embellishment, thus it is of the invention
Protection domain should be defined by the scope of the appended claims.
Claims (11)
1. a kind of board structure of circuit, which is characterized in that including：
First conductive layer；
Dielectric layer is located on first conductive layer；And
Through-hole structure forms conductive path in the dielectric layer, and the both ends of the through-hole structure connect first conduction
Layer.
2. board structure of circuit as described in claim 1, which is characterized in that the through-hole structure includes first connecting portion, second
Interconnecting piece and turning point,
The first end of the wherein first connecting portion connects first conductive layer, and the first end of the second connecting portion connects this and first leads
Electric layer, and the second end of the first connecting portion connects the second end of the second connecting portion via the turning point, is led with forming this
Power path.
3. board structure of circuit as claimed in claim 2, which is characterized in that have between the first connecting portion and first conductive layer
There is the first angle, there is the second angle between the second connecting portion and first conductive layer,
The wherein angle of first angle and the angle of second angle is smaller than 90 degree.
4. board structure of circuit as claimed in claim 3, which is characterized in that the angle of first angle is identical to second angle
Angle.
5. board structure of circuit as described in claim 1, which is characterized in that the through-hole structure to be connected in this first
First electronic component of conductive layer and the second electronic component for being set to first conductive layer.
6. board structure of circuit as described in claim 1, which is characterized in that further include the second conductive layer, the wherein dielectric layer position
Between first conductive layer and second conductive layer,
Wherein the through-hole structure is not connected to second conductive layer.
7. board structure of circuit as described in claim 1, which is characterized in that further include the second conductive layer, the wherein dielectric layer position
Between first conductive layer and second conductive layer,
Wherein the through-hole structure is also connected with second conductive layer.
8. board structure of circuit as claimed in claim 7, which is characterized in that the through-hole structure includes first connecting portion, second
Interconnecting piece, third interconnecting piece and turning point,
The first end of the wherein first connecting portion connects first conductive layer, and the first end of the second connecting portion connects this and first leads
The first end of electric layer, the third interconnecting piece connects second conductive layer,
Wherein the second end of the first connecting portion connects the second end of the second connecting portion via the turning point and is connect with the third
The second end in portion.
9. board structure of circuit as claimed in claim 7, which is characterized in that the through-hole structure to be connected in this first
First electronic component of conductive layer, the second electronic component for being set to first conductive layer and it is set to second conductive layer
Third electronic component.
10. board structure of circuit as described in claim 1, which is characterized in that first conductive layer is signals layer.
11. board structure of circuit as described in claim 1, which is characterized in that first conductive layer is ground plane.
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| CN201710067629.1A CN108401363B (en) | 2017-02-07 | 2017-02-07 | Circuit board structure |
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| CN201710067629.1A CN108401363B (en) | 2017-02-07 | 2017-02-07 | Circuit board structure |
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| CN108401363B CN108401363B (en) | 2021-04-06 |
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| JP2004273790A (en) * | 2003-03-10 | 2004-09-30 | Sony Corp | Process for fabricating semiconductor device |
| US20100071951A1 (en) * | 2005-10-31 | 2010-03-25 | Tokuo Yoshida | Multilayer wiring board and method for manufacturing multilayer wiring board |
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| Publication number | Publication date |
|---|---|
| CN108401363B (en) | 2021-04-06 |
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