CN108400120A - Fingerprint identification packaging structure - Google Patents
Fingerprint identification packaging structure Download PDFInfo
- Publication number
- CN108400120A CN108400120A CN201710513512.1A CN201710513512A CN108400120A CN 108400120 A CN108400120 A CN 108400120A CN 201710513512 A CN201710513512 A CN 201710513512A CN 108400120 A CN108400120 A CN 108400120A
- Authority
- CN
- China
- Prior art keywords
- identification
- fingerprint
- carrier
- circuit
- line carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 claims description 44
- 230000001070 adhesive effect Effects 0.000 claims description 44
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000000084 colloidal system Substances 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides a fingerprint identification packaging structure which comprises a first circuit carrier, a fingerprint identification chip, a sealing colloid and a plurality of welding balls. First circuit carrier includes relative first face and second face, and first face has the fingerprint circuit of discerning. The fingerprint identification chip is arranged on the second surface of the first circuit carrier and is electrically connected to the first circuit carrier in a routing mode. The sealing colloid is arranged on the first line carrier and encapsulates the fingerprint identification chip, wherein the sealing colloid comprises a plurality of through holes which are respectively and electrically connected with the first line carrier. The solder balls are arranged on the sealing colloid and are electrically connected with the via holes. The fingerprint identification packaging structure can identify fingerprints and has low cost.
Description
Technical field
The present invention relates to a kind of encapsulating structure more particularly to a kind of identification of fingerprint encapsulating structures.
Background technology
With the development of science and technology more and more need the electronic device for recognizing user's information to come into being, such as refer to
Line recognizes encapsulating structure, and such identification of fingerprint encapsulating structure can be installed in all kinds of electronic products, such as smart mobile phone, movement
Phone, tablet computer, laptop and personal digital assistant (PDA) etc., to recognize the fingerprint of user, and will be how
The identification of fingerprint encapsulating structure that low cost can be produced is that the project inquired into is wanted in this field.
Invention content
The present invention provides a kind of identification of fingerprint encapsulating structure, can recognize fingerprint and with low cost.
A kind of identification of fingerprint encapsulating structure of the present invention, including first line carrier, identification of fingerprint chip, adhesive body and more
A soldered ball.First line carrier includes opposite the first face and the second face, and the first face has identification of fingerprint circuit.Identification of fingerprint core
Piece is arranged on the second face of first line carrier and is electrically connected at first line carrier in a manner of routing.Adhesive body is arranged
In on first line carrier and encapsulating identification of fingerprint chip, wherein adhesive body includes multiple via holes, is electrically connected in the
One circuit carrier.Multiple soldered balls are configured at adhesive body and are electrically connected at multiple via holes.
In one embodiment of this invention, conductive metal is filled out in above-mentioned multiple via holes, to be electrically connected in
One circuit carrier.
A kind of identification of fingerprint encapsulating structure of the present invention, including first line carrier, identification of fingerprint chip, adhesive body and the
The road-load body in two wires.Identification of fingerprint chip is arranged on first line carrier and that First Line is electrically connected in a manner of routing is road-load
Body.Adhesive body is set on first line carrier and encapsulates identification of fingerprint chip.Second circuit carrier be set on adhesive body and
It is electrically connected at first line carrier, the second circuit carrier includes opposite the first face and the second face, and first facing towards First Line
Road-load body, the second face have identification of fingerprint circuit.
In one embodiment of this invention, the second above-mentioned circuit carrier is flexible circuit carrier.
In one embodiment of this invention, above-mentioned first line carrier and the second circuit carrier are arranged respectively at adhesive body
Opposing sides, adhesive body includes multiple via holes, and each via hole is electrically connected at first line carrier and the second circuit
Carrier.
In one embodiment of this invention, above-mentioned identification of fingerprint encapsulating structure further includes multiple soldered balls, is respectively arranged at
First line carrier and it is electrically connected at identification of fingerprint chip.
In one embodiment of this invention, above-mentioned adhesive body exposes outside a part for first line carrier, the second circuit
A part for carrier bends downward from adhesive body and is connected to the part that first line carrier exposes to adhesive body.
In one embodiment of this invention, on the second above-mentioned circuit carrier setting tool identification of fingerprint circuit signal output line
Road, and bend downward and be connected on first line carrier.
In one embodiment of this invention, above-mentioned identification of fingerprint encapsulating structure, further includes multiple soldered balls, is respectively arranged at
First line carrier and it is electrically connected at identification of fingerprint chip.
There is identification of fingerprint by the first face of first line carrier based on above-mentioned, of the invention identification of fingerprint encapsulating structure
Identification of fingerprint chip is arranged on the second face of first line carrier and is electrically connected at First Line in a manner of routing by circuit
The adhesive body of road-load body, encapsulating identification of fingerprint chip includes being electrically connected at the via hole of first line carrier, and soldered ball is electrical
Multiple via holes are connected to, the finger print information received by identification of fingerprint circuit is transferred to fingerprint via first line carrier
Chip is recognized, and the information crossed through identification of fingerprint chip processing is transferred to the electricity outside other by via hole and soldered ball
Road.Another identification of fingerprint encapsulating structure of the present invention further includes the second circuit carrier, and identification of fingerprint circuit is changed configuration and is existed
Second circuit carrier can be electrically connected between first line carrier and the second circuit carrier by the via hole through adhesive body,
Or second circuit carrier can be flexible circuit carrier and be bent and electrical to the direction of first line carrier from adhesive body
It is connected to first line carrier.The identification of fingerprint chip of above-mentioned configuration is connected to first line carrier by way of routing, can
With lower cost.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to coordinate attached drawing to make
Carefully it is described as follows.
Description of the drawings
Fig. 1 is the schematic diagram according to a kind of identification of fingerprint encapsulating structure of one embodiment of the invention；
Fig. 2 is the schematic diagram according to a kind of identification of fingerprint encapsulating structure of another embodiment of the present invention；
Fig. 3 is the schematic diagram according to a kind of identification of fingerprint encapsulating structure of one more embodiment of the present invention.
Reference sign：
100、100a、100b：Identification of fingerprint encapsulating structure
105：Identification of fingerprint circuit
110：First line carrier
112：Second face
114：First face
116、118、119：Connection pad
120：Identification of fingerprint chip
122：Connection pad
125：Conducting wire
130：Adhesive body
132：Via hole
140：Soldered ball
150：Second circuit carrier
152：First face
154：Second face
156：Connection pad
Specific implementation mode
Fig. 1 is the schematic diagram according to a kind of identification of fingerprint encapsulating structure of one embodiment of the invention.Referring to Fig. 1, this
The identification of fingerprint encapsulating structure 100 of embodiment includes first line carrier 110, identification of fingerprint chip 120, adhesive body 130 and more
A soldered ball 140.First line carrier 110 includes opposite the first face 114 and the second face 112, and the first face 114 has identification of fingerprint
Circuit 105.Identification of fingerprint circuit 105 can be capacitance type fingerprint identification circuit 105, for example, including by multiple sensing electrodes (not
Display) the sensing array that is constituted, and the ridge using sensing electrode relative to finger surface is formed by capacitance difference with rill
It is different to obtain fingermark image.Alternatively, identification of fingerprint circuit 105 can also be resistance-type identification of fingerprint circuit or include luminous
The Eco-drive identification of fingerprint module etc. of unit and semiconductor photosensitive array, the type and identification mode of identification of fingerprint circuit 105 are simultaneously
It is not limited system.
Identification of fingerprint chip 120 is arranged on the second face 112 of first line carrier 110 and is electrically connected in a manner of routing
It is connected to first line carrier 110.Adhesive body 130 is set on first line carrier 110 and encapsulates identification of fingerprint chip 120, should
Adhesive body 130 is, for example, EMC (Epoxy molding compound) material.In the present embodiment, adhesive body 130 includes multiple
Via hole 132 is electrically connected in first line carrier 110.More particularly, conductive metal is filled out in multiple via holes 132,
The e.g. conductive metals such as gold, silver, copper, aluminium, iron, nickel or its alloy, to be electrically connected in first line carrier 110, but
In other embodiments, via hole 132 can also only have inner wall to have conductive layer, can also equally reach and be electrically connected at first
The effect of circuit carrier 110.In addition, multiple soldered balls 140 are configured at adhesive body 130 and are electrically connected at multiple via holes 132.
By above-mentioned configuration, the finger contact in user or the identification of fingerprint encapsulating structure 100 close to the present embodiment
After identification of fingerprint circuit 105, the finger print information received by identification of fingerprint circuit 105 can be via first line carrier 110
Connection pad 116, conducting wire 125, connection pad 122 are transferred to identification of fingerprint chip 120, and at row information in identification of fingerprint chip 120
Reason, can pass through connection pad 122, connection pad 116, connection pad 118, via hole 132 and soldered ball through 120 processed information of identification of fingerprint chip
140 and be transferred to the circuit (not shown) outside other.Above-mentioned configuration is comparatively simple in structure, and with the excellent of low cost
Point.
Certainly, the form of identification of fingerprint encapsulating structure 100 is not limited to this, other kind of identification of fingerprint encapsulation knot is described below
Structure 100.It should be noted that in the following embodiments, with the element that previous embodiment is same or like with identical or phase
As label indicate.
Fig. 2 is the schematic diagram according to a kind of identification of fingerprint encapsulating structure of another embodiment of the present invention.Referring to Fig. 2,
The identification of fingerprint encapsulating structure 100a of the present embodiment include first line carrier 110, identification of fingerprint chip 120, adhesive body 130,
Second circuit carrier 150 and multiple soldered balls 140.Identification of fingerprint chip 120 is arranged on first line carrier 110 and with routing
Mode is electrically connected at first line carrier 110.Adhesive body 130 is set on first line carrier 110 and encapsulates identification of fingerprint
Chip 120.
Second circuit carrier 150 is set on adhesive body 130 and is electrically connected at first line carrier 110, the second circuit
Carrier 150 includes opposite the first face 152 and the second face 154, and the first face 152 is towards first line carrier 110, the second face 154
With identification of fingerprint circuit 105.In the present embodiment, the second circuit carrier 150 be flexible circuit carrier, with it is lower at
This, but the type of the second circuit carrier 150 is not limited system.More particularly, as shown in Fig. 2, first line carrier 110 with
Second circuit carrier 150 is arranged respectively at the opposing sides of adhesive body 130.In the present embodiment, first line carrier 110 and
The length and width dimensions of the road-load body in two wires 150 are substantially the same, system that but not limited to this.Adhesive body 130 includes multiple via holes 132,
And each via hole 132 is electrically connected in first line carrier 110 and the second circuit carrier 150.Multiple soldered balls 140 are distinguished
It is configured at first line carrier 110 and is electrically connected at identification of fingerprint chip 120.
Therefore, in the contact of the finger of user or the identification of fingerprint of the identification of fingerprint encapsulating structure 100a of close the present embodiment
After circuit 105, finger print information received by identification of fingerprint circuit 105 can via the second circuit carrier 150, connection pad 156, lead
Through-hole 132, the connection pad 118 of first line carrier 110, connection pad 116, conducting wire 125, connection pad 122 are transferred to identification of fingerprint chip
120, and information processing is carried out in identification of fingerprint chip 120, it can pass through connection pad through 120 processed information of identification of fingerprint chip
122, conducting wire 125, the connection pad 116 of first line carrier 110, connection pad 118, connection pad 119 and soldered ball 140 and be transferred to outside other
Circuit (not shown).Identification of fingerprint circuit 105 is changed configuration on the second circuit carrier 150 by above-mentioned configuration, and makes cloth
Space of lines is dispersed on first line carrier 110 and the second circuit carrier 150, first line carrier 110 and the second circuit carrier
Cabling spacing on 150 can improve, and upper relatively simple in processing, flexible circuit carrier also can be selected in the second circuit carrier 150
To reduce cost.
Fig. 3 is the schematic diagram according to a kind of identification of fingerprint encapsulating structure of one more embodiment of the present invention.Referring to Fig. 3,
The main difference of the identification of fingerprint encapsulating structure 100a of identification of fingerprint the encapsulating structure 100b and Fig. 2 of Fig. 3 are, in the present embodiment
In, the length and width dimensions of first line carrier 110 and the second circuit carrier 150 are all higher than the length and width dimensions of adhesive body 130, and make
Adhesive body 130 exposes outside a part for (or not covering) first line carrier 110, and the second circuit carrier 150 is equipped with fingerprint
The signal output line road and connection pad 156 of identification circuit 105 and identification of fingerprint circuit 105,105, identification of fingerprint circuit are sealing
130 top of colloid, signal output line road are the second circuit carrier 150 in the left part of Fig. 3.Due to the second circuit carrier 150
It is flexible circuit carrier and bent, the e.g. flexible circuit carrier such as winding (PI) or film, the second circuit carrier 150
The part on signal output line road bent downward from adhesive body 130 and to be connected to first line carrier 110 with connection pad 156 exposed
It is electrically connected in the part of adhesive body 130, and with the connection pad 118 on first line carrier 110.
In the identification of fingerprint circuit of the identification of fingerprint encapsulating structure 100b of the finger contact or close the present embodiment of user
After 105, the finger print information received by identification of fingerprint circuit 105 can be via the connection pad 156, first of the second circuit carrier 150
Connection pad 118, connection pad 116, conducting wire 125, the connection pad 122 of circuit carrier 110 are transferred to identification of fingerprint chip 120, and are distinguished in fingerprint
Know and carry out information processing in chip 120, can pass through connection pad 122, conducting wire 125, the through 120 processed information of identification of fingerprint chip
The connection pad 116 of one circuit carrier 110, connection pad 119 and soldered ball 140 and be transferred to the circuit (not shown) outside other.Above-mentioned
Via hole 132 through adhesive body 130 in Fig. 2 is made into be bent downward by the second flexible circuit carrier 150 and be connected by configuration
Replace to first line carrier 110, processing is simple and cost is relatively low.
In conclusion the identification of fingerprint encapsulating structure of the present invention has identification of fingerprint by the first face of first line carrier
Identification of fingerprint chip is arranged on the second face of first line carrier and is electrically connected at First Line in a manner of routing by circuit
The adhesive body of road-load body, encapsulating identification of fingerprint chip includes being electrically connected at the via hole of first line carrier, and soldered ball is electrical
Multiple via holes are connected to, the finger print information received by identification of fingerprint circuit is transferred to fingerprint via first line carrier
Chip is recognized, and the information crossed through identification of fingerprint chip processing is transferred to the electricity outside other by via hole and soldered ball
Road.Another identification of fingerprint encapsulating structure of the present invention further includes the second circuit carrier, and identification of fingerprint circuit is changed configuration and is existed
Second circuit carrier can be electrically connected between first line carrier and the second circuit carrier by the via hole through adhesive body,
Or second circuit carrier can be flexible circuit carrier and be bent and electrical to the direction of first line carrier from adhesive body
It is connected to first line carrier.The identification of fingerprint chip of above-mentioned configuration is connected to first line carrier by way of routing, can
With lower cost.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
Middle technical staff, without departing from the spirit and scope of the present invention, when can make a little change with retouching, therefore the present invention protection
Subject to range ought be defined depending on claim.
Claims (9)
1. a kind of identification of fingerprint encapsulating structure, which is characterized in that including：
First line carrier, including the first opposite face and the second face, first face have identification of fingerprint circuit；
Identification of fingerprint chip is arranged on second face of the first line carrier and is electrically connected in a manner of routing
The first line carrier；
Adhesive body is set on the first line carrier and encapsulates the identification of fingerprint chip, wherein the adhesive body includes
Multiple via holes are electrically connected in the first line carrier；And
Multiple soldered balls are configured at the adhesive body and are electrically connected at the multiple via hole.
2. identification of fingerprint encapsulating structure according to claim 1, which is characterized in that fill out conductive gold in the multiple via hole
Belong to, to be electrically connected in the first line carrier.
3. a kind of identification of fingerprint encapsulating structure, which is characterized in that including：
First line carrier；
Identification of fingerprint chip is arranged on the first line carrier and is electrically connected at the first line in a manner of routing
Carrier；
Adhesive body is set on the first line carrier and encapsulates the identification of fingerprint chip；And
Second circuit carrier is set on the adhesive body and is electrically connected at the first line carrier, second circuit
Carrier includes opposite the first face and the second face, and described first facing towards the first line carrier, and second face, which has, to be referred to
Line identification circuit.
4. identification of fingerprint encapsulating structure according to claim 3, which is characterized in that the second circuit carrier is can torsion line
Road-load body.
5. identification of fingerprint encapsulating structure according to claim 3 or 4, which is characterized in that the first line carrier and institute
The opposing sides that the second circuit carrier is arranged respectively at the adhesive body is stated, the adhesive body includes multiple via holes, and each
The via hole is electrically connected at the first line carrier and the second circuit carrier.
6. identification of fingerprint encapsulating structure according to claim 3, which is characterized in that further include：
Multiple soldered balls are respectively arranged at the first line carrier and are electrically connected at the identification of fingerprint chip.
7. identification of fingerprint encapsulating structure according to claim 3, which is characterized in that the adhesive body exposes outside described first
A part for a part for circuit carrier, the second circuit carrier bends downward from the adhesive body and is connected to described
One circuit carrier exposes to the part of the adhesive body.
8. identification of fingerprint encapsulating structure according to claim 7, which is characterized in that setting tool refers on the second circuit carrier
The signal output line road of line identification circuit, and bend downward and be connected on the first line carrier.
9. identification of fingerprint encapsulating structure according to claim 7, which is characterized in that further include：
Multiple soldered balls are respectively arranged at the first line carrier and are electrically connected at the identification of fingerprint chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106104144 | 2017-02-08 | ||
| TW106104144A TWI653725B (en) | 2017-02-08 | 2017-02-08 | Fingerprint identification package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108400120A true CN108400120A (en) | 2018-08-14 |
| CN108400120B CN108400120B (en) | 2020-03-13 |
Family
ID=63094295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710513512.1A Active CN108400120B (en) | 2017-02-08 | 2017-06-29 | Fingerprint identification packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108400120B (en) |
| TW (1) | TWI653725B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103168283A (en) * | 2010-10-18 | 2013-06-19 | 高通Mems科技公司 | Fabrication of touch, handwriting and fingerprint sensor |
| CN103730434A (en) * | 2012-10-11 | 2014-04-16 | 台湾积体电路制造股份有限公司 | Pop structures and methods of forming the same |
| US20150325556A1 (en) * | 2014-05-08 | 2015-11-12 | Siliconware Precision Industries Co., Ltd. | Package structure and method for fabricating the same |
| US20160026846A1 (en) * | 2014-07-22 | 2016-01-28 | Yi-Jun Lin | Flexible fingerprint sensor materials and processes |
| CN105940413A (en) * | 2013-08-08 | 2016-09-14 | 三星电子株式会社 | Fingerprint recognition device, manufacturing method therefor and electronic device |
| CN106356348A (en) * | 2015-07-24 | 2017-01-25 | 晨星半导体股份有限公司 | Capacitive sensor structure, circuit board structure with capacitive sensor and packaging structure of capacitive sensor |
-
2017
- 2017-02-08 TW TW106104144A patent/TWI653725B/en active
- 2017-06-29 CN CN201710513512.1A patent/CN108400120B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103168283A (en) * | 2010-10-18 | 2013-06-19 | 高通Mems科技公司 | Fabrication of touch, handwriting and fingerprint sensor |
| CN103730434A (en) * | 2012-10-11 | 2014-04-16 | 台湾积体电路制造股份有限公司 | Pop structures and methods of forming the same |
| CN105940413A (en) * | 2013-08-08 | 2016-09-14 | 三星电子株式会社 | Fingerprint recognition device, manufacturing method therefor and electronic device |
| US20150325556A1 (en) * | 2014-05-08 | 2015-11-12 | Siliconware Precision Industries Co., Ltd. | Package structure and method for fabricating the same |
| US20160026846A1 (en) * | 2014-07-22 | 2016-01-28 | Yi-Jun Lin | Flexible fingerprint sensor materials and processes |
| CN106356348A (en) * | 2015-07-24 | 2017-01-25 | 晨星半导体股份有限公司 | Capacitive sensor structure, circuit board structure with capacitive sensor and packaging structure of capacitive sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108400120B (en) | 2020-03-13 |
| TW201830630A (en) | 2018-08-16 |
| TWI653725B (en) | 2019-03-11 |
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