CN108395765A - Photosensitive solder resist white ink, LED circuit board and preparation method - Google Patents
Photosensitive solder resist white ink, LED circuit board and preparation method Download PDFInfo
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- CN108395765A CN108395765A CN201810083688.2A CN201810083688A CN108395765A CN 108395765 A CN108395765 A CN 108395765A CN 201810083688 A CN201810083688 A CN 201810083688A CN 108395765 A CN108395765 A CN 108395765A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
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- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Abstract
The present invention relates to belong to anti-solder ink technical field, refer in particular to a kind of photosensitive solder resist white ink, preparation method and the application in LED circuit board, including 30 35 parts of photosensitive resin, 58 parts of photoinitiator, 20 30 parts of titanium dioxide, 5 10 parts of nano silicon dioxide, 57 parts of nano zine oxide, 12 parts of antifoaming agent, 13 parts of adhesion promoter, 5 12 parts of dipropylene glycol methyl ether, 13 parts of levelling agent, 13 parts of antioxidant, the titanium dioxide by rutile type titanium white and anatase titanium dioxide according to 4:1 mass ratio composition；The grain size of the titanium dioxide is 5 10 μm；It solves that photosensitive solder resist white ink cost of material is high, resin temperature tolerance used is inadequate, the phenomenon that viscous, colour-darkening is returned in heating occurs.
Description
Technical field
The present invention relates to anti-solder ink technical field is belonged to, a kind of photosensitive solder resist white ink, LED circuit board are referred in particular to
And preparation method.
Background technology
Solder mask is one of the critical material of printed wiring board (PCB), and main function is to be not required to PCB surface
The circuit to be welded covers, situations such as to prevent from causing short circuit and oxidation in scolding tin.
Conventional liquid photosensitive solder mask, it is the ink that a kind of existing photocuring has heat cure again, photosensitive resin
It is to be obtained again with anhydride reaction after novolac epoxy resin is reacted with unsaturated carboxylic acid, because its resin contains acidic group, so
It can be developed with buck, excellent heat resistance after the ink solidification, but because solidification after-contraction is larger, solder mask is not resistant to bending.
Photosensitive resin synthesis using bisphenol A type epoxy resin either bisphenol f type epoxy resin or methylol bisphenol A type epoxy resin come
The product of novolac epoxy resin or partial alternative is substituted completely to synthesize photosensitive resin, is changed though this has in bending resistance
It is good but bending resistance is also inadequate, it may be only available for low-grade flex plate.Currently, photosensitive solder resist white ink cost of material height,
Resin temperature tolerance used in photosensitive solder resist white ink is inadequate, the phenomenon that viscous, colour-darkening is returned in heating occurs.
Invention content
The present invention is for a kind of photosensitive solder resist white ink of problem of the prior art offer, preparation method and on LED line road
Application in plate, solves that photosensitive solder resist white ink cost of material is high, resin temperature tolerance used is inadequate, occur heating return it is viscous,
The phenomenon that colour-darkening.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme that：
One of the objects of the present invention is to provide a kind of photosensitive solder resist white inks, including following component：
The titanium dioxide is by rutile type titanium white and anatase titanium dioxide according to 4:1 mass ratio composition；
The grain size of the titanium dioxide is 5-10 μm.
Every physical property of rutile titanium dioxide pigment is integrally better than anatase pigments, rutile-type titanium dioxide
The reeflectance ratio anatase titanium dioxide pigment of titanium pigment is high, and explanation will generate the other covering power of ad eundem, rutile-type two
Titanium oxide pigments amount ratio anatase titanium dioxide pigment is few.In addition, rutile titanium dioxide pigment compact structure, stability
Well, photochemical activity is small；And ultraviolet resistance irradiates, is not easy dusting；Weatherability and glossiness are all better than anatase titanium dioxide, but golden red
Costly, the present invention is by the collaboration of each component, using rutile type titanium white and anatase for the price of stone-type titanium dioxide
Type titanium dioxide is according to 4:Photosensitive solder resist white ink made from 1 mass ratio is equally with good performance, greatly reduces
The cost of material of photosensitive solder resist white ink.
The preparation of the photosensitive resin includes the following steps：
25 parts of union II toluene type epoxy resin are dissolved in 30 parts of ethylene glycol monobutyl ethers by step (1), and 20 parts of first are then added
Base acrylic acid, 2 parts of tetraethylammonium bromides and 3 parts of 2,6- di-tert-butyl-4-methy phenols are reacted, reaction temperature be 85~
115 DEG C, the reaction time is 5~15 hours, obtains reaction intermediate；
20 parts of maleic anhydrides are added in the reaction intermediate into step (1) and are reacted for step (2), and reaction temperature is
95~120 DEG C, the reaction time is 5~10 hours to get to photosensitive resin.
The photoinitiator includes 45-50 parts of radical photoinitiators, 5-8 parts of cationic photoinitiators and 5-8 parts
Photosensitizer；The radical photoinitiator is by 2,4,6- trimethylbenzoyls-hexichol phosphine oxide, 2- isopropyl thioxanthone anthracenes
Ketone, 2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone are according to mass ratio 3:2:1 composition；It is described sun from
Subtype photoinitiator is by mixed type triaryl hexafluorophosphoric acid sulfosalt, η 6- isopropylbenzene cyclopentadienyl iron hexafluorophosphates according to mass ratio 3:2
Composition.According to the photoinitiator component ratio in the present invention, the photoinitiator made has good light-initiated efficiency, can improve
Efficiency of initiation problem under LED light, and cost is relatively low, has broad application prospects.
The antioxidant is made of 20 parts of dimethyl ketone oxime, 20 portions of soybean oils, 4 parts of tert-butyl alcohols, 4 parts of atoleines.This
Invention antioxidant raw material is easily purchased, at low cost, does not contain petroleum mineral oil component, and whole oil series solvents are substituted with soya-bean oil,
Soya-bean oil, which has, is easy the characteristics such as degradation, hypotoxicity and low VOC, can effectively reduce the consumption of non-renewable resources in printing, to
Reduce the pollution to environment.
The antifoaming agent is by organic silicon modified by polyether, polysiloxanes according to mass ratio 3:2 compositions；
The adhesion promoter, levelling agent are the reagents of this field routine；
The grain size of the nano silicon dioxide is in 10-40nm；
The grain size of the nano-titanium dioxide is 20-40nm；
The grain size of the nano zine oxide is 20-40nm；
Realize photosensitive solder resist ink certainly by introducing titanium dioxide and zinc oxide in the photosensitive solder resist ink of the present invention
Clean function, it is possible to reduce the cleaning to wiring board, and then the service life of extension wire plate；Meanwhile by adding nanometer
Grade silicon dioxide, titanium dioxide, zinc oxide increase the mobility of photosensitive solder resist ink, simultaneously, additionally it is possible to reduce the surface of substance
Tension is added in ink, can carry out nano modification to pigment particle surface property, granules of pigments is made uniformly to disperse
It opens；The motility of granules of pigments can be adjusted, improves ink dispersibility, shortens jitter time.
The second object of the present invention is to provide a kind of preparation method of photosensitive solder resist white ink, include the following steps：
(1) by 30-35 parts of photosensitive resins, 5-8 photoinitiators, 20-30 parts of titanium dioxides, 5-10 parts of nano silicon dioxides, 5-7 parts of nano oxygens
Change zinc, 1-2 parts of antifoaming agent, 1-3 parts of adhesion promoters, 5-12 parts of dipropylene glycol methyl ethers, 1-3 parts of levelling agents, 1-3 parts of antioxidants
It sequentially adds in feeding barrel, is stirred at rotating speed 800r/min with high speed dispersor, and be heated to 70 DEG C, reaction stops after 2 hours
It only stirs, is cooled to room temperature；
(2) material after reacting step (1) is ground with grinder so that the grain size of final material is less than 5 μm, i.e.,
Obtain the photosensitive solder resist white ink.Material is ground to grain size and is less than 5 μm；The viscosity of ink obtained is low and with fabulous
Mobility.
The third object of the present invention is to provide a kind of application of photosensitive solder resist white ink in LED circuit board, described
Wiring board is welding resistance white ink layer, copper foil layer, insulating layer, copper foil layer, welding resistance white ink layer, the wiring board from top to bottom
On be provided with circular location hole, cooling fin, buckle, the wiring board quadrangle is provided with circular location hole, is provided at both ends with
Buckle, the buckle both sides are provided with cooling fin.
The thickness of the welding resistance white ink layer is 5-10 μm, and the thickness of the copper foil layer is 25~30 μm, the insulation
Layer is Kapton, and the thickness of the insulating layer is 5-10 μm.
The fourth object of the present invention is to provide a kind of preparation method of LED circuit board, include the following steps：
Step 1：Copper foil plate is chosen, scale removal processing is done to copper foil plate surface, the oxide skin handles specific steps
For：Copper foil plate is placed on workbench, grinding process is carried out to the surface of copper foil plate with sander；
Step 2：A layer binder is coated on Kapton two sides, then takes two panels copper foil plate, respectively by copper foil
Plate is bonded in the both sides of Kapton；Compoboard is pressed together by pressurizing unit after bonding, the pressure of extruding is
2.5MPa, is then punched out copper foil plate or cuts and form line layer again；
Step 3：It is printed using silk-screen, carrying out welding resistance printing to the line layer that need not be welded prepares welding resistance white ink
Then layer carries out punching using four angles of laser drilling device assist side and prepares location hole to get to the LED line road
Plate.
The preparation process of the welding resistance white ink layer includes the following steps：
Photosensitive solder resist white ink is diluted to viscosity 180dPa.s with dipropylene glycol methyl ether, then is printed using silk-screen by step 1
Photosensitive solder resist white ink is printed on circuit layer surface by brush；
The wiring board printed in step 1 is put into baking oven by step 2, and the dry 40min at 80 DEG C of temperature is obtained just solid
The wiring board of change；
Step 3 uses ultraviolet exposure equipment sealant, irradiating ultraviolet light, light exposure 350mJ/cm2, reaching 10 grades, (this figure takes 21 grades
Exposure)；
Step 4, with the Na of a concentration of 0.9~1.2wt%2CO3Aqueous solution develops the wiring board in step 3 45~80 seconds,
Then it is rinsed with water, the wiring board to be developed；
The wiring board handled by step 4 is cured 50min to get oily to welding resistance white by step 5 at 150 DEG C
Layer of ink.
Beneficial effects of the present invention：
(1) collaboration of the invention by each component, using rutile type titanium white and anatase titanium dioxide according to 4:1
Photosensitive solder resist white ink made from mass ratio is equally with good performance, and photosensitive solder resist white ink greatly reduces
Cost of material.
(2) the photoinitiator component ratio in the present invention, the photoinitiator made have good light-initiated efficiency, can change
Efficiency of initiation problem under kind LED light, and cost is relatively low, has broad application prospects.
(3) antioxidant raw material of the present invention is easily purchased, at low cost, does not contain petroleum mineral oil component, is substituted with soya-bean oil complete
Portion's oil series solvent, soya-bean oil, which has, is easy the characteristics such as degradation, hypotoxicity and low VOC, can effectively reduce non-renewable money in printing
The consumption in source, to reduce the pollution to environment.
(4) by introducing titanium dioxide and zinc oxide to realize photosensitive solder resist ink in photosensitive solder resist ink of the invention
Self-cleaning function, it is possible to reduce the cleaning to wiring board, and then the service life of extension wire plate；Meanwhile it being received by addition
Meter level silica, titanium dioxide, zinc oxide increase the mobility of photosensitive solder resist ink, simultaneously, additionally it is possible to reduce the table of substance
Face tension, is added in ink, can carry out nano modification to pigment particle surface property, granules of pigments is made uniformly to disperse
It opens；The motility of granules of pigments can be adjusted, improves ink dispersibility, shortens jitter time.
(5) hardness is enough after solder mask of the invention solidification, and will not fall off or split under organic solvent scouring
It opens；High temperature resistance is excellent, at high temperature material non yellowing, substantially prolongs the service life of LED circuit board.
Description of the drawings
Fig. 1 is LED circuit board surface texture schematic diagram of the present invention.
Fig. 2 is LED circuit board side structure schematic diagram of the present invention.
In figure：1- location holes；2- is buckled；3- cooling fins；4- welding resistance white ink layers；5- copper foil layers；6- insulating layers.
Specific implementation mode
For the ease of the understanding of those skilled in the art, the present invention is made further with reference to embodiment and attached drawing
Bright, the content that embodiment refers to not is limitation of the invention.The present invention is carried out below in conjunction with attached drawing 1 to attached drawing 2 detailed
Description.
Embodiment 1
A kind of photosensitive solder resist white ink of the present embodiment, including following component：
The titanium dioxide is by rutile type titanium white and anatase titanium dioxide according to 4:1 mass ratio composition；
The grain size of the titanium dioxide is 5-10 μm.
Embodiment 2
The titanium dioxide is by rutile type titanium white and anatase titanium dioxide according to 4:1 mass ratio composition；
The grain size of the titanium dioxide is 5-10 μm.
Embodiment 3
The titanium dioxide is by rutile type titanium white and anatase titanium dioxide according to 4:1 mass ratio composition；
The grain size of the titanium dioxide is 5-10 μm.
Embodiment 4
The preparation of photosensitive resin described in embodiment 1-3 is all made of following steps：
25 parts of union II toluene type epoxy resin are dissolved in 30 parts of ethylene glycol monobutyl ethers by step (1), and 20 parts of first are then added
Base acrylic acid, 2 parts of tetraethylammonium bromides and 3 parts of 2,6- di-tert-butyl-4-methy phenols are reacted, reaction temperature be 85~
115 DEG C, the reaction time is 5~15 hours, obtains reaction intermediate；
20 parts of maleic anhydrides are added in the reaction intermediate into step (1) and are reacted for step (2), and reaction temperature is
95~120 DEG C, the reaction time is 5~10 hours to get to photosensitive resin.
The photoinitiator includes 45-50 parts of radical photoinitiators, 5-8 parts of cationic photoinitiators and 5-8 parts
Photosensitizer；The radical photoinitiator is by 2,4,6- trimethylbenzoyls-hexichol phosphine oxide, 2- isopropyl thioxanthone anthracenes
Ketone, 2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone are according to mass ratio 3:2:1 composition；It is described sun from
Subtype photoinitiator is by mixed type triaryl hexafluorophosphoric acid sulfosalt, η 6- isopropylbenzene cyclopentadienyl iron hexafluorophosphates according to mass ratio 3:2
Composition.
The antioxidant is made of 20 parts of dimethyl ketone oxime, 20 portions of soybean oils, 4 parts of tert-butyl alcohols, 4 parts of atoleines.
The antifoaming agent is by organic silicon modified by polyether, polysiloxanes according to mass ratio 3:2 compositions；
The grain size of the nano silicon dioxide is in 10-40nm；
The grain size of the nano-titanium dioxide is 20-40 nanometers.
Embodiment 5
The preparation method of photosensitive solder resist white ink described in embodiment 1-3, is all made of following steps：
(1) by 30-35 parts of photosensitive resins, 5-8 photoinitiators, 20-30 parts of titanium dioxides, 5-10 parts of nano silicon dioxides, 5-7
Part nano zine oxide, 1-2 parts of antifoaming agent, 1-3 parts of adhesion promoters, 5-12 parts of dipropylene glycol methyl ethers, 1-3 parts of levelling agents, 1-3 parts
Antioxidant sequentially adds in feeding barrel, is stirred at rotating speed 800r/min with high speed dispersor, and be heated to 70 DEG C, reaction 2
Stop stirring after hour, is cooled to room temperature；
(2) material after reacting step (1) is ground with grinder so that the grain size of final material is less than 5 μm, i.e.,
Obtain the photosensitive solder resist white ink.
Embodiment 6
Application of the photosensitive solder resist white ink prepared in embodiment 5 in LED circuit board, the wiring board is from top to bottom
For welding resistance white ink layer 4, copper foil layer 5, insulating layer 6, copper foil layer 5, welding resistance white ink layer 4, it is provided on the wiring board
Circular location hole 1, cooling fin 2, buckle 3, the wiring board quadrangle is provided with circular location hole 1, is provided at both ends with buckle
3,3 both sides of the buckle are provided with cooling fin 2.
The thickness of the welding resistance white ink layer 4 is 5-10 μm, and the thickness of the copper foil layer 5 is 25~30 μm, described exhausted
Edge layer 6 is Kapton, and the thickness of the insulating layer 6 is 5-10 μm.
The fourth object of the present invention is to provide a kind of preparation method of LED circuit board, include the following steps：
Step 1：Copper foil plate is chosen, scale removal processing is done to copper foil plate surface, the oxide skin handles specific steps
For：Copper foil plate is placed on workbench, grinding process is carried out to the surface of copper foil plate with sander；
Step 2：A layer binder is coated on Kapton two sides, then takes two panels copper foil plate, respectively by copper foil
Plate is bonded in the both sides of Kapton；Compoboard is pressed together by pressurizing unit after bonding, the pressure of extruding is
2.5MPa, is then punched out copper foil plate or cuts and form line layer again；
Step 3：It is printed using silk-screen, carrying out welding resistance printing to the line layer that need not be welded prepares welding resistance white ink
Then layer carries out punching using four angles of laser drilling device assist side and prepares location hole to get to the LED line road
Plate.
The preparation process of the welding resistance white ink layer includes the following steps：
Photosensitive solder resist white ink is diluted to viscosity 180dPa.s with dipropylene glycol methyl ether, then is printed using silk-screen by step 1
Photosensitive solder resist white ink is printed on circuit layer surface by brush；
The wiring board printed in step 1 is put into baking oven by step 2, and the dry 40min at 80 DEG C of temperature is obtained just solid
The wiring board of change；
Step 3 uses ultraviolet exposure equipment sealant, irradiating ultraviolet light (light exposure 350mJ/cm2), reach 10 grades of (this figure expenses 21
Grade exposure)；
Step 4, with the Na of a concentration of 0.9~1.2wt%2CO3Aqueous solution develops the wiring board in step 3 45~80 seconds,
Then it is rinsed with water, the wiring board to be developed；
The wiring board handled by step 4 is cured 50min to get oily to welding resistance white by step 5 at 150 DEG C
Layer of ink.
Adhesion, soldering resistance, electroless gold plating patience, the various experiments of insulating properties are carried out to the circuit of the present invention；It is right
Ratio
Using certain model in the market photosensitive solder resist white ink LED circuit board as the present invention comparative example.
Hardness is enough after can be seen that the solder mask solidification of the present invention from the comparison of upper table, and in organic solvent wine
Being impregnated 20 minutes in essence will not fall off or split；High temperature resistance is excellent, at high temperature material non yellowing, substantially prolongs
The service life of LED circuit board.
Basic principles and main features of the invention and the present invention has been shown and described above a little, the technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.
Claims (10)
1. a kind of photosensitive solder resist white ink, it is characterised in that：Including following component：
The titanium dioxide is by rutile type titanium white and anatase titanium dioxide according to 4:1 mass ratio composition；
The grain size of the titanium dioxide is 5-10 μm.
2. photosensitive solder resist white ink as described in claim 1, it is characterised in that：The preparation of the photosensitive resin includes as follows
Step：
25 parts of union II toluene type epoxy resin are dissolved in 30 parts of ethylene glycol monobutyl ethers by step (1), and 20 parts of methyl-props are then added
Olefin(e) acid, 2 parts of tetraethylammonium bromides and 3 parts of 2,6- di-tert-butyl-4-methy phenols are reacted, and reaction temperature is 85~115
DEG C, the reaction time is 5~15 hours, obtains reaction intermediate；
20 parts of maleic anhydrides are added in the reaction intermediate into step (1) and are reacted for step (2), and reaction temperature is 95~
120 DEG C, the reaction time is 5~10 hours to get to photosensitive resin.
3. photosensitive solder resist white ink as described in claim 1, it is characterised in that：
The photoinitiator includes that 45-50 parts of radical photoinitiators, 5-8 parts of cationic photoinitiators and 5-8 parts are photosensitive
Agent；The radical photoinitiator is by 2,4,6- trimethylbenzoyls-hexichol phosphine oxide, 2- isopropyl thioxanthones, 2-
Methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone is according to mass ratio 3:2:1 composition；The cationic light
Initiator is by mixed type triaryl hexafluorophosphoric acid sulfosalt, η 6- isopropylbenzene cyclopentadienyl iron hexafluorophosphates according to mass ratio 3:2 compositions.
4. photosensitive solder resist white ink as described in claim 1, it is characterised in that：
The antioxidant is made of 20 parts of dimethyl ketone oxime, 20 portions of soybean oils, 4 parts of tert-butyl alcohols, 4 parts of atoleines.
5. photosensitive solder resist white ink as described in claim 1, it is characterised in that：
The antifoaming agent is by organic silicon modified by polyether, polysiloxanes according to mass ratio 3:2 compositions；
The grain size of the nano silicon dioxide is in 10-40nm；
The grain size of the nano-titanium dioxide is 20-40nm.
6. a kind of preparation method of photosensitive solder resist white ink as described in any one in claim 1-5, it is characterised in that including
Following steps：
(1) 30-35 parts of photosensitive resins, 5-8 photoinitiators, 20-30 parts of titanium dioxides, 5-10 parts of nano silicon dioxides, 5-7 parts are received
Rice zinc oxide, 1-2 parts of antifoaming agent, 1-3 parts of adhesion promoters, 5-12 parts of dipropylene glycol methyl ethers, 1-3 parts of levelling agents, 1-3 parts of antioxygens
Agent sequentially adds in feeding barrel, is stirred at rotating speed 800r/min with high speed dispersor, and be heated to 70 DEG C, reacts 2 hours
Stop stirring afterwards, is cooled to room temperature；
(2) by step (1) react after material be ground with grinder so that the grain size of final material be less than 5 μm to get to
The photosensitive solder resist white ink.
7. a kind of LED circuit board of the photosensitive solder resist white ink prepared comprising method of claim 6, feature exist
In the wiring board is welding resistance white ink layer, copper foil layer, insulating layer, copper foil layer, welding resistance white ink layer, institute from top to bottom
It states and is provided with circular location hole, cooling fin, buckle on wiring board, the wiring board quadrangle is provided with circular location hole, and two
End is provided with buckle, and the buckle both sides are provided with cooling fin.
8. a kind of LED circuit board as claimed in claim 7, which is characterized in that the thickness of the welding resistance white ink layer is 5-10 μ
The thickness of m, the copper foil layer are 25~30 μm, and the insulating layer is Kapton, and the thickness of the insulating layer is 5-10 μ
m。
9. a kind of preparation method of LED circuit board as claimed in claim 7 or 8, which is characterized in that include the following steps 1：Choosing
Take copper foil plate, scale removal processing done to copper foil plate surface, the oxide skin processing the specific steps are：Copper foil plate is placed in work
Make on platform, grinding process is carried out to the surface of copper foil plate with sander；
Step 2：A layer binder is coated on Kapton two sides, two panels copper foil plate is then taken, respectively glues copper foil plate
Together in the both sides of Kapton；Compoboard is pressed together by pressurizing unit after bonding, the pressure of extruding is
2.5MPa, is then punched out copper foil plate or cuts and form line layer again；
Step 3：It is printed using silk-screen, carrying out welding resistance printing to the line layer that need not be welded prepares welding resistance white ink layer, so
Punching is carried out using four angles of laser drilling device assist side prepare location hole to get to the LED circuit board afterwards.
10. a kind of preparation method of LED circuit board as claimed in claim 9, which is characterized in that the welding resistance white ink layer
Preparation process include the following steps：
Photosensitive solder resist white ink is diluted to viscosity 180dPa.s by step 1 with dipropylene glycol methyl ether, then will using silk-screen printing
Photosensitive solder resist white ink is printed on circuit layer surface；
The wiring board printed in step 1 is put into baking oven by step 2, and the dry 40min at 80 DEG C of temperature is obtained just cured
Wiring board；
Step 3 uses ultraviolet exposure equipment sealant, irradiating ultraviolet light, light exposure 350mJ/cm2, reach 10 grades；
Step 4, with the Na of a concentration of 0.9~1.2wt%2CO3Aqueous solution develops the wiring board in step 3 45~80 seconds, then
It is rinsed with water, the wiring board to be developed；
Step 5, the wiring board that will be handled by step 4 cure 50min to get to the welding resistance white ink layer at 150 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810083688.2A CN108395765B (en) | 2018-01-29 | 2018-01-29 | Photosensitive solder-resist white ink, LED circuit board and preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810083688.2A CN108395765B (en) | 2018-01-29 | 2018-01-29 | Photosensitive solder-resist white ink, LED circuit board and preparation method |
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| Publication Number | Publication Date |
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| CN108395765A true CN108395765A (en) | 2018-08-14 |
| CN108395765B CN108395765B (en) | 2021-04-20 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110054929A (en) * | 2019-02-13 | 2019-07-26 | 盐城艾肯科技有限公司 | One kind having imide structure photosensitive-ink and its application |
| CN114900952A (en) * | 2020-11-10 | 2022-08-12 | 广东高仕电研科技有限公司 | Circuit board solder mask, printed circuit board and printed circuit board preparation method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101210155A (en) * | 2006-12-28 | 2008-07-02 | 财团法人工业技术研究院 | Material surface treatment composition, material and hydrophobic film prepared from the same |
| CN102458038A (en) * | 2010-10-18 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation part and electronic apparatus having heat radiation part |
| CN104830148A (en) * | 2015-06-03 | 2015-08-12 | 林振坤 | Environment-friendly UV curing silk screen ink and production method thereof |
| CN104830143A (en) * | 2015-04-17 | 2015-08-12 | 陆开云 | Environment-friendly antioxidant used for printing ink |
| CN104974596A (en) * | 2015-07-02 | 2015-10-14 | 深圳市容大感光科技股份有限公司 | Photosensitive solder-resist printing ink composition and circuit board including cured film of same |
| CN106675178A (en) * | 2016-11-18 | 2017-05-17 | 蚌埠金黄山凹版印刷有限公司 | Photoinitiator for ultraviolet curing ink and preparation method and application of photoinitiator |
| CN107197591A (en) * | 2017-06-27 | 2017-09-22 | 上达电子（深圳）股份有限公司 | A kind of FPC plates for covering photonasty coat and preparation method thereof |
-
2018
- 2018-01-29 CN CN201810083688.2A patent/CN108395765B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101210155A (en) * | 2006-12-28 | 2008-07-02 | 财团法人工业技术研究院 | Material surface treatment composition, material and hydrophobic film prepared from the same |
| CN102458038A (en) * | 2010-10-18 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation part and electronic apparatus having heat radiation part |
| CN104830143A (en) * | 2015-04-17 | 2015-08-12 | 陆开云 | Environment-friendly antioxidant used for printing ink |
| CN104830148A (en) * | 2015-06-03 | 2015-08-12 | 林振坤 | Environment-friendly UV curing silk screen ink and production method thereof |
| CN104974596A (en) * | 2015-07-02 | 2015-10-14 | 深圳市容大感光科技股份有限公司 | Photosensitive solder-resist printing ink composition and circuit board including cured film of same |
| CN106675178A (en) * | 2016-11-18 | 2017-05-17 | 蚌埠金黄山凹版印刷有限公司 | Photoinitiator for ultraviolet curing ink and preparation method and application of photoinitiator |
| CN107197591A (en) * | 2017-06-27 | 2017-09-22 | 上达电子（深圳）股份有限公司 | A kind of FPC plates for covering photonasty coat and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| RAIMO ALÉN: "《造纸化学》", 30 June 2016, 中国轻工业出版社 * |
| 徐峰: "《建筑涂料与涂装技术》", 31 May 2000, 化学工业出版社 * |
| 曾晓鹰等: "《电子束固化涂料及应用》", 31 December 2014, 天津大学出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110054929A (en) * | 2019-02-13 | 2019-07-26 | 盐城艾肯科技有限公司 | One kind having imide structure photosensitive-ink and its application |
| CN114900952A (en) * | 2020-11-10 | 2022-08-12 | 广东高仕电研科技有限公司 | Circuit board solder mask, printed circuit board and printed circuit board preparation method |
| CN114900952B (en) * | 2020-11-10 | 2024-04-02 | 广东高仕电研科技有限公司 | Circuit board solder mask layer, printed circuit board and printed circuit board preparation method |
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