CN108389816A - 一种硅片自动清洗插片设备 - Google Patents

一种硅片自动清洗插片设备 Download PDF

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CN108389816A
CN108389816A CN201810397372.0A CN201810397372A CN108389816A CN 108389816 A CN108389816 A CN 108389816A CN 201810397372 A CN201810397372 A CN 201810397372A CN 108389816 A CN108389816 A CN 108389816A
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CN108389816B (zh
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马建国
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Zhejiang Qida Technology Co ltd
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Jiaxing Qida New Materials Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781Batch transfer of wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

本发明公开了一种硅片自动清洗插片设备,包括下料斗、清洗槽、接料清洗器、翻面清洗器、转运插片器、插片架。本发明能够使硅片的插片自动进行,降低了人工参与,提升了插片品质和效率,同时还能够对硅片进行翻面清洗,保证干净整洁,方便后续生产。

Description

一种硅片自动清洗插片设备
【技术领域】
本发明涉及硅片生产的技术领域,特别是一种硅片自动插片设备的技术领域。
【背景技术】
21世纪以来,全球能源消费急剧攀升,传统化石能源日益枯竭,能源问题和环境问题逐渐成为全球关注的两大重点问题。迫于可持续发展的压力,各主要国家纷纷将太阳能光伏产业列入可再生能源开发利用的重点。硅片是硅棒通过切割、脱胶而成,在脱胶完成后需要对硅片进行分片,然后将分片插入到花篮内,然后再进行后续清洗等工艺;现有技术中,将硅片进行分片和插入到花篮中的步骤基本通过人工实现,因此操作工人在进行操作的过程中效率较低,并且操作者容易受到伤害,硅片容易受到损坏,同时硅片容易受到污染。
【发明内容】
本发明的目的就是解决现有技术中的问题,提出一种硅片自动清洗插片设备,能够使硅片的插片自动进行,降低了人工参与,提升了插片品质和效率,同时还能够对硅片进行翻面清洗,保证干净整洁,方便后续生产。
为实现上述目的,本发明提出了一种硅片自动清洗插片设备,包括下料斗、清洗槽、接料清洗器、翻面清洗器、转运插片器、插片架,所述下料斗设置在清洗槽正上方,所述下料斗的正下方设置有接料清洗器,所述接料清洗器包括旋转轮、接料柱、吸料皮碗、真空阀、物料感应器,所述旋转轮设置在清洗槽内,所述旋转轮上均匀环绕设置有若干接料柱,所述接料柱的最外端设置有真空阀,所述真空阀顶端安装有吸料皮碗,所述吸料皮碗的底部设置有物料感应器,所述翻面清洗器设置在接料清洗器的左侧,所述翻面清洗器包括旋转轮、翻面柱、吸料皮碗、真空阀、物料感应器,所述旋转轮设置在清洗槽内,所述旋转轮上均匀环绕设置有若干翻面柱,所述翻面柱的最外端设置有真空阀,所述真空阀顶端安装有吸料皮碗,所述吸料皮碗的底部设置有物料感应器,所述转运插片器设置在翻面清洗器的左侧,所述转运插片器包括升降柱、升降滑块、转位套环、伸缩插片柱、吸料皮碗、真空阀、物料感应器,所述升降柱竖直设置在清洗槽内,所述升降滑块套设在升降柱上,所述伸缩插片柱通过转位套环安装在升降滑块上,所述伸缩插片柱的最外端设置有真空阀,所述真空阀顶端安装有吸料皮碗,所述插片架设置在转运插片器的左侧,所述插片架包括插片台、插片篮,所述插片台设置在清洗槽左侧,所述插片台顶部安装有插片篮。
作为优选,所述接料柱的数量至少有八根,接料柱的最外端设置有稳定环相互连接,所述接料柱的数量为四的倍数,所述接料柱径向设置在旋转轮上,所述旋转轮在相邻的接料柱之间设置有涡流螺旋桨。
作为优选,所述接料柱和翻面柱的数量相同,接料清洗器和翻面清洗器的旋转轮圆心位于同一水平面上,所述料清洗器和翻面清洗器的旋转轮均沿顺时针方向旋转旋转轮上的接料柱和翻面柱承左右一一对应关系,所述吸料皮碗的底端设置有伸缩缓冲管。
作为优选,所述翻面柱径向设置在旋转轮上,所述旋转轮在相邻的翻面柱之间设置有涡流螺旋桨。
作为优选,所述伸缩插片柱为水平气缸臂,所述转位套环可沿水平方向180度旋转,所述插片篮内均匀竖直设置有多个开口向上的插片槽,所述插片槽底部设置有物料感应器,所述插片篮的顶部高于清洗槽的顶部高度。
本发明的有益效果:本发明通过将下料斗、清洗槽、接料清洗器、翻面清洗器、转运插片器、插片架结合在一起,经过试验优化能够使硅片的插片自动进行,降低了人工参与,提升了插片品质和效率,同时还能够对硅片进行翻面清洗,保证干净整洁,方便后续生产。
本发明的特征及优点将通过实施例结合附图进行详细说明。
【附图说明】
图1是本发明一种硅片自动清洗插片设备的结构示意图。
图中:1-下料斗、2-清洗槽、3-接料清洗器、4-翻面清洗器、5-转运插片器、6-插片架、7-旋转轮、8-接料柱、9-吸料皮碗、10-真空阀、11-物料感应器、12-翻面柱、13-升降柱、14-升降滑块、15-转位套环、16-伸缩插片柱、17-插片台、18-插片篮、19-稳定环、20-涡流螺旋桨、21-插片槽、22-伸缩缓冲管。
【具体实施方式】
参阅图1,本发明一种硅片自动清洗插片设备,包括下料斗1、清洗槽2、接料清洗器3、翻面清洗器4、转运插片器5、插片架6,所述下料斗1设置在清洗槽2正上方,所述下料斗1的正下方设置有接料清洗器3,所述接料清洗器3包括旋转轮7、接料柱8、吸料皮碗9、真空阀10、物料感应器11,所述旋转轮7设置在清洗槽2内,所述旋转轮7上均匀环绕设置有若干接料柱8,所述接料柱8的最外端设置有真空阀10,所述真空阀10顶端安装有吸料皮碗9,所述吸料皮碗9的底部设置有物料感应器11,所述翻面清洗器4设置在接料清洗器3的左侧,所述翻面清洗器4包括旋转轮7、翻面柱12、吸料皮碗9、真空阀10、物料感应器11,所述旋转轮7设置在清洗槽2内,所述旋转轮7上均匀环绕设置有若干翻面柱12,所述翻面柱12的最外端设置有真空阀10,所述真空阀10顶端安装有吸料皮碗9,所述吸料皮碗9的底部设置有物料感应器11,所述转运插片器5设置在翻面清洗器4的左侧,所述转运插片器5包括升降柱13、升降滑块14、转位套环15、伸缩插片柱16、吸料皮碗9、真空阀10、物料感应器11,所述升降柱13竖直设置在清洗槽2内,所述升降滑块14套设在升降柱13上,所述伸缩插片柱16通过转位套环15安装在升降滑块14上,所述伸缩插片柱16的最外端设置有真空阀10,所述真空阀10顶端安装有吸料皮碗9,所述插片架6设置在转运插片器5的左侧,所述插片架6包括插片台17、插片篮18,所述插片台17设置在清洗槽2左侧,所述插片台17顶部安装有插片篮18,所述接料柱8的数量至少有八根,接料柱8的最外端设置有稳定环19相互连接,所述接料柱8的数量为四的倍数,所述接料柱8径向设置在旋转轮7上,所述旋转轮7在相邻的接料柱8之间设置有涡流螺旋桨20,所述接料柱8和翻面柱12的数量相同,接料清洗器3和翻面清洗器4的旋转轮7圆心位于同一水平面上,所述料清洗器和翻面清洗器4的旋转轮7均沿顺时针方向旋转旋转轮7上的接料柱8和翻面柱12呈左右一一对应关系,所述吸料皮碗9的底端设置有伸缩缓冲管22,所述翻面柱12径向设置在旋转轮7上,所述旋转轮7在相邻的翻面柱12之间设置有涡流螺旋桨20,所述伸缩插片柱16为水平气缸臂,所述转位套环15可沿水平方向180度旋转,所述插片篮18内均匀竖直设置有多个开口向上的插片槽21,所述插片槽21底部设置有物料感应器11,所述插片篮18的顶部高于清洗槽2的顶部高度。
本发明通过将下料斗1、清洗槽2、接料清洗器3、翻面清洗器4、转运插片器5、插片架6结合在一起,经过试验优化能够使硅片的插片自动进行,降低了人工参与,提升了插片品质和效率,同时还能够对硅片进行翻面清洗,保证干净整洁,方便后续生产。
上述实施例是对本发明的说明,不是对本发明的限定,任何对本发明简单变换后的方案均属于本发明的保护范围。

Claims (5)

1.一种硅片自动清洗插片设备,其特征在于:包括下料斗(1)、清洗槽(2)、接料清洗器(3)、翻面清洗器(4)、转运插片器(5)、插片架(6),所述下料斗(1)设置在清洗槽(2)正上方,所述下料斗(1)的正下方设置有接料清洗器(3),所述接料清洗器(3)包括旋转轮(7)、接料柱(8)、吸料皮碗(9)、真空阀(10)、物料感应器(11),所述旋转轮(7)设置在清洗槽(2)内,所述旋转轮(7)上均匀环绕设置有若干接料柱(8),所述接料柱(8)的最外端设置有真空阀(10),所述真空阀(10)顶端安装有吸料皮碗(9),所述吸料皮碗(9)的底部设置有物料感应器(11),所述翻面清洗器(4)设置在接料清洗器(3)的左侧,所述翻面清洗器(4)包括旋转轮(7)、翻面柱(12)、吸料皮碗(9)、真空阀(10)、物料感应器(11),所述旋转轮(7)设置在清洗槽(2)内,所述旋转轮(7)上均匀环绕设置有若干翻面柱(12),所述翻面柱(12)的最外端设置有真空阀(10),所述真空阀(10)顶端安装有吸料皮碗(9),所述吸料皮碗(9)的底部设置有物料感应器(11),所述转运插片器(5)设置在翻面清洗器(4)的左侧,所述转运插片器(5)包括升降柱(13)、升降滑块(14)、转位套环(15)、伸缩插片柱(16)、吸料皮碗(9)、真空阀(10)、物料感应器(11),所述升降柱(13)竖直设置在清洗槽(2)内,所述升降滑块(14)套设在升降柱(13)上,所述伸缩插片柱(16)通过转位套环(15)安装在升降滑块(14)上,所述伸缩插片柱(16)的最外端设置有真空阀(10),所述真空阀(10)顶端安装有吸料皮碗(9),所述插片架(6)设置在转运插片器(5)的左侧,所述插片架(6)包括插片台(17)、插片篮(18),所述插片台(17)设置在清洗槽(2)左侧,所述插片台(17)顶部安装有插片篮(18)。
2.如权利要求1所述的一种硅片自动清洗插片设备,其特征在于:所述接料柱(8)的数量至少有八根,接料柱(8)的最外端设置有稳定环(19)相互连接,所述接料柱(8)的数量为四的倍数,所述接料柱(8)径向设置在旋转轮(7)上,所述旋转轮(7)在相邻的接料柱(8)之间设置有涡流螺旋桨(20)。
3.如权利要求1所述的一种硅片自动清洗插片设备,其特征在于:所述接料柱(8)和翻面柱(12)的数量相同,接料清洗器(3)和翻面清洗器(4)的旋转轮(7)圆心位于同一水平面上,所述料清洗器和翻面清洗器(4)的旋转轮(7)均沿顺时针方向旋转旋转轮(7)上的接料柱(8)和翻面柱(12)呈左右一一对应关系,所述吸料皮碗(9)的底端设置有伸缩缓冲管(22)。
4.如权利要求1所述的一种硅片自动清洗插片设备,其特征在于:所述翻面柱(12)径向设置在旋转轮(7)上,所述旋转轮(7)在相邻的翻面柱(12)之间设置有涡流螺旋桨(20)。
5.如权利要求1所述的一种硅片自动清洗插片设备,其特征在于:所述伸缩插片柱(16)为水平气缸臂,所述转位套环(15)可沿水平方向180度旋转,所述插片篮(18)内均匀竖直设置有多个开口向上的插片槽(21),所述插片槽(21)底部设置有物料感应器(11),所述插片篮(18)的顶部高于清洗槽(2)的顶部高度。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110190015A (zh) * 2019-06-27 2019-08-30 西安奕斯伟硅片技术有限公司 一种晶圆清洗装置及晶圆清洗方法
CN110707032A (zh) * 2019-11-18 2020-01-17 内蒙古中环光伏材料有限公司 一种用于大尺寸硅片的插片装置以及插片方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10277287A (ja) * 1997-04-08 1998-10-20 Hitachi Ltd 家庭電化機器および洗濯機
JP2007319723A (ja) * 2005-07-05 2007-12-13 Aqua Kagaku Kk 洗浄装置
JP2013188423A (ja) * 2012-03-15 2013-09-26 Ishino Seisakusho Co Ltd 皿選別装置及び皿洗浄システム
CN104386455A (zh) * 2014-11-20 2015-03-04 宁波科田磁业有限公司 自动清除传送带上沉积金属的设备及其清除方法
CN105436176A (zh) * 2015-12-01 2016-03-30 重庆华瑞玻璃有限公司 吸盘式自动翻面装置
CN106798517A (zh) * 2017-01-17 2017-06-06 杭州知加网络科技有限公司 一种高空吸附清洗装置
CN107946212A (zh) * 2017-11-21 2018-04-20 乐山新天源太阳能科技有限公司 硅片水下自动取片插片机

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10277287A (ja) * 1997-04-08 1998-10-20 Hitachi Ltd 家庭電化機器および洗濯機
JP2007319723A (ja) * 2005-07-05 2007-12-13 Aqua Kagaku Kk 洗浄装置
JP2013188423A (ja) * 2012-03-15 2013-09-26 Ishino Seisakusho Co Ltd 皿選別装置及び皿洗浄システム
CN104386455A (zh) * 2014-11-20 2015-03-04 宁波科田磁业有限公司 自动清除传送带上沉积金属的设备及其清除方法
CN105436176A (zh) * 2015-12-01 2016-03-30 重庆华瑞玻璃有限公司 吸盘式自动翻面装置
CN106798517A (zh) * 2017-01-17 2017-06-06 杭州知加网络科技有限公司 一种高空吸附清洗装置
CN107946212A (zh) * 2017-11-21 2018-04-20 乐山新天源太阳能科技有限公司 硅片水下自动取片插片机

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110190015A (zh) * 2019-06-27 2019-08-30 西安奕斯伟硅片技术有限公司 一种晶圆清洗装置及晶圆清洗方法
CN110707032A (zh) * 2019-11-18 2020-01-17 内蒙古中环光伏材料有限公司 一种用于大尺寸硅片的插片装置以及插片方法

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