CN108384195B - Nickel-to-epoxy resin composition with high adhesion and application thereof - Google Patents
Nickel-to-epoxy resin composition with high adhesion and application thereof Download PDFInfo
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- CN108384195B CN108384195B CN201810227058.8A CN201810227058A CN108384195B CN 108384195 B CN108384195 B CN 108384195B CN 201810227058 A CN201810227058 A CN 201810227058A CN 108384195 B CN108384195 B CN 108384195B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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Abstract
The invention relates to an epoxy resin composition with high bonding property to nickel and application thereof. The high-adhesion epoxy resin composition adopts one or a mixture of several of 2-methyl-5-amino-2H-tetrazole, 2-ethyl-2H-tetrazole-5-amine, 1-ethyl-1H-tetrazole-5-amine, 2-propyl-2-alkenyl tetrazole-5-amine, 5-amino tetrazole and 3- [ 2-alkyl-3- (2H-tetrazole-5-amino) -propoxy ] -propyl trimethoxy silane according to any proportion as a coupling agent. The application comprises the following steps: the epoxy resin composition with high bonding property to nickel is used as an encapsulating material for encapsulating components, and generates firmer bonding force with the nickel surface; the flame retardant has excellent flame retardance, flow forming property and curing property, and the operability is good; when the material is used as a packaging material for packaging components, the material has the characteristics of excellent adhesion, reflow soldering resistance, electrical stability and moisture resistance, and is suitable for packaging various components.
Description
Technical Field
The invention relates to the field of IC packaging, in particular to an epoxy resin composition with high bonding property to nickel and application thereof.
Background
Epoxy resin polymer materials (Epoxy molding compounds) have excellent mechanical, heat-resistant, acid-base-resistant and electrical properties after being cured, so that Epoxy resins play a very important role in composite materials in the sports equipment, automobile and aerospace industries, and are widely applied to IC packaging materials in the 3C industry (computers, communication and consumer electronics) in recent years due to easy curing, low curing shrinkage, good adhesiveness, mechanical properties and chemical resistance of Epoxy resins. The main purpose of IC packaging is to protect the chip, the wires and the circuits from being damaged by moisture, dust and other external forces in the air, so as to improve the service life and reliability of the chip.
The bonding performance of the epoxy resin material in the PKG is extremely important for the reliability assessment of the device. Because of the interfacial adhesion problem between the PKG internal molding compound and the surfaces of the chip, lead frame, carrier, etc., a so-called PKG delamination phenomenon occurs if the adhesion is poor. Therefore, improving the adhesion of the molding compound is very important to improve the internal delamination phenomenon of the PKG. Essentially, improving adhesion is to improve the robustness of the interfacial layer reaction, which is a key role for the coupling agent. In the encapsulating resin, silane coupling agents are generally used, and the type and the proportion of the silane coupling agents are a core technology of production and development units. The function of the coupling agent is to improve the compatibility of the interface, which is mainly reflected in the following two aspects: (1) organic interfaces of silica and epoxy. Silica is an inorganic substance and has poor compatibility with organic substances such as epoxy resins, and therefore, when silica is used, it is subjected to surface modification treatment to change the physicochemical properties of the surface thereof and improve the interface compatibility with organic substrates such as epoxy resins. The study showed that, after the addition of a coupling agent, it was confirmed by FT-IR that the coupling reaction did occur at the SiO 2/epoxy interface and a chemical bond was formed. Experimental data also indicate that the addition of the coupling agent or not, the formed composite material interface layer is quite different, and directly influences the sealing and bonding performance of the packaging resin. (2) The encapsulation resin interfaces with the metal, chip, etc. The interface contains a release agent and a coupling agent, and the release agent has a great influence on the bonding strength of the epoxy resin with the chip and the lead frame. The release agent can be quickly adsorbed on the surfaces of the chip and the lead frame to influence the normal adhesion of the packaging resin and the surface of the chip and the lead frame due to the fact that the release agent is low in molecular weight and easy to flow when the packaging resin flows and moves faster than other resins, and the larger the release agent amount is, the larger the area of a covered interface is, and the adhesion between the packaging resin and other interfaces can be seriously influenced. Therefore, on one hand, the amount of the release agent is reduced as much as possible, and on the other hand, the adhesion of the encapsulation resin to other surfaces can be improved by adding different types of coupling agents, such as silane coupling agents, which also have small molecular weight and high moving speed, and can be adsorbed on the interface to generate coupling reaction to form relatively firm combination. In a word, the selection of a proper coupling agent for metal materials such as chips, lead frames, carrier chips and the like can greatly improve the adhesive property of the packaging resin so as to improve the internal layering phenomenon of PKG.
In addition, the adhesion properties of different metals to coupling agents also vary widely. The commonly used PKG is mainly copper plating, silver plating, nickel plating and the like, and the three metals have different activity types, so that nickel is easier to oxidize compared with copper and silver, an oxide film is formed on the surface of the nickel, and-OH on the surface of the nickel is prevented from reacting with a coupling agent, so that the adhesion is poor, and the layering is easy.
Disclosure of Invention
The invention provides a nickel high-adhesion epoxy resin composition, which can fully form intermolecular force with-OH on the surface of nickel to generate firmer adhesion, has excellent flame retardance, excellent flowing formability and curability and good operability, has the characteristics of excellent adhesion, reflow resistance, electrical stability and moisture resistance when being used as a packaging material for packaging components, and is suitable for packaging various components.
The high-adhesion epoxy resin composition adopts one or a mixture of several of 2-methyl-5-amino-2H-tetrazole, 2-ethyl-2H-tetrazole-5-amine, 1-ethyl-1H-tetrazole-5-amine, 2-propyl-2-alkenyl tetrazole-5-amine, 5-amino tetrazole and 3- [ 2-alkyl-3- (2H-tetrazole-5-amino) -propoxy ] -propyl trimethoxy silane according to any proportion as a coupling agent.
The high-adhesion epoxy resin composition for nickel is prepared with epoxy resin 2-15 weight portions, curing agent 2-10 weight portions, fire retardant 0.1-6 weight portions, curing promoter 0.01-1 weight portions, inorganic stuffing 70-95 weight portions and coupling agent 0.1-0.8 weight portions.
The epoxy resin is one or a mixture of several of bisphenol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl epoxy resin, triphenol methane epoxy resin, naphthol epoxy resin, stilbene epoxy resin, epoxy resin containing a triazine nucleus structure, phenolic novolac epoxy resin, phenolic alkyl novolac epoxy resin, modified phenolic novolac epoxy resin and dicyclopentadiene epoxy resin in any proportion.
The hardener is phenolic resin; the phenolic resin is one or a mixture of several of novolac resin, cresol novolac resin, triphenol alkylphenol, aralkyl resin, naphthalene type phenolic resin and cyclopentadiene type phenolic resin according to any proportion.
The hardening accelerator is one or a mixture of several of tertiary amine, imidazole compound and nitrogen-containing heterocyclic compound according to any proportion.
The tertiary amine is one or a mixture of several of triethylamine, dimethylaniline, benzyl dimethylamino and N, N-dimethyl-aminomethyl phenol in any proportion.
The imidazole compound is one or a mixture of several of 2-methylimidazole, 2-methyl-4-methylimidazole, 2-heptadecylimidazole and 1-cyanoethyl-4-methylimidazole in any proportion.
The nitrogen-containing heterocyclic compound comprises 1, 8-diazabicyclo [5,4,0] undec-7-ene.
The inorganic filling material is one or a mixture of several of fused silica, crystalline silica, talcum powder, alumina and silicon nitride according to any proportion.
An application of the epoxy resin composition with high adhesion to nickel as the packing material for packing the components.
The invention has the advantages that: the high-adhesiveness epoxy resin composition to nickel can fully form intermolecular force with-OH on the surface of nickel to generate firmer adhesive force; the flame retardant has excellent flame retardance, excellent flow forming property and curing property and good operability; when the material is used as a packaging material for packaging components, the material has the characteristics of excellent adhesion, reflow soldering resistance, electrical stability and moisture resistance, and is suitable for packaging various components.
Detailed Description
In order to enhance the understanding of the present invention, the present invention will be described in further detail with reference to the following examples, which are provided for the purpose of illustration only and are not intended to limit the scope of the present invention.
The first embodiment is as follows: the embodiment provides a nickel-bonding epoxy resin composition, which adopts one or a mixture of several of 2-methyl-5-amino-2H-tetrazole, 2-ethyl-2H-tetrazole-5-amine, 1-ethyl-1H-tetrazole-5-amine, 5-aminotetrazole, 2-propyl-2-alkenyl tetrazole-5-amine and 3- [ 2-alkyl-3- (2H-tetrazole-5-amino) -propoxy ] -propyl trimethoxy silane according to any proportion as a coupling agent.
In the present embodiment, it is preferred that,
the structural formula of the 2-methyl-5-amino-2H-tetrazole is shown as
The structural formula of the 2-ethyl-2H-tetrazole-5-amine is shown in the specification
The structural formula of the 1-ethyl-1H-tetrazole-5-amine is shown in the specification
The structural formula of the 2-propyl-2-alkenyl tetrazole-5-amine is shown in the specification
The structural formula of the 5-aminotetrazole is shown as
The structural formula of the 3- [ 2-alkyl-3- (2H-tetrazole-5-amino) -propoxy ] -propyl trimethoxy silane is shown in the specification
In the embodiment, the coupling agent contains amino, is very active and is easy to form more covalent bonds with-OH, so that the epoxy molding compound and the nickel material are bonded together, and meanwhile, the molecular main framework is annular, has high stability and is not easy to decompose after IR (infrared radiation) and is favorable for forming stable bonding force; and other characteristics of the product are not influenced through verification and examination.
The second embodiment is as follows: the embodiment provides a nickel-epoxy resin composition with high adhesion, which is prepared from 2-15 parts of epoxy resin, 2-10 parts of a curing agent, 0.1-6 parts of a flame retardant, 0.01-1 part of a curing accelerator, 70-95 parts of an inorganic filling material and 0.1-0.8 part of a coupling agent in parts by mass.
The mass percentage of the coupling agent in the embodiment is 0.1-0.8%; if the mass percentage of the coupling agent is less than 0.1 percent, the PKG has partial layering phenomenon and can not achieve the ideal effect; if the mass percentage of the coupling agent exceeds 0.8%, the reaction and gelation time of the resin system is affected, and more ions are introduced to affect the electrical property.
The mass percentage of the epoxy resin in the present embodiment is 2% to 15%, preferably 6% to 12%.
The mass percentage of the hardener in the present embodiment is 2% to 10%, preferably 3% to 8%.
The hardening accelerator in the present embodiment is 0.01 to 1% by mass, preferably 0.1 to 0.3% by mass.
The flame retardant in this embodiment does not contain halogen or antimony compounds, and the content of halogen atoms and antimony atoms (derived from the catalyst or additive inevitably used in the resin preparation process) in the final composition is less than 0.1 wt% based on the total weight of the composition, so that the environment-friendly requirement can be met.
The third embodiment; the second embodiment is different from the first embodiment in that: the epoxy resin is one or a mixture of several of bisphenol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl epoxy resin, triphenol methane epoxy resin, naphthol epoxy resin, stilbene epoxy resin, epoxy resin containing a triazine nucleus structure, phenolic novolac epoxy resin, phenolic alkyl novolac epoxy resin, modified phenolic novolac epoxy resin and dicyclopentadiene epoxy resin in any proportion.
In the present embodiment, examples of commercially available epoxy resins include: CNE-200ELA (Changchun Chemicals); ESCN-195XL, (manufactured by Sumitomo chemical); YX-4000H (manufactured by Shell Co.); n-670 (manufactured by NIPPON DIC); JECN-801 (manufactured by Jiang Hua chemical Co., Ltd.); NC-3000H (manufactured by Nippon Kagaku Co., Ltd.); NPEB-400 (made of epoxy resin south Asia).
In the present embodiment, the epoxy resin is well known to those skilled in the art, and may be used alone, or may be used in the form of a mixture of two or more kinds mixed in an arbitrary ratio; the present embodiment is not limited to a specific example, and the present invention is not limited to this embodiment.
The fourth concrete implementation mode: the second embodiment is different from the first embodiment in that: the hardener is phenolic resin; the phenolic resin is one or a mixture of several of novolac resin, cresol novolac resin, triphenol alkylphenol, aralkyl resin, naphthalene type phenolic resin and cyclopentadiene type phenolic resin according to any proportion.
In the present embodiment, examples of commercially available phenol resins include: TD-2131 (manufactured by JEIC), HRJ-1583 (manufactured by Schenectady), XLC-3L (manufactured by Mitsui Chemicals), HP-5000 (manufactured by JEIC), PK-7500 (manufactured by King chemical Co., Ltd.), HP-7200 (manufactured by JEIC), and KPH-F3065 (manufactured by KOLON).
In this embodiment, the hardener is used with an epoxy resin, which is well known to those skilled in the art, such as but not limited to phenolic resins; the phenolic resin of this embodiment contains two or more hydroxyl functional groups; this embodiment is merely an example of a part of the curing agent, and this should not be construed as limiting the present invention.
The fifth concrete implementation mode: the second embodiment is different from the first embodiment in that: the hardening accelerator is one or a mixture of several of tertiary amine, imidazole compound and nitrogen-containing heterocyclic compound according to any proportion.
In this embodiment, the hardening accelerator can accelerate the hardening reaction between the epoxy group of the epoxy resin and the phenolic hydroxyl group of the hardening agent; this embodiment is merely an example of a part of the hardening accelerator, and this should not be construed as limiting the present invention.
The sixth specific implementation mode: the fifth embodiment is different from the specific embodiment in that: the tertiary amine is one or a mixture of several of triethylamine, dimethylaniline, benzyl dimethylamino and N, N-dimethyl-aminomethyl phenol in any proportion.
The seventh embodiment: the fifth embodiment is different from the specific embodiment in that: the imidazole compound is one or a mixture of several of 2-methylimidazole, 2-methyl-4-methylimidazole, 2-heptadecylimidazole and 1-cyanoethyl-4-methylimidazole in any proportion.
The specific implementation mode is eight: the fifth embodiment is different from the specific embodiment in that: the nitrogen-containing heterocyclic compound comprises 1, 8-diazabicyclo [5,4,0] undec-7-ene.
The specific implementation method nine: the second embodiment is different from the first embodiment in that: the inorganic filling material is one or a mixture of several of fused silica, crystalline silica, talcum powder, alumina and silicon nitride according to any proportion.
In this embodiment, the inorganic filler is added in an amount of about 70% to about 95% by mass based on the balance of moldability and solder resistance; if the inorganic filler is less than 70% by mass, the solderability of the resin composition will be reduced due to the increase in moisture absorption; if the inorganic filler content is more than 95% by mass, the flowability of the resin composition during molding is lowered, and filling failure is easily caused.
The detailed implementation mode is ten: the second embodiment is different from the first embodiment in that: the epoxy resin composition may further include various other additives such as a silane coupling agent, a mold release agent, a colorant, and a flame retardant.
The silane coupling agent of the present embodiment contains 2, 3-epoxypropyltrimethoxysilane or β - (3, 4-epoxycyclohexane) ethyltrimethoxysilane.
The release agent of the present embodiment includes paraffin wax, palm wax, long-chain fatty acid or metal salt thereof, and polyethylene/olefin synthetic wax.
The colorant of the present embodiment contains carbon black.
The flame retardant of the present embodiment contains aluminum hydroxide.
The concrete implementation mode eleven: the embodiment provides an application of the nickel high-adhesion epoxy resin composition: the epoxy resin composition is used as an encapsulating material for encapsulating the component.
The following examples were used to demonstrate the beneficial effects of the present invention:
examples
This example provides a nickel high-adhesion epoxy resin composition, which is compared with 5 comparative examples with different kinds of coupling agents in the same content ratio to verify the beneficial effects of the present invention.
The high-adhesion epoxy resin compositions to nickel of examples and comparative examples 1 to 5, the compositions of which are listed in Table 1, were prepared in the manner described below.
The components are mixed at room temperature by using a mixer according to the weight parts listed in Table 1, the temperature is controlled to be 60-120 ℃, and the components are melted and kneaded at high temperature by using a double-shaft mixer to obtain the flame-retardant epoxy resin composition.
Tables comparing examples 1 to 5 with example 1
The ingredient data in table 1 are as follows:
epoxy resin: CNE-200ELA, softening point: 65 ℃, epoxy equivalent: 200g/eq, purchased from vinpocetine; the specific structural formula is as follows:
phenol resin: TD-2131, softening point: 80 ℃, OH equivalent: 102g/eq, available from DIC in Japan; the specific structural formula is as follows:
spherical fused silica: SS-0183R, available from Korea KOSEM.
Aluminum hydroxide: purchased from SHOWA DENKO.
DBU (1, 8-diazabicyclo [5,4,0] undec-7-ene): purchased from japan backstroke company.
Coupling agent 1: 2-methyl-5-amino-2H-tetrazole.
Coupling agent 2: 2-ethyl-2H-tetrazol-5-amine.
Coupling agent 3: 1-ethyl-1H-tetrazol-5-amine.
Coupling agent 4: 2-prop-2-enyltetrazol-5-amine.
Examples coupling agents: 3- [ 2-hydrocarbyl-3- (2H-tetrazol-5-amino) -propoxy ] -propyltrimethoxysilane.
Releasing agent: consisting of 0.4 parts by weight of palm wax (Carnauba No.1, from Toyo chemical Co.) and 0.3 parts by weight of polyethylene/olefin synthetic wax (PED-522, from Clariant Co.).
Carbon black: MA-600, available from Mitsubishi, Japan.
The test method comprises the following steps:
spiral flow: the measurement is according to EMMI-1-66, using a mould to measure the spiral flow, the length of the spiral flow, expressed in cm, measured at a moulding temperature of 175 ℃, at an injection clamping pressure of 6.9MPa and a hardening time of 120 seconds.
Gel time: the method is used for measuring the molding curing property and the mixing uniformity of the epoxy resin molding material. The above composition was poured onto the center of an electric hot plate at 175. + -. 2 ℃ and immediately ground to about 5cm2 using a tongue depressor, and when a stopwatch was pressed from the start of melting the composition, a powdery material was discharged at a frequency of 1 st/sec using the tongue depressor, and when the powdery material gradually changed from a fluid to a gel state, the time taken was read. The same procedure was carried out twice (the two measurements were not greater than 2s), and the gelation time was averaged over the two measurements.
Flame retardancy test pieces (127mm × 12.7.7 mm and three kinds of thickness 1.0mm, 2.0mm and 3.0mm) were molded using a low pressure transfer injection type machine, and the molding temperature was 175 ℃ under an injection pressure of 6.9MPa and the curing time was 120 seconds, followed by post-curing at 175 ℃ for 8 hours, after which the time of ∑ F, Flaming was measured according to the UL-94 vertical method, and the flame retardancy was judged.
And (4) judging the standard:
flaming: flame Glowing of combustion: red hot state without causing flame
Shore hardness: with reference to the test standard of GB2411-80, 16P SOP (20mm by 6.5mm by 3.3mm) was formed by transfer molding under the following conditions: the temperature of the metal mold is 175 plus or minus 3 ℃, and the injection pressure is 70 plus or minus 5kg/cm2Cure time 2 minutes. The surface hardness of the molded product was measured at 10 seconds after the mold was opened using a Shore hardness tester.
Melt viscosity: the melt viscosity of EMC was measured using a rheometer with high degree of change (CFT-500D), and the pore size of die was chosen according to the viscosity. After the die was installed, the software was started to begin heating the die to a constant temperature of 175. + -. 1 ℃. An appropriate amount of EMC sample (generally about 2g) was weighed with an electronic balance and beaten into a cylindrical sample having a size of phi 0.5mm and a height of 1.0mm with a cake machine. The sample is quickly placed in a rheometer to test by pressing a start key, the molten material flows out from the small hole, and the rheometer automatically calculates and displays the melt viscosity value.
Na+、Cl-And conductance: rolling an appropriate amount of epoxy molding compound on an electric hot plate at the temperature of 175 +/-3 ℃ to solidify the epoxy molding compound, shoveling the solidified material from the electric hot plate, placing the solidified material in an oven at the temperature of 175 +/-5 ℃ to solidify for 6 hours, cooling the post-solidified material sheet to room temperature, and grinding powderPulverizing and sieving with 80 mesh sieve to obtain extractive solution. Taking the extract, measuring Na ion content with an atomic absorption spectrometer, measuring Cl ion content with a titration method, and measuring conductivity with a conductivity meter.
Moisture absorption: test pieces (size) made of epoxy resin composition
Height 3mm), post-curing the molded water absorption sample strips at 175 ℃ for 8 hours, placing the sample strips in a basket of a high Pressure Cooker (PCT), and autoclaving the sample strips at 121 ℃ for 24 hours to test the water absorption weight increase rate.
Reflow resistance: the 100P TQFP was encapsulated with an epoxy resin composition (semiconductor component size 8.0 × 8.0mm, lead frame made of 42 alloy) under the molding conditions: the temperature of the metal mold is 175 plus or minus 3 ℃, and the injection pressure is 70 plus or minus 5kg/cm2The curing time was 1.5 minutes. Further, post-curing treatment was performed at 175 ℃ for 8 hours, while the resulting package was left in an environment at a temperature of 60 ℃ and a relative humidity of 60% for 40 hrs; thereafter, the package was immersed in a solder bath at 240 ℃ for 10 seconds. The peeling area of the cured product of the epoxy resin composition, i.e., the area of the cured epoxy resin composition peeled from the surface of the lead frame base material was measured by a scanning acoustic chromatography technique, and the peeling rate was calculated from the following formula:
[ peeling rate ] { (peeling area)/(surface area of semiconductor device) × 100% }
The number of samples n is 10. The unit of the peeling rate is%.
And (3) testing results: the results of the above tests are reported in table 2:
TABLE 2
As can be seen from Table 2, example 1 is a high-adhesion epoxy resin composition of the present invention with nickel, and the test results show that it has good flame retardancy, fluidity, adhesion, reflow resistance and low moisture absorption. In comparison with the comparative example in example 1,after the coupling agent is added, the stripping rate is extremely low, and the problem of nickel layering is thoroughly solved, wherein Na is used as a main component+、Cl-Changes in electrical conductivity, moisture absorption, etc. are not obvious and have no effect on other properties, indicating that the modifier plays a positive role in layering and does not have a negative effect.
Thus, it is understood from Table 2 that the high-adhesion epoxy resin composition to nickel of the present invention exhibits good adhesion to nickel without affecting flame retardancy and Na+、Cl-Electrical conductivity, and moisture absorption.
The above embodiments should not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent transformations fall within the protection scope of the present invention.
Claims (9)
1. The high-adhesion epoxy resin composition for nickel is characterized in that a coupling agent adopted by an epoxy resin composition is 3- [ 2-hydroxy-3- (2H-tetrazole-5-amino) -propoxy ] -propyl trimethoxy silane, and the high-adhesion epoxy resin composition is prepared from 2-15 parts of epoxy resin, 2-10 parts of a curing agent, 0.1-6 parts of a flame retardant, 0.01-1 part of a curing accelerator, 70-95 parts of an inorganic filling material and 0.1-0.8 part of a coupling agent in parts by mass.
2. The epoxy resin composition having high adhesion to nickel according to claim 1, wherein: the epoxy resin is one or a mixture of several of bisphenol epoxy resin, biphenyl epoxy resin, triphenol methane epoxy resin, naphthol epoxy resin, stilbene epoxy resin, epoxy resin containing a triazine core structure, novolac epoxy resin, modified novolac epoxy resin and dicyclopentadiene epoxy resin in any proportion.
3. The epoxy resin composition having high adhesion to nickel according to claim 2, wherein: the bisphenol epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin or bisphenol S epoxy resin.
4. The epoxy resin composition having high adhesion to nickel according to claim 1, wherein: the hardener is one or a mixture of several of novolac resin, cresol novolac resin, naphthalene type phenolic resin and cyclopentadiene type phenolic resin according to any proportion.
5. The epoxy resin composition having high adhesion to nickel according to claim 1, wherein: the hardening accelerator is one or a mixture of several of tertiary amine and nitrogen heterocyclic compounds according to any proportion.
6. The epoxy resin composition having high adhesion to nickel according to claim 5, wherein: the tertiary amine is one or a mixture of several of triethylamine, dimethylaniline, benzyl dimethylamino and N, N-dimethyl-aminomethyl phenol in any proportion.
7. The epoxy resin composition having high adhesion to nickel according to claim 5, wherein: the nitrogen heterocyclic compound is one or a mixture of several of 2-methylimidazole, 2-methyl-4-methylimidazole, 2-heptadecylimidazole, 1-cyanoethyl-4-methylimidazole and 1, 8-diazacyclo [5,4,0] undec-7-ene in any proportion.
8. The epoxy resin composition having high adhesion to nickel according to claim 1, wherein: the inorganic filling material is one or a mixture of several of fused silica, crystalline silica, talcum powder, alumina and silicon nitride according to any proportion.
9. The use of the nickel high adhesion epoxy resin composition as claimed in any one of claims 1 to 8, wherein the epoxy resin composition is used as an encapsulating material for encapsulating components.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100067213A (en) * | 2008-12-11 | 2010-06-21 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
| KR20140082523A (en) * | 2012-12-24 | 2014-07-02 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
| CN104513462A (en) * | 2014-12-22 | 2015-04-15 | 科化新材料泰州有限公司 | High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof |
| CN105778409A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy resin composition for semiconductor packaging, and preparation method thereof |
-
2018
- 2018-03-19 CN CN201810227058.8A patent/CN108384195B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100067213A (en) * | 2008-12-11 | 2010-06-21 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
| KR20140082523A (en) * | 2012-12-24 | 2014-07-02 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
| CN105778409A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy resin composition for semiconductor packaging, and preparation method thereof |
| CN104513462A (en) * | 2014-12-22 | 2015-04-15 | 科化新材料泰州有限公司 | High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof |
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