CN108375275B - Double-temperature-zone sectional type semiconductor refrigeration equipment - Google Patents
Double-temperature-zone sectional type semiconductor refrigeration equipment Download PDFInfo
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- CN108375275B CN108375275B CN201711459751.XA CN201711459751A CN108375275B CN 108375275 B CN108375275 B CN 108375275B CN 201711459751 A CN201711459751 A CN 201711459751A CN 108375275 B CN108375275 B CN 108375275B
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 95
- 239000004065 semiconductor Substances 0.000 title claims abstract description 92
- 238000009413 insulation Methods 0.000 claims description 64
- 238000009434 installation Methods 0.000 claims description 53
- 230000003014 reinforcing effect Effects 0.000 claims description 17
- 230000009977 dual effect Effects 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 abstract description 6
- 238000005187 foaming Methods 0.000 description 12
- 235000000396 iron Nutrition 0.000 description 5
- 238000005728 strengthening Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/002—Liquid coolers, e.g. beverage cooler
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/06—Walls
- F25D23/062—Walls defining a cabinet
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/06—Walls
- F25D23/065—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/06—Walls
- F25D23/065—Details
- F25D23/067—Supporting elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D25/00—Charging, supporting, and discharging the articles to be cooled
- F25D25/02—Charging, supporting, and discharging the articles to be cooled by shelves
- F25D25/024—Slidable shelves
- F25D25/025—Drawers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a dual-temperature-zone sectional type semiconductor refrigeration device, which comprises an upper box body and a lower box body which are arranged up and down, wherein the upper box body comprises an upper shell and an upper inner container, the lower box body comprises a lower shell and a lower inner container, the dual-temperature-zone sectional type semiconductor refrigeration device also comprises a connecting belt assembly, the connecting belt assembly comprises two supporting frames, a front panel and a drawer assembly, the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a hot end heat conduction seat and a cold end heat conduction seat which are assembled together, the cold end heat conduction seat is connected with a heat pipe, and the heat pipe is divided into a first heat pipe arranged on the upper inner container and a second heat pipe arranged on the lower inner container; two the cold junction heat conduction seat all is connected with first heat pipe, one of them the cold junction heat conduction seat is connected with the second heat pipe. The storage function diversification of the double-temperature-zone sectional type semiconductor refrigeration equipment is realized, so that the user experience is improved.
Description
Technical Field
The invention relates to refrigeration equipment, in particular to double-temperature-zone sectional type semiconductor refrigeration equipment.
Background
At present, an insulation box for a wine cabinet generally comprises a box body and a door body, wherein the box body is generally divided into a plurality of temperature zones, and different temperature zones are separated by insulation partitions under a common condition, for example: chinese patent No. 201410711305.3 discloses a semiconductor wine cabinet, which is patented by semiconductor refrigeration technology, and the upper and lower inner containers need to be isolated and separated by heat preservation. However, the storage space of the cabinet body is used for refrigeration, and the function is single. The invention aims to solve the technical problem of how to design a refrigeration device with diversified functions to improve the user experience.
Disclosure of Invention
The invention provides a double-temperature-zone sectional type semiconductor refrigeration device, which realizes the function diversification of a cabinet body so as to improve the user experience.
In order to achieve the technical purpose, the invention adopts the following technical scheme:
a dual-temperature-zone sectional type semiconductor refrigeration device comprises an upper box body and a lower box body which are arranged up and down, wherein the upper box body comprises an upper shell and an upper liner, the lower box body comprises a lower shell and a lower liner, and the upper liner and the lower liner are heat-conducting liner bodies; the double-temperature-zone sectional type semiconductor refrigeration equipment further comprises a connecting belt assembly, the connecting belt assembly comprises two supporting frames, a front panel and a drawer assembly, the corresponding side edges of the upper shell and the lower shell are connected through the supporting frames, the upper inner container and the lower inner container are connected through the front panel, the front panel is made of heat-insulating materials, the drawer assembly is located between the upper box body and the lower box body, the drawer assembly comprises an installation barrel and a drawer, the drawer is slidably arranged in the installation barrel through a sliding rail, the installation barrel is fixed on the front panel, and the front panel is provided with a through hole for the drawer to pass through; the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a hot end heat conduction seat and a cold end heat conduction seat which are assembled together, wherein the cold end heat conduction seat is connected with a heat pipe, and the heat pipe is divided into a first heat pipe arranged on the upper inner container and a second heat pipe arranged on the lower inner container; two the cold junction heat conduction seat all is connected with first heat pipe, one of them the cold junction heat conduction seat is connected with the second heat pipe.
Furthermore, the two cold end heat conduction seats are arranged up and down, and the cold end heat conduction seat positioned below is connected with the second heat pipe.
Furthermore, the semiconductor refrigeration module further comprises a heat insulation support, two installation cavities are formed in the heat insulation support, installation holes communicated with the installation cavities are formed in the outer surface of the heat insulation support, the semiconductor refrigeration chips are arranged in the corresponding installation holes, the cold end heat conduction seats are arranged in the corresponding installation cavities and are in contact with the cold end surfaces of the corresponding semiconductor refrigeration chips, and the hot end heat conduction seats are arranged on the heat insulation support and are in contact with the hot end surfaces of the corresponding semiconductor refrigeration chips.
Further, the heat insulation bracket comprises a first heat insulation plate and a second heat insulation plate; the inner surface of the first heat insulation plate and/or the inner surface of the second heat insulation plate are/is provided with a groove, the groove area forms the installation cavity after the first heat insulation plate and the second heat insulation plate are connected, and the first heat insulation plate is provided with the installation hole.
And further. The inner surface of the first heat insulation plate is provided with a first pipe groove for mounting the heat pipe, and the edge of the second heat insulation plate is provided with a notch or a through hole or a second pipe groove for the heat pipe to pass through; the outer surface of the first heat insulation plate is provided with a plurality of positioning baffles around the outer side of the mounting hole, and the hot end heat conduction seat is arranged among the positioning baffles.
Further, the cold junction heat-conducting seat is including the first heat-conducting plate and the second heat-conducting plate that link together, the heat pipe presss from both sides first heat-conducting plate with between the second heat-conducting plate, the internal surface of first heat-conducting plate has seted up the first mounting groove of horizontal setting, the internal surface of second heat-conducting plate has seted up the second mounting groove of vertical setting, the heat pipe divide into horizontal flat heat pipe and vertical flat heat pipe, horizontal flat heat pipe sets up in the first mounting groove, vertical flat heat pipe sets up in the second mounting groove, and, horizontal flat heat pipe with vertical flat heat pipe contacts each other.
Furthermore, inner folded edge structures are respectively arranged on two sides of the lower end part of the upper shell and two sides of the upper end part of the lower shell, and the support frame is connected with the corresponding inner folded edge structures.
Furthermore, the upper part and the lower part of the support frame are respectively provided with an installation slot, and the inner folding edge structure is clamped in the corresponding installation slot.
Furthermore, a clamping jaw is arranged in the installation slot, a clamping groove matched with the clamping jaw is arranged on the inner folded edge structure, and the clamping jaw is clamped in the clamping groove.
Furthermore, reinforcing ribs are further arranged in the installation slots, the reinforcing ribs and the clamping jaws are arranged in a staggered and opposite mode, and clamping spaces are formed between the reinforcing ribs and the inner walls of the installation slots.
Compared with the prior art, the invention has the advantages and positive effects that: through connecting through the connecting band subassembly between two boxes, the connecting band subassembly can be in the same place two firm reliable links of box on the one hand, when the inner bag is not heat-conducting about guaranteeing, still is formed with the storing space in the connecting band subassembly, satisfies the diversified requirement of storing function to improve user experience nature.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a dual-temperature-zone sectional type semiconductor refrigeration device according to the present invention;
FIG. 2 is an exploded view of an embodiment of the dual temperature zone sectional type semiconductor refrigeration apparatus of the present invention;
FIG. 3 is a partial assembly view of the support frame and the housing of the embodiment of the semiconductor refrigeration device of the present invention;
FIG. 4 is a partial assembly view of the front panel and the inner container of the dual temperature zone sectional type semiconductor refrigeration device according to the embodiment of the present invention;
FIG. 5 is a schematic view of a partial structure of a support frame in an embodiment of the dual temperature zone sectional type semiconductor refrigeration device of the present invention;
FIG. 6 is a first assembly view of the liner and the semiconductor refrigeration module in the embodiment of the dual temperature zone sectional type semiconductor refrigeration device of the present invention;
FIG. 7 is a schematic structural diagram of a semiconductor refrigeration module in the dual-temperature-zone sectional type semiconductor refrigeration apparatus according to the present invention;
FIG. 8 is a schematic front view of a first thermal shield of the dual temperature zone sectional type semiconductor refrigeration apparatus of the present invention;
FIG. 9 is a schematic view of the reverse structure of the first thermal baffle of the dual temperature zone sectional type semiconductor refrigeration device of the present invention;
FIG. 10 is a schematic front view of a second heat insulation board of the dual temperature zone sectional type semiconductor refrigeration device according to the present invention;
FIG. 11 is a schematic view of the reverse structure of the second thermal shield in the dual temperature zone sectional type semiconductor refrigeration apparatus of the present invention;
FIG. 12 is a schematic structural diagram of a first heat-conducting plate in the sectional type semiconductor refrigeration equipment with dual temperature zones according to the present invention;
FIG. 13 is a schematic structural diagram of a second heat-conducting plate in the sectional type semiconductor refrigeration equipment with dual temperature zones according to the present invention;
FIG. 14 is a partial exploded view of a semiconductor refrigeration module of the dual temperature zone sectional type semiconductor refrigeration apparatus according to the present invention;
FIG. 15 is a second assembly view of the liner and the semiconductor refrigeration module in the embodiment of the dual temperature zone sectional type semiconductor refrigeration device of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 14, the dual-temperature-zone sectional type semiconductor refrigeration device of the present embodiment includes an upper box 1, a lower box 2, and a connection belt assembly 3, wherein the upper box 1 and the lower box 2 are connected together through the connection belt assembly 3, and a storage cavity is disposed in the connection belt assembly 3. The upper box body 1 comprises an upper shell 11 and an upper inner container 12, the lower box body 2 is provided with a lower shell 21 and a lower inner container 22, and the upper inner container 12 and the lower inner container 22 adopt heat-conducting container bodies; the drawer assembly comprises an upper shell 11 and a lower shell 12, wherein the corresponding side edges of the upper shell 11 and the lower shell 12 are connected through the supporting frames 31, the upper inner container 12 and the lower inner container 22 are connected through the front panel 32, the front panel 32 is made of heat insulating materials, the drawer assembly is positioned between the upper box body 1 and the lower box body 2, the drawer assembly comprises an installation barrel 33 and a drawer 34, the drawer 34 is slidably arranged in the installation barrel 33 through a sliding rail, the installation barrel 33 is fixed on the front panel 32, and the front panel 32 is provided with a through hole 321 for the drawer 34 to pass through; the semiconductor refrigeration module 4 is respectively arranged on the upper inner container 12 and the lower inner container 22.
Particularly, this embodiment dual temperature zone sectional type semiconductor refrigeration plant adopts the box of two independent foaming, goes up box 1 and lower box 2 promptly, and goes up and connect fixedly through connecting band subassembly 3 between box 1 and the lower box 2, and the storing cavity that forms in the connecting band subassembly 3 can be used for the storing to the diversified design of storing function of the cabinet body has been realized. The upper shell 11 and the lower shell 12 are connected and fixed through support frames 31 respectively arranged on two sides, the upper box body and the lower box body can be connected and fixed together through the support frames 31 from two sides, and meanwhile, a storage cavity is formed between the two box bodies between the support frames 31 for storing; inner folded edge structures (not shown) are respectively arranged on two sides of the lower end part of the upper shell 11 and two sides of the upper end part of the lower shell 21, the supporting frame 31 is connected with the corresponding inner folded edge structures, the shells are usually made of sheet metal, the structural strength is high, and the requirement of the connection strength can be met; in order to facilitate the assembly of the operator, the upper part and the lower part of the supporting frame 31 are respectively provided with an installation slot 311, and the inner folding edge structure 111 is clamped in the corresponding installation slot; further, a clamping jaw 312 is arranged in the installation slot 311, a clamping groove matched with the clamping jaw 312 is arranged on the inner flanging structure, the clamping jaw 312 is clamped in the clamping groove, the inner flanging structure is clamped on the support frame 31 through the matching of the clamping jaw 312 and the clamping groove, so that the on-site quick installation of an operator is facilitated, in order to improve the connection reliability, a reinforcing rib 313 is further arranged in the installation slot 311, the reinforcing rib 313 and the clamping jaw 312 are arranged in a staggered and opposite mode, a clamping space is formed between the reinforcing rib 313 and the inner wall of the installation slot 31, specifically, the inner flanging structure can move up and down in the installation slot 311 after being inserted into the installation slot 311, the reinforcing rib 313 can limit the inner flanging structure inserted into the installation slot 311, so that the inner flanging structure is clamped by the surfaces of the reinforcing rib 313 and the installation slot 311, thereby avoid interior hem structure to reciprocate in installation slot 311, in order to improve connection reliability, and in the installation slot 311 is inserted interior hem structure for the convenience of operating personnel is smooth and easy, strengthening rib 313 is provided with inclined plane (unmarked) near installation slot 311 open-ended position, hem structure enters into the clamping space along strengthening rib 313 in the inclined plane can guide, hem structure reciprocates in the restriction through strengthening rib 313, and the horizontal direction that hem structure removed in realizing through jack catch 312 and draw-in groove cooperation, improve connection reliability. The inner folding structure of the box body 1 is connected with the support frame 31 as an example: as shown in fig. 3, the bottom of the outer shell 11 of the upper case 1 is provided with an inner folding structure 111, the inner folding structure 111 is inserted into the installation slot 311 of the support frame 31, and in the process that the inner folding structure 111 is inserted into the installation slot 311, the inner folding structure 111 enters into the clamping space along the guide of the reinforcing rib 313, and the clamping jaws 312 are correspondingly clamped in the clamping grooves of the inner folding structure 111 to complete installation. The front panel 32 is adopted to shield the storage cavity in the front, and the drawer assembly is arranged on the front panel 32, so that storage is performed by using the drawer 34, and the drawer 34 is convenient for a user to use, wherein the drawer 34 is provided with the push-eject module 341, and the push-eject module 341 pushes the drawer 34 out of the installation barrel 33 by pressing the drawer 34. Preferably, in order to improve the structural strength of the front panel 32, reinforcing irons 321 are respectively disposed on both sides of the front panel 32, and screws sequentially penetrate through the front panel 32 and the reinforcing irons 321 to be fixed on the supporting frame 31, specifically, the reinforcing irons 321 are respectively disposed on both sides of the front panel 32, and the reinforcing irons 321 are fixed on the corresponding supporting frame 31 together with the front panel 32, so that the reinforcing irons 321 can effectively enhance the structural strength of the front panel 32, and the drawer assembly can be reliably mounted. The upper housing 11 and the lower housing 21 are provided with first positioning slots (not labeled) for positioning the front panel 32, two side edges of the front panel 32 are clamped in the first positioning slots, the upper edge and the lower edge of the front panel 32 are provided with second positioning slots 322, and the lower edge of the upper liner 12 and the upper edge of the lower liner 22 are inserted into the corresponding second positioning slots 322. The front panel 32 is connected with the shell and the inner container correspondingly around, so that the overall appearance effect is better, the front panel 32 is connected with the shell and the inner container of the upper and lower box bodies from the front, and the overall structural strength is improved.
The cabinet body can be processed by adopting the following processing method, and specifically, the processing method comprises the following steps:
step 1, connecting the two supporting frames between the corresponding side edges of the two shells respectively, so that the two shells are fixedly connected together through the supporting frames. Specifically, operating personnel is at the equipment scene, and in the installation slot on support frame upper portion was inserted to the interior hem structure of the shell of last box, back in inserting the installation slot with interior hem structure, the draw-in groove is gone into to the jack catch card, carries out the horizontal direction location through jack catch and draw-in groove cooperation, and at the in-process that inserts the installation slot with interior hem structure, interior hem structure enters into along the strengthening rib and presss from both sides tight space, and the strengthening rib supports to lean on including the hem structure, realizes vertical direction location.
And 2, installing an inner container in each shell, installing an installation barrel on the front panel, then respectively connecting the two side edges of the front panel with the shells arranged up and down, and respectively connecting the upper edge and the lower edge of the front panel with the inner containers in the corresponding shells. Specifically, the inner container is installed in the upper outer shell, then the two side edges of the front panel are inserted into the corresponding first positioning slots, the lower edge of the inner container in the upper outer shell is inserted into the second positioning slot in the upper portion of the front panel, and finally the inner container is installed in the lower outer shell, and the upper edge of the inner container in the lower portion is inserted into the second positioning slot in the lower portion of the front panel.
And 3, mounting the back plate on the two shells to form a foaming cavity, and injecting a foaming material into the foaming cavity for foaming. Specifically, the shell and the inner bag of the upper box body and the lower box body are connected and fixed through the connecting belt component, the back plate is installed on the shell and the supporting frame, a foaming cavity is formed between the shell, the inner bag, the supporting frame, the mounting barrel, the front panel and the back plate, foaming materials are injected into the foaming cavity to foam, and therefore the foaming layer in the upper box body, the foaming layer in the lower box body and the foaming layer wrapped outside the mounting barrel are of an integral foaming structure, and the structural strength of the whole cabinet body is improved.
For the semiconductor refrigeration module 4, the semiconductor refrigeration module 4 comprises a semiconductor refrigeration chip 41 and a heat pipe 42, the semiconductor refrigeration chip 41 comprises a cold end surface for releasing cold and a hot end surface for releasing heat, and further comprises an assembly module 43, the assembly module 43 comprises a first heat insulation plate 431, a second heat insulation plate 432, a hot end heat conduction seat 433 and a cold end heat conduction seat 434, a first groove 4311 is arranged on the inner surface of the first heat insulation plate 431, a mounting hole 4312 penetrating through the first heat insulation plate 431 is formed in the first groove 4311, a second groove 4321 is arranged on the inner surface of the second heat insulation plate 432, the first heat insulation plate 431 is fixed on the second heat insulation plate 432, a mounting cavity is formed between the first groove 4311 and the second groove 4321, the semiconductor refrigeration chip 41 is located in the mounting hole 4312, the cold end heat conduction seat 434 is arranged in the mounting cavity and is in contact with the cold end surface of the semiconductor refrigeration chip 41, the hot end heat conduction seat 433 is arranged on the first heat insulation plate 431 and is in surface contact with the hot end of the semiconductor refrigeration chip 41, the heat pipe 42 is connected with the cold end heat conduction seat 434, and the heat pipes 2 of the two semiconductor refrigeration modules 4 are attached to the corresponding upper inner container 12 and the corresponding lower inner container 22 to transfer cold. Specifically, the semiconductor refrigeration chip 41 is embedded into the mounting hole 4312 of the first heat insulation plate 431, the periphery of the semiconductor refrigeration chip 41 is wrapped by the first heat insulation plate 431, and the hot end heat conduction seat 433 and the cold end heat conduction seat 434 are spaced apart by the first heat insulation plate 431, the heat transfer generated between the hot end heat conduction seat 433 and the cold end heat conduction seat 434 can be effectively reduced, so that the cold loss of the cold end heat conduction seat 434 is reduced, meanwhile, the cold end heat conduction seat 434 is wrapped in the mounting cavity formed by the first heat insulation plate 431 and the second heat insulation plate 432 and having the heat insulation function, the cold energy generated by the semiconductor refrigeration chip 41 conducted by the cold end heat conduction seat 434 can be transmitted to a required area through the heat pipe 42 to the greatest extent, so that the cold energy dissipation amount of the cold end heat conduction seat 434 is reduced, and the energy consumption is more effectively reduced.
Preferably, the outer surface of the first heat insulation plate 431 is provided with a heat insulation groove 4313 around the mounting hole 4312, and heat insulation cotton (not marked) is arranged in the heat insulation groove 4313; the hot side of the semiconductor refrigeration chip 41 protrudes outward from the outer surface of the first insulation board 431. Specifically, the heat insulation groove 4313 can be used for arranging the heat insulation cotton at the periphery of the semiconductor refrigeration chip 41, so that the heat insulation ring formed by the heat insulation cotton further reduces the outward dissipation of the cold quantity on the cold end face of the semiconductor refrigeration chip 41, and meanwhile, the heat quantity on the hot end face of the semiconductor refrigeration chip 41 can be reduced to enter the installation cavity, so that the loss of the cold quantity is reduced to the maximum extent; the hot end face of the semiconductor refrigeration chip 41 is slightly higher than the outer surface of the first heat insulation plate 431, so that the hot end face of the semiconductor refrigeration chip 41 and the hot end heat conduction seat 433 can be in good contact heat transfer on one hand, and on the other hand, the hot end face of the semiconductor refrigeration chip 41 is separated from the mounting hole 4312, heat can be reduced from being transmitted into the mounting cavity from the mounting hole 4312, and loss of cold can be effectively reduced. In order to facilitate the connection of circuit wiring, a wiring groove 4314 is further disposed on the outer surface of the first heat insulation plate 431, and the wiring groove 4314 is communicated with the mounting hole 4312. In addition, according to the requirement of the refrigerating capacity of the refrigerating device, the semiconductor refrigerating module of this embodiment includes a plurality of semiconductor refrigerating chips 41, the assembling module 43 is configured with the hot-end heat conduction seat 433 and the cold-end heat conduction seat 434 corresponding to the semiconductor refrigerating chips 41, and the first heat insulation board 431 is provided with the mounting hole 4312 corresponding to the semiconductor refrigerating chip 41.
Further, in order to more effectively reduce heat transfer generated between the hot end heat conduction seat 433 and the cold end heat conduction seat 434 due to assembly, an avoidance notch 4340 is formed in the cold end heat conduction seat 434, through holes (not marked) are respectively formed in the first heat insulation plate 431, the second heat insulation plate 432 and the hot end heat conduction seat 433, a bolt 435 is inserted into the corresponding through hole, and the bolt 435 penetrates through an area formed by the avoidance notch 4340. Specifically, in the assembling process, the hot-end heat conducting seat 433, the first heat insulating plate 431, the cold-end heat conducting seat 434 and the second heat insulating plate 432 are sequentially assembled and fixed together through the bolt 435, and the bolt 435 avoids the cold-end heat conducting seat 434 through the avoiding notch 4340, so that heat exchange between the hot-end heat conducting seat 433 and the cold-end heat conducting seat 434 through the bolt 435 can be avoided. The inner surface of the first heat insulation board 431 is provided with a first pipe groove 4316 and a first pipe groove 4317 for installing the heat pipe 42, and the edge of the second heat insulation board 432 is provided with a notch or a through hole 4322 or a second pipe groove for the heat pipe 42 to pass through. Specifically, the heat pipe 42 passes through the assembly module 43 through the first pipe groove 4316 and the first pipe groove 4317 in cooperation with the through hole 4322, so that the heat pipe 42 can be conveniently disposed on the inner container of the refrigeration apparatus. In addition, in order to facilitate quick positioning and installation of the hot-end heat-conducting seat 433, a plurality of positioning baffles 4315 are arranged on the outer surface of the first heat insulation plate 431 around the outer side of the installation hole 4312, and the hot-end heat-conducting seat 433 is arranged among the positioning baffles 4315. During assembly, the hot-end heat-conducting seat 433 can be conveniently positioned and installed through the positioning baffle 4315, and the hot-end heat-conducting seat 433 can be ensured to be in good contact with the semiconductor refrigeration chip 41 accurately.
Still further, the cold end heat conductor 434 includes a first heat conductive plate 4341 and a second heat conductive plate 4342 connected together, the heat pipe 42 being sandwiched between the first heat conductive plate 4341 and the second heat conductive plate 4342. Specifically, a first mounting groove 43411 is transversely formed in the inner surface of the first heat conducting plate 4341, a second mounting groove 43421 is longitudinally formed in the inner surface of the second heat conducting plate 4342, the heat pipe 42 is divided into a transverse flat heat pipe and a longitudinal flat heat pipe, the transverse flat heat pipe is arranged in the first mounting groove 43411, the longitudinal flat heat pipe is arranged in the second mounting groove 43421, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other. Specifically, the area of contact that adopts flat heat pipe can effectual increase heat pipe and cold junction heat conduction seat 434, and simultaneously, flat heat pipe can also the area of contact between effectual increase and the inner bag, provides heat exchange efficiency. And the transverse flat heat pipe is contacted with the longitudinal flat heat pipe, so that the temperature of the heat pipes at different positions is uniformly distributed, the temperature difference is reduced, and the temperature uniformity is improved.
The cold end heat conduction seat is installed through the installation cavity formed between the two heat insulation supports, so that the cold end heat conduction seat and the hot end heat conduction seat are effectively insulated and spaced by the heat insulation supports, the heat exchange quantity generated between the cold end heat conduction seat and the hot end heat conduction seat can be greatly reduced, the dissipation of cold quantity is effectively reduced, and the refrigeration efficiency of refrigeration equipment is improved and the energy consumption is reduced. Meanwhile, the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation plate, so that the cold end face of the semiconductor refrigeration chip is ensured to be in good contact with the cold end heat conduction seat, the hot end face of the semiconductor refrigeration chip is ensured to be in good contact with the hot end heat conduction seat, heat is ensured to be rapidly dissipated, and the use reliability is improved.
Based on the above technical solution, optionally, as shown in fig. 15, for the upper inner container 12 and the lower inner container 22, one semiconductor refrigeration module 4 may be shared, two semiconductor refrigeration fins 41 are disposed in the semiconductor refrigeration module 4, the heat pipes are divided into a first heat pipe 421 disposed on the upper inner container 12 and a second heat pipe 422 disposed on the lower inner container 22, and the semiconductor refrigeration module 4 may be mounted on the upper inner container 12 or the lower inner container 22 to reduce the manufacturing cost. Specifically, the semiconductor refrigeration module 4 utilizes two semiconductor refrigeration chips 41 to provide cold energy, and the two semiconductor refrigeration chips 41 respectively transmit cold energy outwards through corresponding cold end heat conduction seats, wherein, in order to ensure that the upper inner container 12 positioned on the upper portion obtains sufficient cold energy to weaken the influence of sinking of the cold energy, the cold energy generated by one of the semiconductor refrigeration chips is completely used for refrigerating the upper inner container 12 through the first heat pipe 421, and partial cold energy of the other semiconductor refrigeration chip is also completely used for refrigerating the upper inner container 12 through the first heat pipe 421, and the residual cold energy of the other semiconductor refrigeration chip is transmitted to the lower inner container 22 through the second heat pipe 422, so that the refrigeration temperature of the upper inner container 12 can be effectively lowered, and the requirement of high-efficiency refrigeration of the large volume of the upper inner container 12 can be met. Wherein, in order to ensure that the cold quantity of the upper inner container and the lower inner container is uniformly distributed, the heat pipes are distributed on the back and two side walls of the inner container. In addition, for the convenience of assembly, two cold junction heat conduction seats are arranged up and down and are installed on the upper inner container 12, and the cold junction heat conduction seat located below is connected with the second heat pipe 422.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (8)
1. The double-temperature-zone sectional type semiconductor refrigeration equipment is characterized by further comprising a connecting belt assembly and two semiconductor refrigeration modules, wherein the connecting belt assembly comprises two support frames, a front panel and a drawer assembly, and the corresponding side edges of the upper shell and the lower shell are connected through the support frames; inner folded edge structures are respectively arranged on two sides of the lower end part of the upper shell and two sides of the upper end part of the lower shell, the support frame is connected with the corresponding inner folded edge structures, installation slots are respectively arranged on the upper part and the lower part of the support frame, and the inner folded edge structures are clamped in the corresponding installation slots; the upper inner container and the lower inner container are connected through the front panel, the front panel is made of heat insulating materials, the drawer assembly is located between the upper box body and the lower box body, the drawer assembly comprises an installation barrel and a drawer, the drawer is slidably arranged in the installation barrel through a sliding rail, the installation barrel is fixed on the front panel, and the front panel is provided with a through hole for the drawer to pass through; the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a hot end heat conduction seat and a cold end heat conduction seat which are assembled together, wherein the cold end heat conduction seat is connected with a heat pipe, and the heat pipe is divided into a first heat pipe arranged on the upper inner container and a second heat pipe arranged on the lower inner container; two the cold junction heat conduction seat all is connected with first heat pipe, one of them the cold junction heat conduction seat is connected with the second heat pipe.
2. The semiconductor refrigeration device of claim 1, wherein two of the cold end heat conduction seats are arranged up and down, and the second heat pipe is connected to the lower cold end heat conduction seat.
3. The dual-temperature-zone segmented semiconductor refrigeration equipment as claimed in claim 1, wherein the semiconductor refrigeration module further comprises a heat insulation support, two mounting cavities are formed in the heat insulation support, mounting holes communicated with the corresponding mounting cavities are formed in the outer surface of the heat insulation support, the semiconductor refrigeration chips are arranged in the corresponding mounting holes, the cold-end heat conduction seats are arranged in the corresponding mounting cavities and are in contact with the cold end surfaces of the corresponding semiconductor refrigeration chips, and the hot-end heat conduction seats are arranged on the heat insulation support and are in contact with the hot end surfaces of the corresponding semiconductor refrigeration chips.
4. The dual temperature zone segmented semiconductor refrigeration device of claim 3, wherein the heat shield support comprises a first heat shield and a second heat shield; the inner surface of the first heat insulation plate and/or the inner surface of the second heat insulation plate are/is provided with a groove, the groove area forms the installation cavity after the first heat insulation plate and the second heat insulation plate are connected, and the first heat insulation plate is provided with the installation hole.
5. The dual-temperature-zone segmented semiconductor refrigeration equipment as claimed in claim 4, wherein the inner surface of the first heat insulation plate is provided with a first pipe groove for installing the heat pipe, and the edge of the second heat insulation plate is provided with a notch or a through hole or a second pipe groove for the heat pipe to pass through; the outer surface of the first heat insulation plate is provided with a plurality of positioning baffles around the outer side of the mounting hole, and the hot end heat conduction seat is arranged among the positioning baffles.
6. The dual-temperature-zone sectional type semiconductor refrigeration equipment as claimed in claim 2, wherein the cold-end heat conduction seat comprises a first heat conduction plate and a second heat conduction plate which are connected together, the heat pipe is sandwiched between the first heat conduction plate and the second heat conduction plate, a first mounting groove is formed in the inner surface of the first heat conduction plate, a second mounting groove is formed in the inner surface of the second heat conduction plate, the heat pipe is divided into a transverse flat heat pipe and a longitudinal flat heat pipe, the transverse flat heat pipe is arranged in the first mounting groove, the longitudinal flat heat pipe is arranged in the second mounting groove, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other.
7. The semiconductor refrigeration device with a segmented dual temperature zone according to claim 1, wherein a clamping jaw is arranged in the installation slot, a clamping groove matched with the clamping jaw is arranged on the inner folded edge structure, and the clamping jaw is clamped in the clamping groove.
8. The semiconductor refrigeration device with a dual temperature zone section as claimed in claim 7, wherein a reinforcing rib is further arranged in the installation slot, the reinforcing rib and the clamping jaw are arranged in a staggered and opposite mode, and a clamping space is formed between the reinforcing rib and the inner wall of the installation slot.
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| CN110873476A (en) * | 2018-08-29 | 2020-03-10 | 青岛海尔特种电冰柜有限公司 | Cold end and semiconductor refrigeration equipment |
| CN109302100A (en) * | 2018-11-22 | 2019-02-01 | 欧家成 | A kind of temperature difference electricity generation device and accumulating system |
| US11486629B2 (en) * | 2020-06-25 | 2022-11-01 | Whirlpool Corporation | Refrigeration appliance cabinet assembly |
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| CN2722146Y (en) * | 2004-06-29 | 2005-08-31 | 河南新飞电器有限公司 | Assembled refrigerator with multiple doors and internal linings |
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| CN108375275A (en) | 2018-08-07 |
| CN108800711B (en) | 2020-12-15 |
| CN108800711A (en) | 2018-11-13 |
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Effective date of registration: 20201112 Address after: 266101 Haier Industrial Park, Haier Road, Laoshan District, Shandong, Qingdao, China Applicant after: QINGDAO HAIER SPECIAL FREEZER Co.,Ltd. Applicant after: QINGDAO HAIER SMART TECHNOLOGY R&D Co.,Ltd. Applicant after: Haier Zhijia Co.,Ltd. Address before: 266100 Haier Industrial Park, 1 Haier Road, Laoshan District, Shandong, Qingdao Applicant before: QINGDAO HAIER SPECIAL FREEZER Co.,Ltd. Applicant before: QINGDAO HAIER SMART TECHNOLOGY R&D Co.,Ltd. |
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