CN218587518U - Electronic product heat dissipation device - Google Patents
Electronic product heat dissipation device Download PDFInfo
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- CN218587518U CN218587518U CN202221985947.9U CN202221985947U CN218587518U CN 218587518 U CN218587518 U CN 218587518U CN 202221985947 U CN202221985947 U CN 202221985947U CN 218587518 U CN218587518 U CN 218587518U
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- heat
- fixed mounting
- heat dissipation
- dissipation device
- shell
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an electronic product heat abstractor belongs to heat abstractor technical field. The utility model provides an electronic product heat abstractor, includes the heat absorption piece, heat absorption piece top fixed mounting has the heat conduction post, heat conduction post top fixed mounting has the radiating block, the radiating block outside cover is established and is installed the heat transfer shell, the jack has been seted up at heat transfer shell top. The utility model discloses a holistic structure setting supports the pressure contact chip through the heat absorption piece that has smooth plane to in transmitting the radiating block with the heat through the heat conduction post, the radiating block is in heat transfer medium with heat transfer in the heat transfer shell, and the medium is heated and volatilizes the loss and to the radiating ring, through the abundant contact of giving vent to anger of guide vane and air pump, improves heat transfer area of contact greatly, effectively guarantees the radiating effect that the chip was handled to the electronic product.
Description
Technical Field
The utility model relates to a heat abstractor technical field, more specifically says, relates to an electronic product heat abstractor.
Background
The electronic product calculates through the treater, and then realizes intelligent control, and the size of treater is usually less than 2 square centimeters, but the consumption reaches dozens, hundreds of watts, if can not in time go out the heat conduction, the heat in case accumulate in the treater, will lead to serious consequence, so can set up the heat radiation of heat radiation structure to electronic product.
In the conventional heat dissipation structure, a fan is directly used for blowing heat for heat dissipation, but when air-cooled heat dissipation is performed, the heat dissipation effect is poor due to poor heat transfer capability of air and small size of a chip.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved
An object of the utility model is to provide an electronic product heat abstractor to propose the little poor problem that leads to the radiating effect of current forced air cooling heat dissipation area of contact in solving above-mentioned background art.
2. Technical scheme
A heat dissipation device of an electronic product comprises a heat absorption block, wherein a heat conduction column is fixedly mounted at the top end of the heat absorption block, a heat dissipation block is fixedly mounted at the top end of the heat conduction column, a heat exchange shell is sleeved and mounted on the outer side of the heat dissipation block, an insertion hole is formed in the top end of the heat exchange shell, an insertion pipe is inserted and mounted in the middle of the insertion hole, a heat dissipation ring is fixedly mounted at the top end of the insertion pipe in a penetrating mode, and a guide vane is fixedly mounted on the side wall of the heat dissipation ring in a penetrating mode;
when the chip of electronic product such as computer need dispel the heat, the heat absorption piece can hug closely the chip surface and arrange to transmit the radiating block with the heat through a plurality of heat conduction posts, carry out quick heat transfer, with the lateral wall of heat transfer shell, radiating ring and guide vane, improve greatly with the area of contact of outside air, effectively improve the radiating effect.
Preferably, the side wall of the bottom end of the heat exchange shell is provided with a through hole, and the through hole is fixedly connected with the side wall of the heat conduction column;
the through hole conveniently passes the heat conduction post to connect through welding mode or rubber coating mode, prevent that heat transfer medium from revealing.
Preferably, the radiating blocks are arranged in the heat exchange shell in an annular array, and the heat exchange shell is filled with a heat exchange medium;
the radiating block is provided with a plurality ofly to the equidistance is arranged inside the heat transfer shell, can be with the even heat transfer medium that transmits of absorbed heat, and heat transfer medium is heated can gasify, and heat transfer medium after the gasification gets into the radiating ring, fully contacts radiating ring and guide vane lateral wall, can further improve heat exchange efficiency.
Preferably, a bottom plate is fixedly mounted on the side wall of the bottom end of the heat exchange shell, and a bolt seat is fixedly mounted at the edge of the bottom plate;
the bottom plate can support the whole device, is connected with an external fixing structure through a bolt seat matched bolt, is fixedly connected with the device, and ensures that the heat absorption can be quickly and tightly attached to the outer surface of the chip.
Preferably, the middle part of the guide vane is fixedly provided with an inserting ring, and the middle part of the inserting ring is fixedly provided with an air pump in a penetrating way;
the inserting ring can fix the position of the far end of the guide vane and can be inserted with an air pump, the air pump blows air downwards, the air blows the surface of the guide vane to be discharged upwards to take away heat, and efficient heat dissipation is carried out.
Preferably, the side wall of the inserting ring is fixedly provided with supports which are arranged at equal intervals, and the middle of each support is provided with a hollow-out opening;
the support can be fixed the position of grafting ring, guarantees air pump job stabilization to the fretwork mouth shelters from less to the air passage, makes things convenient for the air current to pass through fast.
Preferably, adapter bases which are arranged at equal intervals are fixedly installed on the outer wall of the heat exchange shell, a threaded rod is rotatably installed on the upper portion of each adapter base, a threaded sleeve is sleeved on the outer side of the threaded rod, and the threaded sleeves are fixedly connected with the heat dissipation rings;
the adapter can rotate the threaded rod spacing, and hexagonal groove has been seted up on the threaded rod top, and it is fixed to conveniently cooperate the thread bush to compress tightly all around heat transfer shell and radiating ring, guarantees sealed effect.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages of:
1. the utility model discloses a holistic structure setting supports the pressure contact chip through the heat absorption piece that has smooth plane to through the heat conduction post with heat transfer to the radiating block, the radiating block is in heat transfer medium with heat transfer in the heat transfer shell, the medium is heated and volatilizes the loss and to the cooling ring, through the abundant contact of giving vent to anger of guide card and air pump, improves heat transfer area of contact greatly, effectively guarantees the radiating effect that the chip was handled to the electronic product.
2. The utility model discloses a holistic structure setting, the pipe of pegging graft is installed to installation between heat transfer shell and cooling ring, and the medium of gasification can be through the synchronous upwards loss of a plurality of grafting pipes, improves heat exchange efficiency to grafting pipe collocation threaded rod can be with the stable crimping of heat transfer shell and cooling ring, guarantees stable connection and can carry out swift split, changes inside heat transfer medium, further improves the practicality of device.
Drawings
Fig. 1 is a left side schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the middle structure position of the present invention;
FIG. 3 is a schematic sectional view of a partial structure of the present invention;
fig. 4 is a schematic diagram of the partial structure split of the present invention.
The reference numbers in the figures illustrate: a base plate 1; a heat dissipation ring 2; a guide blade 3; an air pump 4; a bracket 5; a plug-in ring 6; a threaded sleeve 7; a heat absorbing block 8; a bolt seat 9; an adapter 10; a heat exchange shell 11; a jack 12; a threaded rod 13; a bayonet tube 14; a through hole 15; a heat-conducting post 16; and a heat dissipation block 17.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides two technical solutions:
the first embodiment is as follows:
the utility model provides an electronic product heat abstractor, includes heat absorption piece 8, and 8 top fixed mounting of heat absorption piece have heat conduction post 16, and 16 top fixed mounting of heat conduction post have a radiating block 17, and the heat exchange shell 11 is established to the cover in the radiating block 17 outside, and jack 12 has been seted up on 11 tops of heat exchange shell, and the grafting is installed at 12 middle parts of jack 14, and the grafting is managed 14 tops and is run through fixed mounting and have the cooling ring 2, and the 2 lateral walls of cooling ring run through fixed mounting and have guide vane 3.
Specifically, the side wall of the bottom end of the heat exchange shell 11 is provided with a through hole 15, and the through hole 15 is fixedly connected with the side wall of the heat conducting column 16.
Further, the radiating blocks 17 are arranged inside the heat exchange shell 11 in an annular array, and the heat exchange shell 11 is filled with a heat exchange medium.
It is worth to say that, the bottom end side wall of the heat exchange shell 11 is fixedly provided with the bottom plate 1, and the edge of the bottom plate 1 is fixedly provided with the bolt seat 9.
When the chip of an electronic product such as a computer needs to dissipate heat, the heat absorption block 8 can be arranged close to the surface of the chip, and the heat is transmitted to the heat dissipation block 17 through the heat conduction columns 16, rapid heat transmission is performed, the heat is transmitted to the heat exchange shell 11, the side walls of the heat dissipation ring 2 and the guide fin 3, the contact area with the outside air is greatly increased, the heat dissipation effect is effectively improved, the through hole 15 conveniently passes through the heat conduction columns 16, the heat conduction columns are connected in a welding mode or a gluing mode, the heat exchange medium is prevented from leaking, the heat dissipation block 17 is provided with a plurality of heat dissipation blocks, the heat dissipation blocks are arranged inside the heat exchange shell 11 at equal intervals, the heat exchange medium can be uniformly transmitted to the absorbed heat exchange medium, the heat exchange medium is heated and gasified, the gasified heat exchange medium enters the heat dissipation ring 2, the heat dissipation ring 2 and the side walls of the guide fin 3 are fully contacted, the heat exchange efficiency can be further improved, the bottom plate 1 can support the whole device, the bolt seat 9 is matched with a bolt and connected with an external fixing structure, the fixed connection of the device is performed, and the heat absorption block 8 can be ensured to be close to the external surface of the chip.
Example two:
the utility model provides an electronic product heat abstractor, includes heat absorption piece 8, and 8 top fixed mounting of heat absorption piece have heat conduction post 16, and 16 top fixed mounting of heat conduction post have radiating block 17, and the heat exchange shell 11 is established to the cover in the radiating block 17 outside, and jack 12 has been seted up on 11 tops of heat exchange shell, and the pipe 14 of pegging graft is installed in 12 middle parts of jack, and the pipe 14 tops of pegging graft run through fixed mounting have radiator ring 2, and the 2 lateral walls of radiator ring run through fixed mounting have guide vane 3.
It is worth noting that the middle part of the guide vane 3 is fixedly provided with an inserting ring 6, and the middle part of the inserting ring 6 is fixedly provided with an air pump 4 in a penetrating way.
Besides, the side wall of the inserting ring 6 is fixedly provided with a support 5 which is arranged at equal intervals, and the middle part of the support 5 is provided with a hollow-out opening.
It has to be said that adapter seats 10 arranged at equal intervals are fixedly installed on the outer wall of the heat exchange shell 11, a threaded rod 13 is rotatably installed on the upper portion of the adapter seat 10, a threaded sleeve 7 is installed on the outer side of the threaded rod 13 in a sleeved mode, and the threaded sleeve 7 is fixedly connected with the heat dissipation ring 2.
The air pump 4 that involves in two kinds of embodiments adopts the electron air pump, and its supporting control system, electromagnetic switch and pipeline circuit also can be provided by the producer, in addition, the utility model discloses in involve power module, circuit and electronic components and control module and be prior art, the skilled person in the art can realize completely, need not proud, the utility model discloses the content of protection does not relate to the improvement to inner structure and method yet.
The foregoing shows and describes the basic principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A heat dissipation device for electronic products comprises a heat absorption block (8), and is characterized in that: the heat absorption block (8) top fixed mounting has heat conduction post (16), heat conduction post (16) top fixed mounting has radiating block (17), radiating block (17) outside cover is established and is installed heat transfer shell (11), jack (12) have been seted up on heat transfer shell (11) top, jack (12) middle part is pegged graft and is installed grafting pipe (14), grafting pipe (14) top is run through fixed mounting and is had cooling ring (2), cooling ring (2) lateral wall runs through fixed mounting has guide vane (3).
2. The heat dissipation device of claim 1, wherein: the heat exchange shell (11) is characterized in that a through hole (15) is formed in the side wall of the bottom end of the heat exchange shell, and the through hole (15) is fixedly connected with the side wall of the heat conducting column (16).
3. The heat dissipation device of claim 2, wherein: the radiating blocks (17) are arranged inside the heat exchange shell (11) in an annular array mode, and heat exchange media are filled inside the heat exchange shell (11).
4. The heat dissipation device of claim 3, wherein: the heat exchange shell (11) bottom lateral wall fixed mounting has bottom plate (1), bottom plate (1) edge fixed mounting has bolt seat (9).
5. The heat dissipation device of claim 1, wherein: the middle part of the guide vane (3) is fixedly provided with an inserting ring (6), and the middle part of the inserting ring (6) is penetrated through and fixedly provided with an air pump (4).
6. The heat dissipation device of claim 5, wherein: the side wall of the inserting ring (6) is fixedly provided with supports (5) which are arranged at equal intervals, and hollow-out openings are formed in the middle of the supports (5).
7. The heat dissipation device of claim 6, wherein: heat transfer shell (11) outer wall fixed mounting has adapter (10) that the equidistance was arranged, adapter (10) upper portion is rotated and is installed threaded rod (13), threaded rod (13) outside cover is established and is installed thread bush (7), thread bush (7) and cooling ring (2) fixed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221985947.9U CN218587518U (en) | 2022-07-29 | 2022-07-29 | Electronic product heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221985947.9U CN218587518U (en) | 2022-07-29 | 2022-07-29 | Electronic product heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218587518U true CN218587518U (en) | 2023-03-07 |
Family
ID=85360873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221985947.9U Active CN218587518U (en) | 2022-07-29 | 2022-07-29 | Electronic product heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218587518U (en) |
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2022
- 2022-07-29 CN CN202221985947.9U patent/CN218587518U/en active Active
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