CN108370646B - 用于移动设备的可调整间隙结构 - Google Patents

用于移动设备的可调整间隙结构 Download PDF

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Publication number
CN108370646B
CN108370646B CN201580085293.0A CN201580085293A CN108370646B CN 108370646 B CN108370646 B CN 108370646B CN 201580085293 A CN201580085293 A CN 201580085293A CN 108370646 B CN108370646 B CN 108370646B
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CN
China
Prior art keywords
mobile device
mode
air gap
magnets
printed circuit
Prior art date
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Active
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CN201580085293.0A
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English (en)
Chinese (zh)
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CN108370646A (zh
Inventor
M·翁
A·亨格
C-W·严
C-S·程
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Intel Corp
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Intel Corp
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Publication of CN108370646A publication Critical patent/CN108370646A/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Telephone Set Structure (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
CN201580085293.0A 2015-12-26 2015-12-26 用于移动设备的可调整间隙结构 Active CN108370646B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/000400 WO2017111842A1 (fr) 2015-12-26 2015-12-26 Structure d'écartement réglable pour dispositifs mobiles

Publications (2)

Publication Number Publication Date
CN108370646A CN108370646A (zh) 2018-08-03
CN108370646B true CN108370646B (zh) 2021-05-14

Family

ID=59091100

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580085293.0A Active CN108370646B (zh) 2015-12-26 2015-12-26 用于移动设备的可调整间隙结构

Country Status (4)

Country Link
US (1) US10462274B2 (fr)
CN (1) CN108370646B (fr)
DE (1) DE112015007238T5 (fr)
WO (1) WO2017111842A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11586260B2 (en) * 2017-03-06 2023-02-21 Tapicu, Inc. Device holder and solar powered charger unit for smart device cooler
US10886875B2 (en) * 2017-03-06 2021-01-05 Tapicu, Inc. Solar powered cooler for smart device
US10555427B2 (en) * 2017-11-08 2020-02-04 Microsoft Technology Licensing, Llc Electronic device with a magnetically attached electronic component
US11270824B2 (en) 2018-01-12 2022-03-08 Scooch, LLC Ferromagnetic accessories for a handheld device
US11417451B2 (en) 2020-10-16 2022-08-16 Hewlett Packard Enterprise Development Lp Magnetic blocks for thermally coupling cooling component and heat spreader

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101854827A (zh) * 2007-07-17 2010-10-06 费得洛克有限公司 机械-磁性连接结构
WO2015147885A1 (fr) * 2014-03-28 2015-10-01 Intel Corporation Réglage de force magnétique dans un dispositif informatique

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US5402313A (en) 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
US7472215B1 (en) * 1999-03-31 2008-12-30 International Business Machines Corporation Portable computer system with thermal enhancements and multiple power modes of operation
JP3658316B2 (ja) * 2000-12-19 2005-06-08 株式会社日立製作所 冷却方法および冷却システムならびに情報処理装置
US6657811B1 (en) * 2001-05-25 2003-12-02 Western Digital Technologies, Inc. Mobile device and disk drive having a seek current profile responsive to an environment signal
DE60209423T2 (de) 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Mikrochip-Kühlung auf Leiterplatte
US20060229502A1 (en) * 2003-06-03 2006-10-12 Bayer Healthcare Llc Portable medical diagnostic apparatus
US8069910B2 (en) * 2005-10-12 2011-12-06 Nuventix, Inc. Acoustic resonator for synthetic jet generation for thermal management
US8988881B2 (en) * 2007-12-18 2015-03-24 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US20090266516A1 (en) * 2008-04-28 2009-10-29 University Of Washington Electrospray Evaporative Cooling (ESC)
US7872864B2 (en) * 2008-09-30 2011-01-18 Intel Corporation Dual chamber sealed portable computer
CN103703658B (zh) * 2011-04-12 2016-10-26 巨石风力股份有限公司 气隙控制系统和方法
US8823477B2 (en) * 2011-06-21 2014-09-02 They Innovate Inc. Shielded magnetic attachment apparatus
US8688168B2 (en) * 2012-02-28 2014-04-01 Cellco Partnership Communication protocol between mobile client and docking station
US9066210B2 (en) * 2012-09-21 2015-06-23 Cellco Partnership Method and apparatus for automatic mobile communications restriction
US9753506B2 (en) * 2015-02-13 2017-09-05 Hewlett-Packard Development Company, L.P. Electronic devices with multi-layer heat reduction components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101854827A (zh) * 2007-07-17 2010-10-06 费得洛克有限公司 机械-磁性连接结构
WO2015147885A1 (fr) * 2014-03-28 2015-10-01 Intel Corporation Réglage de force magnétique dans un dispositif informatique

Also Published As

Publication number Publication date
US10462274B2 (en) 2019-10-29
CN108370646A (zh) 2018-08-03
DE112015007238T5 (de) 2018-11-15
US20180359345A1 (en) 2018-12-13
WO2017111842A1 (fr) 2017-06-29

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