CN108365374B - 插座电连接器 - Google Patents

插座电连接器 Download PDF

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Publication number
CN108365374B
CN108365374B CN201810016827.XA CN201810016827A CN108365374B CN 108365374 B CN108365374 B CN 108365374B CN 201810016827 A CN201810016827 A CN 201810016827A CN 108365374 B CN108365374 B CN 108365374B
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terminal
receptacle connector
electrical receptacle
shielding shell
terminals
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CN108365374A (zh
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王耀德
洪瑞禧
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Advanced-Connectek (kun-Shan) Ltd
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Advanced-Connectek (kun-Shan) Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6596—Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding   with earth pin, blade or socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H01R13/6595—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45

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  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明为一种插座电连接器，包括屏蔽外壳、屏蔽外壳内之端子模组、屏蔽外壳后侧之挡板及复数导电接地脚；藉由屏蔽外壳后方覆盖之挡板，在两侧设置有导电接地脚结构设计，插座电连接器在传输资料时所发出之杂讯被挡板隔绝，形成之电流透过导电接地脚接触电路板上接地后消散，各导电接地脚皆设置在离挡板较近的距离，在挡板上的电流从两侧之导电接地脚以杂讯电流回流路径短的方式导引电路板，不易在电流回流路径上形成天线效应，进而减少杂讯溢散。

Description

插座电连接器
技术领域
本发明有关于一种电连接器，特别是指一种插座电连接器。
背景技术
现今各式电子产品愈渐多功能，提供高度便利性，但形成复杂的电磁波干扰环境，影响电子产品之运作及传输，例如射频干扰（Radio Frequency Interference，简称RFI）的问题。
现有USB3.0插座电连接器在传输资料时会发出杂讯，一般USB3.0插座电连接器以沉板方式安装在电路板一侧端缘的破孔中，而USB3.0插座电连接器在屏蔽外壳后侧下方会加上一屏蔽铁片加以隔绝，以减少杂讯朝USB3.0插座电连接器后侧向外溢散。
但因杂讯被屏蔽铁片隔绝后会形成电流，需要将此电流经由屏蔽外壳两侧的铁壳脚导引至电路板上接地后消散，但因铁壳脚皆设置在离屏蔽铁片较远的距离，即铁壳脚非设置在屏蔽外壳后侧下方而与屏蔽铁片相接触，在屏蔽铁片上的电流需由两侧导引至屏蔽外壳后侧，再从屏蔽外壳后侧导引至其他处的铁壳脚。
故杂讯电流需从较远距离回流路径至屏蔽外壳两侧铁壳脚作接地，亦会在路径过长的电流回流路径上形成天线效应，进而导致杂讯溢散，干扰其它频段而影响运作，例如笔电上USB 3.0在讯号传输时会影响2.4G的无线滑鼠操作，导致无线滑鼠产生延迟（Lag）的情形。是以，如何解决习知结构的问题，即为相关业者所必须思考的问题所在。
发明内容
有鉴于上述问题，本发明是提供一种插座电连接器，包括屏蔽外壳、端子模组、挡板及复数导电接地脚；屏蔽外壳包括容置槽、位于容置槽前方之插接侧及位于容置槽后方之焊接侧；端子模组设置容置槽内，端子模组包含位于焊接侧之座体、自座体一侧朝外延伸至插接侧之舌板、复数设置于座体之第一端子以及第二端子，各第一端子一侧与各第二端子一侧露出舌板表面，各第一端子另一侧与各第二端子另一侧穿出于座体；挡板设置于焊接侧，挡板包括平贴于座体后侧面并接触屏蔽外壳后端缘之本体、以及自本体两侧分别延伸至屏蔽外壳两侧外壁面之侧壁；以及各导电接地脚相邻于屏蔽外壳后方两侧并对应各侧壁设置，各导电接地脚包括分别接触各侧壁之接触部、以及自接触部朝外延伸之焊接片。
在一些实施例中，各导电接地脚与挡板为一体，各导电接地脚分别自各侧壁端缘朝外延伸。
在一些实施例中，各导电接地脚包括自焊接片端缘朝外延伸之插接片。
在一些实施例中，挡板包括复数分别形成在各侧壁内侧面之突块，屏蔽外壳两侧外壁面包括有供突块扣接之卡槽。
在一些实施例中，屏蔽外壳两侧朝外延伸有复数焊接电路板接点之铁壳接地脚。
在一些实施例中，挡板包括复数形成在本体两侧之弯折片，各弯折片卡扣于屏蔽外壳后侧端缘。
在一些实施例中，各导电接地脚与屏蔽外壳为一体，各导电接地脚分别自屏蔽外壳后方两侧朝外延伸。
在一些实施例中，屏蔽外壳后方两侧形成有凹孔，各侧壁分别位于各导电接地脚底部而遮蔽各凹孔。
在一些实施例中，座体后侧包括有朝外延伸一端子脚固定块以及位于端子脚固定块底部之电路板焊接区，各第一端子另一侧与各第二端子另一侧穿出于端子脚固定块底部。
在一些实施例中，各第一端子设置于座体及舌板并位于舌板之上表面，各第二端子设置于座体及舌板并位于舌板之上表面，各第二端子一侧排列于各第一端子一侧的前侧。
藉由屏蔽外壳后方覆盖之挡板，在两侧设置有导电接地脚结构设计，插座电连接器在传输资料时所发出之杂讯被挡板隔绝，形成之电流透过导电接地脚接触电路板上接地后消散，各导电接地脚皆设置在离挡板较近的距离，即各导电接地脚设置在屏蔽外壳后方两侧而与挡板之各侧壁相接触，在挡板上的电流从两侧之导电接地脚以杂讯电流回流路径短的方式导引电路板，不易在电流回流路径上形成天线效应，进而减少杂讯溢散，改善电磁干扰（Electromagnetic Interference，EMI）、射频干扰（Radio Frequency Interference，简称RFI）的问题。
附图说明
图1是本发明的第一实施例之外观示意图。
图2 是本发明的第一实施例之分解示意图。
图3 是本发明的第一实施例安装挡板时之外观示意图。
图4 是本发明的第一实施例安装挡板后之外观示意图。
图5 是本发明的第一实施例之仰视示意图。
图6 是本发明的第一实施例之侧视示意图。
图7 是本发明的第二实施例安装挡板时之外观示意图。
图8 是本发明的第二实施例安装挡板后之外观示意图。
图9 是本发明的第三实施例安装挡板时之外观示意图。
图10 是本发明的第三实施例之仰视示意图。
符号说明
100................ 插座电连接器
1................... 屏蔽外壳
1a.................. 插接侧
1b.................. 焊接侧
10.................. 容置槽
11.................. 外壁面
12.................. 后端缘
13.................. 卡槽
14.................. 铁壳接地脚
15.................. 凹孔
2................... 端子模组
31.................. 座体
311................ 端子脚固定块
32.................. 舌板
34.................. 电路板焊接区
5................... 第一端子
54.................. 接触段
55.................. 连接段
56.................. 焊接段
6................... 第二端子
61.................. 讯号端子
611................ 正讯号端子
612................ 负讯号端子
62.................. 接地端子
64.................. 接触段
65.................. 连接段
66.................. 焊接段
7................... 挡板
71.................. 本体
72.................. 侧壁
73.................. 突块
74.................. 弯折片
8’/8’’............. 导电接地脚
81’/81’’.......... 接触部
82’/82’’.......... 焊接片
83’/83’’.......... 插接片
9................... 电路板
91............. 接点。
具体实施方式
参照图1及图2，为本创作之第一实施例，图1为外观示意图，图2为分解示意图，插座电连接器100为以USB 3.0或USB 3.1规格的电连接器作一说明，插座电连接器100包含屏蔽外壳1、端子模组2、挡板7及复数导电接地脚8’。
参照图2、图3、图5及图6，图3为安装挡板时之外观示意图，图5为仰视示意图，图6为侧视示意图，本实施例中，屏蔽外壳1为一中空壳体，屏蔽外壳1包括一容置槽10，端子模组2设置于容置槽10而使屏蔽外壳1覆盖于端子模组2外，屏蔽外壳1前后侧为镂空状态而可观视到内部的端子模组2，并且，屏蔽外壳1包括位于容置槽10前方之插接侧1a及位于容置槽10后方之焊接侧1b（如图3所示），插接侧1a提供插头电连接器插接，焊接侧1b提供沉板方式焊接电路板9，即电路板9一侧端缘形成有破孔（如图5所示），屏蔽外壳1安装电路板9定位后而于该破孔中。此外，屏蔽外壳1两侧朝外延伸有复数焊接电路板9接点91之铁壳接地脚14。
参照图2、图3、图5及图6，本实施例中，端子模组2设置容置槽10内，端子模组2包含座体31、舌板32、复数第一端子5以及复数第二端子6，座体31位于焊接侧1b、舌板32自该座体31一侧朝外延伸至该插接侧1a。
参照图2、图3、图5及图6，本实施例中，座体31后侧包括有朝外延伸端子脚固定块311以及位于端子脚固定块311底部之电路板焊接区34，端子脚固定块311装在电路板9上方，电路板9侧端置于电路板焊接区34。
参照图1、图2、图5及图6，本实施例中，各第一端子5设置于座体31及舌板32并位于舌板32之上表面，各第二端子6设置于座体31及舌板32并位于舌板32之上表面，各第二端子6一侧排列于各第一端子5一侧的前侧，各第一端子5另一侧与各第二端子6另一侧穿出于端子脚固定块311底部而接触电路板9上各接点91。
参照图2、图3及图4，图4为安装挡板后之外观示意图，本实施例中，挡板7设置于焊接侧1b，挡板7包括平贴于座体31后侧面并接触屏蔽外壳1后端缘12之本体71、以及自本体71两侧分别延伸至屏蔽外壳1两侧外壁面11之侧壁72，在此，本体71为一长条型平板，本体71与两侧壁72的俯视观之概呈ㄇ字型外观，本体71接收座体31内第一端子5与第二端子6传输资料所发出之杂讯，本体71加以隔绝，以减少杂讯向屏蔽外壳1后侧向外溢散。
参照图2、图3及图4，本实施例中，挡板7包括复数分别形成在各侧壁72内侧面之突块73，屏蔽外壳1两侧外壁面11包括一有供突块73扣接之卡槽13，挡板7由下向上组装在屏蔽外壳1的后侧时，突块73与卡槽13扣接而提供挡板7在屏蔽外壳1后侧的前后位置限位。
参照图2、图3及图4，本实施例中，挡板7包括复数形成在本体71两侧之弯折片74，各弯折片74卡扣于屏蔽外壳1后侧端缘，挡板7由下向上组装在屏蔽外壳1的后侧时，各弯折片74卡扣屏蔽外壳1后侧的底部端缘壁面，提供挡板7在屏蔽外壳1后侧的上下位置限位。
参照图2、图3、图5及图6，本实施例中，复数导电接地脚8’各相邻于屏蔽外壳1后方两侧并对应各侧壁72设置，各导电接地脚8’包括分别接触各侧壁72之接触部81’、以及自接触部81’朝外延伸之焊接片82’。在此，复数导电接地脚8’与挡板7为一体，各导电接地脚8’分别自各侧壁72顶部端缘朝外延伸，并且，各导电接地脚8’包括一自焊接片82’端缘朝外延伸之插接片83’，插接片83’垂直向下延伸形成垂直接脚（Through-hole Technology）与电路板9上的接点91接触，换言之，插接片83’插入电路板9上的焊接孔进行焊接。
杂讯被挡板7之本体71隔绝后会形成电流，电流经由本体71之两侧侧壁72导引至各导电接地脚8’，透过导电接地脚8’接触电路板9上接地后消散，在此，各导电接地脚8’皆设置在离挡板7较近的距离，即各导电接地脚8’与挡板7之各侧壁72一体而直接传输电流，且各导电接地脚8’设置在屏蔽外壳1后方两侧，在挡板7上的电流即从两侧侧壁72上之导电接地脚8’导引电路板9。
请参阅图2，本实施例中，以射出成型有座体31及舌板32，舌板32自座体31一侧延伸，舌板32上表面延伸形成复数端子槽。
参照图2、图3、图5及图6，复数第一端子5为弹性端子，系为USB 2.0传输介面，复数第一端子5排列为一横列，数量可为四根，各第一端子5分别设置在各该端子槽中。各第一端子5包括有一位于舌板32表面之接触段54，接触段54用以与对应之插头电连接器的端子接触、一自接触段54后侧延伸之焊接段56，焊接段56穿出于端子脚固定块311底部而焊接于电路板9、以及一位于接触段54与焊接段56之间的连接段55，接触段54、连接段55及焊接段56为单一根端子的各部位结构。在此，复数第一端子5为嵌入成型固定在各端子槽中。
参照图2、图3、图5及图6，复数第二端子6为平板端子，系为USB 3.0或USB 3.1传输介面，复数第二端子6排列为一横列，数量可为五根，各第二端子6设置于座体31及舌板32并位于舌板32之上表面。各该第二端子6位于舌板32之上表面而排列于各第一端子5的前侧。在此，座体31及舌板32为嵌入成型（insert-molding）方式结合复数第二端子6。本实施例揭示为复数第二端子6搭配复数第一端子5符合USB 3.0或USB 3.1协会标准所订定之传输规格。
参照图2及图5，复数第二端子6包括有两对讯号端子61及位于两对讯号端子61之间的一接地端子62，各第二端子6包括有一位于该舌板32表面之接触段64，接触段64用以与对应之插头电连接器的端子接触、一自该接触段64后侧延伸之焊接段66，焊接段66焊接于电路板9、以及一位于该接触段64与该焊接段66之间的连接段65，接触段64、连接段65及焊接段66为单一根端子的各部位结构。
参照图2，各对讯号端子61包括有一正讯号端子611以及一负讯号端子612，特别是，第一对讯号端子61包括有一正讯号传送端子以及一负讯号传送端子（Super-SpeedTransmitter Differential Terminal），第二对讯号端子61包括有一正讯号接收端子以及一负讯号传送端子（Super-Speed Receiver Differential Terminal）。第一对讯号端子61之正讯号端子611位于其该负讯号端子621与该接地端子62之间，第二对讯号端子61之该负讯号端子612位于其该正讯号端子611与该接地端子62之间，也就是，该接地端子62的两侧分别为两对讯号端子61之各该正讯号端子611与各该负讯号端子612。
请参阅图7及图8，为第二实施例，图7为安装挡板时之外观示意图，图8为安装挡板后之外观示意图，本实施例与第一实施例最大差别在于：第一实施例的复数导电接地脚8’与挡板7为一体仅是举例，本实施例中，复数导电接地脚8’’与挡板7可为分离构件，各导电接地脚8’’与屏蔽外壳1为一体，各导电接地脚8’’包括分别自各侧壁72朝外弯折之接触部81’’、以及自接触部81’’朝外延伸之焊接片82’’，各导电接地脚8’’分别自屏蔽外壳1后方两侧朝外延伸，也就是，屏蔽外壳1后方两侧壁72弯折出各导电接地脚8’’，而挡板7本身未包括有导电接地脚，仅具有本体71与两侧壁72，以两侧壁72安装在各导电接地脚8’’下方，并且，挡板7之两侧壁72可与各导电接地脚8’’相接触而导引电流，或可透过挡板7之其它部位与屏蔽外壳1相接触而导引电流，亦具有较近的距离在挡板7上的电流即从两侧侧壁72至导电接地脚8’’导引电路板9（如图6所示）。
请参阅图7及图8，第二实施例中，屏蔽外壳1后方两侧壁72弯折出各导电接地脚8’’，各导电接地脚8’’下方形成有凹孔15，即屏蔽外壳1后方两侧形成有凹孔15，挡板7安装在屏蔽外壳1后方时，各侧壁72分别位于各导电接地脚8’底部而遮蔽各凹孔15。
请参阅图7及图8，第二实施例中，各导电接地脚8’’更包括自焊接片82’’端缘朝外延伸之插接片83’’，插接片83’’垂直向下延伸形成垂直接脚（Through-hole Technology）与电路板9上的接点91接触（如图5所示），换言之，插接片83’’插入电路板9上的焊接孔进行焊接。在此，挡板7包括复数形成在本体71两侧之弯折片74，各弯折片74卡扣于屏蔽外壳1后侧端缘，挡板7由下向上组装在屏蔽外壳1的后侧时，各弯折片74卡扣屏蔽外壳1后侧的底部端缘壁面，提供挡板7在屏蔽外壳1后侧的上下位置限位。
请参阅图9及图10，为第三实施例，图9为安装挡板时之外观示意图，图10为仰视示意图，本实施例与第一实施例最大差别在于：第一实施例的各导电接地脚8’之插接片83’形成垂直接脚（Through-hole Technology）与电路板9接触的方式仅是举例，本实施例中，各导电接地脚8’可省略插接片83’的设置，仅以平板之焊接片82’以表面黏着接脚（SurfaceMount Technology）的方式与电路板9上的接点91接触，换言之，焊接片82’置于电路板9表面的焊盘与焊锡接触，经高温溶接导通，亦具有接地导通的效果，此表面黏着接脚（SurfaceMount Technology）的方式亦可运用在第二实施例中。
藉由屏蔽外壳后方覆盖之挡板，在两侧设置有导电接地脚结构设计，插座电连接器在传输资料时所发出之杂讯被挡板隔绝，形成之电流透过导电接地脚接触电路板上接地后消散，各导电接地脚皆设置在离挡板较近的距离，即各导电接地脚设置在屏蔽外壳后方两侧而与挡板之各侧壁相接触，在挡板上的电流从两侧之导电接地脚以杂讯电流回流路径短的方式导引电路板，不易在电流回流路径上形成天线效应，进而减少杂讯溢散，改善电磁干扰（Electromagnetic Interference，EMI）、射频干扰（Radio Frequency Interference，简称RFI）的问题。

Claims (12)

1.一种插座电连接器，其特征在于：
一屏蔽外壳，包括一容置槽、位于所述容置槽前方之一插接侧及位于所述容置槽后方之一焊接侧；
一端子模组，所述端子模组设置所述容置槽内，所述端子模组包含一位于所述焊接侧之座体、一自所述座体一侧朝外延伸至所述插接侧之舌板、复数设置于所述座体之第一端子以及第二端子，所述各第一端子一侧与所述各第二端子一侧露出所述舌板表面，所述各第一端子另一侧与所述各第二端子另一侧穿出于所述座体；
一挡板，所述挡板设置于所述焊接侧，所述挡板包括一平贴于所述座体后侧面并接触所述屏蔽外壳后端缘之本体、以及自所述本体两侧分别延伸至所述屏蔽外壳两侧外壁面之侧壁；以及
复数导电接地脚，所述各导电接地脚相邻于所述屏蔽外壳后方两侧并对应所述各侧壁设置，所述各导电接地脚包括一分别接触所述各侧壁之接触部、以及一自所述接触部朝外延伸之焊接片。
2.如权利要求1所述的插座电连接器，其特征在于，所述各导电接地脚与所述挡板为一体，所述各导电接地脚分别自所述各侧壁端缘朝外延伸。
3.如权利要求2所述的插座电连接器，其特征在于，所述各导电接地脚包括一自所述焊接片端缘朝外延伸之插接片。
4.如权利要求2所述的插座电连接器，其特征在于，所述挡板包括复数分别形成在所述各侧壁内侧面之突块，所述屏蔽外壳两侧外壁面包括一有供所述突块扣接之卡槽。
5.如权利要求1所述的插座电连接器，其特征在于，所述屏蔽外壳两侧朝外延伸有复数焊接一电路板接点之铁壳接地脚。
6.如权利要求1所述的插座电连接器，其特征在于，所述挡板包括复数形成在所述本体两侧之弯折片，所述各弯折片卡扣于所述屏蔽外壳后侧端缘。
7.如权利要求1所述的插座电连接器，其特征在于，所述各导电接地脚与所述屏蔽外壳为一体，所述各导电接地脚分别自所述屏蔽外壳后方两侧朝外延伸。
8.如权利要求7所述的插座电连接器，其特征在于，所述各导电接地脚包括一自所述焊接片端缘朝外延伸之插接片。
9.如权利要求7所述的插座电连接器，其特征在于，所述屏蔽外壳后方两侧形成有一凹孔，所述各侧壁分别位于所述各导电接地脚底部而遮蔽所述各凹孔。
10.如权利要求7所述的插座电连接器，其特征在于，所述挡板包括复数形成在所述本体两侧之弯折片，所述各弯折片卡扣于所述屏蔽外壳后侧端缘。
11.如权利要求1所述的插座电连接器，其特征在于，所述座体后侧包括有朝外延伸一端子脚固定块以及一位于所述端子脚固定块底部之电路板焊接区，所述各第一端子另一侧与所述各第二端子另一侧穿出于所述端子脚固定块底部。
12.如权利要求1所述的插座电连接器，其特征在于，所述各第一端子设置于该座体及所述舌板并位于所述舌板之上表面，所述各第二端子设置于所述座体及所述舌板并位于所述舌板之上表面，所述各第二端子一侧排列于所述各第一端子一侧的前侧。
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