CN108365134B - Mask plate, mask device, vapor deposition method, and mask plate manufacturing method - Google Patents
Mask plate, mask device, vapor deposition method, and mask plate manufacturing method Download PDFInfo
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- CN108365134B CN108365134B CN201810142723.3A CN201810142723A CN108365134B CN 108365134 B CN108365134 B CN 108365134B CN 201810142723 A CN201810142723 A CN 201810142723A CN 108365134 B CN108365134 B CN 108365134B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Abstract
A mask plate and a manufacturing method, a mask device and an evaporation method thereof are provided, the mask plate comprises a strip-shaped first part and at least one second part protruding from at least one side of the first part, wherein at least one plate surface of the second part is provided with a stress adjusting structure.
Description
Technical Field
Embodiments of the present invention relate to a mask plate, a mask device, an evaporation method, and a mask plate manufacturing method.
Background
The organic light emitting display device has the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright color, lightness and thinness, etc., and thus becomes an important display technology. The organic light emitting display device can be manufactured by ink jet printing, vapor deposition, or the like. The evaporation method has the advantages of simple operation, easy control of film thickness, easy realization of doping and the like. In the process of manufacturing an organic light emitting display device using thin film evaporation, a mask plate is required to be used in order to evaporate a specific material at a specific position such as a pixel region. The mask plate usually includes a plurality of mask patterns, and a thin film having a corresponding pattern can be formed on the vapor deposition substrate by using the plurality of mask patterns of the mask plate as masks during vapor deposition.
Disclosure of Invention
At least one embodiment of the invention provides a mask plate, which comprises a strip-shaped first part and at least one second part protruding from at least one side of the first part, wherein at least one plate surface of the second part is provided with a stress adjusting structure.
For example, an embodiment of the present invention provides a mask blank, which includes a plurality of second portions, where the plurality of second portions are respectively disposed on two sides of the first portion.
For example, in a mask blank according to an embodiment of the present invention, a plurality of concave portions are formed on at least one plate surface of each of the second portions, and the plurality of concave portions constitute the stress adjustment structure.
For example, in the mask blank according to an embodiment of the present invention, a plurality of protruding portions are formed on at least one plate surface of each of the second portions, and the plurality of protruding portions constitute the stress adjustment structure.
For example, in a mask blank according to an embodiment of the present invention, the protruding portion includes a patterned thin film layer, and the patterned thin film layer is stacked on at least one plate surface of the second portion.
For example, in the mask blank according to an embodiment of the present invention, the hardness of the material constituting the thin film layer is greater than the hardness of the material constituting the first portion.
For example, in the mask blank provided by an embodiment of the present invention, at least a portion of at least one plate surface of the second portion is ion-doped to form the stress adjustment structure.
For example, in a mask blank according to an embodiment of the present invention, the first portion includes a main portion and clamp portions at both ends of the main portion, and a width of the clamp portions is larger than a width of the main portion in the first direction.
For example, in a mask blank provided by an embodiment of the present invention, the clamping portion includes at least a first clamping position and a second clamping position juxtaposed to each other in the first direction, the first clamping position and the second clamping position being configured to clamp the mask blank.
For example, in the mask blank according to an embodiment of the present invention, the shape of the clamping portion is a wedge shape in which the width in the first direction gradually decreases toward the main portion.
For example, in the mask blank provided by an embodiment of the present invention, a cross-sectional shape of the stress adjustment structure on a plane parallel to the mask blank includes a zigzag shape, a curved shape, a circular shape, a triangular shape, a quadrilateral ring shape, a cross-bar shape, and any combination thereof.
For example, in the mask plate provided in an embodiment of the present invention, a planar shape of the second portion includes a rounded rectangle or an arc-shaped isosceles trapezoid.
At least one embodiment of the present invention provides a mask device including the mask plate according to any one of the embodiments of the present invention and an evaporation frame for fixing the mask plate.
For example, the mask device according to an embodiment of the present invention further includes a vapor deposition mask plate having a plurality of mask openings, wherein the vapor deposition frame is further configured to fix the vapor deposition mask plate, the mask plate is disposed on the vapor deposition frame, and the second portion of the mask plate is configured to partially shield the plurality of mask openings of the vapor deposition mask plate.
At least one embodiment of the present invention provides a method for manufacturing a mask blank, including: forming a strip-shaped first portion and at least one second portion protruding laterally from at least one side of the first portion; processing at least one plate surface of the second part to form a stress adjustment structure on the at least one plate surface of the second part.
For example, in a method provided by an embodiment of the present invention, forming the stress adjustment structure on at least one board surface of the second portion includes: and etching the second part through a photoetching process to form a plurality of concave parts on at least one plate surface of the second part, wherein the plurality of concave parts form the stress adjusting structure.
For example, in a method provided by an embodiment of the present invention, forming the stress adjustment structure on at least one board surface of the second portion includes: and etching the first part and the second part of the mask plate through a photoetching process to form a plurality of protruding parts on at least one plate surface of the second part, wherein the plurality of protruding parts form the stress adjusting structure.
For example, in a method provided by an embodiment of the present invention, forming the stress adjustment structure on at least one board surface of the second portion includes: depositing a thin film layer on at least one plate surface of the mask plate; patterning the thin film layer to form a thin film pattern on at least one plate surface of the second portion; the thin film pattern constitutes the stress adjustment structure.
For example, in a method provided by an embodiment of the present invention, forming the stress adjustment structure on at least one board surface of the second portion includes: welding a thin film pattern on at least one plate surface of the second part; the thin film pattern constitutes the stress adjustment structure.
For example, in a method provided by an embodiment of the present invention, forming the stress adjustment structure on at least one board surface of the second portion includes: ion doping at least a portion of at least one plate surface of the second portion.
For example, in one embodiment of the present invention, the first portion includes a main body portion and clamping portions at both ends of the main body portion, wherein a width of the clamping portions is greater than a width of the main body portion in the first direction.
At least one embodiment of the present invention provides a vapor deposition system including the mask device and the vapor deposition source according to any one of the embodiments of the present invention, wherein the mask device is located on one side in a vapor deposition direction of the vapor deposition source.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below, and it is apparent that the drawings in the following description only relate to some embodiments of the present invention and are not limiting on the present invention.
FIG. 1 is a schematic view of a mobile phone screen;
FIG. 2 is a schematic plan view of a mask blank;
fig. 3A is a schematic plan structure view of a mask blank according to an embodiment of the present invention;
FIG. 3B is a schematic diagram of an exemplary stress adjustment structure;
FIG. 3C is a schematic illustration showing a comparison between a conventional mask and a mask according to an embodiment of the present invention;
fig. 3D is a schematic plan structure diagram of another mask blank according to an embodiment of the present invention;
FIG. 4 is a schematic plan view of a mask device according to another embodiment of the present invention;
fig. 5 is a schematic partial plan view of a mask blank according to another embodiment of the present invention;
fig. 6A to 6B are schematic sectional views of a mask blank in a first exemplary manufacturing process taken along the line a-a' in fig. 5;
FIGS. 7A-7B are schematic cross-sectional views of a mask blank taken along line A-A' of FIG. 5 in a second exemplary manufacturing process;
fig. 8A to 8C are schematic sectional views of a mask blank in a third exemplary manufacturing process taken along the line a-a' in fig. 5;
fig. 9 is a schematic cross-sectional view of a mask blank taken along line a-a' in fig. 5 in a fourth exemplary manufacturing process;
fig. 10A to 10B are schematic sectional views of a mask blank in a fifth exemplary manufacturing process taken along the line a-a' in fig. 5;
FIG. 11 is a schematic plan view of a mask blank according to another exemplary embodiment of the present invention during a manufacturing process;
fig. 12 is a schematic view of an evaporation method according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The evaporation method is one of the commonly used methods for thin film deposition, and an evaporation mask plate is usually used in the thin film evaporation process. The organic light emitting diode display panel is increasingly popular in the market due to a series of advantages of self-luminescence, low power consumption, high display brightness, wide viewing angle, fast response speed and the like. The organic light emitting layer in the organic light emitting diode display panel may be formed by, for example, a method of vapor deposition. With the market demand, the application of the organic light emitting diode display panel has been expanded from mobile phones, computers and the like to the wearable field, and the demand for the shape of the organic light emitting diode display panel is diversified, and the shape of the display panel is gradually changed from a common rectangle to other irregular shapes such as a circle or a polygon. The diversity of the shapes of the display panels puts high demands on vapor deposition mask plates used for manufacturing the display panels.
For example, the screen of a current mobile phone is shaped as shown in fig. 1, four corners of the display area are rounded, and the middle of the top end of the mobile phone screen is designed to be a groove, for example, a structure for installing a front camera is generally used. Such irregular-shaped display panels present a great challenge to the mask plate, especially to the mask plate corresponding to the irregular portion of the display panel.
For example, in order to form the organic thin film into the shape shown in fig. 1 by vapor deposition in the manufacturing process of the organic light emitting diode display panel, the first method may design the mask pattern of the vapor deposition mask plate into the same shape as shown in fig. 1, for example. However, the vapor deposition mask plate designed and formed by the method has asymmetric mask patterns, the vapor deposition mask plate with asymmetric shapes is easily stressed unevenly, wrinkles are easily generated when the vapor deposition mask plate is fixed on a mask device, the pixel opening position of the vapor deposition mask plate is offset, the offset of the vapor deposition position of an organic film is caused, and finally the color mixing phenomenon of a product display picture is caused.
The second method may be, for example, to design the mask pattern of the vapor deposition mask plate to be a regular rectangle, and then to solder the vapor deposition mask plate to a shaped mask plate, and to limit the vapor deposition area of the vapor deposition film by using the shaped mask plate to form the shape shown in fig. 1. In the method, the mask pattern of the vapor deposition mask plate is designed into a conventional rectangle, so that the mesh stretching precision, the flatness and the like of the vapor deposition mask plate are good. However, in the process of welding the vapor deposition mask plate to the special-shaped mask plate, due to the fact that the double-layer mask plate is difficult to weld, a false welding phenomenon is easy to occur, the service life of the mask plate can be shortened, liquid medicine and the like used in the vapor deposition process are easy to remain between the vapor deposition mask plate and the special-shaped mask plate, and cleaning of the subsequent mask plate is not facilitated.
The third method may be, for example, to design the mask pattern of the vapor deposition mask plate in a regular rectangular shape, shield the mask pattern of the vapor deposition mask plate with the mask plate 20 shown in fig. 2, and then form the thin film shape shown in fig. 1 for the mask with the mask pattern after shielding. As shown in fig. 2, the mask plate 20 includes a first part 21 having a long shape and a plurality of second parts 22 protruding from both sides of the first part 21, and during the vapor deposition, the mask plate 20 is fixed and tensioned by both ends of the first part 21 having a long shape, and then a rectangular mask pattern of the vapor deposition mask plate is shielded by the plurality of second parts 22 in the mask plate 20 to form a shape as shown in fig. 1. In the method, the mask pattern of the vapor deposition mask plate is designed into a conventional rectangle, so that the stretching precision, the flatness and the like are easily controlled, meanwhile, the vapor deposition mask plate and the mask plate 20 are not required to be welded together, and the phenomena of insufficient welding and the like are avoided, so that the method is one of the commonly used methods for depositing films, particularly films with irregular patterns. However, since the shape of the mask plate 20 used in this method is irregular, the mask plate 20 is likely to be bent, warped, or sagged as a whole during the stretching process, and thus, a product vapor-deposited using this mask plate may have a poor color mixing on the screen.
In order to improve the phenomena of overall bending, warping or sagging of the mask plate 20 in the third method, at least one embodiment of the present invention provides a mask plate, which includes a strip-shaped first portion and at least one second portion protruding laterally from at least one side of the first portion, and at least one plate surface of the second portion has a stress adjustment structure.
In the above embodiment, by designing the stress adjustment structure on the second portion of the mask plate, the stress distribution of the mask plate, especially the second portion of the mask plate, can be improved, so that the phenomena of tilting or drooping of the second portion of the mask plate in the net stretching process can be improved, the flatness of the mask plate is improved, and the mask precision of the mask plate is further improved.
For example, in the mask blank provided by an embodiment of the present invention, the stripe-shaped first portion includes a main portion and clamping portions located at both ends of the main portion, wherein, in the first direction, the width of the clamping portions is greater than the width of the main portion.
In the mask plate provided by the embodiment, the clamping part of the mask plate is widened, so that the clamping part of the mask plate can be clamped by at least one pair of clamps in the net tensioning process, the stress of the mask plate is more uniform, and the bending phenomenon of the mask plate is improved.
The present disclosure is illustrated by the following specific examples. Detailed descriptions of known functions and known components may be omitted in order to keep the following description of the embodiments of the present invention clear and concise. When any element of an embodiment of the present invention appears in more than one drawing, that element is identified by the same reference numeral in each drawing.
Example one
Fig. 3A is a schematic plan view of the mask blank 200 provided in this embodiment, and fig. 3B is a schematic structural view of an exemplary stress adjustment structure 203 on the mask blank 200 provided in this embodiment. As shown in fig. 3A, the mask plate 200 includes a strip-shaped first portion 201 and a plurality of second portions 202 protruding laterally from two sides of the first portion 201, and at least one plate surface of the second portions 202 has a stress adjustment structure 203.
For example, as shown in a partially enlarged schematic view of the first portion 201 and the second portion 202 in fig. 3A, in this example, the planar shape of the second portion 202 includes two irregular shapes of a rounded rectangle and an arc-shaped side waist trapezoid, and a plurality of second portions 202 of the two shapes project laterally from both sides of the first portion 201 with a certain regularity.
Specifically, for example, as shown in fig. 3A, a plurality of second portions 202 having an arc-shaped side waist trapezoid project laterally from a first side of the first portion 201 with a certain interval therebetween; a plurality of second portions 202 having arc-shaped side waist trapezoids protrude laterally from the second side of the first portion 201, the plurality of second portions 202 located at the second side are spaced apart from each other and located corresponding to the second portions 202 at the first side, and a rounded rectangular second portion 202 is further provided between every adjacent two of the arc-shaped side waist trapezoids 202 at the second side of the first portion 201, i.e., the plurality of second portions 202 having arc-shaped side waist trapezoids and the plurality of second portions 202 having rounded rectangular second portions protrude laterally from the second side of the first portion 201 alternately in sequence and spaced apart from each other. Of course, the present embodiment includes but is not limited to this, for example, a plurality of second portions 202 having arc-shaped side waist trapezoids may also laterally protrude from the first side of the first portion 201 with a certain interval therebetween, and a rounded rectangle second portion 202 may also be disposed between every two adjacent arc-shaped side waist trapezoids; a plurality of second portions 202 having an arc-shaped side waist trapezoid protrude laterally from a second side of the first portion 201, and the second portions 202 of the second side have a certain interval from each other and are positioned corresponding to the second portions 202 of the arc-shaped side waist trapezoid of the first side.
In the embodiment of the present disclosure, the first side refers to one side of the first portion 201 in a direction perpendicular to the extending direction, and the second side refers to the other side of the first portion 201 in the direction perpendicular to the extending direction.
It should be noted that, in the present embodiment, the shape of the second portion 202 is not limited to the arc-shaped waist trapezoid and the rounded rectangle, and the shape of the second portion 202 of the mask plate 200 shown in fig. 3A is designed correspondingly for matching the shape of the product shown in fig. 1, so correspondingly, for example, when the shape required for the evaporation object is changed to another shape, the shape of the second portion 202 of the mask plate 200 also needs to be adjusted correspondingly, and the planar shape of the second portion 202 is an arbitrary regular shape or an irregular shape, which is not specifically limited in the present embodiment.
It is noted that in the present embodiment, the number of the second portions 202 may be, for example, one, two, three, or more; the second portion 202 may, for example, protrude laterally from one side of the first portion 201, or may protrude laterally from both sides of the first portion 201 as described above. The number and the position of the second portions 202 need to be adjusted accordingly according to the shape design requirement of the product, which is not limited in this embodiment.
As shown in fig. 3A and 3B, the cross-sectional shape of the stress adjustment structure 203 on at least one plate surface of each second portion 202 in a plane parallel to the mask plate 200 may be, for example, a zigzag shape, a curved shape, a circular shape, a triangular shape, a quadrilateral circular shape, a cross-bar shape, or any combination thereof, which is not particularly limited in this embodiment. The stress adjustment structure 203 may be formed on one surface or both surfaces of the second portion 202, and may have various implementations as long as the stress distribution of the mask plate 200, particularly the mask plate second portion 202, can be improved.
As shown in fig. 3A and 3B, for example, at least one plate surface of each of the second portions 202 includes a plurality of concave portions, and the plurality of concave portions constitute the stress adjustment structure 203; alternatively, at least one plate surface of each second portion 202 includes a plurality of protruding portions, and the plurality of protruding portions form the stress adjustment structure 203; alternatively, at least one plate surface of each second portion 202 includes a patterned thin film layer, and the patterned thin film layer constitutes the stress adjustment structure 203; alternatively, at least one surface of each second portion 202 may include a surface treatment thereon to obtain the stress adjustment structure 203, the surface treatment including, but not limited to, ion implantation or surface enhanced plasma doping.
When the stress adjustment structure 203 is formed of a patterned thin film layer, for example, the thin film layer is formed of a material having a hardness greater than that of the material forming the first portion 201, thereby contributing to an improvement in the bending phenomenon of the mask sheet. Because the material hardness of the thin film layer is relatively high, when the thin film layer is deposited or welded on the second part 202 of the mask plate 200, the hardness of the second part 202 comprising the thin film layer can be enhanced to a certain degree, so that the bending resistance of the mask plate is improved, and the deformation and uneven stress are reduced. The material of the thin film layer may be, for example, titanium alloy, and the material of the main body portion of the mask plate including the first portion 201 may be, for example, invar alloy, nickel-iron alloy, or the like.
It should be noted that, in this embodiment, the force adjusting structure 203 may be provided on any one plate surface of the second portion 202 of the mask, or the stress adjusting structures 203 may be provided on both plate surfaces of the second portion 202 of the mask, which is not limited in this embodiment. For example, the present embodiment is described by taking as an example the stress adjustment structure 203 provided on the D1 board of the second mask portion 202 (as shown in fig. 3A, the D1 board refers to the board facing the reader, and the D2 board refers to the board facing away from the reader).
Fig. 3C is a schematic diagram illustrating a comparison between the flatness of the conventional mask blank 20 shown in fig. 1 and the flatness of the mask blank 200 provided in this embodiment, and this example is described by taking as an example that one plate surface of the second portion 202 includes a plurality of concave portions, and the plurality of concave portions constitute the stress adjustment structure 203. As shown in fig. 3C, taking a point a on the first portion 21 and a point B on the second portion 22 of the mask plate 20 at a certain coordinate in the X direction, the difference in the numerical values of the point B and the point a in the Z direction is 366 μm through experimental tests; on the opposite surface of the mask plate 200 to the surface on which the stress adjustment structure 203 is located, taking a point a 'on the first portion 201 and a point B' on the second portion 202 of the mask plate 200 at the same coordinate as the above-mentioned X direction, the difference in the numerical values of the point B 'and the point a' in the Z direction is 87 micrometers by experimental tests. It can be seen from the test data that the stress adjustment structure 203 is designed on one plate surface of the second portion 202 of the mask plate 200, so that the stress distribution of the mask plate 200, especially the second portion 202 of the mask plate, is improved, the phenomena of tilting or sagging of the second portion 202 of the mask plate are correspondingly improved, and the flatness of the mask plate is improved.
In the embodiment of the present disclosure, the extending direction of the mask plate first portion 201 is defined as "X", the extending direction perpendicular to the mask plate first portion 201 in the plane of the mask plate is defined as "Y", and the direction perpendicular to the paper is defined as "Z".
Fig. 3D is a schematic plan view of another exemplary mask 300. Referring to fig. 3D, the structure of the mask blank 300 of this example is substantially the same as that of the mask blank 200 described in fig. 3A, except for the planar shape of the first portion of the mask blank 300.
As shown in fig. 3D, the first portion of the mask plate 300 includes a main portion 301 and holding portions 302 at both ends of the main portion, wherein the width of the holding portions 302 is larger than the width of the main portion 301 in the first direction (perpendicular to the extending direction of the first portion 301, i.e., the Y direction). As shown in fig. 3D, in one example, the shape of the clamping portion 302 may further be a wedge shape having a width in a direction perpendicular to the extension direction of the first portion gradually decreasing toward the body portion 301. Of course, the present embodiment includes, but is not limited to, the shape of the clamping portion 302 may also be any shape such as a rectangle, a triangle, a circle, etc., as long as the width of the clamping portion 302 is wider than the width of the main body portion 301 in the direction perpendicular to the extending direction of the first portion.
Before using the mask plate, the mask plate is usually required to be stretched flat by a tensioning machine, and then the stretched flat mask plate is fixed on an evaporation frame. When the tensioning machine is used for flattening the mask plate, the two ends of the mask plate are required to be clamped to flatten the mask plate. If each end of the mask plate is provided with a clamping position, the stress is uneven due to a small clamping range, and the mask plate can not be completely stretched, so that the mask plate is bent, wrinkled and the like, and the flatness of the mask plate is affected.
As shown in fig. 3D, the clamping portion 302 of the reticle 300 provided in the present embodiment includes at least a first clamping position 3021 and a second clamping position 3022 which are perpendicular to the extending direction of the first portion and juxtaposed to each other, the first clamping position 3021 and the second clamping position 3022 being configured for clamping the reticle 300.
In the above-described embodiment, by widening the grip portions 302 of the reticle so that at least two grip positions, for example, the first grip position 3021 and the second grip position 3022, can be accommodated on each grip portion 302, the tensioner can grip each grip portion 302 of the reticle 300 with the double grip in the course of the reticle-expanding process. In the process of flattening the mask plate 300, the tensioning machine can adjust the tension magnitude, direction and the like between the first clamping position 3021 and the second clamping position 3022, so that the stress of the mask plate 300 is uniform, the mask plate 300 can be better flattened, and the phenomena of bending, wrinkling and the like of the mask plate are effectively improved. Meanwhile, the stress adjusting structure 203 is arranged on the second part 202 of the mask plate 300, so that the stress distribution of the mask plate 300, particularly the second part 202 of the mask plate, is improved, the phenomena of tilting or drooping of the second part 202 of the mask plate are effectively improved, and the flatness of the mask plate is further enhanced.
Furthermore, the technical means of widening the clamping portion of the mask plate can be used alone for the mask plate 20 shown in fig. 2, for example, so that the mask plate 20 can be better stretched and the phenomena of the mask plate such as bending and wrinkling can be effectively improved.
Example two
The present embodiment provides a mask apparatus 400, and fig. 4 is a schematic plan view of the mask apparatus 400 provided in the present embodiment, where the mask apparatus 400 includes any mask plate described in the above embodiments.
As shown in fig. 4, the mask device 400 further includes a vapor deposition frame 401 and a vapor deposition mask plate 402. The vapor deposition frame 401 is used to fix any one of the mask plates and the vapor deposition mask plate 402 described in the above embodiments, and the vapor deposition mask plate 402 includes a plurality of mask opening regions 4021.
As shown in fig. 4, the evaporation frame 401 may be, for example, rectangular, but this embodiment includes but is not limited to this, and for example, the evaporation frame 401 may also be, for example, square or any other suitable shape, which is not specifically limited in this embodiment.
As shown in fig. 4, the vapor mask plate 402 may be rectangular as a whole, for example. The vapor deposition mask plate 402 includes a plurality of mask opening regions 4021 arranged in an array, and the mask opening regions 4021 are capable of vapor depositing a region corresponding to the mask opening regions 4021 on an object to be vapor deposited, for example, an organic light emitting diode display substrate, through a vapor deposition material. The shape of the mask opening region 4021 substantially corresponds to the outline of the shape of the product to be manufactured, and the shape of the mask opening region 4021 may be any suitable regular shape, such as a rectangle, a circle, a pentagon, and the like, which is not particularly limited in this embodiment, and the mask opening region 4021 is described as a rectangle in this embodiment.
As shown in fig. 4, the mask plate 300 and the vapor mask plate 402 are fixed to the vapor deposition frame 401, and the vapor mask plate 402 and the mask plate 300, which are flattened, may be welded to the vapor deposition frame 401 by a method such as laser welding. As shown in fig. 4, a plurality of mask opening regions 4021 are arrayed on a vapor deposition mask plate 402, a plurality of mask plates 300 are provided at the top and bottom of the mask opening regions 4021 respectively in the horizontal direction, second portions 202 of two adjacent mask plates partially shield each rectangular mask opening region 4021, and the shielded mask pattern defines the shape of a vapor deposition product. For example, as shown in fig. 4, each right angle of a rectangular mask opening area 4021 is blocked by the second portion 202 of the arc-shaped side waist trapezoid of the mask plate 300, a portion between two right angles at the top of the rectangular mask opening area 4021 is blocked by the second portion 202 of the rounded rectangle of the mask plate 300, and the shape of the mask opening area 4021 of the vapor deposition mask plate 402 after being blocked by the mask plate 300 is substantially the same as that shown in fig. 1. Therefore, a product having a shape as shown in fig. 1 can be formed by using the rectangular mask opening region 4021 shielded by the mask plate 300 as a mask.
Note that, for the sake of clarity, the entire structure of the vapor deposition device 400 is not shown in the drawings. In order to realize the necessary functions of the evaporation apparatus, those skilled in the art may set other structures not shown according to the specific application scenarios, which is not limited by the embodiment of the present invention.
In the mask apparatus 400 provided in at least one embodiment of the present invention, the rectangular mask opening region 4021 of the vapor deposition mask plate 402 is partially blocked by the mask plate 300 to form a mask pattern of a desired shape. On one hand, the stress adjustment structure 203 is designed on the second portion 202 of the mask plate 300, so that the stress distribution of the mask plate 300, especially the second portion 202 of the mask plate, can be improved, the phenomena of tilting or sagging of the second portion 202 of the mask plate in the screen stretching process can be improved, and the flatness of the mask plate 300 is improved.
On the other hand, in at least one embodiment, the clamping portions 302 of the mask plate 300 may be widened by widening the clamping portions of the mask plate alone or by combining the design that the second portion has a stress adjustment structure, so that each clamping portion 302 may accommodate at least two clamping positions, and therefore, the tensioner may clamp each clamping portion 302 of the mask plate 300 by using a dual clamp during the stretching process, so that the stress on the mask plate 300 may be more uniform, and the phenomena of bending, wrinkling, etc. of the mask plate may be effectively improved. The mask plate 300 partially blocks the mask opening area 4021 of the vapor deposition mask plate 402, thereby improving the mask accuracy of the mask device 400.
For example, another example of the present embodiment also provides an evaporation system including any one of the mask devices and the evaporation source of the present embodiment, wherein the mask device is located on one side of the evaporation source in the evaporation direction, so that a material to be evaporated in the evaporation source can be evaporated onto an object to be evaporated by the mask device to obtain a product of a desired shape. The technical effects of the evaporation system provided by this example can refer to the technical effects of any mask plate or any mask device described in the above embodiments, and are not described herein again.
EXAMPLE III
Fig. 5 is a schematic partial plan view of a mask 200 provided in this embodiment, and fig. 6A to 6B are schematic cross-sectional views of the mask taken along line a-a' in fig. 5 during a manufacturing process. The stress adjustment structure 203 on the mask plate 200 may be, for example, a zigzag structure, a curved structure, a circular structure, a triangular structure, a quadrilateral structure, or any combination thereof, and the embodiment is described by taking the stress adjustment structure 203 as a zigzag structure. Meanwhile, according to different types of stress adjustment structures, the embodiment of the invention provides different preparation methods.
As shown in fig. 6A, a mask plate 200 is first provided, where the mask plate 200 includes a strip-shaped first portion 201 extending along an extending direction and a plurality of second portions 202 protruding laterally from two sides of the first portion 201, and the mask plate 200 may be formed by a conventional mechanical processing method such as stamping, line cutting, or the like, or by a non-mechanical processing method such as a photolithography process, and related processes are not described herein again. Examples of the material of the mask plate 200 include invar, or other suitable materials, which is not limited in the present embodiment.
As shown in fig. 6A, for example, a photoresist layer may be deposited on the mask plate 200, and patterned through a photolithography process including an exposure process and a development process to form a photoresist pattern 204 on the mask plate 200. The photoresist pattern 204 covers the first portion 201 of the mask plate 200 and is zigzag-shaped on the second portion 202.
As shown in fig. 6B, the second portion 202 of the mask plate 200 is etched using the photoresist pattern 204 as an etching mask, and a plurality of concave portions constituting the stress adjustment structure 203 on the second portion 202 are formed on the second portion 202 by controlling etching time, etching rate, and the like.
Fig. 7A to 7B are schematic sectional views of a mask blank in a manufacturing process in another example taken along line a-a' in fig. 5.
As shown in fig. 7A, first, a mask plate 200 is provided, the mask plate 200 including a stripe-shaped first portion 201 extending in an extending direction and a plurality of second portions 202 protruding laterally from both sides of the first portion 201.
As shown in fig. 7A, for example, a photoresist layer may be deposited on the mask plate 200, and patterned through a photolithography process including an exposure process and a development process to form a photoresist pattern 204 in a zigzag shape on the second portion 202 of the mask plate 200.
As shown in fig. 7B, the first portion 201 and the second portion 202 of the mask plate 200 are etched using the photoresist pattern 204 as an etching mask, by controlling etching time, etching rate, and the like, to form a plurality of protruding portions on the second portion 202, which constitute the stress adjustment structures 203 on the second portion 202.
Fig. 8A to 8C are schematic sectional views of a mask blank in a manufacturing process in another example taken along line a-a' in fig. 5.
As shown in fig. 8A, first, a mask plate 200 is provided, the mask plate 200 including a stripe-shaped first portion 201 extending in an extending direction and a plurality of second portions 202 protruding laterally from both sides of the first portion 201. Examples of the material of the mask plate 200 include invar, or other suitable materials, which is not limited in the present embodiment.
As shown in fig. 8A, a thin film layer 205 may be deposited on the mask plate 200 by chemical vapor deposition, physical vapor deposition, or the like, for example. The material hardness of the thin film layer 205 is greater than that of the first portion 201 of the mask plate 200, and an example of the material of the thin film layer 205 may be, for example, a titanium alloy or other suitable material.
As shown in fig. 8B, for example, a photoresist layer may be deposited on the thin film layer 205, and patterned through a photolithography process including an exposure process and a development process to form a photoresist pattern 204 in a zigzag shape on the thin film layer 205.
As shown in fig. 8C, the thin film layer 205 is etched using the photoresist pattern 204 as an etching mask, and a zigzag thin film pattern 205 is formed on the second portion 202 of the mask blank 200 by controlling etching time, etching rate, and other factors, wherein the thin film pattern 205 constitutes the stress adjustment structure 203 on the second portion 202.
Fig. 9 is a schematic cross-sectional view of a mask plate in a manufacturing process in another example taken along line a-a' in fig. 5.
As shown in fig. 9, first, a mask plate 200 is provided, the mask plate 200 including a stripe-shaped first portion 201 extending in an extending direction and a plurality of second portions 202 protruding laterally from both sides of the first portion 201.
As shown in fig. 9, after providing the mask plate 200, a metal thin film may be welded on the second portion 202 of the mask plate 200 by, for example, a metal welding method to form a thin film pattern constituting the stress adjustment structure 203 on the second portion 202. The hardness of the material forming the thin film layer may be greater than the hardness of the material forming the first portion 201, for example, thereby facilitating further improvement of the bending phenomenon of the mask plate, and reduction of deformation and stress unevenness. The metal welding may include, for example, fusion welding, pressure welding, brazing, or other suitable welding methods.
Fig. 10A to 10B are schematic sectional views of a mask plate in a manufacturing process in another example taken along line a-a' in fig. 5.
As shown in fig. 10A, first, a mask plate 200 is provided, the mask plate 200 including a stripe-shaped first portion 201 extending in an extending direction and a plurality of second portions 202 protruding laterally from both sides of the first portion 201.
As shown in fig. 10B, a portion of the second portion 202 or the entire second portion 202 is treated, for example, by ion implantation or surface enhanced (e.g., low temperature plasma or carburizing treatment) plasma doping, thereby forming a stress adjustment structure 203 on the surface of the second portion 202. The darker portions of the stress adjustment structure 203 in fig. 10B indicate that they are ion doped, e.g., the doping level gradually decreases from the top surface of the second portion 202 shown in fig. 10B. Of course, in the present embodiment, the doping manner is not limited thereto, as long as the stress distribution of the mask plate, especially the mask plate second portion 202, can be improved. In this example, the resulting first and second portions 201, 202 of the reticle may have substantially the same surface.
In the mask plate 200 provided in the above embodiment, the stress adjustment structure 203 is formed on the second portion 202 of the mask plate 200 by different methods, so that the stress distribution of the mask plate 200, especially the second portion 202 of the mask plate, is improved, the phenomena of the second portion 202 of the mask plate, such as tilting or sagging, are improved, the flatness of the mask plate 200 is improved, and the mask accuracy of the mask plate 200 is enhanced.
Fig. 11 is a schematic plan view of a mask blank 300 according to another example of the present invention during a manufacturing process. As shown in fig. 11, the mask plate 300 of this example has a substantially identical planar structure to the mask plate 200 described in fig. 5, except for the planar shape of the first portion of the mask plate 300. The first portion of the mask plate 300 includes a main body portion 301 and grip portions 302 at both ends of the main body portion 301, and the width of the grip portions 302 is wider than the width of the main body portion 301 in an extending direction perpendicular to the first portion. The mask plate 300 may be formed by a conventional machining process or a non-machining process, for example, and the related processes are not described herein. The method of forming the stress adjustment structure 203 in the mask blank 300 in this example may refer to any of the manufacturing methods described in the above embodiments.
According to the mask plate 300 formed in the example, each clamping part 302 can accommodate at least two clamping positions by widening the mask plate clamping parts 302, and the tensioning machine can clamp each clamping part 302 of the mask plate 300 by using double clamps in the net tensioning process, so that the stress of the mask plate 300 is more uniform, and the phenomena of bending, wrinkling and the like of the mask plate are effectively improved. Meanwhile, by designing the stress adjustment structure 203 on the second portion 202 of the mask plate 300, the stress distribution of the mask plate 300, particularly the second portion 202 of the mask plate, is improved, the phenomena of tilting or drooping of the second portion 202 of the mask plate are improved, and the flatness of the mask plate is enhanced.
Example four
Fig. 12 is a schematic view of an evaporation method according to this embodiment, the evaporation method including evaporating an object to be evaporated by using any one of the mask devices described in the above embodiments, the mask device including the mask plate according to any one of the embodiments of the present invention. For example, the mask device may be used to form a functional layer of an organic light emitting display device, including, but not limited to, an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, a hole injection layer, or the like. In the present embodiment, the vapor deposition method is described by taking the mask device 400 as an example.
As shown in fig. 12, the mask apparatus 400 is disposed on the evaporation surface of the substrate 502 to be evaporated, the mask apparatus 400 includes a shielding region 503 and a mask opening region 4021, the mask opening region 4021 is an opening structure, for example, the shape of the mask opening region 4021 may be defined by the opening region of the evaporation mask plate and the mask plate described in any embodiment of the present invention in cooperation with each other. The evaporation source 501 is provided on the side facing the evaporation surface of the evaporation substrate 502. The shape of the mask opening regions 4021 of the mask device may be any regular shape or irregular shape, for example, and the specific shape needs to be adjusted accordingly according to the design requirements of the product shape.
For example, as shown in fig. 12, when the vapor deposition source 501 deposits a vapor deposition material on the vapor deposition surface of the vapor deposition substrate 502, the vapor deposition material is deposited on the region of the vapor deposition substrate 502 corresponding to the mask opening region 4021 through the mask opening region 4021 of the mask device 400, and the vapor deposition material is not formed in the region of the vapor deposition substrate 502 blocked by the blocking region 503 of the mask device 400. In this embodiment, by designing the stress adjustment structure on the second portion of the mask plate and/or by widening the clamping portion of the mask plate, the phenomena of bending, warping, sagging, and the like of the mask apparatus 400 composed of the mask plate can be improved, the flatness of the mask apparatus 400 can be improved, and the mask accuracy of the mask apparatus 400 can be improved. Thus, by using the mask device 400, a product having a desired shape can be formed more accurately on the deposition surface of the deposition substrate 502.
For other technical effects of the evaporation method provided in this embodiment, reference may be made to the mask plate described in the first embodiment and the evaporation apparatus described in the second embodiment, which are not described herein again.
Without conflict, the various embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.
The above description is intended to be illustrative of the present invention and not to limit the scope of the invention, which is defined by the claims appended hereto.
Claims (18)
1. A mask plate comprising a stripe-shaped first portion and at least one second portion laterally protruding from at least one side of the first portion, wherein,
at least one plate surface of each second part is provided with a stress adjusting structure, and a plurality of concave parts are formed on at least one plate surface of each second part in the direction vertical to the plate surface, and the concave parts form the stress adjusting structure.
2. A mask plate comprising a stripe-shaped first portion and at least one second portion laterally protruding from at least one side of the first portion, wherein,
at least one plate surface of each second part is provided with a stress adjusting structure, and a plurality of protruding parts are formed on at least one plate surface of each second part in the direction perpendicular to the plate surface direction and form the stress adjusting structure.
3. The mask blank of claim 2, wherein the projecting portion comprises a patterned thin film layer laminated on at least one plate surface of the second portion.
4. A mask according to claim 3 wherein the hardness of the material constituting the thin film layer is greater than the hardness of the material constituting the first portion.
5. A mask plate comprising a stripe-shaped first portion and at least one second portion laterally protruding from at least one side of the first portion, wherein,
at least one plate surface of the second part is provided with a stress adjusting structure, and at least part of at least one plate surface of the second part is doped with ions to form the stress adjusting structure.
6. A mask blank according to any one of claims 1 to 5 comprising a plurality of said second portions, wherein a plurality of said second portions are respectively disposed on both sides of said first portion.
7. A mask blank according to any one of claims 1 to 5,
the first portion includes a body portion and grip portions at both ends of the body portion, and a width of the grip portions is greater than a width of the body portion in a first direction.
8. A mask blank according to claim 7, wherein the clamping portion comprises at least a first clamping position and a second clamping position juxtaposed in the first direction,
the first and second clamping positions are configured for clamping the reticle.
9. The mask plate according to claim 7, wherein the shape of the grip portion is a wedge shape whose width in the first direction is gradually reduced toward the main body portion.
10. A mask blank according to any one of claims 1 to 5 wherein the planar shape of the second portion comprises a rounded rectangle or an arcuate waisted trapezoid.
11. A mask arrangement comprising a mask plate according to any one of claims 1 to 10 and a vapor deposition frame for holding the mask plate.
12. The mask apparatus according to claim 11, further comprising a vapor deposition mask plate having a plurality of mask openings, wherein,
the vapor deposition frame is further used for fixing the vapor deposition mask plate, the mask plate is arranged on the vapor deposition frame, and the second portion of the mask plate is used for partially shielding the mask openings of the vapor deposition mask plate.
13. A method for manufacturing a mask blank, comprising:
forming a strip-shaped first portion and at least one second portion protruding laterally from at least one side of the first portion;
processing at least one plate surface of the second portion to form a stress adjustment structure on the at least one plate surface of the second portion,
wherein forming the stress adjustment structure on at least one panel of the second portion comprises:
and etching the second part through a photoetching process to form a plurality of concave parts on at least one plate surface of the second part in a direction vertical to the plate surface, wherein the plurality of concave parts form the stress adjusting structure.
14. A method for manufacturing a mask blank, comprising:
forming a strip-shaped first portion and at least one second portion protruding laterally from at least one side of the first portion;
processing at least one plate surface of the second portion to form a stress adjustment structure on the at least one plate surface of the second portion,
wherein forming the stress adjustment structure on at least one panel of the second portion comprises:
and etching the first part and the second part of the mask plate through a photoetching process so as to form a plurality of protruding parts on at least one plate surface of the second part in a direction vertical to the plate surface, wherein the plurality of protruding parts form the stress adjusting structure.
15. The method of claim 14, wherein forming the stress modifying structure on at least one panel of the second portion comprises:
depositing a thin film layer on at least one plate surface of the mask plate;
etching the thin film layer through a photoetching process to form a thin film pattern on at least one plate surface of the second part;
the thin film pattern constitutes the stress adjustment structure.
16. The method of claim 14, wherein forming the stress modifying structure on at least one panel of the second portion comprises:
welding a thin film pattern on at least one plate surface of the second part;
the thin film pattern constitutes the stress adjustment structure.
17. A method for manufacturing a mask blank, comprising:
forming a strip-shaped first portion and at least one second portion protruding laterally from at least one side of the first portion;
processing at least one plate surface of the second portion to form a stress adjustment structure on the at least one plate surface of the second portion,
wherein forming the stress adjustment structure on at least one panel of the second portion comprises:
ion doping at least a portion of at least one plate surface of the second portion.
18. A vapor deposition system comprising the mask device according to any one of claims 11 and 12 and a vapor deposition source, wherein the mask device is located on one side in a vapor deposition direction of the vapor deposition source.
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| CN201810142723.3A CN108365134B (en) | 2018-02-11 | 2018-02-11 | Mask plate, mask device, vapor deposition method, and mask plate manufacturing method |
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| CN201810142723.3A CN108365134B (en) | 2018-02-11 | 2018-02-11 | Mask plate, mask device, vapor deposition method, and mask plate manufacturing method |
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| CN108365134B true CN108365134B (en) | 2020-11-06 |
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| KR102631256B1 (en) * | 2018-09-28 | 2024-01-31 | 삼성디스플레이 주식회사 | Mask assembly, apparatus and method for manufacturing a display apparatus using the same |
| CN109321880B (en) * | 2018-10-18 | 2021-01-26 | 京东方科技集团股份有限公司 | Mask plate |
| KR20200097375A (en) * | 2019-02-07 | 2020-08-19 | 삼성디스플레이 주식회사 | Mask assembly and manufacturing method of the same |
| CN110284107A (en) * | 2019-06-28 | 2019-09-27 | 武汉天马微电子有限公司 | Evaporation coating method for the support bar of display panel, support device and display panel |
| US11560615B2 (en) * | 2019-08-28 | 2023-01-24 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Mask and manufacturing method thereof, fine metal mask, mask device and use method thereof |
| CN111748766A (en) * | 2020-06-22 | 2020-10-09 | 武汉华星光电半导体显示技术有限公司 | Metal mask plate |
| CN114134460B (en) * | 2021-11-29 | 2023-06-06 | 昆山国显光电有限公司 | Mask plate |
| CN115181934A (en) * | 2022-06-21 | 2022-10-14 | 广州国显科技有限公司 | Mask plate and preparation method thereof |
| TWI822510B (en) * | 2022-12-09 | 2023-11-11 | 達運精密工業股份有限公司 | Metal mask and the method to produce metal mask |
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