CN108363090B - Detector module and detector system based on bendable photodiode - Google Patents

Detector module and detector system based on bendable photodiode Download PDF

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Publication number
CN108363090B
CN108363090B CN201810108160.6A CN201810108160A CN108363090B CN 108363090 B CN108363090 B CN 108363090B CN 201810108160 A CN201810108160 A CN 201810108160A CN 108363090 B CN108363090 B CN 108363090B
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photodiode
bendable
pixel
scintillator
pixels
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CN108363090A (en
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张岚
顾铁
刘柱
王伟
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Yirui New Material Technology Taicang Co ltd
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Yirui New Material Technology Taicang Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • G01T1/20183Arrangements for preventing or correcting crosstalk, e.g. optical or electrical arrangements for correcting crosstalk
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • G01T1/20182Modular detectors, e.g. tiled scintillators or tiled photodiodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • G01T1/20187Position of the scintillator with respect to the photodiode, e.g. photodiode surrounding the crystal, the crystal surrounding the photodiode, shape or size of the scintillator
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14658X-ray, gamma-ray or corpuscular radiation imagers
    • H01L27/14663Indirect radiation imagers, e.g. using luminescent members

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)

Abstract

The invention provides a detector module and a detector system based on a bendable photodiode, comprising: the substrate, at least the first surface of the substrate is cambered surface; a first bendable photodiode pixel array, comprises a plurality of first bendable photodiode pixels arranged in an array, the first bendable photodiode pixel is bent to be stuck on the first surface of the substrate in an arc shape; the first scintillator pixel array comprises a plurality of first scintillator pixels which are in a sector shape and are arranged in an array, the first scintillator pixel is attached to the surface of the first bendable photodiode pixel, which is far away from the substrate; first scintillator first of pixels surface and second the surfaces are cambered surfaces. The structure of the invention can ensure that rays emitted by the ray source can vertically enter the surface of each scintillator pixel at equal angles, and the crosstalk signals among pixels are avoided, the influence caused by pixel overlapping is avoided, the signals are more accurate, and the image resolution is higher.

Description

Detector module and detector system based on bendable photodiode
Technical Field
The invention belongs to the technical field of photoelectric detection, and particularly relates to a detector module and a detector system based on a bendable photodiode.
Background
In the case of radiation detection medical imaging devices, security detection imaging devices, industrial nondestructive detection imaging devices, food and agricultural product security sorting systems and other radiation detection systems, if a scintillator detection medium is used, a silicon-based photodiode is required to convert visible light generated after radiation irradiation in the scintillator into an electrical signal, and then the electrical signal is amplified and transmitted by a subsequent electronics system.
Referring to fig. 1, a conventional flat panel detector module 10 is shown, and as can be seen from fig. 1, the flat panel detector module 10 includes a substrate 101, a flat photodiode pixel 102 disposed on a surface of the substrate 101, and a scintillator pixel 103 disposed on a surface of the flat photodiode pixel 102. As shown in fig. 2, another conventional flat panel detector module 10 is shown in fig. 2, where the flat panel detector module 10 includes a substrate 101, a plurality of flat panel photodiode pixels 102 located on the surface of the substrate 101, and a plurality of scintillator pixels 103 located on the surface of the flat panel photodiode pixels 102, the flat panel photodiode pixels 102 are arranged in a line array or a surface array on the surface of the substrate 101, and the scintillator pixels 103 are arranged in one-to-one correspondence with the flat panel photodiode pixels 102. When the end user device needs to arrange the above-mentioned planar detector modules 10 in an arc or circular arc, a plurality of segmented planar detector modules 10 are needed to be spliced together to form an approximate arc (as shown in fig. 3 and 4), wherein a plurality of planar detector modules 10 in fig. 3 are arranged in an L-shaped detector main body 11 to form an approximate arc, and a plurality of planar detector modules 10 in fig. 4 are arranged in an annular inner wall of the detector main body 11 to form an approximate arc.
In order to ensure the performance of the detector, it is necessary to ensure that the radiation emitted from the radiation source 12 shown in fig. 3 and 4 enters the scintillator pixel 103 as perpendicular as possible when entering the surface of the scintillator pixel 103, so that the center of each flat detector module 10 faces the direction in which the radiation enters (the arrows in fig. 3 and 4 indicate the direction in which the radiation enters). In practice, for the detector shown in fig. 3 and 4, only the scintillator pixel 103 in the center of the flat panel detector module 10 can ensure the normal incidence of the radiation, and the incident direction of the radiation on the scintillator pixel 103 at other positions of the flat panel detector module 10 has a certain angle with respect to the normal incidence direction. While rays which are not normally incident may enter adjacent pixels along an oblique incident direction to generate signals, thereby causing crosstalk. Meanwhile, at the splice of the adjacent planar detector modules 10, the radiation may sometimes pass through the edge pixels of both the planar detector modules 10 (it should be noted that, here and later, the pixel refers to a structure formed by one of the planar photodiode pixels 102 and one of the scintillator pixels 103 located on the surface thereof, i.e., a structure as shown in fig. 1), i.e., a shadow portion, so as to affect the formed image. More importantly, the stitching of the conventional flat panel detector modules 10 may cause the signals of the pixels to be acquired other than equiangularly, resulting in poor image resolution. If only a stitching of the line array, only the pixels of a column where the ray is not normally incident are affected. When the pixels are in a planar array, such as a high-speed imaging CT (computed tomography) system or a multi-row array scanning system, the pixels in the rows are affected, and the effect on the image is greater.
In addition, as shown in fig. 5, the conventional dual-energy detector module corresponds to the conventional dual-energy detector module, and the dual-energy detector module includes two substrates 101, a planar photodiode pixel 102, a high-energy scintillator pixel 1031, a low-energy scintillator pixel 1032, a copper filter 14, and a fixing post 13, which are arranged in parallel and spaced up and down; the planar photodiode pixels 102 are respectively distributed on the upper surfaces of the two substrates 101 in an array manner; the copper filter 14 is positioned on the lower surface of the substrate 101 above and is used for filtering low-energy rays; the high-energy scintillator pixel 1031 is located on the planar photodiode pixel 102 on the substrate 101 below; the low energy scintillator pixel 1032 is located on the planar photodiode pixel 102 on the substrate 101 above; the fixing posts 13 are located at the periphery of the two substrates 101 and fixedly connected with the two substrates 101. However, the conventional dual-energy detector module still has problems in splicing the plurality of dual-energy detector modules into an arc shape due to the use of the planar photodiode pixels 102, such as the planar detector module 10 described in fig. 1 to 4. Meanwhile, since there is a gap between the high-energy scintillator pixel 1031 and the low-energy scintillator pixel 1032, interference such as scattering may exist, which affects the accuracy of the signal, so that the resolution of the image is low.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a detector module and a detector system based on a flexible photodiode, which are used for solving the problem that in the detector in the prior art, a planar detector module is adopted, only a ray of a pixel located at the center of the planar detector module can be guaranteed to be perpendicularly incident, and crosstalk is caused when the ray is obliquely incident to a plurality of pixels, or when the planar detector modules are spliced, the ray can simultaneously pass through edge pixels of two planar detector modules to affect image quality.
To achieve the above and other related objects, the present invention provides a bendable photodiode-based detector module including:
the substrate comprises a first surface and a second surface which are opposite to each other, wherein at least the first surface of the substrate is a cambered surface;
the first bendable photodiode pixel array comprises a plurality of first bendable photodiode pixels which are arranged in an array, and the first bendable photodiode pixels are bent to be in an arc shape and are attached to the first surface of the substrate;
the first scintillator pixel array comprises a plurality of fan-shaped first scintillator pixels which are arranged in an array manner, wherein the first scintillator pixels are attached to the surface of the first bendable photodiode pixels, which is far away from the substrate, and are arranged in one-to-one correspondence with the first bendable photodiode pixels; the first scintillator pixel includes a first surface and a second surface opposite to each other, the first surface and the second surface of the first scintillator pixel are cambered surfaces, and the first surface or the second surface of the first scintillator pixel is in contact with the first bendable photodiode pixel.
Preferably, the substrate is an arc-shaped substrate, and the second surface of the substrate is an arc surface.
Preferably, the substrate is a spherical substrate, and the first surface of the substrate is an outer surface.
Preferably, the cambered surfaces of the substrate, the first bendable photodiode pixel and the first scintillator pixel all have the same radian.
Preferably, a first surface of the first scintillator pixel is in contact with the first bendable photodiode pixel, and an arc length of the first surface of the first scintillator pixel is greater than an arc length of the second surface of the first scintillator pixel.
Preferably, the first scintillator pixel is a high energy scintillator pixel, and the detector module of the bendable photodiode further comprises:
a low energy ray filter located at a surface of the first scintillator pixel array remote from the first bendable photodiode pixel array;
the second bendable photodiode pixel array comprises a plurality of second bendable photodiode pixels which are arranged in an array, the second bendable photodiode pixels are bent to be stuck to the surface of the low-energy ray filter, which is far away from the first scintillator pixel array, in an arc shape, and the second bendable photodiode pixels are arranged in one-to-one correspondence with the first scintillator pixels;
the second scintillator pixel array comprises a plurality of fan-shaped second scintillator pixels which are arranged in an array manner, the second scintillator pixels are low-energy scintillator pixels, and the second scintillator pixels are attached to the surface of the second bendable photodiode pixels, which is far away from the low-energy ray filter, and are arranged in one-to-one correspondence with the second bendable photodiode pixels; the second scintillator pixel comprises a first surface and a second surface which are opposite, the first surface and the second surface of the second scintillator pixel are cambered surfaces, and the first surface or the second surface of the second scintillator pixel is in contact with the second bendable photodiode pixel.
Preferably, the first surface of the second scintillator pixel is in contact with the second bendable photodiode pixel, and the arc length of the first surface of the second scintillator pixel is greater than the arc length of the second surface of the second scintillator pixel.
Preferably, the arc length of the first surface of the second scintillator pixel is smaller than the arc length of the second surface of the first scintillator pixel.
Preferably, the detector module based on the bendable photodiode further comprises a PCB board, and the PCB board is attached to the surface of the substrate far away from the first bendable photodiode pixel array.
Preferably, a plurality of readout pixels are arranged on the PCB, and the readout pixels are electrically connected with the first bendable photodiode pixels in a one-to-one correspondence.
The invention also provides a detector, which comprises a plurality of detector modules based on the bendable photodiodes in any scheme, and the detector modules are spliced together in a seamless way.
The invention also provides a detection system which comprises the detector.
Preferably, the detection system is an electronic computed tomography scanner, the electronic computed tomography scanner further comprising: a circular slip ring and a radiation source; wherein,
the detector is fixed on the inner wall of the circular slip ring, and the surface, away from the first bendable photodiode pixel, of the substrate is contacted with the inner wall of the circular slip ring;
the radiation source is positioned in the circular slip ring and positioned on the inner wall of the circular slip ring.
Preferably, the detection system is a radiation imaging detection device, the detection system further comprises a cantilever crane, the detector is located in the cantilever crane, and the surface of the substrate, which is far away from the first bendable photodiode pixel array, is contacted with the cantilever crane.
As described above, the bendable photodiode-based detector module and the detector system of the present invention have the following advantageous effects:
the bendable photodiode and the scintillator pixels in the detector module based on the bendable photodiode are of sector-shaped structures and are fixed on the cambered surface of the substrate, and when the detector modules based on the bendable photodiode are seamlessly spliced, rays emitted by a ray source can vertically enter the surface of each scintillator pixel at equal angles, crosstalk signals among the pixels are avoided, influence caused by pixel overlapping is avoided, signals are more accurate, and image resolution is higher.
Drawings
Fig. 1 and 2 are schematic structural views of a prior art flat panel detector module.
Fig. 3 and 4 are schematic diagrams of a prior art detector comprising a plurality of flat detector modules spliced into an arc.
Fig. 5 shows a schematic structure of a dual-energy flat panel detector according to the prior art.
Fig. 6 to 10 are schematic structural views showing a bendable photodiode-based detector module according to a first embodiment of the present invention.
Fig. 11 to 15 are schematic structural views of a detector module based on a flexible photodiode according to a second embodiment of the present invention.
Fig. 16 is a schematic view showing the structure of a detector according to a third embodiment of the present invention.
Fig. 17 and 18 are schematic structural views of a detector system according to a fourth embodiment of the present invention.
Description of element reference numerals
10. Planar detector module
101. Substrate board
102. Planar photodiode pixel
103. Scintillator pixels
1031. High energy scintillator pixels
1032. Low energy scintillator pixels
11. Detector main body
12. Radiation source
13. Fixing column
14. Copper filter disc
20. Detector module based on bendable photodiode
201. Substrate board
202. First bendable photodiode pixel
203. First scintillator pixel
204. Low-energy ray filter disc
205. Second bendable photodiode pixel
206. Second scintillator pixel
207 PCB (printed circuit board)
30. Detector for detecting a target object
40. Detection system
401. Circular slip ring
402. Radiation source
403. Arm support
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Please refer to fig. 6-18. It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
Example 1
Referring to fig. 6, the present invention provides a bendable photodiode-based detector module 20, the bendable photodiode-based detector module 20 comprising: a substrate 201, wherein the substrate 201 includes a first surface and a second surface opposite to each other, and at least the first surface of the substrate 201 is a cambered surface; a first bendable photodiode pixel array, where the first bendable photodiode pixel array includes a plurality of first bendable photodiode pixels 202 arranged in an array, and the first bendable photodiode pixels 202 are bent to be stuck to the first surface of the substrate 201 in an arc shape; the first scintillator pixel array comprises a plurality of fan-shaped first scintillator pixels 203 which are arranged in an array manner, wherein the first scintillator pixels 203 are attached to the surface of the first bendable photodiode pixels 202, which is far away from the substrate 201, and are arranged in one-to-one correspondence with the first bendable photodiode pixels 202; the first scintillator pixel 203 includes a first surface and a second surface opposite to each other, the first surface and the second surface of the first scintillator pixel 203 are both cambered surfaces, and the first surface or the second surface of the first scintillator pixel 203 is in contact with the first bendable photodiode pixel 202.
As an example, the material of the substrate 201 may include metal, resin, plastic, polytetrafluoroethylene, or carbon fiber. The curvature of the first surface of the substrate 201 may be set according to actual needs, which is not limited herein.
As an example, as shown in fig. 6, only one surface of the substrate 201 may be an arc surface, only the first surface of the substrate 201 may be an arc surface, and the second surface of the substrate 201 may be a plane; of course, as shown in fig. 7, the first surface and the second surface of the substrate 201 may be cambered surfaces. When the first surface and the second surface of the substrate 201 are both cambered surfaces, the first surface of the substrate 201 is parallel to the second surface of the substrate 201.
As an example, the cambered surface of the substrate 201 (when the first surface of the substrate 201 is a cambered surface and the second surface is a planar surface, the cambered surface of the substrate 201 refers to the first surface of the substrate 201; when the first surface and the second surface of the substrate 201 are cambered surfaces, the cambered surface of the substrate 201 refers to the first surface and the second surface of the substrate 201), the cambered surfaces of the first bendable photodiode pixel 202 and the first scintillator pixel 203 all have the same radian, specifically, the radian of the first surface of the substrate 201, the radian of the first bendable photodiode pixel 202 and the radian of the first scintillator pixel 203 are the same, so as to ensure that the first bendable photodiode pixel 202 can be seamlessly and tightly attached to the first surface of the substrate 201, and ensure that the first scintillator pixel 203 can be seamlessly and tightly attached to the first bendable photodiode pixel 202 away from the surface of the substrate 201. It should be noted that, "the arc surface of the substrate 201, the arc surface of the first bendable photodiode pixel 202, and the arc surface of the first scintillator pixel 203 all have the same arc degree" means that, as shown in fig. 6, the arc line of the first surface of the substrate 201 is parallel to the arc line of the surface of the first bendable photodiode pixel 202 and the arc line of the surface of the first scintillator pixel 203.
As an example, the first bendable photodiode array may be a line array or a plane array, that is, the first bendable photodiode pixels 202 may be arranged in a line array or a plane array; likewise, the first scintillator pixel array may be a line array or a plane array, that is, the first scintillator pixels 203 may be arranged in a line array or a plane array.
As an example, a first surface of the first scintillator pixel 203 is in contact with the first bendable photodiode pixel 202, and an arc length of the first surface of the first scintillator pixel 203 is greater than an arc length of a second surface of the first scintillator pixel 202. It should be noted that, in this embodiment, when the bendable photodiode-based detector module 20 is used for detecting radiation emitted by a radiation source, the second surface of the first scintillator pixel 203 is a surface close to the radiation source, and the first surface of the first scintillator pixel 203 is a surface far away from the radiation source. More specifically, in this embodiment, the arc length of the surface of the first scintillator pixel 203 near the radiation source may be set smaller than the arc length of the surface of the first scintillator pixel 203 far from the radiation source according to the position of the radiation source.
As an example, the first surface of the first scintillator pixel 203 and the second surface of the first scintillator pixel 202 may be concave surfaces or convex surfaces, where fig. 6 illustrates that the first surface of the first scintillator pixel 203 and the second surface of the first scintillator pixel 202 are concave surfaces.
It should be noted that the flexible photodiode-based detector module 20 shown in fig. 6 and 7 includes only one type of scintillator pixel (i.e., the first scintillator pixel 202), that is, the flexible photodiode-based detector module 20 shown in fig. 6 and 7 is a single-energy detector module that can capture only high-energy rays or only low-energy rays.
As an example, for the bendable photodiode-based detector module 20 shown in fig. 6 and 7, the bendable photodiode-based detector module 20 may further include a PCB board 207 as shown in fig. 8 and 9, the PCB board 207 being attached to a surface of the substrate 201 remote from the first bendable photodiode pixel array.
As an example, a plurality of readout pixels (not shown) are disposed on the PCB 207, and the readout pixels are electrically connected to the first flexible photodiode pixels 202 in a one-to-one correspondence.
In another example, as shown in fig. 10, the substrate 201 may also be a spherical substrate, and the first surface of the substrate 201 is an outer surface. That is, the first bendable photodiode pixels 202 are attached to the outer surface of the substrate 201, and the first bendable photodiode pixels 202 may be distributed in an array on the entire outer surface of the substrate 201 or may be distributed in an array on a partial area of the outer surface of the substrate 201.
It should be noted that the flexible photodiode-based detector module 20 shown in fig. 10 may be used as a separate detection system without stitching, for example, may be used as a gamma spectrometer, etc.
In the bendable photodiode-based detector module 20 of this embodiment, the first bendable photodiode pixels 202 and the first scintillator pixels 203 are all in a fan-shaped structure and are fixed on the cambered surface of the substrate 201, and then when the plurality of the bendable photodiode-based detector modules 20 are seamlessly spliced, the radiation emitted by the radiation source can vertically enter the surface of each first scintillator pixel 203 at equal angles, and no crosstalk signal between pixels occurs, so that the influence caused by overlapping of pixels is avoided, the signal is more accurate, and the image resolution is higher.
It should be noted that, the dimensions of the first flexible photodiode pixel 202 and the first scintillator pixel 203 may be adjusted according to actual needs, preferably, the smaller the dimensions of the flexible photodiode 202 and the first scintillator pixel 203, the better the dimensions of the first flexible photodiode pixel 202 and the first scintillator pixel 203, and the better the vertical incidence of rays, the higher the spatial resolution, and the more obvious the image optimization effect after the plurality of the flexible photodiode-based detection modules 20 are spliced.
It should be further noted that, the first bendable photodiode pixel 202 refers to a photodiode having a bendable function, and specifically, a substrate for preparing the photodiode is a flexible material, so as to ensure that the photodiode has the bendable function.
Example two
Referring to fig. 11 to 15, wherein the second surface of the substrate 201 of the flexible photodiode-based detection module 20 in fig. 11 is a plane, the second surface of the substrate 201 of the flexible photodiode-based detection module 20 in fig. 12 is a cambered surface, the flexible photodiode-based detection module 20 in fig. 13 is a PCB 207 provided on the second surface of the substrate 201 on the basis of the flexible photodiode-based detection module 20 in fig. 11, the flexible photodiode-based detection module 20 in fig. 14 is a PCB 207 provided on the second surface of the substrate 201 on the basis of the flexible photodiode-based detection module 20 in fig. 12, and the substrate 201 in the flexible photodiode-based detection module 20 in fig. 15 is a spherical substrate; the present embodiment also provides a detector module 20 based on a flexible photodiode, and the specific structure of the detector module 20 based on a flexible photodiode in the present embodiment is substantially the same as that of the detector module 20 based on a flexible photodiode in the first embodiment, and the difference between them is that: the detector module 20 based on the flexible photodiode in the present embodiment is a dual-energy detector module, and the detector module 20 based on the flexible photodiode in the first embodiment is a single-energy detector module; specifically, the bendable photodiode-based detector module 20 in this embodiment adds a low-energy ray filter 204, a second bendable photodiode pixel array and a second scintillator pixel array on the basis of the bendable photodiode-based detector module 20 in the first embodiment, where the low-energy ray filter 204 is located on a surface of the first scintillator pixel array away from the first bendable photodiode pixel array, that is, the low-energy ray filter 204 is located on a surface of each of the first scintillator pixels 203 away from the first bendable photodiode pixel 202, and the low-energy ray filter 204 is used for filtering low-energy rays and preventing the low-energy rays from passing through the low-energy ray filter 204 to reach the first scintillator pixel 203 located below the low-energy ray filter 204; the second bendable photodiode pixel array comprises a plurality of second bendable photodiode pixels 205 arranged in an array, the second bendable photodiode pixels 205 are bent to be stuck to the surface of the low-energy ray filter 204, which is far away from the first scintillator pixel array, in an arc shape, and the second bendable photodiode pixels 205 are arranged in one-to-one correspondence with the first scintillator pixels 203; the second scintillator pixel array includes a plurality of second scintillator pixels 206 in a fan shape and arranged in an array, the second scintillator pixels 206 are low-energy scintillator pixels, and the second scintillator pixels 206 are attached to the surface of the second bendable photodiode pixels 205 away from the low-energy ray filter 204 and are arranged in one-to-one correspondence with the second bendable photodiode pixels 205; the second scintillator pixel 206 includes a first surface and a second surface opposite to each other, the first surface and the second surface of the second scintillator pixel 206 are both cambered surfaces, and the first surface or the second surface of the second scintillator pixel 206 is in contact with the second bendable photodiode pixel 205.
As an example, the low energy ray filter 204 is curved in a fan shape, and the arc of the low energy ray filter 204 is the same as the arc of the first scintillator pixel 203 to ensure that the surface of the low energy ray filter 204 can be seamlessly abutted against the surface of the first scintillator pixel 203 remote from the first bendable photodiode pixel 202.
As an example, a first surface of the second scintillator pixel 206 is in contact with the second bendable photodiode pixel 205, and an arc length of the first surface of the second scintillator pixel 206 is greater than an arc length of the second surface of the second scintillator pixel 206.
As an example, the arc of the second scintillator pixel 206, the arc of the second bendable photodiode pixel 205, the arc of the low-energy ray filter 204, the arc of the first scintillator pixel 203, the arc of the first bendable photodiode pixel 202, and the arc of the substrate 201 are all the same.
As an example, the arc length of the first surface of the second scintillator pixel 206 is smaller than the arc length of the second surface of the first scintillator pixel 203.
As an example, the detector module 20 based on the flexible photodiode in this embodiment further includes a plurality of connection lines (not shown) and connectors (not shown), one end of each connection line is connected to the first flexible photodiode pixel 202 and the second flexible photodiode pixel 205 in a one-to-one correspondence manner, and the other end of each connection line is connected to the connectors to electrically lead out signals of the first flexible photodiode pixel 202 and the second flexible photodiode pixel 205.
The bendable photodiode-based detector module 20 in this embodiment includes high-energy scintillator pixels and low-energy scintillator pixels, and the above dual-energy detector module can effectively avoid interference such as scattering due to the seamless close adhesion of the first scintillator pixels 203 and the low-energy ray filters 204 and the seamless close adhesion of the second bendable photodiode pixels 205 and the low-energy ray filters 204; meanwhile, since the arc length of the first surface of the second scintillator pixel 206, which is a low-energy scintillator pixel, is smaller than the arc length of the second surface of the first scintillator pixel 203, which is a high-energy scintillator pixel, the width of the front end of the bendable photodiode-based detector module 20 (i.e., the second surface of the second scintillator pixel 206) is narrower, the width of the rear end of the bendable photodiode-based detector module 20 (i.e., the first surface of the first scintillator pixel 203) is wider, and when the radiation source is located on the second surface side of the second scintillator pixel 206, the radiation emitted by the radiation source may be perpendicularly incident on each of the first scintillator pixel 203 and each of the second scintillator pixels 206, so that the resulting image has higher resolution.
In the above examples, the high-energy ray and the low-energy ray refer to the concept of relative terms, and the energy of the ray is not limited to a specific value, for example, in some small devices, the "high-energy ray" refers to a ray having an energy of not less than 160keV, the "low-energy ray" refers to a ray having an energy of less than 40keV, and in some large devices, the "high-energy ray" refers to a ray having an energy of not less than 6MeV, the "low-energy ray" refers to a ray having an energy of less than 3 MeV; the "high-energy scintillator pixel" refers to a scintillator pixel that can capture high-energy rays, and the "low-energy scintillator pixel" refers to a scintillator pixel that can capture low-energy rays.
It should be further noted that, the second bendable photodiode pixel 205 refers to a photodiode having a bendable function, and specifically, a substrate for preparing the photodiode is a flexible material, so as to ensure that the photodiode has the bendable function. The structure of the photodiode corresponding to the second flexible photodiode pixel 205 may be the same as or different from the structure of the photodiode corresponding to the first flexible photodiode pixel 202.
Example III
Referring to fig. 16, the present invention further provides a detector 30, where the detector 30 includes the bendable photodiode-based detector modules 20 described in the first embodiment or the second embodiment, a plurality of the detector modules 20 are seamlessly spliced together, and the shape of the detector 30 after the splice of the plurality of detector modules 20 is arc-shaped. The specific structure of the bendable photodiode-based detector module 20 is described in the first and second embodiments, and will not be described again here.
Example IV
Referring to fig. 17 and 18, the present invention further provides a detection system 40, where the detection system 40 includes the detector 30 according to the third embodiment. The specific structure of the detector 30 is shown in the third embodiment, and will not be described here.
In one example, as shown in fig. 17, the detection system 40 may be an electronic Computed Tomography (CT) scanner further comprising: a circular slip ring 401 and a radiation source 402; wherein the detector 30 is attached to the inner wall of the circular slip ring 401, and the surface of the substrate 201 away from the first bendable photodiode pixel array is in contact with the inner wall of the circular slip ring 401; the radiation source 402 is located in the circular slip ring 401 and is located on the inner wall of the circular slip ring 401, and specifically, the radiation source 402 and the center of the detector 30 are symmetrical with each other about the center of the circular slip ring 401. The electron computer tomography scanner can ensure that rays (such as X rays) can vertically enter the surface of each scintillator pixel, so that the resolution of the obtained image is improved in response compared with the existing electron computer tomography scanner, the overlapping of edge pixels can not occur, and extra algorithm correction is not needed; meanwhile, the problem that crosstalk is generated from one pixel to the other pixel due to oblique incidence of rays does not exist, and the quality of an image can be ensured.
In another example, as shown in fig. 18, the detection system 40 may also be a radiation imaging detection device, which may include a small item detection device, a large container detection device, an industrial nondestructive detection device, etc., the detection system 40 further includes a boom 403, the detector 30 is located inside the boom 403, and a surface of the substrate 201 remote from the first bendable photodiode pixel is in contact with the boom 403. The arm 403 may be an L-shaped arm, a U-shaped arm, etc., which is not limited herein. The radiation imaging detection equipment has the advantages of greatly improving the capability of detecting signals, optimizing the quality of the obtained image and the like.
Of course, in other examples, the detection system 40 may be any detection system that requires detector modules to be arranged along an arc, such as an infrared detection system, a visible light detection system, a laser testing system, and so on.
In summary, the present invention provides a bendable photodiode-based detector module and a detector system, the bendable photodiode-based detector module comprising: the substrate comprises a first surface and a second surface which are opposite to each other, wherein at least the first surface of the substrate is a cambered surface; the first bendable photodiode pixels comprise a plurality of first bendable photodiode pixels which are arranged in an array, and the first bendable photodiode pixels are bent to be stuck to the first surface of the substrate in an arc shape; the first scintillator pixels comprise a plurality of fan-shaped first scintillator pixels which are arranged in an array manner, and the first scintillator pixels are attached to the surface of the first bendable photodiode pixels, which is far away from the substrate, and are arranged in one-to-one correspondence with the first bendable photodiode pixels; the first scintillator pixel includes a first surface and a second surface opposite to each other, the first surface and the second surface of the first scintillator pixel are cambered surfaces, and the first surface or the second surface of the first scintillator pixel is in contact with the first bendable photodiode pixel. The bendable photodiode and the scintillator pixels in the detector module based on the bendable photodiode are of sector-shaped structures and are fixed on the cambered surface of the substrate, and when the detector modules based on the bendable photodiode are seamlessly spliced, rays emitted by a ray source can vertically enter the surface of each scintillator pixel at equal angles, crosstalk signals among the pixels are avoided, influence caused by pixel overlapping is avoided, signals are more accurate, and image resolution is higher.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (12)

1. A flexible photodiode-based detector module, the flexible photodiode-based detector module comprising:
the substrate comprises a first surface and a second surface which are opposite to each other, wherein at least the first surface of the substrate is a cambered surface; the substrate is an arc-shaped substrate, and the second surface of the substrate is an arc surface;
the first bendable photodiode pixel array comprises a plurality of first bendable photodiode pixels which are arranged in an array, and the first bendable photodiode pixels are bent to be in an arc shape and are attached to the first surface of the substrate;
the first scintillator pixel array comprises a plurality of fan-shaped first scintillator pixels which are arranged in an array manner, wherein the first scintillator pixels are attached to the surface of the first bendable photodiode pixels, which is far away from the substrate, and are arranged in one-to-one correspondence with the first bendable photodiode pixels; the first scintillator pixel comprises a first surface and a second surface which are opposite to each other, the first surface and the second surface of the first scintillator pixel are cambered surfaces, and the first surface or the second surface of the first scintillator pixel is in contact with the first bendable photodiode pixel; the first scintillator pixel is a high energy scintillator pixel, and the detector module of the flexible photodiode further includes:
a low energy ray filter located at a surface of the first scintillator pixel array remote from the first bendable photodiode pixel array;
the second bendable photodiode pixel array comprises a plurality of second bendable photodiode pixels which are arranged in an array, the second bendable photodiode pixels are bent to be stuck to the surface of the low-energy ray filter, which is far away from the first scintillator pixel array, in an arc shape, and the second bendable photodiode pixels are arranged in one-to-one correspondence with the first scintillator pixels;
the second scintillator pixel array comprises a plurality of fan-shaped second scintillator pixels which are arranged in an array manner, the second scintillator pixels are low-energy scintillator pixels, and the second scintillator pixels are attached to the surface of the second bendable photodiode pixels, which is far away from the low-energy ray filter, and are arranged in one-to-one correspondence with the second bendable photodiode pixels; the second scintillator pixel comprises a first surface and a second surface which are opposite, the first surface and the second surface of the second scintillator pixel are cambered surfaces, and the first surface or the second surface of the second scintillator pixel is in contact with the second bendable photodiode pixel.
2. The flexible photodiode-based detector module of claim 1 wherein: the substrate is a spherical substrate, and the first surface of the substrate is an outer surface.
3. The flexible photodiode-based detector module of claim 1 wherein: the cambered surfaces of the substrate, the first bendable photodiode pixels and the first scintillator pixels all have the same radian.
4. The flexible photodiode-based detector module of claim 1 wherein: the first surface of the first scintillator pixel is in contact with the first bendable photodiode pixel, and the arc length of the first surface of the first scintillator pixel is greater than the arc length of the second surface of the first scintillator pixel.
5. The flexible photodiode-based detector module of claim 1 wherein: the first surface of the second scintillator pixel is in contact with the second bendable photodiode pixel, and the arc length of the first surface of the second scintillator pixel is greater than the arc length of the second surface of the second scintillator pixel.
6. The flexible photodiode-based detector module of claim 5 wherein: the arc length of the first surface of the second scintillator pixel is less than the arc length of the second surface of the first scintillator pixel.
7. The flexible photodiode-based detector module of claim 1 wherein: the detector module based on the bendable photodiode further comprises a PCB (printed circuit board) which is attached to the surface, away from the first bendable photodiode pixel array, of the substrate.
8. The flexible photodiode-based detector module of claim 7 wherein: and a plurality of reading pixels are arranged on the PCB and are electrically connected with the first bendable photodiode pixels in a one-to-one correspondence.
9. A detector, characterized in that it comprises a number of detector modules based on flexible photodiodes according to any of claims 1, 3 to 8, which are seamlessly spliced together.
10. A detection system comprising the detector of claim 9.
11. The detection system of claim 10, wherein: the detection system is an electronic computed tomography scanner, the electronic computed tomography scanner further comprising: a circular slip ring and a radiation source; wherein,
the detector is attached to the inner wall of the circular slip ring, and the surface, away from the first bendable photodiode pixel array, of the substrate is contacted with the inner wall of the circular slip ring;
the radiation source is positioned in the circular slip ring and positioned on the inner wall of the circular slip ring.
12. The detection system of claim 10, wherein: the detection system is radiation imaging detection equipment and further comprises a cantilever crane, the detector is positioned in the cantilever crane, and the surface, away from the first bendable photodiode pixel array, of the substrate is contacted with the cantilever crane.
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