CN108359070A - 一种用于热电半导体充注的改性聚氨酯发泡工艺 - Google Patents

一种用于热电半导体充注的改性聚氨酯发泡工艺 Download PDF

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CN108359070A
CN108359070A CN201810170636.9A CN201810170636A CN108359070A CN 108359070 A CN108359070 A CN 108359070A CN 201810170636 A CN201810170636 A CN 201810170636A CN 108359070 A CN108359070 A CN 108359070A
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thermoelectric semiconductor
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郑兆志
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Shunde Vocational and Technical College
Shunde Polytechnic
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Abstract

本发明公开一种用于热电半导体充注的改性聚氨酯发泡工艺，改性聚氨酯的配方：聚醚多元醇25，偶氮二甲酰胺1，聚酯多元醇40，一氟二氯乙烷20，二苯基甲烷二异氰酸酯200，辛/癸烷基叔胺2，三正己胺1，改性纳米氢氧化钠4，微晶纤维素4，发泡剂1，阻燃剂1，催化剂1；所述改性聚氨酯用于热电半导体内空隙充填，热电半导体45°放置在下模定位坡口上，上模设置排气孔和抽真空自封工艺接管，经充注枪插入孔向模腔内充注改性聚氨酯发泡材料，充注过程对热电半导体充注模具的模腔进行抽真空操作，使整个型腔里面保持预设的负压，令到聚氨酯发泡剂在发泡前夕形成下腔推入、微通道挤出、上腔牵引的势力场。

Description

一种用于热电半导体充注的改性聚氨酯发泡工艺
技术领域：
本发明涉及热电半导体性能改进技术领域，更具体地说，是涉及一种用于热电半导体充注的改性聚氨酯发泡工艺。
背景技术：
随着经济的快速发展，冰箱等电器越来越普及，能耗的消耗也越来越多，中国是一个能耗大国，如何能够减少能耗，实现可持续发展，以及跟环境的友好和谐的相处，成为了当今社会很多学者研究的热点问题之一。半导体制冷作为一种新型的制冷方式，在这个飞速发展，人们生活水平日益提高以及人们对于生活舒适度的要求越来越高的社会上，是一个具有良好发展前景的制冷方式。
半导体制冷是电流换能型制冷方式，又称热电制冷，即能制冷，又能加热，通过对输入电流的控制，可实现对温度的高精度控制，制冷过程不需要任何制冷剂，没有旋转部件，无噪音，无振动。半导体制冷实现的关键是半导体制冷片。目前的半导体制冷片是利用特种半导体材料构成P-N结，N型半导体和P半导体排列的空隙处是空气，这样就会导致①空气对流现象导致冷端和热端短路，严重影响制冷性能；②潮湿的空气造成绝缘强度下降，爬电距离不合格；③加速半导体的老化。
中国专利CN201420306709.X公开了一种半导体制冷器件包括半导体制冷片，其由上基板和下基板，以及位于上基板和下基板之间的多组P-N结半导体组成，所述上基板与下基板的空隙处填充有具有隔热绝缘作用的气凝胶层，使功耗下的制冷效率提高10％以上。但是按照一般的常识，填充二氧化硅材料，其绝热性能都会下降，反而削弱了制冷片的制冷性能。
发明内容：
本发明所要解决的技术问题是：提供一种用于热电半导体充注的改性聚氨酯发泡工艺，以克服现有技术的不足。
为实现上述目的，本发明采取的技术方案是：一种用于热电半导体充注的改性聚氨酯发泡工艺，所述改性聚氨酯的配方组成按重量分数如下：聚醚多元醇25，偶氮二甲酰胺1，聚酯多元醇40，一氟二氯乙烷20，二苯基甲烷二异氰酸酯200，辛/癸烷基叔胺2，三正己胺1，改性纳米氢氧化钠4，微晶纤维素4，发泡剂1，阻燃剂1，催化剂1；所述改性聚氨酯用于热电半导体内空隙充填，所述热电半导体包括陶瓷板、P型半导体、N型半导体、导流片，所述P型和N型半导体在两陶瓷板间排列，充注模具包括上模、下模、左右侧定位板，所述下模设置定位坡口和充注枪插入孔，所述热电半导体45°放置在下模定位坡口上，上模设置排气孔和抽真空自封工艺接管，经充注枪插入孔向模腔内充注改性聚氨酯发泡材料，使热电半导体在两陶瓷板内的间隙中充注改性聚氨酯发泡材料；其特征在于：充注过程对热电半导体充注模具的模腔进行抽真空操作，使整个型腔里面保持预设的负压，令到聚氨酯发泡剂在发泡前夕形成下腔推入、微通道挤出、上腔牵引的势力场，从而完成发泡过程。
所述充注孔兼具密封功能，在充注完成后由螺柱密封，所述工艺接管为自密封机构，保证发泡完成后形成预设的正压和温度，完成发泡化学反应达到所需最佳密度和最小导热率。
本发明的有益效果在于：本发明通过导流、推挤、负压充注技术，使用导热系数比空气低、绝缘强度非常高的聚氨酯发泡材料充注到热电半导体的微通道中发泡成型，发泡成型过程转为正压密封和温度控制，从而使热电半导体的性能大幅度提高，装箱后冰箱的耗电量降低、箱体平均温度显著降低，可靠性大幅度提高。由于采用了改性配方，使聚氨酯发泡剂具备了低粘度和高流动性，保证了充注的有效性。
附图说明：
图1是本发明的热电半导体充注模具结构示意图。
图2是本发明的热电半导体充注模具发泡腔结构布局图。
具体实施例：
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“前后”、“上”、“下”、“左”、“右”、“垂直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接。也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明的具体含义。
请参阅图1-2，热电半导体充注模具分为上模1和下模2，所述热电半导体7包括陶瓷板、P型半导体、N型半导体、导流片，所述P型和N型半导体在两陶瓷板间排列，充注模具包括上模1、下模2、左右侧定位板5，所述下模设置定位坡口4和充注枪插入孔3，所述热电半导体45°放置在下模定位坡口上，上模设置排气孔和抽真空工艺接管，经充注枪插入孔向模腔内充注改性聚氨酯发泡材料。上下模均为梯槽开式设计，加工工艺简单，易达到设计要求，加工成本低，加工途径多样，可以冲压或机机加工成型。上下合模为腰鼓型，合模与分模简单可靠，可以自校正对准。上模设计有排气孔和抽真空工艺接管，其中抽真空工艺接管一端与模体焊接、另一端与维修针阀焊接，方便与真空泵连接。下模设有充注枪插入孔，同时该插入孔为密封螺孔，充注完成后可以用密封螺栓封住。
将已经制备的热电半导体45°放置在下模定位坡口上，热电半导体与坡口之间用橡胶垫密封(橡胶垫与坡口是粘接一体)，形成下桥臂。热电制冷片架空堆积在下模梯形槽内，形成M型腔，制冷片与片之间有胶纸8用于密封盒保护陶瓷表面，两端的热电制冷片与前后端盖有橡胶9密封(橡胶密封与前后端盖粘接为一体)。下桥壁与下模及前后端盖形成密封的M型注入腔，充注剂被迫流过通过热电制冷片的微通道。
上模与下模合模后，形成上桥臂，并与下桥壁构成完整的导流桥。上型腔为W导流腔，与上模的坡口也是密封的，充注剂由上桥臂流出。
充注前进行抽真空操作，在整个型腔里面形成负压，令到聚氨酯发泡剂在发泡前夕形成下腔推入、微通道挤出、上腔牵引的势力场，从而完成发泡过程。
如表1所示，为主要聚氨酯发泡剂组成及比例，在添加改性材料，成为低粘度高流动性、且具有阻燃功能的改性聚氨酯发泡剂，其发泡密度提高、粘接强度提高，导热系数降低为空气的1/2，绝缘强度达到出厂规定。加工条件：将配方按质量分数混合，在25度下，搅拌10秒，注入模具内，在25度下发泡10分钟，获得性能为：泡沫密度0.045g/cm3,导热率0.014W/(m·K),粘接强度410MPa。
表1低粘度高流动性聚氨酯发泡剂,粘度(25℃):50CPS
本发明并不局限于上述实施方式，如果对本发明的各种改动或变形不脱离本发明的精神和范围，倘若这些改动和变形属于本发明的权利要求和等同技术范围之内，则本发明也意图包含这些改动和变形。

Claims (2)

1.一种用于热电半导体充注的改性聚氨酯发泡工艺，所述改性聚氨酯的配方组成按重量分数如下：聚醚多元醇25，偶氮二甲酰胺1，聚酯多元醇40，一氟二氯乙烷20，二苯基甲烷二异氰酸酯200，辛/癸烷基叔胺2，三正己胺1，改性纳米氢氧化钠4，微晶纤维素4，发泡剂1，阻燃剂1，催化剂1；所述改性聚氨酯用于热电半导体内空隙充填，所述热电半导体包括陶瓷板、P型半导体、N型半导体、导流片，所述P型和N型半导体在两陶瓷板间排列，充注模具包括上模、下模、左右侧定位板，所述下模设置定位坡口和充注枪插入孔，所述热电半导体45°放置在下模定位坡口上，上模设置排气孔和抽真空自封工艺接管，经充注枪插入孔向模腔内充注改性聚氨酯发泡材料，使热电半导体在两陶瓷板内的间隙中充注改性聚氨酯发泡材料；其特征在于：充注过程对热电半导体充注模具的模腔进行抽真空操作，使整个型腔里面保持预设的负压，令到聚氨酯发泡剂在发泡前夕形成下腔推入、微通道挤出、上腔牵引的势力场，从而完成发泡过程。
2.根据权利要求1所述用于热电半导体充注的改性聚氨酯的发泡工艺，其特征在于：所述充注孔兼具密封功能，在充注完成后由螺柱密封，所述工艺接管为自密封机构，保证发泡完成后形成预设的正压和温度，完成发泡化学反应达到所需最佳密度和最小导热率。
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US20020094354A1 (en) * 2001-01-17 2002-07-18 Naoyoshi Kimura Mold device for injection molding of synthetic resin
CN204029870U (zh) * 2014-06-10 2014-12-17 四川航天系统工程研究所 一种半导体制冷器件
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