CN108355726A - A kind of interdigitation speedup Micropump chip based on the driving of AC Electric Heater effect - Google Patents
A kind of interdigitation speedup Micropump chip based on the driving of AC Electric Heater effect Download PDFInfo
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
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- 238000000034 method Methods 0.000 description 7
- 238000005086 pumping Methods 0.000 description 6
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- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及微生物芯片技术领域,涉及一种提高流体流速的微泵芯片,具体是一种基于交流电热效应驱动的叉指型增速微泵芯片。The invention relates to the technical field of microbial chips, and relates to a micropump chip for increasing fluid flow rate, in particular to an interdigitated speed-up micropump chip driven by alternating current electrothermal effect.
背景技术Background technique
随着现代科技的发展,所生产的产品精度越来越高,实验操作过程越来越繁琐,之前使用注射泵进行流体泵送的方式已经逐渐被一些由动电原理操纵的微流控芯片代替。由于微流控芯片精度高、操作简便、易于制造、节约试剂成本,所以一直受到人们的广泛运用。With the development of modern technology, the precision of the products produced is getting higher and higher, and the experimental operation process is becoming more and more cumbersome. The previous method of using syringe pumps for fluid pumping has been gradually replaced by some microfluidic chips operated by electrokinetic principles. . Microfluidic chips have been widely used because of their high precision, easy operation, easy manufacture, and cost-saving reagents.
对于叉指型电极,由于电极呈平行分布,故又称其为平行电极。四个主要参数为:叉指电极对的对数、叉指宽度、相邻叉指之间的间隙距离以及叉指电极的厚度。其中,叉指的长宽比越大,叉指的密度越大,速度越大;减小叉指电极间距还可以有效地提高速率;电极越厚,电场强度越小,电极越薄,产生的电场越强,电场力越大,电极边缘与间隙形成非均匀电场区域,提供交流电压可以使流体产生更好的电热流动,且流体是从小电极方向向大电极方向流通。For interdigitated electrodes, because the electrodes are distributed in parallel, they are also called parallel electrodes. The four main parameters are: number of pairs of interdigitated electrodes, interdigital width, gap distance between adjacent interdigitated fingers, and thickness of the interdigitated electrodes. Among them, the greater the aspect ratio of the fingers, the greater the density of the fingers, and the greater the speed; reducing the distance between the electrodes of the fingers can also effectively increase the speed; the thicker the electrodes, the smaller the electric field strength, and the thinner the electrodes, the greater the speed. The stronger the electric field, the greater the electric field force, and the electrode edge and gap form a non-uniform electric field area. Providing an AC voltage can make the fluid generate better electrothermal flow, and the fluid flows from the direction of the small electrode to the direction of the large electrode.
交流电热(Alternating Cμrrent electrothermal,ACET)主要用于较高电导率流体的驱动中,交流电热效应基于流体的焦耳热和小尺寸范围带来的温度梯度。对于电导率大于100mS/m的流体,在频率高于100kHz的交流电场作用下,焦耳热效应增强,从而导致流体性质改变,从而流体产生电热流动。因此增加输入热量以增大流体内部温度梯度、改变电压大小、提高流体体力等都可以提高流体的流速。其中,如果电压太大有可能造成流体中带有的检测细胞或颗粒损伤失活;体积热力过大有可能导致活性降低;施加外部温度梯度可以改善微流控芯片中电热流动速度大小、流动方向和涡流形态。在此基础上只需在施加相同的交流电的基础上便可以实现更高流速的泵送效果。Alternating Cμrrent electrothermal (ACET) is mainly used in the drive of fluids with higher conductivity. The AC electrothermal effect is based on the Joule heat of the fluid and the temperature gradient brought about by the small size range. For a fluid with a conductivity greater than 100mS/m, under the action of an alternating electric field with a frequency higher than 100kHz, the Joule heating effect is enhanced, which leads to a change in the properties of the fluid, so that the fluid generates electrothermal flow. Therefore, increasing the input heat to increase the internal temperature gradient of the fluid, changing the voltage, and improving the fluid's physical strength can all increase the flow rate of the fluid. Among them, if the voltage is too large, it may cause the detection cells or particles in the fluid to be damaged and inactivated; if the volume heat is too large, the activity may be reduced; applying an external temperature gradient can improve the electrothermal flow velocity and flow direction in the microfluidic chip. and eddy currents. On this basis, the pumping effect of a higher flow rate can be achieved only by applying the same alternating current.
发明内容Contents of the invention
为解决现有技术的不足,本发明提供一种基于交流电热效应驱动的叉指型增速微泵芯片。本发明设计一种叉指型高效率流体驱动微泵芯片,提供一种高效流体驱动的方法,解决普通叉指电极微泵芯片流速低的问题,节省时间提高效率。其特点为速度可调、高精度,保证了检测的精确性和实用性。In order to solve the deficiencies of the prior art, the present invention provides an interdigital speed-up micropump chip driven by alternating current electrothermal effect. The invention designs an interdigitated high-efficiency fluid-driven micropump chip, provides a high-efficiency fluid-driven method, solves the problem of low flow rate of the common interdigitated electrode micropump chip, saves time and improves efficiency. It is characterized by adjustable speed and high precision, which ensures the accuracy and practicability of detection.
本发明所采用的技术方案是:设计一种基于交流电热效应驱动的叉指型增速微泵芯片,包括通道盖片、基片、温控沟槽与电极对;所述电极对设置在基片的上表面,且通道盖片的下表面与基片上表面紧紧贴合,基片的下方设置有温控沟槽。The technical solution adopted in the present invention is: design an interdigitated speed-up micropump chip driven by AC electrothermal effect, including a channel cover, a substrate, a temperature control groove and an electrode pair; the electrode pair is arranged on the substrate The upper surface of the channel cover sheet is closely attached to the upper surface of the substrate, and a temperature control groove is arranged under the substrate.
所述通道盖片为板状结构,其上表面设置有两个与下表面贯通的通孔,分别为入口通道和出口通道;其下表面设置有内凹矩形槽口,为内部通道,入口通道和出口通道与内部通道连通;基片设置在通道盖片下方,并与其下表面紧贴,基片的上表面覆盖内部通道;基片的下表面与温控沟槽的上表面紧贴在一起;电极对设置在内部通道的内部,且粘连在基片的上表面上。The channel cover is a plate-shaped structure, and its upper surface is provided with two through holes connected with the lower surface, which are respectively an inlet channel and an outlet channel; its lower surface is provided with a concave rectangular notch, which is an internal channel, and the inlet channel The outlet channel communicates with the internal channel; the substrate is arranged under the channel cover and is in close contact with its lower surface, and the upper surface of the substrate covers the internal channel; the lower surface of the substrate is in close contact with the upper surface of the temperature control groove ; Electrode pairs are arranged inside the internal channel and adhered to the upper surface of the substrate.
所述电极对包括小电极和大电极,所述小电极与大电极均为主体垂直向外伸出分支的结构,小电极的分支较大电极的小,小电极与大电极相对设置,两者的分支相互交错且不接触。The electrode pair includes a small electrode and a large electrode. Both the small electrode and the large electrode have a structure in which the main body extends outwards vertically. The branch of the small electrode is smaller than that of the electrode. branches intersect and do not touch each other.
温控沟槽的上表面设置有交错且不连通的内凹槽道,该内凹槽道的两端位于基片的外侧,一端为加热槽,另一端为降温槽;加热槽与降温槽均呈梳状,相对交错设置且不连通,加热槽的分槽道分别与小电极的分支对应且位于其正下方;降温槽的分槽道分别与大电极的分支对应且位于其正下方。The upper surface of the temperature control groove is provided with staggered and disconnected inner grooves, the two ends of the inner grooves are located on the outside of the substrate, one end is a heating groove, and the other end is a cooling groove; the heating groove and the cooling groove are both Comb-shaped, relatively staggered and disconnected, the sub-channels of the heating tank respectively correspond to the branches of the small electrodes and are located directly below them; the sub-channels of the cooling tank respectively correspond to the branches of the large electrodes and are located directly below them.
本发明具有以下特点:The present invention has the following characteristics:
(1)加速了芯片中流体的泵送速度,大幅缩短了所需时间;(1) The pumping speed of the fluid in the chip is accelerated, and the required time is greatly shortened;
(2)通过改变温度梯度来实现目标,温度控制方式很简单,使实验变得简单已完成;(2) To achieve the goal by changing the temperature gradient, the temperature control method is very simple, making the experiment simple and completed;
(3)此芯片结构简单,加工难度低。(3) The chip has a simple structure and low processing difficulty.
与现有技术相比,本发明有益效果在于:本发明设计的微流体泵送芯片,通过在温控沟槽中分别加入电阻丝和制冷片对沟槽内的导热流体进行温度控制,对大电极进行散热的同时对小电极进行升热来得到要实现的效果。本发明设计的泵送芯片,安装简便,在保证高精度的基础上,具有方便、快捷、高效等特点。Compared with the prior art, the beneficial effect of the present invention lies in that the microfluid pumping chip designed by the present invention can control the temperature of the heat-conducting fluid in the groove by respectively adding resistance wires and refrigeration sheets in the temperature-controlled groove, and can control the temperature of large While the electrodes dissipate heat, the small electrodes are heated up to obtain the effect to be achieved. The pumping chip designed by the invention is easy to install, and on the basis of ensuring high precision, it has the characteristics of convenience, quickness, high efficiency and the like.
附图说明Description of drawings
图1是本发明一种实施例的的整体结构示意图;Fig. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;
图2是本发明一种实施例的叉指电极结构示意图;Fig. 2 is a schematic diagram of the structure of interdigitated electrodes according to an embodiment of the present invention;
图3是本发明一种实施例的温控沟槽结构示意图;Fig. 3 is a schematic diagram of the structure of a temperature-controlled trench according to an embodiment of the present invention;
图4是本发明一种实施例的截面结构示意图。Fig. 4 is a schematic cross-sectional structure diagram of an embodiment of the present invention.
具体实施方式Detailed ways
下面结合附图1-4,对本发明的具体实施进行详细说明。The specific implementation of the present invention will be described in detail below in conjunction with accompanying drawings 1-4.
本发明设计的一种基于交流电热效应驱动的叉指型增速微泵芯片,包括通道盖片1、基片2、温控沟槽3与电极对4。所述电极对4设置在通道盖片1和基片2之间,紧紧贴合在基片2的上表面,基片2的下方设置有水槽3。An interdigitated speed-up micropump chip driven by AC electrothermal effect designed in the present invention includes a channel cover 1 , a substrate 2 , a temperature control groove 3 and an electrode pair 4 . The electrode pair 4 is arranged between the channel cover sheet 1 and the substrate 2 , and is closely attached to the upper surface of the substrate 2 , and a water tank 3 is arranged below the substrate 2 .
所述通道盖片1为板状结构,其上表面设置有两个与下表面贯通的通孔,分别为入口通道11和出口通道13;其下表面设置有内凹矩形槽口,为内部通道12,入口通道11和出口通道13与内部通道12连通。基片2设置在通道盖片1下方,并与其下表面紧贴,基片2的上表面覆盖内部通道12。基片2的下表面与温控沟槽3的上表面紧贴在一起。电极对4设置在内部通道12的内部,且粘连在基片2的上表面上。The channel cover 1 is a plate-like structure, and its upper surface is provided with two through holes connected with the lower surface, which are respectively the inlet channel 11 and the outlet channel 13; its lower surface is provided with a concave rectangular notch, which is an internal channel. 12 , the inlet channel 11 and the outlet channel 13 communicate with the inner channel 12 . The substrate 2 is arranged under the channel cover 1 and is in close contact with the lower surface thereof, and the upper surface of the substrate 2 covers the internal channel 12 . The lower surface of the substrate 2 is in close contact with the upper surface of the temperature control groove 3 . The electrode pairs 4 are arranged inside the internal channel 12 and adhered to the upper surface of the substrate 2 .
所述电极对4包括小电极41和大电极42,所述小电极41与大电极42均为主体垂直向外伸出分支的结构,小电极41的分支较大电极42的小,小电极41与大电极42相对设置,两者的分支相互交错且不接触。The electrode pair 4 includes a small electrode 41 and a large electrode 42. The small electrode 41 and the large electrode 42 both have a structure in which the main body extends outwards vertically. The branch of the small electrode 41 is smaller than that of the electrode 42. The small electrode 41 Set opposite to the large electrode 42 , the branches of the two are interlaced and do not touch each other.
温控沟槽3的上表面设置有交错且不连通的内凹槽道,该内凹槽道的两端位于基片2的外侧,一端为加热槽31,另一端为降温槽32。加热槽31与降温槽32均呈梳状,相对交错设置且不连通,加热槽31的分槽道分别与小电极41的分支对应且位于其正下方;降温槽32的分槽道分别与大电极42的分支对应且位于其正下方。The upper surface of the temperature control groove 3 is provided with staggered and disconnected inner grooves, the two ends of the inner grooves are located outside the substrate 2 , one end is a heating groove 31 , and the other end is a cooling groove 32 . The heating tank 31 and the cooling tank 32 are comb-shaped, relatively staggered and not connected. The sub-channels of the heating tank 31 correspond to the branches of the small electrodes 41 and are located directly below them; The branch of the electrode 42 corresponds to and is located directly below it.
所述电极对4为叉指电极对,宽度比为1:1-1:100。The electrode pair 4 is an interdigitated electrode pair with a width ratio of 1:1-1:100.
如附图1-4所示,小电极41和大电极42分别设置有3根分支,对应的,加热槽31与降温槽32均分别设置有3个分槽道,每个槽道的宽度与长度分别与对应电极的分支对应。As shown in accompanying drawings 1-4, the small electrode 41 and the large electrode 42 are respectively provided with 3 branches, and correspondingly, the heating tank 31 and the cooling tank 32 are respectively provided with 3 sub-channels, and the width of each channel is the same as The lengths respectively correspond to the branches of the corresponding electrodes.
所述通道12为矩形,边长为1-20mm,高度为10-100μm。The channel 12 is rectangular, with a side length of 1-20 mm and a height of 10-100 μm.
所述电极对4采用金或ITO等导电金属材料,尺寸为1-500μm,对数为1-100对。The electrode pairs 4 are made of conductive metal materials such as gold or ITO, with a size of 1-500 μm and a logarithm of 1-100 pairs.
基片2的材料可以使用硅、玻璃、聚合物等其他材料,优选为玻璃或硅,尺寸结合载玻片。The material of the substrate 2 can be other materials such as silicon, glass, polymer, etc., preferably glass or silicon, and the size is combined with a glass slide.
所述温控沟槽3为了更好地散热,温控沟槽材料可以是玻璃、聚合物、硅等其他材料,优选为PDMS。温控沟槽为方形结构,边长为1-20mm,高度为1-10mm,其内部用于控温的流体是导热性好的流体,优选为导热油。沟槽尺寸为1-500μm。In order to better dissipate heat, the temperature control groove 3 can be made of other materials such as glass, polymer, silicon, etc., preferably PDMS. The temperature control groove is a square structure with a side length of 1-20mm and a height of 1-10mm. The fluid used for temperature control inside is a fluid with good thermal conductivity, preferably heat-conducting oil. The groove size is 1-500 μm.
通过在电极所在的基片下部对应的加热槽31和降温槽32,加热槽31里安放电阻丝用于给小电极加热,降温槽32里安放制冷片用于给大电极散热,从而加大通道中流体的温度梯度,来促进流体的流通。Through the heating tank 31 and the cooling tank 32 corresponding to the lower part of the substrate where the electrode is located, a resistance wire is placed in the heating tank 31 to heat the small electrode, and a cooling plate is placed in the cooling tank 32 to dissipate heat for the large electrode, thereby enlarging the channel The temperature gradient of the fluid in the medium is used to promote the circulation of the fluid.
本发明工作原理和过程如下:将流体从入口通道11注入,经通道12向出口通道13流动过程中,对电极41与42施加交流电,电极产生交流热,温度梯度产生,交流电热作用产生,力的方向由小电极41指向大电极42,带动流体向13流,在31的导热油中加入电阻丝给小电极加热,在32的导热油中加入制冷片给大电极降温,使温度梯度进一步增大,从而交流电热效应更强,流体流向出口通道13的效率提升时间大大缩短,可以很好地保证泵送效果的稳定性。The working principle and process of the present invention are as follows: the fluid is injected from the inlet channel 11, and during the flow process from the channel 12 to the outlet channel 13, an alternating current is applied to the electrodes 41 and 42, the electrodes generate alternating heat, the temperature gradient is generated, and the alternating electric heating effect is generated. The direction of the small electrode 41 points to the large electrode 42, driving the fluid to flow to 13, adding a resistance wire to the heat transfer oil at 31 to heat the small electrode, and adding a cooling sheet to the heat transfer oil at 32 to cool down the large electrode, so that the temperature gradient is further increased Larger, so that the AC electrothermal effect is stronger, and the efficiency improvement time of the fluid flowing to the outlet channel 13 is greatly shortened, which can well ensure the stability of the pumping effect.
利用本发明所述的技术方案,或本领域的技术人员在本发明技术方案的启发下,设计出类似的技术方案,而达到上述技术效果的,均是落入本发明的保护范围。Utilize the technical solution described in the present invention, or those skilled in the art design a similar technical solution under the inspiration of the technical solution of the present invention, and achieve the above-mentioned technical effect, all fall into the protection scope of the present invention.
本发明未述及之处适用于现有技术。What is not mentioned in the present invention is applicable to the prior art.
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