CN108349163B - 三维打印的方法、三维打印机以及计算机可读存储介质 - Google Patents

三维打印的方法、三维打印机以及计算机可读存储介质 Download PDF

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CN108349163B
CN108349163B CN201580083186.4A CN201580083186A CN108349163B CN 108349163 B CN108349163 B CN 108349163B CN 201580083186 A CN201580083186 A CN 201580083186A CN 108349163 B CN108349163 B CN 108349163B
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build material
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CN108349163A (zh
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小詹姆斯·埃尔默·阿博特
戴维·A·钱皮恩
费尔南多·朱昂
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Hewlett Packard Development Co LP
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Abstract

在示例性实施方式中，一种用于将构造材料的层提取至载体中的方法。该方法包括将构造材料的层提供至床上。用液体功能材料(LFM)数字打印床上的构造材料的层的部分。该方法重复提供构造材料的层和数字打印而不向LFM施加能量，以在床上的构造材料的层中限定结构。将构造材料的层提取至载体中并且移除载体。

Description

三维打印的方法、三维打印机以及计算机可读存储介质
背景技术
随着打印机的成本下降，三维(3D)打印机变得更加普遍。3D打印机，也称为增材制造机器，通常通过使用材料逐层产生3D对象来操作。在一些系统中，可创建三维计算机辅助绘图(CAD)模型。然后，可根据模型产生对象。示例性材料可包括聚合物、金属或塑料。
附图说明
图1是本公开的示例的装置的框图；
图2是本公开的示例的示意性流程图；
图3是用于将未结合的构造材料的层提取至载体(carrier)中的示例的方法的流程图；
图4是本公开的示例的控制器的框图；
图5是本公开的示例的载体和基板的正面截面框图；以及
图6是本公开的示例的载体和基板的侧面截面框图。
具体实施方式
本公开公开了用于经由载体从3D打印机提取数字打印的构造材料的方法和装置。载体和被数字打印的但是未结合的构造材料的层可被置入微波熔炉中进行熔融。
例如，可在每遍打印时用液体功能材料数字打印构造材料的每个层的部分。液体功能材料对将在构造材料熔融之后形成三维对象的每个层的部分“描绘轮廓”。注意，在本公开中，在将液体功能材料施加至构造材料的每个层的部分之后，每个层不是固化的或熔融的。
而是，在构造材料的每个层的部分被数字打印之后，包含未结合的数字打印的构造材料的层的载体可被移动至熔炉，以使数字打印的构造材料的每个层的部分熔融。换句话说，数字打印的构造材料的层的熔融发生在熔炉中，而不是如一些其他3D打印技术那样发生在3D打印机内。
相反，一些3D打印过程在每个层被打印时加热和熔融每个层或者在层的每遍打印之后立即加热和熔融每个层。通过消除打印每个层期间或之后的加热过程，可提高3D打印过程的效率和材料特性的均匀性。另外，本公开允许使用要求过高温度以用于一些3D打印机的某些材料，比如陶瓷。
另外，本公开允许被数字打印但是未结合的构造材料的层被置入载体并且置入熔炉(例如，微波熔炉、熔炉、将对象暴露于指定为微波辐射范围之外的电磁辐射的熔融室)中。熔炉提供热量或能量，其使彼此接收液体功能材料和在接收液体功能材料的构造材料的层之间的构造材料的部分熔融。用液体功能材料数字打印的构造材料的层的每个层的部分可在单个操作中在载体内同步或同时熔融。
图1阐释了本公开的示例的3D打印机100的框图。在一个实施例中，3D打印机100可包括床108、液体功能材料(LFM)分配器110和构造材料分配器和涂布器112。在一个实施方式中，床108可与马达116耦联，以上下移动床108。
在一个实施方式中，控制器114可与LFM分配器110、构造材料分配器和涂布器112和马达116通信。控制器114可控制构造材料分配器和涂布器112，以分配构造材料102的层104-1至104-N(本文各自称为层104或共同称为层104)。控制器114可控制LFM分配器110，以在构造材料102的每个层104的部分上分配LFM。控制器114可控制马达116，以在每个层104被提供并且被LFM数字打印之后，更向下移动床108，以接收构造材料102的附加层104。控制器114也可控制马达116，以更向上移动床108，以将层104-1至104-N置入载体中，该载体被去除并且置入熔炉(例如，微波熔炉、熔炉、将对象暴露于指定为微波辐射范围之外的电磁辐射的熔融室)，如下面进一步详细讨论的。
在一个实施例中，床108可经由机械连接与马达116耦联。例如，床108可与连接至马达116的导螺杆耦联。马达116可以是以限定的增量移动导螺杆的步进马达。床108在向下方向上的移动可称为向下引导(indexing down)并且床108在向上方向上的移动可称为向上引导(indexing up)。
在一个实施例中，可使用例如计算机辅助设计(CAD)程序设计结构106并且上传至控制器114。在一些实施方式中，可将结构106的设计的每个层的位图切片或每个层的光栅切片上传至控制器114。然后控制器114可控制LFM分配器110、构造材料分配器和涂布器112和马达116，以在构造材料102的层104中数字打印结构106，而不施加能量。
在一个实施方式中，构造材料102可以是透射微波的材料。换句话说，构造材料102可以不吸收微波能量或允许微波能量穿过，而不改变构造材料102。换句话说，构造材料102可以不吸收微波能量以及另一种材料(例如，下面描述的液体功能材料)。
透射微波的材料可以是主要为透射微波的任何类型的颗粒材料，包括粉末、凝胶、料浆等。颗粒材料可具有约3微米-30微米(μm)的平均直径。对于料浆和凝胶，平均直径可小至为1纳米(nm)。可用作构造材料102的透射微波的材料的实例可包括氧化铝(Al2O3)、氮化硅(SiN)、陶瓷、玻璃陶瓷、玻璃、聚四氟乙烯(PTFE)、二氧化锆(ZrO2)、二氧化硅(SiO2)、氧化钇(Y2O3)、氧化镁(MgO)、三氧化二铝(Al2O3)、氮化硼(BN)、氟化钙(CaF2)、五氧化二钽(Ta2O5)、五氧化二铌(Nb2O5)、氧化钛(TiO2)、石英、熔融二氧化硅、莫来石等。
构造材料102的层104可被分配在床108上并且通过构造材料分配器和涂布器112轧制成水平或平坦的。基于结构106，控制器114可将LFM分配在构造材料102的层104的部分上。LFM可以是比构造材料102更好地选择性吸收微波能量的感受器。LFM也可以是设计为降低局部熔融温度或以其他方式局部修饰数字限定的对象的材料特性的材料。通过将LFM施加至构造材料102的层104的部分来数字打印构造材料102的层104，以创建对应于结构106的相应层的感受器图案。LFM也可用于修饰构造材料102的局部电学特性或其他基本特性，以为最终的结构106提供益处。
应当注意，LFM本身不是粘合剂并且在不施加能量的情况下不结合构造材料102的颗粒。换句话说，单独的LFM不结合构造材料102的颗粒。而是，如下所述在熔炉中将能量施加至LFM，以结合构造材料102。
LFM的实例可包括导电的、半导电的或具有可在环境温度下用作微波或射频(RF)感受器的磁偶极子的任何类型的材料。一些实例可包括炭黑、石墨、碳纳米管、碳化硅(SiC)、氧化锌(ZnO)、氧化铟锡(ITO)、氮化钛(TiN)、铁素体油墨、铁磁材料、铁电材料等。
另外，LFM可包括设计为与基础材料反应的材料，以确保用递送的更少的熔融能量熔融。这可包括在颗粒之间的间隙区域形成玻璃的二氧化硅(SiO2)纳米颗粒、氧化物的组合等。
可重复分配构造材料102和数字打印构造材料102的层104的部分，直到在构造材料102的多个层104-N内数字打印整个结构106。注意，不加热或熔融构造材料102的每个层104。而是，构造材料102的层104-1至104-N保持为松散的或未结合的。
在一个实施方式中，可将不含LFM的附加层104分配为最底层和最顶层，以提供绝缘。另外，可在构造材料102的每个层104内以与3D打印机和/或(下面讨论的)载体的壁150的最小距离118来数字打印结构106，以提供绝缘层。在一个实施方式中，最小距离118可约为大于或等于10毫米(mm)。
如下面讨论，构造材料102的层104-1至104-N可被插入载体中。载体可从3D打印机100移除并且插入微波熔炉中，以使每个层104-1至104-N的数字打印的部分同时熔融。
图2阐释了用于将未结合的构造材料的层提取至载体中的方法200的示例的示意性流程图。在框202中，构造材料102的层104-1可被分配至3D打印机100的床108上。
在框204中，LFM可被分配至构造材料102的层104-1的选择性部分上。在分配LFM之后，床108可被向下引导并且回到框202，以接收构造材料102的另一个层104-2。如框206中所示，可重复框202和204，直到整个结构106被数字打印在构造材料102的层104-1至104-N中。
在一个实施方式中，也可将填料材料插入构造材料102的层104-1的选择部分中。例如，在分配构造材料102之前，可将填料材料与构造材料102混合。填料材料可用于增加构造材料102的密度或有助于驱动(下面讨论的)熔融过程。可使用的填料材料的实例可包括陶瓷的纳米颗粒、溶胶-凝胶等。
在框208中，载体120可与床108耦联。载体120可与围绕床108的壁150机械耦联(例如，经由扣件、夹子等)或可机械地保持在床108上方(例如，经由机械臂、夹钳等)。载体120可由透射微波的材料构成。透射微波的材料的实例可包括氧化铝、氮化硅、陶瓷、玻璃陶瓷、玻璃、聚四氟乙烯(PTFE)、二氧化锆(ZrO2)、二氧化硅(SiO2)、氧化钇(Y2O3)、氧化镁(MgO)、三氧化二铝(Al2O3)、氮化硼(BN)、氟化钙(CaF2)、五氧化二钽(Ta2O5)、五氧化二铌(Nb2O5)、氧化钛(TiO2)、石英、熔融二氧化硅、莫来石等。
在一个实施例中，载体120的尺寸可与床108的尺寸相同或相当。例如，载体120的形状(例如，外周界)可与床108的形状相同。载体120的外周界的长度和宽度可与床108的长度和宽度相同。载体120的体积可与床108上构造材料102的层104-1至104-N的体积相同等。
在一个实施例中，围绕床108的壁150可具有传感器或探测系统(未显示)，以将载体120被附接的信号转播至控制器114。载体120被附接的信号可使得控制器114如下所述将床108向上引导。
在框210中，床108可被向上引导，以将层104-1至104-N移动至载体120中。在一个实施例中，当控制器114检测到载体120被附接时，床108可被向上引导。在一个实施例中，在层104-1至104-N被提取至载体120中之后，可将基板122插在最低层104-1和床108之间。在一个实施方式中，基板122可由透射微波的材料或反射金属构成。例如，当载体120被插入完整的微波腔时，基板122可以是透射微波的材料。当载体120的基底被设计为是微波腔的活性部分时，基板122可由反射材料制备，或可包括反射材料。基板122可将层104-1至104-N密封在载体120中。基板122可经由机械连接(例如，基板122可滑入的狭槽、机械夹钳、锁定片等)与载体120机械耦联或附接。
图5和图6阐释了基板122和载体120的另一实施方式。图5阐释了活塞502和连杆(ram)504组件的正面截面框图。在一个实施方式中，活塞502可用作构造材料102层叠到其上的床108。在构造材料102的层104放置在活塞502上之后，可经由连杆504将活塞502移动至载体120中。活塞502可包括开孔508并且载体120可具有对应于开孔508的开孔506。换句话说，活塞502的开孔508和载体的开孔506可对齐并且具有类似的尺寸和形状。活塞502和载体120可分别具有任何数量的开孔508和开孔506。
活塞502可经由机械设备使用开孔508和开孔506与载体120耦联。例如，可将杆或任何其他机械设备插入开孔508和开孔506中。在活塞502与载体120耦联之后，可将活塞502与连杆504分离。例如，可将活塞502机械地附接至连杆504(例如，螺杆、扣件等)、磁性附接至连杆504等。
图6阐释了活塞502和连杆504组件的侧面截面框图。图6阐释了两个开孔508。然而，如上所述，活塞502可具有任何数量的开孔508。
在框212中，可从床108和3D打印机移除具有基板122的载体120。载体120和基板122可确保层104-1至104-N在载体120和基板122内部保持稳定。例如，可在每个层104被分配和填充载体120而没有很多移动空间之后轧制和压实层104-1至104-N。如上所述，在每个层104的部分被数字打印之后，每个层104-1至104-N不是熔融的。换句话说，当运输至具有基板122的载体120中时，层104-1至104-N保持未结合的或未熔融。
在框214中，可将载体120和基板122插入熔炉124中。熔炉124可以是微波熔炉。熔炉可将用LFM数字打印的每个层104的部分同时熔融。如上所述，LFM可以是比不接收LFM的周围的构造材料102更好的选择性吸收微波能量的感受器。结果，如框214中阐释的，可熔融限定的结构106，而不熔融每个层104的虚线部分。在一个实施例中，可移除和回收不熔融的过多的构造材料102。也可重新使用载体120。
图3阐释了用于将未结合的构造材料的层提取至载体中的示例的方法300的流程图。在一个实施例中，方法300的框可通过控制器114或使用3D打印机100进行。
在框302中，方法300开始。在框304中，方法300将构造材料的层提供至床上。在一个实施例中，构造材料可以是透射微波的材料。透射微波的材料可以是透射微波的粉末。粉末的颗粒的平均直径可以是约3微米-30微米(μm)。可用作构造材料的透射微波的材料的实例可包括氧化铝、氮化硅、陶瓷、玻璃陶瓷、玻璃、聚四氟乙烯(PTFE)、二氧化锆(ZrO2)、二氧化硅(SiO2)、氧化钇(Y2O3)、氧化镁(MgO)、三氧化二铝(Al2O3)、氮化硼(BN)、氟化钙(CaF2)、五氧化二钽(Ta2O5)、五氧化二铌(Nb2O5)、氧化钛(TiO2)、石英、熔融二氧化硅或莫来石等。
在框306中，方法300在床上的构造材料的层的部分上数字打印。例如，可将LFM分配至将限定结构的构造材料的层的部分上。LFM可以是比构造材料更好的选择性吸收微波能量的感受器。可将LFM施加至构造材料的层的部分，以创建对应于结构106的相应的层的感受器图案。
在框308中，方法300重复提供和数字打印，以在床上的构造材料的层中限定结构。例如，可逐层限定或数字打印该结构。换句话说，可添加构造材料的层，可通过将LFM施加至选择部分来数字打印构造材料的层的部分，可在之前的构造材料的层的顶部上添加另一个构造材料的层，可数字打印新的构造材料的层的部分，等等，直到数字打印足够的构造材料的层，以限定结构。
在框310中，方法300将未结合的构造材料的层提取至放置在床上的载体中。例如，载体可与床机械耦联或保持在床上。构造材料的层可保持未结合的(例如，在数字打印之后，每个层不被加热或熔融)。床可被向上引导至载体中，直到数字打印的且未结合的构造材料的层位于载体内。基板可与载体的底部机械耦联，以将构造材料的层密封至载体中。
在一个实施方式中，载体可包括透射微波的材料。透射微波的材料的实例可包括氧化铝、氮化硅、陶瓷、玻璃陶瓷、玻璃、聚四氟乙烯(PTFE)、二氧化锆(ZrO2)、二氧化硅(SiO2)、氧化钇(Y2O3)、氧化镁(MgO)、三氧化二铝(Al2O3)、氮化硼(BN)、氟化钙(CaF2)、五氧化二钽(Ta2O5)、五氧化二铌(Nb2O5)、氧化钛(TiO2)、石英、熔融二氧化硅、莫来石等。基板可包括透射微波的材料或反射金属。例如，当载体插入完整的微波腔时，基板可以是透射微波的材料。当载体的基底被设计为是微波腔的活性部分时，基板可以是反射材料。
在框312中，方法300移除载体。例如，包含具有数字打印结构的未结合的构造材料的层的密封载体可从床和3D打印机移除。整个载体可被置入微波熔炉中。微波熔炉可使载体中数字打印在构造材料的层中的结构熔融。换句话说，不是在每遍之后使构造材料的每个层的部分熔融，本公开可使数字打印的构造材料的每个层同步，或同时在熔炉内部和载体内熔融。在框314中，方法300结束。
图4阐释了装置400的另一实施例。在一个实施例中，装置400也可以是控制器114。在一个实施例中，装置400可包括处理器402和非暂时性计算机可读存储介质404。非暂时性计算机可读存储介质404可包括指令406、408、410和412，当其由处理器402执行时，使得处理器402实施各种功能。
在一个实施例中，指令406可包括将构造材料的层分配至床上的指令。指令408可包括将LFM分配至构造材料的层的部分上的指令。指令410可包括重复该分配构造材料的层和LFM的指令，以在床上的构造材料的层中限定结构的指令。指令412可包括向上引导床直到未结合的构造材料的层包含在放置在床上的载体内，其中从具有构造材料的层的床移除载体的指令。
将认识到上述公开内容和其他特征和功能的变型，或其可选方式，可与许多其他不同的系统或应用组合。本领域技术人员可随后做出其中各种目前未预见到的或预料之外的可选方案、修饰、变型或改进，它们也旨在被下述权利要求所涵盖。

Claims (14)

1.一种三维打印的方法，包括：
将构造材料的层提供至床上；
在所述床上的所述构造材料的层的部分上数字打印液体功能材料(LFM)，其中
所述液体功能材料在不施加能量的情况下不结合所述构造材料；
重复所述提供和所述数字打印而不向所述液体功能材料施加能量，以在所述床上的构造材料的层中限定结构；
将所述构造材料的层提取至载体中；
将所述载体置入熔炉中；
将在所述载体中的所述构造材料的层中数字打印的所述结构熔融；以及
移除所述载体。
2.根据权利要求1所述的方法，其中所述提取包括：
用基板密封所述载体。
3.根据权利要求2所述的方法，其中所述基板是反射微波的金属或透射微波的。
4.根据权利要求1所述的方法，其中所述载体包括透射微波的材料。
5.根据权利要求4所述的方法，其中所述透射微波的材料包括下述的至少一种：氧化铝、氮化硅、陶瓷、玻璃陶瓷、玻璃、聚四氟乙烯(PTFE)、二氧化锆(ZrO2)、二氧化硅(SiO2)、氧化钇(Y2O3)、氧化镁(MgO)、三氧化二铝(Al2O3)、氮化硼(BN)、氟化钙(CaF2)、五氧化二钽(Ta2O5)、五氧化二铌(Nb2O5)、氧化钛(TiO2)、石英、熔融二氧化硅或莫来石。
6.根据权利要求1所述的方法，其中所述结构以与所述载体的壁最小的距离限定在所述构造材料的层中，以提供绝缘层。
7.一种用处理器可执行的指令编码的非暂时性计算机可读存储介质，所述非暂时性计算机可读存储介质包括：
将构造材料的层分配至床上的指令；
将液体功能材料(LFM)分配至所述构造材料的层的部分上的指令，其中所述液体功能材料在不施加能量的情况下不结合所述构造材料；
重复分配所述构造材料的层和所述液体功能材料的所述指令而不施加能量，以在所述床上的构造材料的层中限定结构的指令；以及
向上引导所述床直到所述构造材料的层包含在用于运送至熔炉中以使所述结构熔融的载体中，其中从具有所述构造材料的层的所述床移除所述载体的指令。
8.根据权利要求7所述的非暂时性计算机可读存储介质，其中所述液体功能材料吸收微波。
9.根据权利要求7所述的非暂时性计算机可读存储介质，其中所述载体包括透射微波的材料。
10.根据权利要求9所述的非暂时性计算机可读存储介质，其中所述透射微波的材料包括下述的至少一种：氧化铝、氮化硅、陶瓷、玻璃陶瓷、玻璃、聚四氟乙烯(PTFE)、二氧化锆(ZrO2)、二氧化硅(SiO2)、氧化钇(Y2O3)、氧化镁(MgO)、三氧化二铝(Al2O3)、氮化硼(BN)、氟化钙(CaF2)、五氧化二钽(Ta2O5)、五氧化二铌(Nb2O5)、氧化钛(TiO2)、石英、熔融二氧化硅或莫来石。
11.一种三维打印机，包括：
液体功能材料(LFM)分配器，其中所述液体功能材料在不施加能量的情况下不结合构造材料；
构造材料分配器和涂布器；
床，所述床接收构造材料的层，并且将液体功能材料接收至所述构造材料的层的每个层的部分以数字打印结构；以及
控制器，所述控制器与所述液体功能材料分配器、所述构造材料分配器和涂布器以及所述床通信，以控制所述构造材料的层的分配、液体功能材料的分配和所述床的移动，而不在分配的所述构造材料的层和所述液体功能材料之间施加能量，其中所述控制器将所述构造材料的层从所述床提取至载体中，以运送至微波熔炉。
12.根据权利要求11所述的三维打印机，其中所述载体包括透射微波的材料。
13.根据权利要求12所述的三维打印机，其中所述载体用与连杆分离的活塞密封。
14.根据权利要求11所述的三维打印机，其中所述载体用插在所述构造材料的层的底层和所述床之间的基板密封。
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