CN108349000A - 用于制造三维金属成形体的装置和方法 - Google Patents
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Abstract
用于金属领域的3D打印机已为人所知。在所述打印机中金属粉末施加在基板上,并且随后借助于能够定向的激光器焊接相关点。通过一层一层的重复得到成形体,所述成形体在原型法中能够作为单件根据计算机模型被实际打印出。但是已经确定的是,金属粉末的施加、随后的焊接以及最后该过程的多次重复需要花费大量时间,使得成形体的制造变得缓慢并且耗时。而且,由于金属粉末中产生涡流,该过程也不能够简单地通过滑架的更快运动来加速。本发明有助于解决这个问题,因为激光器是携带在滑架上的,使得焊接过程可以直接在用滑架横穿时实施。因此,滑架可以更快地移动而不会有涡流的风险,并能够在一次横穿过程中实现多个层的施加,尤其是通过在横穿基板的滑架的整个宽度上布置并行的激光元件和材料腔。
Description
技术领域
本发明涉及一种用于制造三维金属成形体的装置,其包括滑架、相对于滑架高度可调节的基板以及滑架引导装置,滑架在滑架引导装置中运行并横穿基板,所述滑架具有至少一个用于将金属粉末施加到基板上的至少一个材料腔和至少一个用于点状地熔化施加的金属粉末的激光元件,,其中,激光元件和材料腔以交替的顺序彼此在滑架的运动方向上交替设置;并且本发明涉及一种用于制造金属成形体的相应的方法。
背景技术
这样的解决方法已经由EP 2 502 729 A1公开。其中,在点式激光器之前设置从两个邻近的腔出来的金属粉末,激光可以使所述金属粉末与其下层熔合,从而得到期望的形状。这具有优点:材料仅仅在需要的地方施加。但问题是,特别是在狭窄和不断增长的结构中,新施加的金属粉末将流走,从而需要,或者在整个结构空间的漫长进程中,以点状分布地施加均匀的层和仅仅在期望的点上使用激光,或者在施加层之后用其他方法添加金属粉末层,这又损害了该解决方案的速度优势。
而DE 10 2007 029 142 A1设置为面状地施加金属粉末,其中,应通过施加电压来实现粉末层的均质化。
DE 10 2008 000 030 A1公开了一种调节装置,通过所述调节装置可使用于熔化金属粉末的激光器偏转。
US 5,993,554 A再次描述了一种中心的点状激光器,在该激光器之前设置通过多个供应装置提供的金属粉末。
制造三维金属成形体的传统方式是,通过分离工艺例如通过切削或者蚀刻从较大的工件上制出成形体并且在此去除不必要的部分。然而,为此需要的工作步骤提出了一种只在一定界限内才真正自由的结构。弯曲的孔,底切和空腔只有在一定的条件下才是可能的并且大多需要由多个单件组成成形体。
该问题的一种解决方案是所谓的添加方法,其中,待制造的成形体不通过去除多余的部分,而是相反通过一层一层地组合期望的部分产生。在所谓的多喷嘴建模的方法中,例如具有多个喷嘴的印刷头在待制造的物体上移动并且在期望的位置上施加可成形材料、例如塑料的各个滴状物,所述材料然后硬化。硬化可以通过例如UV照射实现。
所谓的立体平版印刷术的工作原理是,待制造的物体在液体塑料浴中建成,其中,工件分别下降到液体中并且再次如此程度地升高,使得在工件上保留合适的层厚度。通过擦拭器,液态的塑料均匀地分布在工件上,然后借助于光束在待构造的点处这样硬化,使得一层一层地构造工件。
与该方法类似地,也在开始时提到的金属成形体的添加结构中工作,其中,代替液态塑料,将金属粉末以薄层填充在工件上并且在期望位置上借助于例如激光射线熔化最上层并且与其下方的层焊接。
为此,例如可以这样进行,使得通过升降系统将金属粉末射出并且借助于例如呈刮刀或擦拭器形式的分配器将其施加在结构区域上,然后激光这样加载新分布的粉末层,使得设置用于计划层的点被焊接进而下一层被构建到工件上。由于材料的原因,层施加因此需要相当显著的时间耗费,因为对于整个结构空间的各个层而言必须被分配器横穿至少一次。在此,速度由于粉末材料的惯性不能任意提高,因为否则会导致材料的涡流并且材料层的不均匀地施加导致工件中的错误。
由于制造单个工件的时间需要,为此这样的方法特别好地适合于所谓的快速成形,因为在不制造模具的情况下能以相对小的耗费制造任意的成形单件。但是由于因此与工业批量生产相比相对较高的时间耗费,这样的方法在已知的配置中仅适用于持续生产产品的个别情况。
发明内容
从这一点出发,本发明的任务在于,如下地改进已知的用于制造三维金属成形体的装置和方法,即显著加速制造过程,进而已知的方法对于生产更大量的产品变得更有吸引力。
这通过根据权利要求1的特征的用于制造三维金属成形体的装置解决。这也通过根据并列权利要求7的特征的用于制造这样的成形体的方法解决。能够分别从对应的从属权利要求中获得该装置和方法的有意义的实施方案。
根据本发明设置为,与现有技术类似地,由金属粉末制成的层施加在基板上。这借助于滑架进行,所述滑架相对于基板是高度可调节的,即或者保持在高度可调节的滑架引导装置中,或者在高度可调节的基板上运行。滑架为此具有一个或者多个材料腔,金属粉末从所述材料腔施加在基板上。此外,滑架具有至少一个激光元件,通过所述激光元件,施加的金属粉末点状地被熔化并且可以与其下方的面焊接。
通过将激光元件直接布置在滑架上,可能的是,使滑架与待施加的金属粉末一起较快速地移动并且在施加金属粉末之后直接一行一行地实施它的焊接。这导致到达滑架的终点之后立即又可以向回移动。消除了直至完全实施激光过程在终点中的等待时间。
此外,滑架可以配置有第二材料腔,从而材料腔和激光元件一条一条地交替。这能够实现,在具有两个材料腔和一个位于中间的激光元件的示例的布置中,在两个方向上运行滑架并且在此在驶过基板时在每个方向上实施完全的材料施加和焊接过程。在行驶方向上位于前面的材料腔在此首先将其中包含的金属粉末施加到存在的金属粉末层和工件的上边沿上,于是,直接地跟随在位于前面的第一材料腔之后的激光元件使刚刚施加的金属粉末立即与工件在为此设置的点上焊接。第二材料腔在此可以在同一通过中施加另一材料层,其中,然后还可以跟随另一激光元件。这个配置可以重复任意次数,其中,尤其设置为,最后布置一材料腔,以便也能够如上所述地在回程上向后运行滑架。
激光元件优选详细地这样构型,使得它们能够覆盖基板的整个宽度。激光元件为此能够具有一个或者多个激光器以及(如有必要的话)转向镜,通过所述激光器以及转向镜能够到达激光线下的所有点。通过在滑架下方布置多个激光器能够实现提高工作速度,其方式是,分别给一定的区段配置激光器。配置给单个激光器的区段越小,滑架在基板上方可以越快地移动。
通常激光器通过处理计算机控制,所述处理计算机已经存储待制造工件的3D模型的一层一层构造的计划。处理计算机因此发布用于激光器的逐行控制的命令,其中,激光器为了到达分别期望的点或者本身在其方向上能够调整,或者用转向镜工作,所述转向镜本身这样运动,使得在激光器的范围内的每个点都能被激光器达到。
材料腔有利地这样构造,一个或者多个材料腔分别位于一行上,所述材料腔在滑架的整个宽度上延伸并且通过所述材料腔能够一层一层地实现金属粉末的均匀的施加。为了实现均匀地施加金属粉末,给材料腔配置振动元件,所述振动元件使材料施加均匀。不仅压电振动元件而且偏心元件或其他通常适宜于此和使用于此的激活器适合作为这样的振动元件。
有利地,给每个激光元件的区域配置成像器,所述成像器记录由激光覆盖的区域的图像接收。关于此能够分析评估,焊接过程是否已经正确地实施并且为此质量可靠地运行。
最后也可能的是,附加地设置在现有技术中已知的和在壳体中布置在上方的激光器,从而在通过滑架施加材料时,在行进方向上最后的材料腔在每次通过中将材料施加在基板上,其中,该最后施加的材料层然后可以由位于上方的其他的激光元件焊接。
为此,用于三维金属成形体的制造方法通过以下方式进行:首先将由金属粉末制成的层施加到基板上。只要基板本身不应是工件的一部分,就可以将多个金属粉末层作为基础施加并且在基板上方一定高度才开始通过激光器进行第一焊接。如果基板相反应该与工件连接,那么第一金属粉末层可以直接点状地与基板焊接。
以相同的方式,用滑架一层一层地施加金属粉末层,并且在每层中属于工件的点由配属于滑架的激光元件紧接在施加金属粉末之后焊接。在滑架通过期间,可以施加并且焊接多层金属粉末。
在滑架用于施加金属粉末层的每次通过之后,滑架和基板之间的间距提高,其方式是,或者滑架提高或者基板下降。在完整的结构过程之后,取出具有或者没有基板的工件和除去未焊接的金属粉末。剩下的是根据在处理计算机中存储的计划构造的工件。
附图说明
下面根据实施方式详细地解释前述的发明。
图1以侧横截面视图示出用于制造三维金属成形体的装置;
图2以侧横截面视图示出用于制造三维金属成形体的替代的装置;以及
图3以侧横截面视图示出用于制造三维金属成形体的另一替代的装置。
具体实施方式
图1示出用于制造三维金属成形体8的装置,所述三维金属成形体一层一层地通过激光烧结金属粉末制造。金属粉末一层一层地施加,其中,每层的应该与工件8连接的点在焊接点9中熔化并且与工件8焊接。但是通过均匀施加金属粉末,工件8在此一直进一步地在金属粉末中下沉,而此外,仅仅最上的边沿保持可见和可接触到。工件8就这点而言位于较老的金属粉末层10中,而在相关时刻第一金属粉末层11从滑架1的第一材料腔2中施加。滑架1在此沿着滑架1右边示出的箭头的方向运动并且从第一材料腔2中施加金属粉末,其中,在施加第一金属粉末层11后立即在第一金属粉末层11中设置焊接点9。这借助于第一激光元件5实施,所述第一激光元件在第一材料腔2和第二材料腔3之间布置在滑架1上。
在到达终点之后,滑架以相反的运动方向在该第一金属粉末层11上的回程上借助于第二材料腔3将第二金属粉末层施加到第一金属粉末层11上并且借助于第一激光元件5同样焊接成焊接点。
图2示出上述解决方案的替代方案,其中,同样存在第一材料腔2和第二材料腔3,但是与上述方法的区别在于同时使用两个材料腔2,3。由第一材料腔2施加的第一金属粉末层11由激光元件5在期望的位置上焊接在需要的焊接点9上,其中,滑架1实际在其后面带来由第二材料腔3施加的第二金属粉末层12。在第二金属粉末层12中实施的焊接点9由提高的激光元件7焊接出,如这在现有技术中设置的那样。虽然在该配置中,滑架必要时必须在终点等待,由此替代仅仅一个金属粉末层,借助一次通过施加至少两个金属粉末层11,12且进而显著提高该方法的速度。
图3示出前述实施方式解决方案的进一步改进方案,具有带有三个材料腔2,3,4的滑架1,所述三个材料腔总共施加三个金属粉末层11,12,13。在两个相邻的层的施加材料之间,通过激光元件5,6进行焊接,最后的材料腔可以选择地根据图1中的实施方式的原理保留用于回程或者施加用于提高的激光元件7的层,所述激光元件在滑架1后面设置焊接点。在此能够实现滑架1的实际上任意的扩展,其中,在应用大的层厚和施加非常大量的层的情况下,也可以为每次通过设置单个高度可调节的材料腔和激光元件。
上面描述用于制造三维金属成形件的装置和方法,其中,一个或者多个激光元件以及一个或者多个材料腔在滑架上被一起引导,以便在滑架的运动期间同时执行尽可能多的工作并且由此在一层一层地构造工件时节省宝贵时间。
附图标记列表
1 滑块
2 第一材料腔
3 第二材料腔
4 第三材料腔
5 第一激光元件
6 第二激光元件
7 提高的激光元件
8 工件
9 焊接点
10 较老的金属粉末层
11 第一金属粉末层
12 第二金属粉末层
13 第三金属粉末层
Claims (9)
1.一种用于制造三维金属成形体的装置,其包括滑架(1)、相对于所述滑架(1)高度能调节的基板、滑架引导装置以及至少一个用于点状地熔化所施加的金属粉末的激光元件(5、6、7),所述滑架在所述滑架引导装置中运行并横穿所述基板,所述滑架具有用于在所述基板上方施加金属粉末的至少一个材料腔(2、3、4),其中,所述激光元件(5、6)和所述材料腔(2、3、4)以交替的顺序彼此在所述滑架(1)的运动方向上交替设置,
其特征在于,所述激光元件(5、6)由多个激光器构成,借助于所述激光器,在所述滑架(1)下方的所述滑架的整个宽度上的点都能被照射,一个材料腔(2、3、4)或者由多个材料腔制成的材料腔组件在所述滑架(1)的整个宽度上延伸并且具有用于在所述滑架(1)的整个宽度下方施加在所述一个或者多个材料腔(2、3、4)中预保持的金属粉末的一个或者多个施加开口。
2.根据权利要求1所述的装置,其特征在于,激光元件(5、6)的一个激光器或者多个激光器或者本身是方向能调的或者定向到能调节方向的转向镜上。
3.根据上述权利要求中任一项所述的装置,其特征在于,给一个材料腔或者多个材料腔(2、3、4)配置至少一个振动元件用于均匀地施加材料。
4.根据权利要求3所述的装置,其特征在于,所述至少一个振动元件是偏心元件或者压电振动元件。
5.根据上述权利要求中任一项所述的装置,其特征在于,给所述滑架(1)配置定向到在所述滑架(1)下方的由至少一个激光元件(5、6)照射的焊接点(9)上的并且与分析评估装置数据连接的至少一个成像器。
6.根据上述权利要求中任一项所述的装置,其特征在于,用于点状地熔化施加的金属粉末的其他激光元件(7)提高地布置在所述基板上方。
7.一种用于制造三维金属成形体的方法,其中,能够在滑架引导装置中在基板上移动的滑架(1)设置有至少一个材料腔(2、3、4),并且在横穿所述基板期间由所述至少一个材料腔(2、3、4)施加金属粉末,其中,给所述滑架(1)配置与所述至少一个材料腔(2、3、4)邻近的激光元件(5、6),借助于所述激光元件,由所述至少一个材料腔(2、3、4)在所述基板上施加的金属粉末在所述基板上方的由与所述激光元件(5,6)数据连接的处理计算机预先设定的焊接点(9)上熔化并且与周围的材料层焊接成工件(8),其特征在于,所述激光元件(5、6)由多个激光器构成,借助于所述激光器,在所述滑架(1)下方的所述滑架的整个宽度上的点都能被照射,一个材料腔(2、3、4)或者由多个材料腔制成的材料腔组件在所述滑架(1)的整个宽度上延伸并且借助于一个或者多个施加开口在所述滑架(1)的整个宽度下方施加在一个或者多个材料腔(2、3、4)中预保持的金属粉末。
8.根据权利要求7所述的方法,其特征在于,在横穿所述基板的过程中,彼此平行布置的材料腔(2、3、4)将金属粉末施加成多个层,所述金属粉末在依次连续的层之间借助于布置在邻近的材料腔(2、3、4)之间的激光元件(5、6)熔化并且与周围的材料层焊接成工件(8)。
9.根据权利要求7或8所述的方法,其特征在于,在所述基板上已经由所述滑架(1)完全横穿的区域中的金属粉末借助于在所述基板上方提高地布置的、附加的激光元件(7)焊接。
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