CN108347869A - Radiator, for electric installation and microwave cooking electric appliance - Google Patents
Radiator, for electric installation and microwave cooking electric appliance Download PDFInfo
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- CN108347869A CN108347869A CN201810388064.1A CN201810388064A CN108347869A CN 108347869 A CN108347869 A CN 108347869A CN 201810388064 A CN201810388064 A CN 201810388064A CN 108347869 A CN108347869 A CN 108347869A
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- Prior art keywords
- electronic component
- radiator
- electric installation
- ontology
- air duct
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- 238000009434 installation Methods 0.000 title claims abstract description 71
- 238000010411 cooking Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 claims description 34
- 238000001816 cooling Methods 0.000 abstract description 26
- 230000000694 effects Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
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- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
Abstract
The radiator of embodiment of the present invention, for for electric installation, radiator to include：Ontology, ontology include the mounting surface for installing electronic component；The radiating part being connect with ontology, radiating part include substrate and multiple first radiating fins for being disposed on the substrate, and substrate is connect with ontology, and multiple first radiating fins are spaced and self-reference substrate is longitudinally extended to the direction of separate ontology.The present invention by the extending direction of the radiating fin of radiator by being set as longitudinal, it is conducted upwards using the hot gas of diverging and generates the principle of air-flow, the heat that radiator is absorbed can be rapidly transmitted in the upper layer air of radiator, then air can be dispelled by fan and takes away heat, to achieve the purpose that cooling, when will generate the big electronic component of heat and be arranged to radiator, the energy that radiator is absorbed can be distributed faster, to control the temperature of element in reasonable range.
Description
Technical field
The present invention relates to household appliance technical field more particularly to a kind of radiator, for electric installation and microwave cooking electric appliance.
Background technology
In the related art, frequency converter is just gradually becoming the new power supply conversion equipment of the micro-wave oven updating and upgrading of a product, and
The electronic component for forming frequency converter is more sensitive to temperature, and excessively high temperature can cause the functional reliability of electronic component to reduce simultaneously
Influence the service life of electronic component.In order to maintain the normal work of electronic component and ensure its service life, electronics member how is solved
The heat dissipation of part is for new problem.
Invention content
The present invention provides a kind of radiator, for electric installation and microwave cooking electric appliance.
The radiator of embodiment of the present invention, for for electric installation, the radiator to include：Ontology, the ontology include
Mounting surface for installing electronic component；The radiating part being connect with the ontology, the radiating part include that substrate exists with setting
Multiple first radiating fins on the substrate, the substrate are connect with the ontology, and the multiple first radiating fin is mutual
It is spaced and is longitudinally extended from the substrate to the direction far from the ontology.
The present invention by the extending direction of the radiating fin of radiator by being set as longitudinal, using the hot gas of diverging to upload
The principle of air-flow is led and generated, the heat that radiator is absorbed can be rapidly transmitted in the upper layer air of radiator, so
After air can be dispelled by fan and take away heat, to achieve the purpose that cooling, the big electronics member of heat will generated
When part is arranged to radiator, the energy that radiator is absorbed can be distributed faster, thus by the temperature control of element
System is in reasonable range.More, without increasing the quantity of radiating fin to increase heat dissipation area or the increase of radiator
The volume of ontology can reduce the use of material while having higher radiating and cooling efficiency, reduce life to increase heat absorption
Produce cost.
In some embodiments, the radiator includes multiple second radiating fins, the multiple second radiating fin
The side opposite with the mounting surface in the ontology is set.
In some embodiments, second radiating fin extends perpendicularly to prolonging for first radiating fin
Stretch direction.
In some embodiments, the radiator includes mounting portion, and the mounting portion and the radiating part are respectively set
In the opposite both sides of the ontology, the mounting surface connects the mounting portion and the radiating part.
In some embodiments, the substrate and the mounting surface are formed with for housing the accommodating of the electronic component
Space.
In some embodiments, first radiating fin includes opposite with adjacent first radiating fin dissipates
Hot surface, the heat-delivery surface are on-plane surface.
The present invention includes radiator described in circuit board and any of the above-described embodiment for electric installation, and the radiator is set
It sets in the circuit board.
The radiator of the present invention can preferably be power supply device radiation cooling, to ensure the temperature for electronic component in electric installation
Degree and service life, and then ensure the normal operation for electric installation and use, and the use of material can be reduced, reduction is produced into
This.
In some embodiments, described for electric installation includes the first electronic component and second mounted on the mounting surface
Electronic component；With the electronic element assembly and transformer being located on the circuit board, the electronic element assembly and the installation
Face relative spacing is arranged to form the first air duct, at least one of first electronic component and second electronic component position
In first air duct, the electronic element assembly is between the transformer and the mounting surface.
In some embodiments, the electronic element assembly includes the third arranged according to first air duct airflow direction
Electronic component and the 4th electronic component, the third electronic component and the first electronic component relative spacing, the 4th electricity
Subcomponent and the second electronic component relative spacing.
In some embodiments, the third electronic component and the 4th electronic component are in strip, and described the
The length direction of three electronic components is tilted relative to the mounting surface, and the length direction of the 4th electronic component is parallel to described
Mounting surface.
In some embodiments, the substrate is at least partially situated at the top of the electronic element assembly, the electricity
There is the part overlapped in the orthographic projection of subcomponent component and the substrate on the circuit board.
In some embodiments, the transformer includes primary side and primary side, the primary side and the primary side
It is respectively formed the second air duct and third air duct with the circuit board, second air duct is located at first air duct and the third
Between air duct.
The present invention microwave cooking electric appliance, including the radiator of any of the above-described embodiment with it is described for electric installation；
With with the microwave generator being connect for electric installation.
Embodiment of the present invention is applicable to microwave cooking electric appliance for electric installation, promotes the standard of microwave cooking electric appliance
Change, reduce the cost and operation noise of microwave cooking electric appliance.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the structural schematic diagram of the radiator of embodiment of the present invention.
Fig. 2 is another structural schematic diagram of the radiator of embodiment of the present invention.
Fig. 3 is the structural schematic diagram for electric installation of embodiment of the present invention.
Fig. 4 is another structural schematic diagram for electric installation of embodiment of the present invention.
Fig. 5 is the stereoscopic schematic diagram of the microwave cooking electric appliance of embodiment of the present invention.
Fig. 6 is the structural schematic diagram of the microwave cooking electric appliance of embodiment of the present invention.
Fig. 7 is another structural schematic diagram of the microwave cooking electric appliance of embodiment of the present invention.
Fig. 8 be embodiment of the present invention radiator with the first electronic component of traditional heat sinks pair and the second electronic component in phase
The temperature comparisons measured under the conditions of.
Main element symbol description：For electric installation 10, circuit board 11, radiator 12, ontology 121, mounting surface 1212, heat dissipation
Portion 123, substrate 1232, the first radiating fin 1234, the first heat-delivery surface 123a, the second radiating fin 124, the second heat-delivery surface
1242, mounting portion 125, accommodation space 126, electronic element assembly 13, third electronic component 132, the 4th electronic component 134, the
Five electronic components 136, transformer 14, primary side 141, primary side 142, bobbin 143, the second air duct 144, the second air inlet
1442, third air duct 145, third air inlet 1452, the first electronic component 15, the second electronic component 16, the first air duct 17, first
Sub-air channel 172, the first air inlet 176, the 6th electronic component 18, the first diode 19, the second diode 19a, microwave generator
20, cavity 30, fan 50, pallet 60, microwave cooking electric appliance 100, the relative dip angle α of third electronic component and mounting surface,
The orthographic projection B of electronic element assembly on circuit boards, the coincidence part of the orthographic projection A, A and B of the second radiating fin on circuit boards
Divide C.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can mutually communicate to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
- 4 are please referred to Fig.1, the radiator 12 of embodiment of the present invention, for for electric installation 10, radiator 12 to include ontology
121 radiating parts 123 being connect with ontology 121.Ontology 121 includes the mounting surface 1212 for installing electronic component.Radiating part 123
Including substrate 1232 and multiple first radiating fins 1234 being arranged on substrate 1232, substrate 1232 is connect with ontology 121, more
A first radiating fin 1234 is spaced and self-reference substrate 1232 is longitudinally extended to the direction far from ontology 121.
The present invention is upward using the hot gas of diverging by the way that the extending direction of the radiating fin of radiator 12 is set as longitudinal
The principle of air-flow is conducted and generated, the heat that radiator 12 is absorbed can be rapidly transmitted to the upper layer air of radiator 12
In, then air can be dispelled by fan 50 and take away heat, to achieve the purpose that cooling, heat is big that will generate
When electronic component is arranged to radiator 12, the energy that radiator 12 is absorbed can be distributed faster, thus will be first
The temperature of part controls in reasonable range.More, without increasing the quantity of radiating fin to increase the heat dissipation of radiator 12
Area increases the volume of ontology 121 to increase heat absorption, and material can be reduced while having higher radiating and cooling efficiency
Use, reduce production cost.
Specifically, in an example, the thickness of ontology 121 is 3-4mm.Preferably, radiator 12 can be by aluminium, copper, alloy
The equal preferable metal of heat dissipation performances is made.The ontology 121 of this thickness range can preferably absorb the heat of electronic component generation
And store to ontology 121, then conduct heat away is gone out to be fever by outwardly extending first radiating fin 1234
Electronic element radiating cooling, have a higher radiating efficiency and preferable heat dissipation effect, while also opposite saving radiator
Material.
Preferably, radiator 12, which is adopted, is formed from aluminium.Aluminium material is lighter, has preferable heat conduction and heat dissipation characteristics, is easy to obtain
, it is cheap, there is preferable ductility, can be easily made prefabricated shape, production cost can be reduced.Aluminium mentioned above
Material is merely illustrative, and does not do concrete restriction to the present invention, such as other heat dissipation performances such as copper, alloy also can be used in radiator 12
Preferable metal.Radiator 12 can make into a single integrated structure, and integral forming process is ripe, and embodiment is simple, can make radiator
12 have preferable globality, and reduce production difficulty and cost.Or after each component separately manufacturing of radiator 12, reconnect
Radiator 12 is formed together.
In some embodiments, the distance between multiple first radiating fins 1234 are 3-4mm, the first radiating fin
1234 length can be 20-25mm.
In this way, the distance between multiple first radiating fins 1234 are suitable, when multiple first radiating fins 1234 are conducting
And the interference that interacts is not easy when distributing heat, such as the first radiating fin because being closed on apart from the heat more closely given out
1234 absorb and influence heat dissipation, or distance increases the overall volume of radiator 12 farther out, and above-mentioned numberical range has preferably
Heat dissipation effect and higher radiating efficiency, and moderate distance can form more rule and integrated radiator 12, subtract
Few unnecessary waste of material, reduces production cost.
In some embodiments, radiator 12 includes multiple second radiating fins 124, multiple second radiating fins 124
The side opposite with mounting surface 1212 in ontology 121 is set.
It is set in radiator 12, is increased scattered by being combined the first radiating fin 1234 with the second radiating fin 124
The heat dissipation area of hot device 12, and the first radiating fin 1234 distributes heat conduction to the longitudinal direction of radiator 12, the second heat dissipation
Fin 124 distributes heat conduction to the other direction of radiator 12, and heat is made to be divided into distributing for two parts rational and orderly,
Have higher radiating efficiency and preferable heat dissipation effect.More, the first radiating fin 1234 is with the second radiating fin 124
Sheet can so correspond to preset electronic component and form longer heat dissipation channel, and certainly, the first heat radiating fin 1234 is dissipated with second
The shape of hot fin 124 is not limited to sheet, can be specifically chosen in actual implementation.
In some embodiments, the distance between multiple described second radiating fins 124 are 4-5mm, the second heat radiating fin
124 length of piece is 10-15mm.
In this way, the distance between multiple second radiating fins 124 are suitable, when multiple second radiating fins 124 are conducting simultaneously
The interference that interacts, such as the second radiating fin 124 because being closed on apart from the heat more closely given out are not easy when distributing heat
It absorbs and influences heat dissipation, or distance increases the overall volume of radiator 12 farther out, above-mentioned numberical range has preferable dissipate
Thermal effect and higher radiating efficiency, and moderate distance can form more rule and integrated radiator 12, reduce not
Necessary waste of material reduces production cost.
In some embodiments, first radiating fin 1234 that extends perpendicularly to of the second radiating fin 124 extends
Direction.
More regular and integrated radiator 12 can be so formed, the space availability ratio for electric installation 10 is improved, is reduced
The use of material reduces the volume and weight of whole microwave cooking electric appliance 100, reduces production cost.
Specifically, the first radiating fin 1234 distributes heat conduction to the longitudinal direction of radiator 12, the second radiating fin 124
Heat conduction is distributed to the transverse direction of radiator 12, to carry out different direction to the electronic component on mounting surface 1212
Heat dissipation, and two orientation are also applied for the air duct that household electrical appliance keep for radiator 12.
In some embodiments, radiator 12 includes mounting portion 125, and mounting portion 125 and radiating part 123 are separately positioned on
The opposite both sides of ontology 121, mounting surface 1212 connect mounting portion 125 and radiating part 123.
More, the cross section of mounting portion 125 is substantially L-shaped, and the long side part of mounting portion 125 is fixed with circuit board 11 to be connected
It connects, the short side part of mounting portion 125 is connect with ontology 121, and through-hole (not shown) can be arranged in the long side part of mounting portion 125, make
Through-hole is worn with fastener (not shown) radiator 12 is fixedly installed on circuit board 11, such mounting portion 125 and circuit board
Contact area between 11 is larger, has higher compactness and the stability of connection between the two, and fastener and through-hole are set
It is simple to set embodiment, versatility is good, and convenient disassembly is reusable, and has higher connective stability, can reduce life
Produce difficulty and cost.
In some embodiments, substrate 1232 and mounting surface 1212 are formed with the accommodating space for housing electronic component
126。
Electronic component is set to the space availability ratio that radiator 12 can be improved in accommodating space 126 and improves electronic component
Radiating efficiency, and the position relationship of electronic component and radiator 12 is simple, electronic component will not influence radiator 12 its
The normal use of his component is run.
Specifically, when radiator 12 be applied to household electrical appliance for electric installation 10 when, accommodating space 126 can with for electric installation
10 other spaces form the air duct of electronic component heat transmission, and then improve the radiating efficiency of electronic component.
In some embodiments, the first radiating fin 1234 includes opposite with the first adjacent radiating fin 1,234
One heat-delivery surface 123a, the first heat-delivery surface 123a is on-plane surface.Further, in the embodiment of figure 1, the second heat radiating fin
Piece 124 includes second heat-delivery surface 1242 opposite with the second adjacent radiating fin 124, and the second heat-delivery surface 1242 is non-flat
Face.
In this way, nonplanar first heat-delivery surface 123a and the second heat-delivery surface 1242 improve the first radiating fin 1234
It, can improving heat radiation efficiency and heat dissipation effect with the cooling surface area of the second radiating fin 124.First heat-delivery surface 123a and second
Heat-delivery surface 1242 can be wavy surface, spherical surface, aspherical, Else Rule or irregular surface etc., in specific implementation
Specific choice.
Fig. 3 and Fig. 4 are please referred to, embodiment of the present invention includes circuit board 11 and any of the above-described embodiment party for electric installation 10
The radiator 12 of formula, radiator 12 are arranged on circuit board 11.Specifically, radiator 12 is set on circuit board 11, so
The distance of the two is closer, and the heat that circuit board 11 generates timely can shed, and is produced to further reduce circuit board 11
Influence of the raw heat to other electronic components.Radiator 12 can be fixedly installed on circuit board 11 by way of screw locking
On, such setting mode is simple, assembling easy to disassemble, and has higher stability.
Further, it is also possible to which the relatively small radiator 12 of heat dissipation performance can meet the temperature increase requirement of element, in this way may be used
To reduce the cost of 12 material of radiator；Also only need relatively small air quantity that can meet the temperature increase requirement of electronic component, because
This can suitably be reduced to the rotation speed of the fan dried for electric installation 10, to reduce fan noise；It is led without other increase
Fan housing (not shown) forms air duct, then eliminates the material cost of plastics wind scooper, while without being made not to different platform
Same wind scooper, then can promote the standardization of products.
In some embodiments, include the first electronic component 15, the second electronic component 16, electronic component for electric installation 10
Component 13 and transformer 14.First electronic component 15 and the second electronic component 16 are set on mounting surface 1212, electric component group
Part 13 and transformer 14 are arranged on circuit board 11, and electronic element assembly 13 is arranged with 1212 relative spacing of mounting surface to form the
One air duct 17, at least one of the first electronic component 15 and the second electronic component 16 are located at the first air duct 17, electric component group
Part 13 is between transformer 14 and mounting surface 1212.
It is above-mentioned for electric installation 10, by being reasonably laid out, utilize electronic element assembly 13 and radiator 12 itself to be formed special
Fixed air duct is concentrated in limited air quantity in the first electronic component 15 and the second electronic component 16 big to heat is generated
At least one heat dissipation, finally make element temperature rise control in reasonable range, it is of the invention for electric installation 10 can be become
Frequency device or electronic transformer etc. can be applied in microwave cooking electric appliance 100 for electric installation 10, be not particularly limited herein.
Specifically, transformer 14 is step-up transformer, at least one in the first electronic component 15 and the second electronic component 16
It is a to be located at the first air duct 17 it is to be understood that the first electronic component 15 is located in the first air duct 17 or the second electronic component 16 is located at
In first air duct 17 or the first electronic component 15 and the second electronic component 16 are respectively positioned in the first air duct 17.In the implementation of diagram
In mode, the first electronic component 15 and the second electronic component 16 are all located in the first air duct 17, such first electronic component 15 with
Second electronic component 16 all can get preferable radiating and cooling effect.
In some embodiments, the first electronic component 15 includes switching tube, and the second electronic component 16 includes rectifier bridge.
In one example, switching tube can be insulated gate bipolar transistor (Insulated Gate Bipolar
Transistor, IGBT), the compound full-control type being made of BJT (double pole triode) and MOS (insulating gate type field effect tube)
Voltage driven type power semiconductor has advantage of both high input impedance and low conduction voltage drop, is relatively suitble to application
In for electric installation 10.Rectifier bridge plays rectified action in for electric installation 10, has the features such as small, easy to use.First
Electronic component 15 and the second electronic component 16 are as the electronic component being widely used in for electric installation 10, relative to other electronics member
It is easier to generate heat for part, thus the first electronic component 15 and the second electronic component 16 is set to the mounting surface of radiator 12
On 1212, the air quantity generated using fan is concentrated in the first air duct 17 as the first electronic component 15 and the second electronic component 16
Radiating and cooling has so reasonably been used for the space in electric installation 10, it is ensured that the first electronic component 15 and the second electronics member
The normal operation and service life of part 16.
More, it by the way that the first electronic component 15 and the second electronic component 16 are set to traditional radiator 12, that is, dissipates
Hot fin is the radiator being laterally arranged, and heat sensor (figure is arranged on the first electronic component 15 and the second electronic component 16
Do not show) or thermometer (not shown) come measure setting time (such as 5min) with setting under 10 power of electric installation (such as 500w)
The temperature of first electronic component 15 and the second electronic component 16, then under the same conditions, by the first electronic component 15 and the second electricity
Subcomponent 16 is set on the radiator 12 of embodiment of the present invention, obtains correction data, to compare traditional heat sinks 12 with
The heat dissipation effect of embodiment of the present invention radiator 12, the illustrative data comparison provided such as Fig. 8.
It can be found that under the same conditions, being set to the first electronic component 15 of the radiator 12 of embodiment of the present invention
It is less than the first electronic component 15 and the second electronic component being arranged on traditional heat sinks 12 with the temperature of the second electronic component 16
16, and since hot-air has the characteristic for being easy to upward (longitudinal direction) conduction, thus longitudinal radiating fin is to the obstruction of heat
Effect (i.e. thermal resistance) is less than the thermal resistance of lateral radiating fin, to faster distribute heat conduction to the top for electric installation 10
Portion, since the electronic component for 10 top of electric installation is less, the heat conducted to top can't influence electronic component again
Heat is dispelled by the generation air-flow of fan 50 and takes the first electronics member completed for electric installation 10 to being easier to fever out of by temperature
The effective temperature-reducing of part 15 and the second electronic component 16 and to for the whole heat dissipation of electric installation 10, thus embodiment of the present invention dissipates
First radiating fin 1234 is set as longitudinal by hot device 12, and lateral 124 one side of the second radiating fin is combined to make full use of
The space of radiator 12, on the other hand also improves radiating efficiency.
In some embodiments, electronic element assembly 13 includes the third electronics arranged along 17 airflow direction of the first air duct
Element 132 and the 4th electronic component 134,15 relative spacing of third electronic component 132 and the first electronic component, the 4th electronic component
134 and 16 relative spacing of the second electronic component.
It is appreciated that the direction of the first 17 airflow directions of air duct, that is, wind, third electronic component 132 and the 4th electronic component
134 are arranged along wind direction, and the first electronic component 15 and the second electronic component 16 are also arranged along wind direction, can be by the flowing of wind by third
Electronic component 132, the 4th electronic component 134, the first electronic component 15 and the second electronic component 16 heat take away, have preferably
Cooling and heat dissipation effect, and 15 relative spacing of third electronic component 132 and the first electronic component, the 4th electronic component 134 and
Two electronic components, 16 relative spacing can form more regular first air duct 17, and air-flow is made more to concentrate, and enhance cooling and heat dissipation effect
Fruit.When the first electronic component 15 includes IGBT and the second electronic component 16 includes rectifier bridge, the first electronic component 15 is along wind direction
It is arranged before the second electronic component 16 so that wind can give the first electronic component 15 to radiate first, ensure that the first electronic component
15 radiating requirements.In some instances, third electronic component 132 includes resonant capacitance, and the 4th electronic component 134 includes filtering
Capacitance.
In some embodiments, third electronic component 132 and the 4th electronic component 134 are in strip, third electronics
The length direction of element 132 is tilted relative to mounting surface 1212, and the length direction of the 4th electronic component 134 is parallel to mounting surface
1212。
More, third electronic component 132 and the 4th electronic component 134 are rectangle body, the wherein length of rectangular body
Facing towards the first electronic component 15 and the second electronic component 16, rectangular body have well-regulated shape and it is more smooth with it is longer flat
Face so can preferably be oriented to and pass through air-flow.The length direction of third electronic component 132 is tilted relative to mounting surface 1212,
But being worth noting is, it does not include the situation vertical with mounting surface 1212 of third electronic component 132 to tilt, more, third electricity
Subcomponent 132 and the relative dip angle α of mounting surface 1212 are 30 ° -45 °, and the benefit being arranged in this way is to increase the first air duct
17 inlet air angle, can conduct more air quantity, and compression then is arranged in parallel by 134 elongatedness direction of the 4th electronic component
Focused airflow improves radiating and cooling effect.
In some embodiments, the first air duct 17 includes that the first sub-air channel 172 of connection and the second sub-air channel (are schemed not
Show), the first sub-air channel 172 is formed by third electronic component 132 and mounting surface 1212, and the second sub-air channel is by the 4th electronic component
134 and the formation of mounting surface 1212, relative to the second sub-air channel, the first sub-air channel 172 is closer to the inlet side for electric installation 10, and the
One sub-air channel 172 is in tapered structure along air duct airflow direction.
First air duct 17 is divided for the first sub-air channel 172 and the second sub-air channel, and respectively by corresponding third electronic component
132 elements, the 4th electronic component 134 and the formation of mounting surface 1212, so corresponding simple in structure, assembling enforcement difficulty is relatively low,
And make the composed structure in the first air duct 17 more flexible and changeable, and when coping with different internal structures for electric installation 10, tool
Standby more variable form and wind-guiding angle, the first sub-air channel 172 are in tapered structure, such inlet side along air duct airflow direction
That is the angle bigger of (side that i.e. air-flow enters), can import more air quantity, when entering the end of the first sub-air channel 172,
Then compressible and focused airflow enhances the intensity and speed of air-flow, improves cooling and heat dissipation efficiency.
In some embodiments, third electronic component 132 and the 4th electronic component 134 are at a distance from mounting surface 1212
8-15mm。
It is appreciated that third electronic component 132 and the 4th electronic component 134 can be 8mm at a distance from mounting surface 1212,
Any number between 15mm or 8-15mm.In this way, both having ensured the compactedness for 10 internal structure of electric installation, is also ensured
The wind-guiding area in one air duct 17 is so that it is guaranteed that wind-guiding amount, has preferable cooling and heat dissipation effect.
In some embodiments, electronic element assembly 13 include the 5th electronic component 136, the 5th electronic component 136 to
Partially it is arranged with 1212 relative spacing of mounting surface, the 4th electronic component 134 is located at third electronic component 132 and the 5th electronics
Between element 136.
5th electronic component 136 is arranged with 1212 relative spacing of mounting surface it is to be understood that the 5th electronics at least partly
Element 136 can partly or entirely with 1212 relative spacing of mounting surface, it will be understood that the 5th electronic component 136 and mounting surface 1212
Between be also formed with the first air duct 17 of part, both can also be formed more regular orderly electricity by the cooling-down effect of air-flow
Subcomponent component 13, third electronic component 132, the 4th electronic component 134 and the 5th electronic component 136 press 17 inlet air of the first air duct
Mouth is arranged in order, and the electronic component that so will be easier to fever is set to the stronger position of air quantity, can play preferable heat dissipation
Effect.
In some embodiments, the 5th electronic component 136 includes differential mode inductance.
Differential mode inductance has that firm, inexpensive, frequency characteristic is excellent, has the advantages that good attenuation characteristic, low magnetism leakage,
It good can be suitable in electric installation 10.
In some embodiments, the 5th electronic component 136 and the 4th electronic component 134 are generally on same straight line.
So, it can be ensured that the rule for being formed by the first air duct 17 is smooth, improves the space availability ratio for electric installation 10, subtracts
The waste of material of few constituent element, and reduce loss of air-flow when by the 5th electronic component 136 and four electronic components 134
And loss, ensure the intensity of air-flow to ensure cooling and heat dissipation efficiency.
In some embodiments, substrate 1232 is at least partially situated at the top of electronic element assembly 13, electronic component
There is the part C overlapped in orthographic projection As of orthographic projection B and substrate 1232 of the component 13 on circuit board 11 on circuit board 11.
In this way, substrate 1232 and electronic element assembly 13 can make the first air duct 17 form more closed air duct, reduce
Wind loss improves the heat dissipation effect of the first electronic component 15 and the second electronic component 16.Electronic element assembly 13 and substrate
There is the part C overlapped in 1232 orthographic projection on circuit board 11, i.e., on the direction for being parallel to circuit board 11, substrate 1232 can
Covering part electronic element assembly 13 is blocked under substrate 1232, such substrate 1232 can limit the flowing of air-flow in the first wind
In road 17, more strict first air duct, 17 structure is formed, it is final to improve cooling and heat dissipation effect to enhance the intensity of air-flow.Example
Such as, in the illustrated embodiment, 1232 covering part third electronic component 132 of substrate and the 4th electronic component 134 of part in
Under substrate 1232.
In some embodiments, include the 6th electronic component 18 being arranged in circuit board 11, the first wind for electric installation 10
Road 17 includes the first air inlet 176, and the 6th electronic component 18 is located at the first air inlet 176.
6th electronic component 18 includes resistance alloys, and resistance alloys is a kind of resistance using alloy as electric current medium, tool
Have low resistance, high-accuracy, low-temperature coefficient, impact resistance electric current, it is high-power the features such as.For in electric installation 10, the 6th electronic component
18 are mainly used for sampling current, the electric current for changing in feedback circuit, further to control or influence the variation of electric current,
It can influence the output power stability for electric installation 10 if the temperature of the 6th electronic component 18 is too high, thus by the 6th electronics
Element 18 is set to first air inlet 176 in the first air duct 17, is effectively 18 radiating and cooling of the 6th electronic component, is protected with controlling
Hold the operation is stable for electric installation 10.
In some embodiments, transformer 14 includes primary side 141 and primary side 142, primary side 141 and primary side
142 are respectively formed the second air duct 144 and third air duct 145 with circuit board 11, and the second air duct 144 is located at the first air duct 17 and third
Between air duct 145.
Specifically, transformer 14 further includes bobbin 143, primary side 141 is located at primary side 142 on bobbin 143, will
After transformer 14 is set to circuit board 11, a lateral extent of bobbin 143 close to circuit board 11 can be 20mm, 25mm or 20-
Any number between 25mm.In this way, after 143 coiling of bobbin complete copper wire, copper wire is close to the side of circuit board 11 and circuit
Vacant distance can be 10mm between plate 11, and any number between 15mm or 10-15mm by the space left in advance, and is borrowed
The structure for helping transformer 14 itself forms the second air duct 144 and third air duct 145, and the second air duct 144 can with third air duct 145
For the copper wire radiating and cooling of institute's coiling in primary side 141 and primary side 142, three air channel structures for electric installation 10 are thusly-formed,
To improve for the whole radiating and cooling effect of electric installation 10.Distance range mentioned above is example of the present invention, has higher
Implementation result and radiating and cooling efficiency are assembled, is not particularly limited, can be specifically chosen in specific implementation.
In some embodiments, include being arranged in the first diode 19 of circuit board 11 and the two or two pole for electric installation 10
Pipe 19a, the second air duct 144 are formed with the second air inlet 1442, and third air duct 145 is formed with third air inlet the 1452, the 1st
Pole pipe 19 is located at the second air inlet 1442, and the second diode 19a is located at third air inlet 1452.
First diode 19 the second air inlet 1442 corresponding with the second diode 19a is arranged with third air inlet 1452, can
Play corresponding effective cooling-down effect, and have specific position relationship, simplify the internal structure for electric installation 10, have compared with
Good space layout, improves the space availability ratio for electric installation 10, contributes to for the integrated of electric installation 10 and minimizes, into
One step realizes the integrated of microwave cooking electric appliance 100 and miniaturization, reduces the waste of material, cost-effective.
In some embodiments, the first diode 19 and the second diode 19a are high-voltage diode, the first diode 19
It is 10mm-15mm at a distance from the tube body and circuit board 11 of the second diode 19a.
More, distance mentioned above can be 10mm, any number between 15mm or 10-15mm, specifically by around
Distance after 143 coiling copper wire of spool determines, so contributes to as the first diode 19 and the second main heating parts of diode 19a
The carry out radiating and cooling divided, improves the effect of heat dissipation.
Fig. 5-7 is please referred to, the microwave cooking electric appliance 100 of embodiment of the present invention includes the confession of any of the above-described embodiment
Electric installation 10 and the microwave generator 20 being connect with for electric installation 10.
Microwave cooking electric appliance 100 utilizes diverging by the way that the extending direction of the radiating fin of radiator 12 is set as longitudinal
Hot gas conduct and generate the principle of air-flow upwards, the heat that radiator 12 is absorbed can be rapidly transmitted to radiator 12
Upper layer air in, then air can be dispelled by fan 50 and take away heat, to achieve the purpose that cooling, will produced
When the big electronic component of heat amount is arranged to radiator 12, the energy that radiator 12 is absorbed can be given out faster
It goes, to control the temperature of element in reasonable range.More, without increasing the quantity of radiating fin to increase heat dissipation
The heat dissipation area of device 12 increases the volume of ontology 121 to increase heat absorption, while having higher radiating and cooling efficiency
The use that material can be reduced, reduces production cost.The integrated ruler that can reduce circuit board 11 for electric installation 10 with miniaturization
Very little and 12 material of radiator use, can be improved economic benefit, reduce production cost.
In some embodiments, microwave cooking device 100 further includes cavity 30, door body (not shown) and fan 50.Chamber
Pallet 60 is equipped in body 30, for placing food to be heated, door body is rotatably arranged in the front of cavity 30, is used for pallet 60
The opening of cavity 30 is opened or closed, microwave generator 20 mounted on the outside of cavity 30 and is set to fan with for electric installation 10
50 blowing direction.When microwave cooking electric appliance 100 works, operating current is provided to microwave generator 20 for electric installation 10, it is micro-
Baud generator 20 generates the microwave energy for food in heating cavity 30.Meanwhile the absorbable air from the external world of fan 50,
And air-flow is formed, air-flow may pass through air duct and be conducted for electric installation 10 is interior, and to carrying out cooling and heat dissipation for electric installation 10, in cooling
After electric installation 10, air-flow can be expelled to out of for electric installation 10 outside microwave cooking electric appliance 100 again.
Effectively cooled down to electronic component by the higher radiator 100 of radiating efficiency and reduces the negative of radiator fan 50
Lotus reduces noise.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (13)
1. a kind of radiator, for for electric installation, which is characterized in that the radiator includes：
Ontology, the ontology include the mounting surface for installing electronic component；With
The radiating part being connect with the ontology, the radiating part include multiple first heat dissipations of substrate on the substrate with setting
Fin, the substrate are connect with the ontology, and the multiple first radiating fin is spaced and from the substrate to far from institute
The direction for stating ontology is longitudinally extended.
2. radiator as described in claim 1, which is characterized in that the radiator includes multiple second radiating fins, described
The side opposite with the mounting surface in the ontology is arranged in multiple second radiating fins.
3. radiator as claimed in claim 2, which is characterized in that extending perpendicularly to for second radiating fin is described
The extending direction of first radiating fin.
4. radiator as described in claim 1, which is characterized in that the radiator includes mounting portion, the mounting portion and institute
The opposite both sides that radiating part is separately positioned on the ontology are stated, the mounting surface connects the mounting portion and the radiating part.
5. radiator as described in claim 1, which is characterized in that the substrate and the mounting surface are formed with for housing
State the accommodating space of electronic component.
6. radiator as described in claim 1, which is characterized in that first radiating fin includes and adjacent described first
The opposite heat-delivery surface of radiating fin, the heat-delivery surface are on-plane surface.
7. a kind of for electric installation, which is characterized in that described including circuit board and claim 1-6 any one of them radiators
Radiator is arranged in the circuit board.
8. as claimed in claim 7 for electric installation, which is characterized in that it is described for electric installation include be mounted on the mounting surface
First electronic component and the second electronic component；With
The electronic element assembly and transformer being located on the circuit board, between the electronic element assembly is opposite with the mounting surface
Every setting to form the first air duct, at least one of first electronic component and second electronic component are located at described the
One air duct, the electronic element assembly is between the transformer and the mounting surface.
9. as claimed in claim 8 for electric installation, which is characterized in that the electronic element assembly includes according to first air duct
The third electronic component and the 4th electronic component of airflow direction arrangement, the third electronic component and the first electronic component phase
To interval, the 4th electronic component and the second electronic component relative spacing.
10. as claimed in claim 9 for electric installation, which is characterized in that the third electronic component and the 4th electronics member
Part is in strip, and the length direction of the third electronic component is tilted relative to the mounting surface, the 4th electronic component
Length direction be parallel to the mounting surface.
11. as claimed in claim 7 for electric installation, which is characterized in that the substrate is at least partially situated at the electronics member
There is the part overlapped in the top of part component, the orthographic projection of the electronic element assembly and the substrate on the circuit board.
12. as claimed in claim 8 for electric installation, which is characterized in that the transformer includes primary side and primary side, described
Primary side and the primary side are respectively formed the second air duct and third air duct with the circuit board, and second air duct is located at described
Between first air duct and the third air duct.
13. a kind of microwave cooking electric appliance, which is characterized in that including claim 7-12 any one of them for electric installation；With
With the microwave generator being connect for electric installation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810388064.1A CN108347869A (en) | 2018-04-26 | 2018-04-26 | Radiator, for electric installation and microwave cooking electric appliance |
| PCT/CN2018/117012 WO2019205610A1 (en) | 2018-04-26 | 2018-11-22 | Heat dissipation device, power supply device, and electric microwave cooking appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810388064.1A CN108347869A (en) | 2018-04-26 | 2018-04-26 | Radiator, for electric installation and microwave cooking electric appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108347869A true CN108347869A (en) | 2018-07-31 |
Family
ID=62956014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810388064.1A Pending CN108347869A (en) | 2018-04-26 | 2018-04-26 | Radiator, for electric installation and microwave cooking electric appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108347869A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019205610A1 (en) * | 2018-04-26 | 2019-10-31 | 广东美的厨房电器制造有限公司 | Heat dissipation device, power supply device, and electric microwave cooking appliance |
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