CN108335989B - Metal debris detection device and metal mask plate conveying device - Google Patents

Metal debris detection device and metal mask plate conveying device Download PDF

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Publication number
CN108335989B
CN108335989B CN201810083169.6A CN201810083169A CN108335989B CN 108335989 B CN108335989 B CN 108335989B CN 201810083169 A CN201810083169 A CN 201810083169A CN 108335989 B CN108335989 B CN 108335989B
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metal
leads
mask plate
signal controller
metal mask
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CN108335989A (en
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王磊
刘文祺
孙中元
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to a metal debris detection device and a metal mask plate conveying device. Wherein, the metal debris detection device includes: the circuit board is used for detecting metal debris and comprises a substrate and a plurality of metal leads arranged on the substrate; the detection device further comprises a signal controller used for being connected with the metal lead and a connecting plug electrically connected with the signal controller, and the connecting plug is used for outputting a feedback signal of the signal controller. According to the embodiment provided by the invention, the metal debris detection device is formed by arranging the metal lead on the substrate and combining the signal controller and the connecting plug. The metal debris detection device detects metal debris by utilizing the conductivity of the metal debris, and the detection process is simple and easy to implement.

Description

Metal debris detection device and metal mask plate conveying device
Technical Field
The present invention relates to semiconductor manufacturing technologies, and particularly to a metal debris detection device and a metal mask plate transfer device.
Background
Organic Light-Emitting diodes (OLEDs) have advantages of self-luminescence, fast response time, wide viewing angle, low cost, simple manufacturing process, good resolution, high brightness, and the like, and have gradually become the mainstream of the display field. Vacuum evaporation is a very important and critical technique in the fabrication of OLED devices. The vacuum evaporation process generally uses a metal mask as a mold to pattern a substrate in the OLED device. Generally, the metal mask needs to be transported into the vacuum evaporation chamber before vacuum evaporation, and the metal mask needs to be transported into the storage chamber of the metal mask after vacuum evaporation. However, after vacuum evaporation, a metal film such as Mg, Ag, Al, etc. is usually deposited on a metal evaporation mask, and the thickness of the metal film cannot be measured, and when the thickness of the metal film reaches a certain level, the metal film may fall off, resulting in generation of a large amount of metal particle contaminants.
Disclosure of Invention
The invention provides a metal debris detection device and a metal mask plate conveying device, which aim to solve the defects in the related technology.
According to a first aspect of embodiments of the present invention, there is provided a metal debris detecting apparatus including: the circuit board is used for detecting metal debris and comprises a substrate and a plurality of metal leads arranged on the substrate; the detection device further comprises a signal controller used for being connected with the metal lead and a connecting plug electrically connected with the signal controller, and the connecting plug is used for outputting a feedback signal of the signal controller.
In one embodiment, the circuit board is a flexible circuit board and the substrate is a flexible substrate.
In one embodiment, the metal leads include a first set of leads and a second set of leads, and the signal controller includes a first signal controller and a second signal controller.
In one embodiment, the first set of leads inputs a forward voltage and the second set of leads inputs a reverse voltage; or the first group of leads inputs reverse voltage and the second group of leads inputs forward voltage.
In one embodiment, the metal leads comprise a third set of leads, and the signal controller comprises a third signal controller; or
The third set of leads inputs an alternating voltage.
In one embodiment, adjacent ones of the leads input voltages in different directions.
In one embodiment, the spacing between the number of metal leads ranges from 2um to 10 um; or the like, or, alternatively,
the width of each lead is in the range of 2-3 um.
According to a second aspect of the embodiments of the present invention, there is provided a metal mask plate conveying device, configured to convey a metal mask plate having a metal mask plate frame and a metal mask plate pattern region, including a mask plate bracket and a groove disposed on the mask plate bracket, where the mask plate bracket is configured to support the metal mask plate frame;
the metal mask plate conveying device further comprises the metal debris detection device, and the metal debris detection device is arranged in the groove.
In one embodiment, the circuit board is disposed at the bottom of the groove; the signal controller is arranged at the end part of the groove.
In one embodiment, the metal mask layout region has a gap with a metal debris detection device disposed in the recess.
In one embodiment, the metal mask plate conveying device further comprises a mechanical arm and a lifting base, and the mechanical arm is respectively connected with the mask plate bracket and the lifting base.
According to the above embodiments, the metal debris detecting device is configured by disposing the metal lead on the substrate, and combining the signal controller and the connection plug. The metal debris detection device detects metal debris by utilizing the conductivity of the metal debris, and the detection process is simple and easy to implement.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of a metal debris detecting device 100 according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another metal debris detecting device 200 according to an embodiment of the present invention;
fig. 3A is a plan view of a conventional metal mask plate conveying device;
FIG. 3B is a side view of the metal mask plate carrying device shown in FIG. 3A;
fig. 4A is a plan view of the metal mask plate conveying device provided with the metal mask plate;
FIG. 4B is a side view of the reticle carrying device shown in FIG. 4A;
fig. 5A is a top view of a metal mask conveying apparatus according to an embodiment of the present invention;
fig. 5B is a side view of the reticle carrying device shown in fig. 5A.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
Fig. 1 is a schematic structural diagram of a metal debris detecting apparatus 100 according to an embodiment of the present invention. The metal debris detecting apparatus 100 can be applied to detecting metal debris released from a metal device or a device (such as a metal mask) having a metal film attached to a surface thereof.
The metal debris detecting apparatus 100 includes a circuit board for detecting metal debris. The circuit board includes a substrate 8 and a plurality of metal leads 9 disposed on the substrate. The detection device 100 further comprises a signal controller 10 for connecting the metal lead 9 and a connection plug electrically connected with the signal controller 10. The connection plug may be used to output a feedback signal of the signal controller 10.
In addition, the plug may be used to input a voltage to the signal controller 10 to input a voltage to the metal lead 9. In this manner, the plug may be connected to a power source that provides a voltage.
In some embodiments, the substrate 8 is a flexible substrate, such as a substrate made of a flexible material, such as Polyimide (PI), Polyethylene terephthalate (PET), and the like. Correspondingly, the circuit board formed by the flexible substrate is a flexible circuit board. Of course, in other embodiments, the substrate 8 may not be a flexible substrate, and accordingly, the circuit board is not a flexible circuit board. This is not a particular limitation of the present application.
The metal lead may be made of a conductive material such as Molybdenum (Mo), Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or the like. Of course, the metal leads may also be composed of other conductive materials. This is not a particular limitation of the present application. The number of the metal leads 9 is at least two.
The metal leads 9 include a first group of leads 91 and a second group of leads 92, and the signal controller 10 includes a first signal controller 101 and a second signal controller 102. Accordingly, the connection plug includes a connection plug 111 electrically connected to the signal controller 101, and a connection plug 112 electrically connected to the signal controller 102. The first signal controller 101 and the second signal controller 102 may be respectively disposed at two opposite ends of the substrate 8, or may be disposed at other positions. The position and the setting mode of the signal controller 103 may be set according to a specific application environment, which is not limited in this application. In addition, the installation positions and the installation manners of the connection plugs 111 and 112 may also be set according to a specific application environment, which is not limited in this application.
Wherein the first set of leads 91 includes leads A1, A2 … An, and the second set of leads 92 includes leads B1, B2 … Bm. The leads A1, A2 … An are commonly connected to the first signal controller 101, and the leads B1, B2 … Bm are commonly connected to the second signal controller 102. The number of the first set of leads 91 and the second set of leads 92 can be set according to the specific application environment. For example, the number of the first group of leads 91 and the second group of metal leads 92 may be set according to the area size of the metal mask pattern 7, which is not limited in the present application. The number of the first group lead wire 91 and the second group lead wire 92 may be the same or different, that is, n and m may be the same or different. The leads A1, A2 … An and the leads B1, B2 … Bm are arranged at intervals. For example, in some embodiments, the leads a1, a2 … An and the leads B1, B2 … Bm are spaced one by one. Of course, in other embodiments, the leads a1, a2 … An and the leads B1, B2 … Bm may not be spaced one by one. This is not a particular limitation of the present application. In addition, the metal wires a1, a2 … An and the wires B1, B2 … Bm may be uniformly or non-uniformly disposed on the substrate 8. This is not a particular limitation of the present application.
In the metal debris detecting apparatus 100, a certain distance is provided between the leads a1 and a2 … An and two adjacent leads of the leads B1 and B2 … Bm, for example, the distance between the leads a1 and a2 … An and two adjacent leads of the leads B1 and B2 … Bm is in a range of 2um to 10 um. The distance between two adjacent leads may be set according to an application environment, which is not specifically limited in this application. In addition, the width range of each of the leads a1, a2 … An and the leads B1, B2 … Bm may be set according to the application environment, and optionally, the width of a single lead is set to 2um-3um, which is not specifically limited in this application. Therefore, the metal debris detection device can detect metal debris with the width of only a few micrometers, and the detection precision of the metal debris detection device is high.
When the metal debris detecting device 100 is in operation, a voltage is input to the first group lead 91 (leads a1, a2 … An) through the signal controller 101, and a voltage is input to the second group lead 92 (leads B1, B2 … Bm) through the signal controller 102. In some embodiments, a forward voltage is input to the leads a1, a2 … An, and a reverse voltage is input to the leads B1, B2 … Bm. In other embodiments, a reverse voltage is input to leads a1, a2 … An, and a forward voltage is input to leads B1, B2 … Bm. This is not a particular limitation of the present application. When metal debris falls to the area of the circuit board where the leads a1 and a2 … An and the leads B1 and B2 … Bm are located, the metal debris connects adjacent leads located at the falling position, such as the lead a2 and the lead B2, so that the lead a2 and the lead B2 are conducted, current is generated in the lead a2 and the lead B2, and the signal controller 101 and the signal controller 102 detect the current. In this manner, at least one of the signal controllers 101 and 102 outputs a feedback signal conducted through the corresponding connector plug output lead A2 and lead B2. The feedback signal may be the current of the lead a2 and the lead B2, or a signal generated by at least one of the signal controller 101 and the signal controller 102 according to the current to indicate that the lead a2 and the lead B2 are conductive.
It should be noted that, with respect to the related description of the metal detection apparatus 100 in operation, only the case where the metal debris conducts the adjacent two leads is exemplarily described. Of course, the metal debris may be conducted through two or more leads, or conducted through a plurality of leads that are not adjacent to each other, and the same is true for the metal detection apparatus 100. And this applies to each of the embodiments described below unless otherwise specified.
Further, the metal debris detecting device further includes a warning device (not shown), such as an alarm, connected to at least one of the connection plug 111 and the connection plug 112. The reminding device can be disposed on the connection plug 111, and certainly can be disposed in other positions. The connection plug 111 can output a feedback signal of the signal controller 103 to the reminding device. After receiving the feedback signal (such as the feedback signals of the lead A2 and the lead B2), the reminding device triggers a reminding action (such as an alarm) to remind related personnel of cleaning metal debris in time, so that pollution caused by the metal debris is reduced.
The beneficial effect of this embodiment is: the metal debris detection device is formed by arranging metal leads on the substrate, and combining a signal controller and a connecting plug. The metal debris detection device detects metal debris by utilizing the conductivity of the metal debris, and the detection process is simple and easy to implement. Compared with other detection devices (such as an optical debris detection device), the metal debris detection device provided by the embodiment of the application has lower cost. In addition, through the arrangement of the connecting plug, the metal debris detection device is easy to replace and clean.
Fig. 2 is a schematic structural diagram of another metal debris detecting apparatus 200 according to an embodiment of the present invention. The metal debris detecting apparatus 200 can also be applied to detecting metal debris released from a metal device or a device having a metal film attached to a surface thereof (e.g., a metal mask).
The metal debris detecting device 200 also includes a circuit board for detecting metal debris. The circuit board includes a substrate 8 and a plurality of metal leads 9 disposed on the substrate. The detection device 100 further comprises a signal controller 10 for connecting the metal lead 9 and a connection plug electrically connected with the signal controller 10. The connection plug is used for outputting a feedback signal of the signal controller 10.
In addition, the plug may be used to input a voltage to the signal controller 10 to input a voltage to the metal lead 9.
Unlike the metal debris detecting device 100 shown in fig. 1 described above, the metal leads 9 include a third set of leads 93. The third set of leads 93 comprises leads C1, C2 … Ck, and correspondingly the signal controller 10 comprises a third signal controller 103 connected to leads C1, C2 … Ck. In addition, the connection plug is specifically a connection plug 113 connected to the third signal controller 103. Wherein the signal controller 103 may be disposed at any one end of the base 8. The position and the setting mode of the signal controller 103 may be set according to a specific application environment, which is not limited in this application. In addition, the installation position and the installation mode of the connection plug 113 may also be set according to a specific application environment, which is not limited in this application.
When the metal debris detecting device 200 is in operation, an alternating voltage is input to the third group of leads 93, i.e., the leads C1 and C2 … Ck, through the third controller 103. In one embodiment, adjacent ones of the leads C1, C2 … Ck input voltages in different directions. When metal debris falls onto the circuit board and is connected to an adjacent lead, for example, the lead C1 and the lead C2 are simultaneously contacted, so that the lead C1 and the lead C2 are conducted to generate a current in the lead C1 and the lead C2, and thus, the signal controller 103 can detect the current. Further, the corresponding feedback signals indicating that the lead C1 and the lead C2 are conducted can be outputted through the connection plug 113 by the operation principle similar to the signal controller 101 or the signal controller 102 described above.
Other structures or operation principles that are the same as or similar to those of the metal debris detecting device 100 can be referred to the above description of the metal debris detecting device 100, and are not repeated herein.
The beneficial effect of this embodiment is: the metal debris detection device is formed by arranging metal leads on the substrate, and combining a signal controller and a connecting plug. The metal debris detection device detects metal debris by utilizing the conductivity of the metal debris, and the detection process is simple and easy to implement. Compared with other detection devices (such as an optical debris detection device), the metal debris detection device provided by the embodiment of the application has lower cost. Through the arrangement of the connecting plug, the metal debris detection device is easy to replace and clean. In addition, compared to the metal debris detecting device 100, the metal detecting device 200 shown in fig. 2 reduces the amount of a signal control device and a connection plug, which is beneficial to saving the cost of the metal debris detecting device.
In addition, the present invention further provides a metal mask plate conveying device (refer to fig. 3A to 5B), which can be used for conveying metal mask plates. The metal mask plate conveying device comprises the metal debris detecting device (comprising the metal debris detecting device 100 or the metal debris detecting device 200) in each embodiment. The metal mask plate conveying device further comprises a mask plate bracket 4 and a groove 5 arranged on the mask plate bracket 4.
The metal mask generally comprises a metal mask frame 6 and a metal mask pattern area 7 arranged on the metal mask frame 6. Correspondingly, the mask bracket 4 is used for supporting a metal mask frame 6, and the metal debris detection device is arranged in the groove 5.
In specific implementation, the circuit board of the metal debris detection device is arranged at the bottom of the groove 5. The signal controller 10 is disposed at an end of the groove 5.
And a gap is reserved between the metal mask pattern region 7 and the metal debris detection device arranged in the groove 5.
The metal mask plate conveying device further comprises a mechanical arm 2 and a lifting base 1, wherein the mechanical arm 2 is connected with the mask plate bracket 4 and the lifting base 1 respectively. The mechanical arm 2 is connected with the lifting base 1 through a rotating shaft 3. The robot arm 2 performs a telescopic operation by rotation of the rotation shaft 3 to realize displacement change of the reticle holder 4 in the horizontal direction. The lifting base 1 is lifted to realize the change of the displacement of the mask plate bracket 4 in the vertical direction. Therefore, the metal mask plate conveying device conveys the metal mask plate to a vacuum evaporation cavity or a storage cavity of the metal mask plate.
In an embodiment, the metal mask plate conveying device further includes a driving device (not shown) for driving the lifting of the metal mask plate conveying device upgrading base 1 and the rotation of the rotating shaft 3. Of course, the metal mask plate conveying device may further include a control unit (not shown), such as a controller, for controlling the driving device. The control assembly drives the lifting of the metal mask plate conveying device upgrading base 1 and the rotation of the rotating shaft 3 by controlling the driving device.
In addition, the reminding device may be disposed on the metal mask plate conveying device, for example, on the mask plate bracket 4. In addition, the reminding device can be arranged at other positions, and the arrangement position and the arrangement mode of the reminding device are not particularly limited.
Because metal mask version not only can drop the metal piece at the in-process that carries, the metal mask version also can drop the metal piece in the vacuum evaporation chamber or the storage chamber of metal mask version to can pollute the storage chamber of vacuum evaporation chamber or metal mask version, reminding device triggers the warning, except can reminding relevant personnel in time clear up the metal piece on the metal mask version carrying device, for example the metal piece in the recess 5. And related personnel can be reminded to clean the storage cavity of the vacuum evaporation cavity or the metal mask plate in time.
The beneficial effect of this embodiment is: by arranging the metal debris detection device (comprising the metal debris detection devices 100 and 200) on the metal mask plate conveying device, the metal mask plate conveying device can realize the detection of metal debris while conveying the metal mask plate. The metal scraps are cleaned in time, so that pollution caused by the metal scraps is reduced, and the service life of metal mask plate conveying equipment and the service life of the evaporation cavity are prolonged. In addition, carrying the metal mask version and realizing the detection to the metal piece simultaneously, need not detect to the metal mask version alone, be favorable to using manpower sparingly cost and operating time to bring better operation experience for relevant operating personnel.
In the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The terms "plurality," "plurality," and "a number" refer to two or more unless expressly limited otherwise.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (9)

1. A metal mask plate conveying device is used for conveying a metal mask plate with a metal mask plate frame (6) and a metal mask plate pattern area (7), and comprises the following components: the metal mask frame structure comprises a mask plate bracket (4) and a groove (5) arranged in the mask plate bracket (4), wherein the mask plate bracket (4) is used for supporting a metal mask plate frame (6), and the metal mask frame structure is characterized by further comprising a metal debris detection device, the metal debris detection device is arranged in the groove (5), and a gap is formed between a metal mask plate graphic area (7) and the metal debris detection device arranged in the groove (5);
the metal debris detecting device includes: the circuit board is used for detecting metal scraps fallen off by the metal mask plate and comprises a substrate (8) and a plurality of metal leads (9) arranged on the substrate (8); the detection device further comprises a signal controller (10) used for being connected with the metal lead (9) and a connecting plug electrically connected with the signal controller (10), wherein the connecting plug is used for outputting a feedback signal of the signal controller (10) and inputting voltage to the signal controller (10) so as to input voltage to the metal lead (9).
2. The metal mask plate conveying device according to claim 1, wherein the circuit board is a flexible circuit board, and the substrate (8) is a flexible substrate.
3. The metal reticle carrying device according to claim 1, wherein the metal leads (9) include a first group of leads (91) and a second group of leads (92), and the signal controller (10) includes a first signal controller (101) and a second signal controller (102).
4. The metal mask conveying device according to claim 3, wherein a forward voltage is input to the first group of leads (91), and a reverse voltage is input to the second group of leads (92); or a reverse voltage is input to the first group lead (91) and a forward voltage is input to the second group lead (92).
5. The metal reticle carrying device according to claim 1, wherein the metal leads (9) comprise a third set of leads (93), and the signal controller (10) comprises a third signal controller (103); the third group of leads (93) inputs an alternating voltage.
6. The metal reticle carrying device according to claim 5, wherein adjacent leads of the third group of leads (93) are supplied with voltages in different directions.
7. The metal mask plate conveying device according to claim 1, wherein the interval between the plurality of metal leads is in a range of 2um to 10 um; or each lead has a width in the range of 2-3 um.
8. The metal mask plate conveying device according to any one of claims 1 to 7, wherein the circuit board is arranged at the bottom of the groove (5); the signal controller (10) is arranged at the end part of the groove (5).
9. The metal mask conveying device according to any one of claims 1 to 7, further comprising a robot arm (2) and a lifting base (1), wherein the robot arm (2) is connected with the mask bracket (4) and the lifting base (1), respectively.
CN201810083169.6A 2018-01-29 2018-01-29 Metal debris detection device and metal mask plate conveying device Active CN108335989B (en)

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CN114932460A (en) * 2022-06-15 2022-08-23 台州亿尔丰精密机械制造有限公司 Milling cutter grinding machine

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JPH02167466A (en) * 1988-12-21 1990-06-27 Toshiba Corp Metallic foreign matter detecting device for gas insulation equipment
CN202369121U (en) * 2011-12-06 2012-08-08 上海华虹Nec电子有限公司 Automatic conveying device for mask plate
CN103779252B (en) * 2014-01-23 2016-05-04 江苏艾特曼电子科技有限公司 A kind of online detection architecture for wafer level bonding particle contamination

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