CN108329632A - A kind of high heat conduction plastics and preparation method for LED light encapsulating material - Google Patents
A kind of high heat conduction plastics and preparation method for LED light encapsulating material Download PDFInfo
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- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
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- C08L33/04—Homopolymers or copolymers of esters
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Abstract
The invention discloses a kind of high heat conduction plastics and preparation method for LED light encapsulating material.The high heat conduction plastics are made by following steps：A, porous glass beads are infiltrated in dispersion liquid made from silicon nitride, composite particles are made in Fast Sintering；B, layer of ZnO base electrically conducting transparent surface layer is plated on the surface of composite particles；C, it is placed in extra electric field and the high heat conduction filler being orientated is made；D, the high heat conduction filler of orientation is poured into a mould, dry, curing molding is to get the high heat conduction plastics for LED light encapsulating material.The method has the advantages that：By generating transparent cubic silicon nitride ceramic coatings in orientation particle porous glass beads internal in-situ, composite particles good dispersion, encapsulating material heat dissipation performance obtained is fabulous, and has good translucency and mechanical strength, is very excellent LED light encapsulating material.
Description
Technical field
The present invention relates to LED light encapsulating material fields, and in particular to the preparation of high heat conduction plastics, more particularly, to a kind of use
In the high heat conduction plastics and preparation method of LED light encapsulating material.
Background technology
In recent years, LED light is increasingly paid close attention to by people.After the power-up, about 30% electric energy is converted into LED light source at present
Luminous energy, remaining is converted to thermal energy, therefore the maximum technical barrier of LED illumination lamp is exactly heat dissipation problem, and heat dissipation is unsmooth to be caused
LED drive power, electrolytic capacitor performance are bad and the service life is shorter, become the short slab that LED illumination lamp further develops.Therefore
Heat dissipation is the key technology of LED lamp structure design, and thermal energy needs just distribute by heat transfer, thermal convection current, heat radiation, is chosen
Heat sink material appropriate is extremely crucial.
Current traditional lamp outer casing heat sink material includes mainly following three kinds：Metal material, ceramics and general plastics.Closely
The development of heat-conducting plastic is noticeable over year：Relative to metal material, heat-conducting plastic has uniform, the light-weight and safety that radiates
The features such as coefficient is high, shape-designing is flexible；Relative to ceramics, heat-conducting plastic is firm, processing and forming is convenient, shape-designing degree of freedom
Higher；Relative to general plastics, the coefficient of expansion of heat-conducting plastic is higher.It is that heat conduction is micro- to prepare the method for high heat conduction plastics at present
Grain is filled into polymeric matrix, and the quality of performance depends primarily on the dispersibility of heat filling, while light transmission
It is a very important index, is directly related to the illumination performance of LED.
It is filling-modified with magnesia crystal whisker-nm-class boron nitride that number of patent application 201510589394.3 discloses a kind of LED
PPS/PBT composite heat-conducting plastics and preparation method thereof, which is used in mixed way PPS plastics with PBT plastic, composite plastic
Material has effects that good mechanical property and heat-resistant anticorrosive are lost, and oxidized magnesium whisker and nm-class boron nitride carry out heat conduction modification
Filler is uniformly dispersed in fibrous material prepared by PBT, PPS composite material afterwards, and both composite short fibers are kneaded in the later stage
What dispersion combined in the process is more uniformly distributed, and can form uniform and stable heat and transmit network, can significantly improve traditional mode of production side
The phenomenon that plastics conduction inequality that method is brought, heat filling utilization rate is improved, test result shows this composite heat-conducting plastics tool
There is an excellent thermal conductivity, flame-retarding, fast light radiation aging can be extensive for a long time using remaining to keep good performance
Be applied to LED cooling field.
Number of patent application 201611157419.3 discloses a kind of low-cost environmental-protecting heat-conducting plastic and preparation method thereof.This is low
Cost environmental protection heat-conducting plastic, using with certain flame retarding function polarity inorganic and other heat fillings mix, both improved
Plastics overall flame performance, no noxious material generates, while decreasing expensive heat filling dosage, reduces into
This, and do not affect the mechanical properties.A kind of preparation method for low-cost environmental-protecting heat-conducting plastic that the invention is related to simultaneously is simple, operation
Convenient, production cost is low, and properties of product are stablized, and disclosure satisfy that LED light requirement, are suitble to promote the use of.
Number of patent application 201510589067.8 discloses a kind of LED nano-silicons-four acicular type zinc oxide crystal whisker filling and changes
The PA6/ABS composite heat-conducting plastics and preparation method thereof of property, which is used in mixed way PA6 and ABS, and composite plastic is can
Plasticity, durability, performance is excellent in terms of electric insulating quality, and through nano-silicon, four acicular type zinc oxide crystal whisker, filling-modified treated
The composite short fiber of high heat conduction has been made using the technique of melt spinning for plastics, and heat filling dispersion is equal in these composite fibres
Even, what dispersion combined in later stage mixing process is more uniformly distributed, and can form uniform and stable heat conduction network, can significantly change
The phenomenon that plastics conduction inequality that kind conventional production methods are brought, improves heat filling utilization rate, and test result shows this multiple
Closing heat-conducting plastic has excellent heat-conducting effect, and extremely tough durable, excellent spring is weather-proof antifouling, can be widely used in LED
Field of radiating.
Number of patent application 201610971802.6 discloses a kind of doped-glass fiber, the LED encapsulation with fluorescent functional
Material and preparation method thereof, which is characterized in that be made of the raw material of following parts by weight：Glass fibre 2 ~ 4, vinyl silicone oil 30
~ 40, mica powder 1 ~ 2, vinyl MQ resin 8 ~ 12, dimethylbenzene 10 ~ 20, citric acid 4 ~ 8, ethylenediamine 3 ~ 6, polyvinyl alcohol 1 ~ 2,
Deionized water 5 ~ 10, silicon powder 5 ~ 10, Silane coupling agent KH550 6 ~ 11, containing hydrogen silicone oil crosslinking agent 25 ~ 35, chloroplatinic acid isopropanol
2~3.The invention impregnates silicon powder using with carbon dots fluorescent material, and is introduced into encapsulation silica gel material, gained silicon
Glue material has fluorescent functional, and crack resistence function admirable；Glass fibre, mica powder etc. are added by cooperation, is significantly improved
The heat-resisting quantity of material, insulating properties.
It can be seen that heat filling dispersibility in resin is poor in HEAT-CONDUCTING PLASTICS FILLED WTTH PARTICLES in the prior art, heat conduction is filled out
When expecting that dosage is smaller, to the promotion limited extent of heat conductivility, with the raising of amount of filler, dispersion problem causes material to be led
Hot property is unstable, and affects the mechanical properties, in addition, existing heat-conducting plastic translucency is poor, and adds glass granules
The heat dissipation performance of high light transmission heat-conducting plastic is poor, and service life is short, and traditional LED encapsulation material can not have both thermal diffusivity and light transmission
Property.
Invention content
Effectively to solve above-mentioned technical problem, the present invention proposes a kind of high heat conduction plastics for LED light encapsulating material
And preparation method, effectively it can ensure the good translucency of material, thermal diffusivity and mechanical property simultaneously.
The specific technical solution of the present invention is as follows：
A kind of high heat conduction plastics and preparation method for LED light encapsulating material, the high heat conduction plastics are by transparent cube of nitrogen
The composite particles of SiClx ceramic coatings porous glass beads, through magnetron sputtering last layer zno-based electrically conducting transparent surface layer and electric field
Be orientated and high heat conduction filler be made, then pour into a mould polybenzazole precursor liquid, curing molding and be made, specific preparation process is：
A, transparent cubic silicon nitride powder, dispersant, water are stirred, dispersion liquid is made, then by heat safe porous
Glass microballon is infiltrated in dispersion liquid, then carries out Fast Sintering, and transparent cubic silicon nitride ceramic coatings porous glass beads are made
Composite particles；
B, using zno-based transparent material as target, by magnetron sputtering technique, the surface of composite particles made from step a plates
Layer of ZnO base electrically conducting transparent surface layer；
C, material made from step b is placed in extra electric field and is orientated, compound glass particle is made to be arranged along direction of an electric field chain
Array is arranged into, the high heat conduction filler being orientated is made；
D, the high heat conduction filler being orientated made from step c is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
Preferably, the grain size of the transparent cubic silicon nitride powder is 0.5 ~ 1 μm.
Preferably, the dispersant be ethylene group bis-stearamides, oleic acid acyl, polyethylene glycol, in polyethylene wax at least
It is a kind of.
Preferably, the grain size of the heat safe porous glass beads is 5 ~ 20 μm, and porosity is 50 ~ 60%, heat resisting temperature
It is 1200 ~ 1500 DEG C.
Preferably, in the step a, 3 ~ 5 parts by weight of cubic silicon nitride powder, 0.5 ~ 1 parts by weight of dispersant, water 64 ~
76.5 parts by weight, 20 ~ 30 parts by weight of porous glass beads.
Preferably, the vacuum degree of magnetron sputtering described in step b is 2 ~ 10Pa, and negative direct current high voltage is 2 ~ 3kV.
Preferably, the thickness on zno-based electrically conducting transparent surface layer is 200 ~ 400nm.
Preferably, the voltage of extra electric field described in step c is 110 ~ 130V, and the distance of positive/negative plate is 10 ~ 15cm, effect
Time is 5 ~ 7s.
Preferably, the polybenzazole precursor liquid is polymethyl methacrylate precursor liquid, polystyrene precursor liquid, poly- carbonic acid
One kind in ester precursor liquid, acrylonitrile-butadiene-styrene (ABS) precursor liquid.
Preferably, in the step d, 20 ~ 30 parts by weight of high heat conduction filler, 70 ~ 80 weight of polybenzazole precursor liquid of orientation
Part.
The above of the present invention also proposes a kind of high heat conduction plastics for LED light encapsulating material, first by cubic silicon nitride
Powder is configured to uniform dispersion, then wherein by the infiltration of heat safe porous glass beads, further by Fast Sintering system
At the composite particles of transparent cubic silicon nitride ceramic coatings porous glass beads, recycle magnetron sputtering last layer zno-based saturating
Bright electrically conductive layer, is subsequently placed in extra electric field and is orientated, and compound glass particle is made to be arranged into array along direction of an electric field chain, cast
After polybenzazole precursor liquid high heat conduction plastics are obtained through drying, curing molding.By being orientated original inside particle porous glass beads
Position generates transparent cubic silicon nitride ceramic coatings, and encapsulating material heat dissipation performance prepared by more conventional glass micro mist is more excellent, and
It is provided simultaneously with good translucency and mechanical strength, is highly suitable for the encapsulating material of LED light.
Beneficial effects of the present invention are：
1. proposing a kind of high heat conduction plastics for LED light encapsulating material.
2. proposing a kind of preparation method of the high heat conduction plastics for LED light encapsulating material.
3. the present invention in orientation particle porous glass beads internal in-situ by generating transparent cubic silicon nitride ceramics packet
It covers, encapsulating material heat dissipation performance obtained is fabulous.
4. being disperseed by being added to more empty glass microballoons and electric fields uniform in the present invention, encapsulating material obtained has
Good translucency, heat resistance and mechanical strength are very excellent LED light encapsulating materials.
Specific implementation mode
In the following, the present invention will be further described in detail by way of specific embodiments, but this should not be interpreted as to the present invention
Range be only limitted to example below.Without departing from the idea of the above method of the present invention, according to ordinary skill
The various replacements or change that knowledge and customary means are made, should be included in the scope of the present invention.
Embodiment 1
A, transparent cubic silicon nitride powder, dispersant, water are stirred, dispersion liquid is made, then by heat safe porous
Glass microballon is infiltrated in dispersion liquid, then carries out Fast Sintering, and transparent cubic silicon nitride ceramic coatings porous glass beads are made
Composite particles；
B, using zno-based transparent material as target, by magnetron sputtering technique, the surface of composite particles made from step a plates
Layer of ZnO base electrically conducting transparent surface layer；
C, material made from step b is placed in extra electric field and is orientated, the high heat conduction filler being orientated is made；
D, the high heat conduction filler being orientated made from step c is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
Dispersant is ethylene group bis-stearamides；The average grain diameter of heat safe porous glass beads is 12 μm, porosity
It is 55%；Polybenzazole precursor liquid is polymethyl methacrylate precursor liquid；
Each group is divided into step a：4 parts by weight of cubic silicon nitride powder, 0.8 parts by weight of dispersant, 70.2 parts by weight of water, porous
25 parts by weight of glass microballon；Each group is divided into step d：25 parts by weight of high heat conduction filler, 75 parts by weight of polybenzazole precursor liquid of orientation；
The vacuum degree of magnetron sputtering is 6Pa, negative direct current high voltage 2kV；The average thickness on zno-based electrically conducting transparent surface layer is 300nm；
The voltage of extra electric field is 120V, and the distance of positive/negative plate is 13cm, action time 6s.
Embodiment 2
A, transparent cubic silicon nitride powder, dispersant, water are stirred, dispersion liquid is made, then by heat safe porous
Glass microballon is infiltrated in dispersion liquid, then carries out Fast Sintering, and transparent cubic silicon nitride ceramic coatings porous glass beads are made
Composite particles；
B, using zno-based transparent material as target, by magnetron sputtering technique, the surface of composite particles made from step a plates
Layer of ZnO base electrically conducting transparent surface layer；
C, material made from step b is placed in extra electric field and is orientated, the high heat conduction filler being orientated is made；
D, the high heat conduction filler being orientated made from step c is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
Dispersant is oleic acid acyl；The average grain diameter of heat safe porous glass beads is 5 μm, porosity 50%；Polymer
Precursor liquid is polystyrene precursor liquid；
Each group is divided into step a：3 parts by weight of cubic silicon nitride powder, 0.5 parts by weight of dispersant, 76.5 parts by weight of water, porous
20 parts by weight of glass microballon；Each group is divided into step d：20 parts by weight of high heat conduction filler, 80 parts by weight of polybenzazole precursor liquid of orientation；
The vacuum degree of magnetron sputtering is 2Pa, negative direct current high voltage 2kV；The average thickness on zno-based electrically conducting transparent surface layer is 200nm；
The voltage of extra electric field is 110V, and the distance of positive/negative plate is 10cm, action time 7s.
Embodiment 3
A, transparent cubic silicon nitride powder, dispersant, water are stirred, dispersion liquid is made, then by heat safe porous
Glass microballon is infiltrated in dispersion liquid, then carries out Fast Sintering, and transparent cubic silicon nitride ceramic coatings porous glass beads are made
Composite particles；
B, using zno-based transparent material as target, by magnetron sputtering technique, the surface of composite particles made from step a plates
Layer of ZnO base electrically conducting transparent surface layer；
C, material made from step b is placed in extra electric field and is orientated, the high heat conduction filler being orientated is made；
D, the high heat conduction filler being orientated made from step c is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
Dispersant is polyethylene glycol；The average grain diameter of heat safe porous glass beads is 20 μm, porosity 60%；It is poly-
Conjunction object precursor liquid is makrolon precursor liquid；
Each group is divided into step a：5 parts by weight of cubic silicon nitride powder, 1 parts by weight of dispersant, 64 parts by weight of water, cellular glass are micro-
30 parts by weight of pearl；Each group is divided into step d：30 parts by weight of high heat conduction filler, 70 parts by weight of polybenzazole precursor liquid of orientation；
The vacuum degree of magnetron sputtering is 10Pa, negative direct current high voltage 3kV；The average thickness on zno-based electrically conducting transparent surface layer is
400nm；The voltage of extra electric field is 130V, and the distance of positive/negative plate is 15cm, action time 5s.
Embodiment 4
A, transparent cubic silicon nitride powder, dispersant, water are stirred, dispersion liquid is made, then by heat safe porous
Glass microballon is infiltrated in dispersion liquid, then carries out Fast Sintering, and transparent cubic silicon nitride ceramic coatings porous glass beads are made
Composite particles；
B, using zno-based transparent material as target, by magnetron sputtering technique, the surface of composite particles made from step a plates
Layer of ZnO base electrically conducting transparent surface layer；
C, material made from step b is placed in extra electric field and is orientated, the high heat conduction filler being orientated is made；
D, the high heat conduction filler being orientated made from step c is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
Dispersant is polyethylene wax；The average grain diameter of heat safe porous glass beads is 8 μm, porosity 52%；Polymerization
Object precursor liquid is acrylonitrile-butadiene-styrene (ABS) precursor liquid；
Each group is divided into step a：3 parts by weight of cubic silicon nitride powder, 0.6 parts by weight of dispersant, 74.4 parts by weight of water, porous
22 parts by weight of glass microballon；Each group is divided into step d：22 parts by weight of high heat conduction filler, 78 parts by weight of polybenzazole precursor liquid of orientation；
The vacuum degree of magnetron sputtering is 5Pa, negative direct current high voltage 2kV；The average thickness on zno-based electrically conducting transparent surface layer is 250nm；
The voltage of extra electric field is 115V, and the distance of positive/negative plate is 12cm, action time 6s.
Embodiment 5
A, transparent cubic silicon nitride powder, dispersant, water are stirred, dispersion liquid is made, then by heat safe porous
Glass microballon is infiltrated in dispersion liquid, then carries out Fast Sintering, and transparent cubic silicon nitride ceramic coatings porous glass beads are made
Composite particles；
B, using zno-based transparent material as target, by magnetron sputtering technique, the surface of composite particles made from step a plates
Layer of ZnO base electrically conducting transparent surface layer；
C, material made from step b is placed in extra electric field and is orientated, the high heat conduction filler being orientated is made；
D, the high heat conduction filler being orientated made from step c is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
Dispersant is ethylene group bis-stearamides；The average grain diameter of heat safe porous glass beads is 15 μm, porosity
It is 58%；Polybenzazole precursor liquid is polymethyl methacrylate precursor liquid；
Each group is divided into step a：5 parts by weight of cubic silicon nitride powder, 1 parts by weight of dispersant, 68 parts by weight of water, cellular glass are micro-
26 parts by weight of pearl；Each group is divided into step d：26 parts by weight of high heat conduction filler, 74 parts by weight of polybenzazole precursor liquid of orientation；
The vacuum degree of magnetron sputtering is 8Pa, negative direct current high voltage 3kV；The average thickness on zno-based electrically conducting transparent surface layer is 350nm；
The voltage of extra electric field is 125V, and the distance of positive/negative plate is 14cm, action time 7s.
Comparative example 1
A, using zno-based transparent material as target, by magnetron sputtering technique, layer of ZnO is plated on the surface of porous glass beads
Base electrically conducting transparent surface layer；
B, material made from step a is placed in extra electric field and is orientated, the high heat conduction filler being orientated is made；
C, the high heat conduction filler being orientated made from step b is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
The average grain diameter of heat safe porous glass beads is 12 μm, porosity 55%；Polybenzazole precursor liquid is poly- methyl
Methyl acrylate precursor liquid；
Each group is divided into step d：25 parts by weight of high heat conduction filler, 75 parts by weight of polybenzazole precursor liquid of orientation；
The vacuum degree of magnetron sputtering is 6Pa, negative direct current high voltage 2kV；The average thickness on zno-based electrically conducting transparent surface layer is 300nm；
The voltage of extra electric field is 120V, and the distance of positive/negative plate is 13cm, action time 6s.
Highly heat-conductive material made from above-described embodiment 1 ~ 5 and comparative example 1, tests its thermal coefficient, light transmittance and shock resistance
Intensity, method or the condition for testing characterization are as follows：
Thermal coefficient：The thermal coefficient that heat-conducting plastic is directly measured using thermal conductivity measuring apparatus QTM, characterizes its heat dissipation performance.
Light transmittance：LS116 high-precision light transmittances instrument is used directly to measure thickness as the light transmittance of 0.02mm heat-conducting plastics, table
Levy its light transmission.
Impact strength：Heat-conducting plastic heat is painted with to the sample of long 120mm, width 15mm, thickness 10mm, is placed at 85 DEG C
After 16h, impact test is carried out using XCJ-50 type shock machines, impact strength is measured, characterizes its mechanical property.
The results are shown in Table 1.
Table 1：
| Test event | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative example 1 |
| Thermal coefficient（W/m·K） | 1.22 | 1.33 | 1.24 | 1.24 | 1.31 | 0.88 |
| Light transmittance（%） | 95.8 | 95.6 | 96.2 | 94.4 | 95.3 | 85.3 |
| Impact strength (J/m2) | 37.7 | 38.4 | 38.2 | 36.6 | 39.2 | 21.5 |
Claims (10)
1. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, it is characterised in that：The high heat conduction plastics are
By the composite particles of transparent cubic silicon nitride ceramic coatings porous glass beads, led through magnetron sputtering last layer zno-based is transparent
High heat conduction filler is made in ammeter layer and electric field orientation, then pours into a mould polybenzazole precursor liquid, curing molding and be made, specific prepare walks
Suddenly it is：
A, transparent cubic silicon nitride powder, dispersant, water are stirred, dispersion liquid is made, then by heat safe porous
Glass microballon is infiltrated in dispersion liquid, then carries out Fast Sintering, and transparent cubic silicon nitride ceramic coatings porous glass beads are made
Composite particles；
B, using zno-based transparent material as target, by magnetron sputtering technique, the surface of composite particles made from step a plates
Layer of ZnO base electrically conducting transparent surface layer；
C, material made from step b is placed in extra electric field and is orientated, compound glass particle is made to be arranged along direction of an electric field chain
Array is arranged into, the high heat conduction filler being orientated is made；
D, the high heat conduction filler being orientated made from step c is placed in mold, and pours into a mould polybenzazole precursor liquid, through drying and curing
Molding, is made the high heat conduction plastics for LED light encapsulating material.
2. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：The grain size of the transparent cubic silicon nitride powder is 0.5 ~ 1 μm.
3. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：The dispersant is at least one of ethylene group bis-stearamides, oleic acid acyl, polyethylene glycol, polyethylene wax.
4. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：The grain size of the heat safe porous glass beads is 5 ~ 20 μm, and porosity is 50 ~ 60%.
5. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：It is 3 ~ 5 parts by weight of cubic silicon nitride powder, 0.5 ~ 1 parts by weight of dispersant, 64 ~ 76.5 parts by weight of water, porous in the step a
20 ~ 30 parts by weight of glass microballoon.
6. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：The vacuum degree of magnetron sputtering described in step b is 2 ~ 10Pa, and negative direct current high voltage is 2 ~ 3kV.
7. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：The thickness on zno-based electrically conducting transparent surface layer is 200 ~ 400nm.
8. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：The voltage of extra electric field described in step c is 110 ~ 130V, and the distance of positive/negative plate is 10 ~ 15cm, and action time is 5 ~ 7s.
9. a kind of preparation method of high heat conduction plastics for LED light encapsulating material, feature exist according to claim 1
In：In step d, the polybenzazole precursor liquid is polymethyl methacrylate precursor liquid, before polystyrene precursor liquid, makrolon
Drive one kind in liquid, acrylonitrile-butadiene-styrene (ABS) precursor liquid；20 ~ 30 parts by weight of high heat conduction filler of the orientation, polymerization
70 ~ 80 parts by weight of object precursor liquid.
10. a kind of high heat conduction plastics for LED light encapsulating material that any one of claim 1-9 the methods are prepared.
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| CN115116723A (en) * | 2022-08-30 | 2022-09-27 | 合肥工业大学 | Transformer packaging method based on electric field driven infiltration |
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| CN115116723A (en) * | 2022-08-30 | 2022-09-27 | 合肥工业大学 | Transformer packaging method based on electric field driven infiltration |
| CN115116723B (en) * | 2022-08-30 | 2022-11-15 | 合肥工业大学 | Transformer packaging method based on electric field driven infiltration |
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Application publication date: 20180727 |