CN108326640A - The Ultrasonic Machining and device of glass substrate - Google Patents
The Ultrasonic Machining and device of glass substrate Download PDFInfo
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- CN108326640A CN108326640A CN201710664772.9A CN201710664772A CN108326640A CN 108326640 A CN108326640 A CN 108326640A CN 201710664772 A CN201710664772 A CN 201710664772A CN 108326640 A CN108326640 A CN 108326640A
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- ultrasonic vibration
- workbench
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- 239000011521 glass Substances 0.000 title claims abstract description 143
- 239000000758 substrate Substances 0.000 title claims abstract description 111
- 238000003754 machining Methods 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 claims abstract description 65
- 230000008569 process Effects 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 239000011241 protective layer Substances 0.000 claims description 15
- 230000004807 localization Effects 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 29
- 238000005520 cutting process Methods 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 12
- 238000005336 cracking Methods 0.000 abstract description 4
- 239000006061 abrasive grain Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002173 cutting fluid Substances 0.000 description 4
- 239000005357 flat glass Substances 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/003—Multipurpose machines; Equipment therefor
Abstract
The present invention provides a kind of Ultrasonic Machining of glass substrate, this method includes：Glass substrate is placed in the arrangement step of workbench；And the material removal process that the glass matrix after the completion of arrangement step is machined out along default machining path using machining apparatus；The material removal process carries out in the state that glass substrate makees ultrasonic vibration by predeterminated frequency and default amplitude.This method forms vibratory impulse by between the ultrasonic vibration of glass substrate and the cutter of machining apparatus, fine crack can be formed on the surface that the two contacts, it is machined out again by the cutter rotated, cutting force can not only be greatly reduced, improve processing efficiency, the hammering of ultrasonic vibration, cavitation, discontinuous the effects that cutting, can also be such that product surface quality is improved, and reduce notch, burn the undesirable generations such as side, cracking, to improve product yield and cutting-tool's used life.The present invention also provides a kind of supersonic machining apparatus of the glass substrate for the above method.
Description
Technical field
The present invention relates to the processing technique fields of glass substrate, more specifically, are related to a kind of ultrasonic wave of glass substrate
Processing method and device.
Background technology
Glassware is widely used in various industry, including electronics industry, the example of such application include smart mobile phone,
Tablet computer, smart television, handheld apparatus and liquid crystal display (LCD) etc..It is traditionally formed with sheet and produces glass, be used in combination
Slicer, laser cutting or Water Cutting equipment by large stretch of glass-cutting at the glass baseplate close to product size, then to glass
Base material carries out Carving Machining (or referred to as finishing impression is processed), and (main Working position includes shape and receiver, home keys, fingerprint for molding
The aperture of the positions such as identification, camera), to obtain glass cover-plate.
There are many drawbacks for existing glass base processing method, and by taking Carving Machining as an example, traditional Carving Machining is general
It is processed using double main shafts or more main shaft carving machines cooperation diamond grinding head, due to crisp, the hard attribute of glass itself, to avoid
Glass generation " burn ", notch, cracking etc. are bad during Carving Machining, and process velocity is often very slow, and processing efficiency is low；Knife
Having wear block, cutter is just needed to change through statistics about 100 sheet glass substrates of processing, frequent tool changing undoubtedly causes processing cost higher,
Actually Carving Machining accounts for the ratio of entire glass cover-plate production cost and is often as high as 50%.In addition, expanded application in recent years
3D, novel glass hardness generally improve, difficulty of processing bigger, traditional processing method seriously constrained production efficiency and
Product yield.
How increasingly increase with every profession and trade to glass cover-plate demand, improve production efficiency and product yield has become this
Field technical problem urgently to be resolved hurrily.
Invention content
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a kind of Ultrasonic Machining of glass substrate and
Device, it is intended to solve to carry out the production efficiency of glass substrate processing using existing processing method and the lower technology of product yield is asked
Topic.
In order to solve the above-mentioned technical problem, the technical solution that the Ultrasonic Machining of glass substrate of the invention uses
It is：
The Ultrasonic Machining of glass substrate, this method include：
Glass substrate is placed in the arrangement step of workbench；
And the glass matrix progress machine after the completion of arrangement step is added along machining path is preset using machining apparatus
The material removal process of work；
The material removal process is in the state that the glass substrate makees ultrasonic vibration by predeterminated frequency and default amplitude
It carries out.
Further, in the arrangement step, the workbench is provided by the objective table of ultrasonic vibration apparatus, it will
The glass substrate is fixedly arranged on the objective table；
In the material removal process, drive the glass substrate by predeterminated frequency by the ultrasonic vibration apparatus and
Default amplitude makees ultrasonic vibration.
Further, the predeterminated frequency is 18kHz~60kHz.
Further, described in defining when the material removal process carries out in the state of the glass substrate remains stationary
The limit feeding speed of machining apparatus is V, and the material removal process is shaken by predeterminated frequency with default in the glass substrate
The limit feeding speed that width makees machining apparatus when progress in the state of ultrasonic vibration is V0；Then V0It is 1.2~2 times of V.
Further, the default amplitude is 1~10 micron.
Further, in the arrangement step, after being positioned to the glass substrate by localization tool, by vacuum or
The glass substrate is fixedly arranged on the workbench by negative-pressure adsorption.
Further, further include early-stage preparations process before carrying out the arrangement step, the early-stage preparations process packet
It includes：
The step of workbench is carried out covering protective layer,
Glass blank is cut into several glass substrates according to engineering drawing,
And the step of glass substrate is carried out covering protective layer；
After the early-stage preparations process, the step of progress feeding, the material removal process and blanking successively；
The feeding step includes carrying out clean process and the arrangement step to the workbench；
It is synchronized during the material removal process carries out and the cutter of the machining apparatus is cooled down.
Further, protective layer of the bonding protective film as the workbench on the workbench；In the glass
Protective layer of at least one side the covering ink, glue or film of glass substrate as the glass substrate.
The supersonic machining apparatus of glass substrate provided by the invention the technical solution adopted is that：
The supersonic machining apparatus of glass substrate, including：
Workbench, the workbench is in the arrangement step of glass substrate for loading the glass substrate；
Machining apparatus, the machining apparatus are used for along default machining path to described in after the completion of the arrangement step
The material removal process that glass matrix is machined out；
Further include ultrasonic vibration apparatus, the ultrasonic vibration apparatus is for making the material removal process in the glass
Glass substrate is made to carry out in the state of ultrasonic vibration by predeterminated frequency and default amplitude.
Further, the workbench is provided by the objective table of the ultrasonic vibration apparatus, the glass substrate is solid
On the objective table.
Based on the above-mentioned technical proposal, the Ultrasonic Machining and device of glass substrate of the invention, relative to existing skill
Art at least has the advantages that：
1. shaking by the ultrasound that the ultrasonic vibration of glass substrate is formed between glass substrate and the cutter of machining apparatus
Dynamic impact can form fine crack on the surface that the two contacts, then when the cutter by rotating is machined out, glass substrate
It falls off along direction of check, cutting force can not only be greatly reduced, improve the removal efficiency of material, moreover it is possible to improve the feeding speed of cutter
Degree, to greatly improve processing efficiency；
2. cutter abrasive grain cutting path (i.e. default engraving path) can become the curve of cyclical fluctuations from straight line, cutter abrasive grain is increased
The area of cut, improve cutter stress, simultaneously because the ultrasonic vibration of glass substrate can make cutter and glass substrate high-speed separation,
Cutting fluid can enter the gap of the two in separation process, and to be conducive to improve the cooling of cutter, that improves cutter uses the longevity
Life；It, can will be between cutter abrasive grain in addition, the cavitation effect that ultrasonic vibration is formed in cutting fluid, effect are equal to ultrasonic cleaning
Glass chip dispose in time, keep cutter it is sharp, so as to greatly improve cutter life；
3. cutting can also be reduced in machining process using characteristics such as the hammering of ultrasonic vibration, cavitation, discontinuous cuttings
Power, the reduction of cutting force and the variation of the Cutting trajectory of abrasive grain, can be so that the surface quality after processing be improved, and reduction lacks
Mouth burns the undesirable generations such as side, cracking, the effect of processing quality and precision is improved, so as to improve product yield.
Description of the drawings
Fig. 1 is a kind of flow diagram of the Ultrasonic Machining of glass substrate provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram for the machining apparatus that existing ultrasonic activation is applied to cutter；
Fig. 3 is a kind of ultrasonic wave processing of glass substrate for realizing method shown in Fig. 1 provided in an embodiment of the present invention
The structural schematic diagram of device；
Fig. 4 is Fig. 3 shown devices in the flow chart for carrying out ultrasonic wave processing to glass substrate.
Specific implementation mode
In order to make technical problems, technical solutions and advantageous effects to be solved by the present invention be more clearly understood, below in conjunction with
Accompanying drawings and embodiments, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indicating or implies relative importance or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more this feature.In the description of the present invention,
The meaning of " plurality " is two or more, unless otherwise specifically defined.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on ... shown in the drawings or position are closed
System, is merely for convenience of description of the present invention and simplification of the description, not indicating or implying the indicated device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Furthermore, it is necessary to explanation, when element is referred to as " being fixed on " or " being set to " another element, it can be direct
On another element or it is connected on another element.When an element is known as " being connected to " another element,
It can be directly to another element or be indirectly connected on another element.
Referring to Figure 1 and Figure 3, the Ultrasonic Machining of a kind of glass substrate provided in an embodiment of the present invention, this method packet
It includes：
Glass substrate 100 is placed in the arrangement step of workbench；
And the glass matrix after the completion of arrangement step is processed along default machining path using machining apparatus 200
Material removal process；
Material removal process carries out in the state that glass substrate 100 makees ultrasonic vibration by predeterminated frequency and default amplitude.
This method, on the one hand by the ultrasonic vibration of glass substrate 100 glass substrate and machining apparatus 200 cutter
Between the vibratory impulse that is formed can form fine crack on the surface that the two contacts, then when the cutter by rotating is machined out,
Glass substrate 100 can fall off along direction of check, and cutting force can not only be greatly reduced, and improve the removal efficiency of material, moreover it is possible to carry
The feed speed of high cutter, to greatly improve processing efficiency；On the other hand, cutter abrasive grain cutting path (i.e. default processing road
Diameter) can the curve of cyclical fluctuations be become from straight line, the area of cut of cutter abrasive grain is increased, improves cutter stress, simultaneously because glass base
The ultrasonic vibration of plate 100 can make 100 high-speed separation of cutter and glass substrate, and cutting fluid can enter the seam of the two in separation process
Gap improves cutting-tool's used life to be conducive to improve the cooling of cutter；In addition, what ultrasonic vibration was formed in cutting fluid
Cavitation effect, effect are equal to ultrasonic cleaning, can dispose the glass chip between cutter abrasive grain in time, keep cutter cutting edge of a knife or a sword
Profit, so as to greatly improve cutter life；In addition, utilizing the characteristics such as the hammering of ultrasonic vibration, cavitation, discontinuous cutting
Cutting force, the reduction of cutting force and the variation of the Cutting trajectory of abrasive grain can also be reduced in machining process, it can be so that processing
Surface quality afterwards is improved, and is reduced notch, is burnt the undesirable generations such as side, cracking, improves the effect of processing quality and precision,
So as to improve product yield.
Further, in the present embodiment, it in arrangement step, is provided by the objective table 400 of ultrasonic vibration apparatus 300
Glass substrate 100 is fixedly arranged on objective table 400 by workbench；
In material removal process, glass substrate 100 is driven to make by predeterminated frequency and amplitude by ultrasonic vibration apparatus 300
Ultrasonic vibration.
The existing method for carrying out machining using ultrasonic vibration mostly uses ultrasonic chief axis greatly and ultrasonic handle of a knife is realized, phase
It answers, existing machining apparatus is as shown in fig.2, (i.e. ultrasonic including workbench 10, cutter 20, amplitude transformer 30, energy converter 40
Wave vibrating device), balance weight 50 etc., ultrasonic vibration is applied on cutter, energy converter 40 need to be with main axis, the prior art
Generally believe that such set-up mode is based on the common cognition for making cutter make ultrasonic vibration processing quality more easy to control.Applicant
It being found in long-term production application, such setting can cause existing machining apparatus complicated, and assembling is extremely inconvenient,
The main shaft to run at high speed, which synchronizes, to be made ultrasonic vibration and can reduce entire mach reliability and stability；Meanwhile such setting
Also there is more limitation to the maximum speed of main shaft, cutter form etc., to which existing machining yield and product matter can be caused
Amount, which is unable to get, to be substantially improved.
It is learnt through applicant's repetition test, the application is used provides work by the objective table 400 of ultrasonic vibration apparatus 300
Glass substrate 100 is fixedly arranged on objective table 400 by platform, to drive glass substrate 100 to press by ultrasonic vibration apparatus 300
Predeterminated frequency and amplitude make the set-up mode of ultrasonic vibration, and glass substrate can on the one hand preferably protected with ultrasonic vibration apparatus
Identical ultrasonic vibration is held, mach stability and reliability are improved, on the other hand, also without change machining apparatus 200
Overall structure, to the form of cutter also without particular/special requirement, the case where not restricting 200 maximum speed of spindle of machining apparatus
Under, it can realize larger input power, processing efficiency, product quality and yield can be substantially improved.
The processing unit (plant) of glass substrate 100 is applied to relative to existing by ultrasonic vibration to the application below by table 1
The advantages of ultrasonic vibration is applied to the processing unit (plant) of cutter carries out detailed comparisons' explanation.
Table 1：
Further, in the present embodiment, in material removal process, ultrasonic vibration apparatus 300 drives glass substrate
100 entirety make high-frequency vibration.The cutting of ultrasonic high-frequency vibration to improving the machinability of glass substrate 100, improve cutter life and
Workpiece processing quality has more preferably effect.
Specifically in the present embodiment, the predeterminated frequency of high-frequency vibration is 18kHz~60kHz, and further preferably 20kHz
~60kHz.
Further, in the present embodiment, definition material removing step in the state of 100 remains stationary of glass substrate into
The limit feeding speed of machining apparatus 200 is V when row, and material removal process by predeterminated frequency and is preset in glass substrate 100
The limit feeding speed that amplitude makees machining apparatus 200 when progress in the state of ultrasonic vibration is V0；Then V0Preferably the 1.2 of V~
2 times.
In practical application, above-mentioned default amplitude is preferably 1~10 micron, and further preferably 5 microns.
Below by test method shown in table 2~4, illustrate to the Ultrasonic Machining of above-mentioned glass substrate
Explanation.
Wherein, the comparative example 1 in table 2~4 (is not applied to glass substrate 100 and cutter in traditional diamond-making technique
Add ultrasonic vibration) under carry out, remaining embodiment 1~14 is carried out under the Ultrasonic Machining using the application；Table 2
Middle Examples 1 to 5 reflection is under the premise of default amplitude and certain feeding speed, and different predeterminated frequencies are to glass substrate
The influence of 100 ultrasonic wave processing effect；What embodiment 6~10 reflected in table 3 is certain in predeterminated frequency and feeding speed
Under the premise of, default influence of the amplitude to the ultrasonic wave processing effect of glass substrate 100 of difference；Embodiment 11~14 reflects in table 4
Be under the premise of predeterminated frequency and certain default amplitude, different feeding speeds imitate the ultrasonic wave processing of glass substrate 100
The influence of fruit.
Table 2：
Table 3：
Table 4：
It should be understood that every glass the piece number representative that cutter can be processed can represent cutter in above table 2~4
The length of service life.Above-described embodiment 1~14 be material removal process to structure identical glass substrate 100 by ultrasonic wave
Vibrating device 300 drive and make ultrasonic vibration state and remaining technological parameter it is certain under the premise of carry out.Above-mentioned test result table
It is bright, processing efficiency and product quality can effectively be improved using ultrasonic vibration apparatus 300, and be conducive to improve making for cutter
Use the service life.When predeterminated frequency is 18kHz~60kHz, default amplitude is 1~10 micron, feeding speed V0It is 1.2~2 times of V
When, compared to other technological parameters, processing efficiency, product quality and the stage property service life of product can reach preferable water
It is flat；And predeterminated frequency is 20kHz, default amplitude is 5 μm, feeding speed V0For 1.5V when it is best.
In practical application, in arrangement step, after being positioned to glass substrate 100 by localization tool 500, pass through vacuum
Or glass substrate 100 is fixedly arranged on objective table 400 by negative-pressure adsorption.The localization tool 500 can be that L-type commonly used in the art is leaned on
Plate.
Reference Fig. 3, the supersonic machining apparatus of glass substrate provided in an embodiment of the present invention, including：
Workbench, workbench is in the arrangement step of glass substrate 100 for loading glass substrate 100；
Machining apparatus 200, machining apparatus 200 are used for along default machining path to the glass base after the completion of arrangement step
Body carries out material removal process；
Further include ultrasonic vibration apparatus, ultrasonic vibration apparatus for make material removal process glass substrate 100 by
Predeterminated frequency and default amplitude are made to carry out in the state of ultrasonic vibration.
Machining apparatus 200 is CNC carving machines, and CNC carving machines are used for complete to arrangement step along default Carving Machining path
Glass matrix 100 after is carved.
Specifically in the present embodiment, workbench, glass substrate are provided by the objective table 400 of ultrasonic vibration apparatus 300
100 are fixedly arranged on objective table 400.
Above-mentioned ultrasonic vibration apparatus 300 is also associated with provides the ultrasonic power driver 900 of power source for it.It is above-mentioned
Ultrasonic vibration apparatus 300 is also associated with negative pressure device or vacuum plant 600, specifically, ultrasonic vibration apparatus 300 has
It is connected to the cavity of the air flue of objective table 400, transtracheal 700 is connected between cavity and negative pressure device or vacuum plant 600, tracheae
Air source mechanism for opening/closing is additionally provided on 700, the mechanism for opening/closing can be rubber sleeve valve 800, air valve switch and other existing structures or
Element.The ultrasonic vibration apparatus 300, which integrates, to be provided negative-pressure adsorption (or vacuum suction) and provides high-frequency vibration function, whole
Body is compact-sized, assembling, easy to use, and can preferably ensure the holding of glass substrate 100 and objective table 400 be relatively fixed and
The reliability and stability that glass substrate 100 is vibrated with objective table 400, are more conducive to being smoothed out for material removal process.
Above-mentioned ultrasonic vibration apparatus 300 can be the existing piezoelectric ceramic ultrasonic for converting electrical signals to mechanical oscillation
Wave transducer or other existing apparatus.
Above-mentioned machining apparatus 200 can be existing CNC carving machines cooperation diamond grinding head.
In conjunction with Fig. 3 and Fig. 4, below by taking the Carving Machining of glass substrate as an example, to the ultrasonic wave processing using glass substrate
The step of when device carries out practical ultrasonic wave processing, carries out more specific detail：
Early-stage preparations process includes installation positioning ultrasonic vibrating device 300, prepares localization tool 500 and prepare glass base
Plate 100, specifically includes：
S10：Drawing and each parts performance are assembled according to ultrasonic vibration apparatus 300, ultrasonic activation is completed in assembly
Device 300；
S20：According to the tool sharpening path of machining apparatus 200, installation positioning is carried out to ultrasonic vibration apparatus 300；
S30：The objective table 400 of ultrasonic vibration apparatus 300 is processed according to the requirement of workbench and on objective table 400
Process air flue；
S40：The step of carrying out covering protective layer to workbench is specifically pasted on objective table 400 certain thickness special
It uses protective film as protective layer, and is periodically replaced (about per for 24 hours)；
S50：Glass blank (i.e. big sheet glass) is cut into several glass substrates 100, glass substrate 100 according to engineering drawing
Appearance and size it is bigger 0.2-0.6mm than the design size of glass cover-plate, to reserve allowance for follow-up engraving, big sheet glass
Existing slicer, laser cutting or Water Cutting equipment can be used to carry out for cutting；
S60：The step of glass substrate 100 is carried out covering protective layer；Specifically covered in the single or double of glass substrate 100
Lid ink, glue or film protect glass surface as protective layer, prevent subsequent processing operations from causing to scratch；Certainly,
The efficiency of protective layer is covered to improve, can also first be cut into big sheet glass in step s 50 relatively large, is cut again after covering protective layer
To geomery needed for glass substrate 100；
It should be noted that when production application, in order to improve production efficiency, above-mentioned steps S10~S40 and step
S50~S60 can be carried out at the same time.
After early-stage preparations process, the step of progress feeding, material removal process and blanking successively；
Feeding step includes：
S70：Clean process is carried out to workbench；The cleaning process and the aforementioned process for covering protective layer are in order to prevent
The glass for remaining in 500 surface of localization tool cuts the glass surface that frays in following process；
And arrangement step；The arrangement step is specifically, include successively：
S80：Glass substrate 100 is positioned on the objective table 400 of ultrasonic vibration apparatus 300, using L-type backup plate or its
He positions glass substrate 100 by localization method；Ensure that glass substrate 100 and localization tool 500 are concentric；
S90：It opens vacuum or glass substrate 100 is fixedly arranged on objective table 400 by negative-pressure adsorption；
S100：Machining apparatus 200 (being specifically CNC carving machines in the present embodiment) and ultrasonic vibration apparatus 300 are opened,
Material removal process (being specifically to carve process in the present embodiment) is carried out to obtain the product needed.It is carried out in material removal process
During further include synchronizing to carry out cooling process to the cutter of machining apparatus 200.
Then, follow-up process is carried out, to obtain the glass cover-plate needed.
It should be noted that the supersonic machining apparatus of above-mentioned glass substrate, due to being based on the method for the present invention embodiment
Same design, the technique effect brought is identical as the method for the present invention embodiment, and particular content can be found in the method for the present invention implementation
Narration in example, details are not described herein again.
It should be noted that for previous embodiment, describe for simplicity, therefore is all expressed as a series of action group
It closes, but those skilled in the art should understand that, the present invention is not limited by the described action sequence, because according to this hair
Bright, certain steps may be used other sequences or be carried out at the same time.Next, those skilled in the art should also know that, specification
Described in embodiment belong to preferred embodiment, involved action and module might not all be that institute of the invention is necessary
's.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
All any modification, equivalent and improvement made by within principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. the Ultrasonic Machining of glass substrate, this method include：
Glass substrate is placed in the arrangement step of workbench；
And the glass matrix after the completion of arrangement step is machined out along default machining path using machining apparatus
Material removal process；
It is characterized in that：The material removal process makees ultrasonic vibration in the glass substrate by predeterminated frequency and default amplitude
It is carried out under state.
2. the Ultrasonic Machining of glass substrate as described in claim 1, it is characterised in that：
In the arrangement step, the workbench is provided by the objective table of ultrasonic vibration apparatus, by the glass substrate
It is fixedly arranged on the objective table；
In the material removal process, the glass substrate is driven by predeterminated frequency by the ultrasonic vibration apparatus and is preset
Amplitude makees ultrasonic vibration.
3. the Ultrasonic Machining of glass substrate as described in claim 1, it is characterised in that：The predeterminated frequency is
18kHz~60kHz.
4. the Ultrasonic Machining of glass substrate as described in claim 1, it is characterised in that：Define the material removal work
The limit feeding speed of sequence machining apparatus when being carried out in the state of the glass substrate remains stationary is V, the material
Expect that the machine adds when removing step carries out in the state that the glass substrate makees ultrasonic vibration by predeterminated frequency and default amplitude
The limit feeding speed of construction equipment is V0；Then V0It is 1.2~2 times of V.
5. the Ultrasonic Machining of glass substrate as described in claim 1, it is characterised in that：The default amplitude be 1~
10 microns.
6. the Ultrasonic Machining of glass substrate as described in claim 1, it is characterised in that：In the arrangement step, by
After localization tool positions the glass substrate, the glass substrate is fixedly arranged on by the work by vacuum or negative-pressure adsorption
Make on platform.
7. such as the Ultrasonic Machining of glass substrate according to any one of claims 1 to 6, it is characterised in that：
Further include early-stage preparations process before carrying out the arrangement step, the early-stage preparations process includes：
The step of workbench is carried out covering protective layer,
Glass blank is cut into several glass substrates according to engineering drawing,
And the step of glass substrate is carried out covering protective layer；
After the early-stage preparations process, the step of progress feeding, the material removal process and blanking successively；
The feeding step includes carrying out clean process and the arrangement step to the workbench；
It is synchronized during the material removal process carries out and the cutter of the machining apparatus is cooled down.
8. the Ultrasonic Machining of glass substrate as claimed in claim 7, it is characterised in that：It is glued on the workbench
Protective layer of the pasting protective film as the workbench；In at least one side covering ink, glue or the film of the glass substrate
Protective layer as the glass substrate.
9. the supersonic machining apparatus of glass substrate, including：
Workbench, the workbench is in the arrangement step of glass substrate for loading the glass substrate；
Machining apparatus, the machining apparatus are used for along default machining path to the glass after the completion of the arrangement step
The material removal process that matrix is machined out；
It is characterized in that, further including ultrasonic vibration apparatus, the ultrasonic vibration apparatus is for making the material removal process
It is carried out in the state that the glass substrate makees ultrasonic vibration by predeterminated frequency and default amplitude.
10. the supersonic machining apparatus of glass substrate as claimed in claim 9, it is characterised in that：By the ultrasonic activation
The objective table of device provides the workbench, and the glass substrate is fixedly arranged on the objective table.
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| CN112829073A (en) * | 2021-01-07 | 2021-05-25 | 中国人民解放军火箭军工程大学 | Method for weakening processing fragmentation damage of hard and brittle material by utilizing interface reaction |
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Application publication date: 20180727 |