CN108323092A - Liquid cooling header structure with uniform flow path path - Google Patents
Liquid cooling header structure with uniform flow path path Download PDFInfo
- Publication number
- CN108323092A CN108323092A CN201710040035.1A CN201710040035A CN108323092A CN 108323092 A CN108323092 A CN 108323092A CN 201710040035 A CN201710040035 A CN 201710040035A CN 108323092 A CN108323092 A CN 108323092A
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- CN
- China
- Prior art keywords
- chamber
- liquid cooling
- header structure
- uniform flow
- flow path
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The present invention provides a kind of liquid cooling header structure with uniform flow path path comprising upper cover, ontology and bottom plate.Upper cover includes fluid inlet and fluid outlet.Ontology includes upper surface, lower surface and first chamber to the 5th chamber.First chamber is adjacent to upper surface and extends along central line direction, and is connected to fluid inlet.Second chamber is adjacent to lower surface, and is connected to first chamber.Third chamber and the 4th chamber run through upper surface and lower surface, and are respectively arranged at the two opposite sides of ontology, and are in mirror symmetry by symmetry axis of central line.5th chamber is adjacent to upper surface, and with fluid outlet, third chamber and the 4th chamber.Bottom plate includes that multiple guide channels are parallel to each other, and second chamber is connected to third chamber and the 4th chamber, in uniform flow path of the formation one with isometric path on bottom plate.
Description
Technical field
The present invention relates to a kind of liquid-cooling heat dissipation structure, more particularly to a kind of liquid cooling head knot with uniform flow path path
Structure.
Background technology
With the increasingly update of development in science and technology, many electronic components are while promoting efficiency also along with more heats
It generates, general air-cooled radiator is caused to be unable to reach the radiating requirements of heat-generating electronic elements, and must use has liquid cooling
The liquid-cooling heat radiator of circulating technology effect could effectively radiate to heat-generating electronic elements.Traditional liquid cooling type radiation
Device includes the liquid cooling head (liquid cooling block head) being interconnected, liquid cooling row (liquid cooling
Pipe) and one pumps (pump), constitutes a circulation loop each other, refrigerant fluid is wherein filled in circulation loop, passes through liquid cooling head
Contact heating electronic component simultaneously carries out heat exchange by refrigerant fluid by takes away heat, liquid cooling row by conduct heat away to outside with
Cooling refrigerant fluid, pump drive refrigerant fluid to be circulated in circulation loop again.
However, refrigerant fluid is arranged from liquid cooling after importing liquid cooling head, if flowing through the refrigerant fluid nothing of the internal cavity of liquid cooling head
Method is transmitted with uniform flow passage route, it will leading to liquid cooling head, temperature distribution is non-uniform with electronic component contact surface, Jin Erying
Ring the efficiency of electronic component.In addition, the liquid-cooling heat radiator in use, it is necessary to while ensuring that refrigerant fluid is completely sealed in and following
In loop back path, if refrigerant fluid temperature (F.T.) is unevenly distributed, may influence liquid cooling head closes seal structure, causes outside refrigerant fluid
Leakage, and then damage electronic component and cause short circuit.Therefore, it is really necessary to develop a kind of liquid cooling head knot with uniform flow path path
Structure, to improve prior art problem encountered.
Invention content
The purpose of the present invention is to provide a kind of liquid cooling header structures with uniform flow path path, to solve the prior art
The problem that flow passage route is uneven or heat exchanger effectiveness is bad.
Another object of the present invention is to provide a kind of liquid cooling header structure with uniform flow path path, wherein liquid cooling header structure
Simply, alternatively, simply and firmly on heat source surface of the group assigned in electronic component, and cooling medium liquid is sent with uniform flow path path
Body avoids generating temperature difference on the bottom plate contacted with electronic component and influencing the performance of electronic component.In addition, liquid cooling header structure
Part-structure can more be constituted with a translucent material, and add a light-emitting component, make the liquid cooling header structure in runaway electron element
And light-emitting component generate thermal energy while, a light source illumination functions are more provided.
To reach foregoing purpose, the present invention provides a kind of liquid cooling header structure with uniform flow path path comprising upper cover,
Ontology and bottom plate.Upper cover includes fluid inlet and fluid outlet, and wherein fluid inlet forms a central line with fluid outlet.
Ontology is set to the lower section of upper cover, and includes upper surface, lower surface, first chamber, second chamber, third chamber, the 4th chamber
And the 5th chamber.First chamber is adjacent to upper surface and extends along the central line direction of part, and is connected to fluid inlet.
Second chamber is adjacent to lower surface, and extends along the direction of central line, and is connected to first chamber.Third chamber and the 4th chamber
Upper surface and lower surface are run through in room, and are respectively arranged at the two opposite sides of ontology, and are in mirror by symmetry axis of central line
As symmetrical.5th chamber is adjacent to upper surface, and with fluid outlet, third chamber and the 4th chamber.Bottom plate includes multiple
Guide channel, one first groove and one second groove, wherein the first groove and the second groove are respectively relative to third chamber and the 4th chamber
Room and the two opposite sides for being set to bottom plate.Multiple guide channels are parallel to each other, and are connected between the first groove and the second groove, and
Relative to the second chamber, wherein second chamber is connected to third chamber by multiple guide channels, the first groove and the second groove
With the 4th chamber, and on bottom plate formed one with isometric path uniform flow path.
The beneficial effects of the present invention are the present invention provides a kind of liquid cooling header structure with uniform flow path path, with solution
The problem that certainly flow passage route of the prior art is uneven or heat exchanger effectiveness is bad.Wherein liquid cooling header structure is simple, replaceable, letter
Easily and firmly on heat source surface of the group assigned in electronic component, and refrigerant liquid is sent with uniform flow path path, avoided and electronics
Temperature difference is generated on the bottom plate of element contact and influences the performance of electronic component.In addition, the part-structure of liquid cooling header structure is more
It can be constituted with a translucent material, and add a light-emitting component, the liquid cooling header structure is made to be produced in runaway electron element and light-emitting component
While raw thermal energy, a light source illumination functions are more provided.
Description of the drawings
Figure 1A is for the STRUCTURE DECOMPOSITION of the liquid cooling header structure with uniform flow path path of the first preferred embodiment of the invention
Figure.
Figure 1B is for another visual angle of the liquid cooling header structure with uniform flow path path of the first preferred embodiment of the invention
Structural exploded view.
Fig. 2 is the combination assumption diagram for indicating the liquid cooling header structure with uniform flow path path in Figure 1A and Figure 1B.
Fig. 3 A are the top views for indicating ontology in the first preferred embodiment of the invention.
Fig. 3 B are the bottom views for indicating ontology in the first preferred embodiment of the invention.
Fig. 4 is the flow passage route schematic diagram for indicating liquid cooling header structure of the present invention.
Fig. 5 is the bottom view of the body construction for the liquid cooling header structure for indicating the second preferred embodiment of the invention.
Fig. 6 is the structural exploded view for the liquid cooling header structure for indicating third preferred embodiment of the present invention.
Wherein, the reference numerals are as follows：
1：Liquid cooling header structure
11：Upper cover
111：Fluid inlet
112：Fluid outlet
113：Second locking hole
12：Ontology
120：Storage tank
121：Upper surface
122：Lower surface
123：First chamber
124：Second chamber
125：Third chamber
126：4th chamber
127：5th chamber
128：Third locking hole
129：Locking perforation
13：Bottom plate
131：Guide channel
132：First groove
133：Second groove
134：Seal assembly
1341：Limit channel
1342：Sealing ring
135：First locking hole
14：Lock member
15：Locking unit
16：Light-emitting component
L：Central line
Specific implementation mode
Embodying some exemplary embodiments of feature of present invention and advantage will in detail describe in the explanation of back segment.It should be understood that
Various variations can be had in different aspects by being the present invention, neither be departed from the scope of the present invention, and explanation therein
And it illustrates inherently as use is described, and is not intended to limit the present invention.
Figure 1A and Figure 1B be for first preferred embodiment of the invention the liquid cooling header structure with uniform flow path path not
With the structural exploded view at visual angle.Fig. 2 is the combination knot for indicating the liquid cooling header structure with uniform flow path path in Figure 1A and Figure 1B
Composition.Fig. 3 A and Fig. 3 B are the top view and bottom view for indicating ontology in the first preferred embodiment of the invention respectively.Such as Figure 1A, figure
Shown in 1B, Fig. 2, Fig. 3 A and Fig. 3 B, (the hereinafter referred to as liquid cooling head knot of liquid cooling header structure 1 with uniform flow path path of the invention
Structure) it is that assembling is applied to the such as, but not limited to fever such as central processing unit (Central Processing Unit, CPU) electronics
A heat source surface (not shown) for element.The liquid cooling header structure 1 of the present invention includes upper cover 11, ontology 12 and bottom plate 13.Upper cover 11
Including fluid inlet 111 and fluid outlet 112, wherein fluid inlet 111 forms a central line L with fluid outlet 112.Ontology
12 are disposed on the lower section of upper cover 11.Ontology 12 include upper surface 121, lower surface 122, first chamber 123, second chamber 124,
Third chamber 125, the 4th chamber 126 and the 5th chamber 127.First chamber 123 is adjacent to upper surface 121 and along part
It entreats the directions line L to extend, and is connected to fluid inlet 111.Second chamber 124 is adjacent to lower surface 122, and along central line L
Direction extend, and be connected to first chamber 123.Third chamber 125 and the 4th chamber 126 run through the upper surface 121 of ontology 12
With lower surface 122, and it is respectively arranged at the two opposite sides of ontology 12.5th chamber 127 is then adjacent to the upper surface of ontology 12
121, it is connected to fluid outlet 112, third chamber 125 and the 4th chamber 126.It is worth noting that, in this present embodiment, third
Chamber 125 and the 4th chamber 126 are using central line L as symmetry axis be in mirror symmetry chamber structure.In addition, bottom plate 13 wraps
Include multiple guide channels 131, one first groove 132 and one second groove 133.In this present embodiment, the first groove 132 and the second groove
133 are respectively relative to third chamber 125 and the 4th chamber 126 and are set to the two opposite sides of bottom plate 13.Multiple guide channels 131 are in that
This is parallel, and is connected between the first groove 132 and the second groove 133, and relative to second chamber 124.Wherein the second chamber
Room 124 be by multiple guide channels 131 each both sides by be connected to the first groove 132 and the second groove 133, and third chamber 125 with
4th chamber 126 is connected with the first groove 132 and the second groove 133 respectively, and thereby second chamber 124 can pass through multiple guide channels
131, the first groove 132 and the second groove 133 and be connected to third chamber 125 and the 4th chamber 126 simultaneously, and thereby in bottom plate
A uniform flow path with isometric path is formed on 13.
Fig. 4 is the flow passage route schematic diagram for indicating liquid cooling header structure of the present invention.In this present embodiment, second chamber 124 has
There is an oval poroid orthographic projection, extends along the directions central line L, and between third chamber 125 and the 4th chamber 126, and
And it is equidistant with third chamber 125 and the 4th chamber 126 respectively.Therefore, refrigerant liquid is taken up an official post from 124 liang of marginal edges of second chamber
A bit, be guided to through multiple guide channels 131 on bottom plate 13 third chamber 125 or the 4th chamber 126 apart from all same.Yu Benshi
It applies in example, third chamber 125 and the 4th chamber 126 are respectively provided with a trapezoidal orthographic projection, and with the long bottom of its trapezoidal orthographic projection
Side is connect with multiple guide channels 131.Refrigerant liquid converges into third chamber 125 and the 4th respectively through multiple guide channels 131 on bottom plate 13
After chamber 126, towards the short top margin flowing of the trapezoidal orthographic projection of third chamber 125 and the 4th chamber 126, and simultaneously by ontology 12
Lower surface 122 towards upper surface 121 be oriented to the 5th chamber 127.It is worth noting that, third chamber 125 and the 4th chamber 126
Trapezoidal orthographic projection in addition to conducive to concentrating refrigerant fluid and by 12 lower surface 122 of ontology being transmitted to the 5th chamber 127 of upper surface 121,
Bottom plate 13 more may include multiple first locking holes 135, be adjacent to two end sides of the short top margin of trapezoidal orthographic projection, thereby can be effectively sharp
With 13 area of bottom plate.On the other hand, correspond to multiple first locking holes 135 of bottom plate 13, upper cover 11 and ontology 12 have more respectively
There are multiple second locking holes 113 and multiple third locking holes 128, both with respect to multiple first locking holes 135 of bottom plate 13, with altogether
Upper cover 11 and bottom plate 13 are locked in respectively on the upper surface 121 and lower surface 122 of ontology 12 with assembling.In this present embodiment,
Liquid cooling header structure 1 further includes multiple lock members 14 for being for example but not limited to screw, passes through corresponding second locking hole respectively
113, third locking hole 128 and the first locking hole 135 and the upper cover 11 that locks, ontology 12 and bottom plate 13.It is emphasized that of the invention
In the ontology 12 of liquid cooling header structure 1, in addition to the mirror symmetry configuration relation of third chamber 125 and the 4th chamber 126, first chamber
123, second chamber 124 and the composition of the 5th chamber 127 are also in mirror symmetry configuration by symmetry axis of central line L,
Opposite size is not to limit the condition of liquid cooling header structure 1 of the present invention.Under conditions of not influencing mirror symmetry configuration and constituting, the
One chamber 123, second chamber 124 and the 5th chamber 127 scale visual demand and modulation.Fig. 5 is to indicate the present invention second
The bottom view of the body construction of the liquid cooling header structure of preferred embodiment.In this present embodiment, ontology 12 is and sheet shown in Fig. 3 B
Body 12 is similar, and identical element numbers represent identical element, structure and function, are repeated no more in this.Different from Fig. 3 B institutes
12 the included second chamber 124 of ontology of the ontology 12 shown, the present embodiment only extends shorter distance along the directions central line L,
But still maintain the flow passage route of mirror symmetry similar to Figure 4 in the both sides central line L.It is emphasized that previous embodiment
In, the heating electric corresponding to the scale visual liquid cooling header structure 1 of first chamber 123, second chamber 124 and the 5th chamber 127
The shape of subcomponent and modulation, and the quantity and size of multiple guide channels 131 also not limit the item of feature of present invention on bottom plate 13
Part can regard demand in practical application and adjust, so that the liquid cooling header structure 1 of the present invention can be with the uniform flow path of mirror symmetry
Path, stabilization effectively radiate to heat-generating electronic elements.
Furthermore in some embodiments, aforementioned 5th chamber 127 is respectively communicated in third chamber 125 and the 4th chamber 126
To between fluid outlet 112, to constitute a confluence runner, i.e., as shown in Figure 1A and Fig. 3 A.What wherein the 5th chamber 127 was constituted
Cross section of fluid channel converge respectively by the 5th chamber 127 and 125 connectivity part of third chamber and the 5th chamber 127 and the 4th chamber 126
112 connectivity part of fluid outlet that connectivity part is entreated thereto is gradually successively decreased, and is used the hydraulic pressure for increasing refrigerant fluid and is promoted flow velocity, suitable
Channel Group, the present invention is not limited thereto certainly.
In addition, please referring to Fig.1 A and Figure 1B again, in this present embodiment, bottom plate 13 further includes a seal assembly 134, is set to
Between bottom plate 13 and ontology 12, and it is located on the periphery of multiple guide channels 131, the first groove 132 and the second groove 133.It is specific and
Speech, seal assembly 134 include the correspondence composite structure of a limit channel 1341 and a sealing ring 1342, and wherein sealing ring 1342 can
To be such as, but not limited to rubber ring.It is recessed in bottom plate 13 to limit channel 1341, and is surrounded on multiple guide channels 131, the first groove
132 and second groove 133 periphery.Sealing ring 1342 is to assemble to be placed on limit channel 1342.When bottom plate 13 and ontology 12
When clamping, by the setting of seal assembly 134, it can be formed and be fully sealed, avoid refrigerant liquid between bottom plate 13 and ontology 12
Gap leaks outside, and in turn results in the damage of electronic component.On the other hand, in previous embodiment, ontology 12 more may include multiple locks
Admittedly perforating 129, multiple periphery extensions of ontology 12 are respectively arranged at, and mutually assemble with multiple locking units 15, and by liquid
Cold head structure 1 secures to the heat source surface (not shown) of an electronic component.In an embodiment, multiple locking units 15 can be such as
It is but not limited to screw, assembled respectively with multiple lockings of ontology 12 perforation 129 and engages and secures to electronic component or electronics member
The support plate (not shown) of part setting, and then the bottom plate 13 of liquid cooling header structure 1 is made to be contacted with heat source surface.It is emphasized that liquid cooling
The mode that header structure 1 is engaged with electronic component heat source surface not limits the condition of feature of present invention, other locking sides that can be
Formula is also applicable to the liquid cooling header structure 1 of the locking present invention.The present invention is not limited to aforementioned illustration, and repeats no more.
Since the liquid cooling header structure 1 of the present invention is that assembling is applied to such as, but not limited to central processing unit (Central
Processing Unit, CPU) etc. heat-generating electronic elements a heat source surface (not shown), therefore bottom plate 13 is with a metal material
Institute's constitutor is preferable.On the other hand, upper cover 11 can be then made of with ontology 12 transparent material, certainly the present invention not by
It is limited to this.And when upper cover 11 and ontology 12 are constituted by a light-permeable material, liquid cooling header structure 1 of the invention is more in combination with one
Light-emitting component and radiation source is provided.Fig. 6 is the structural exploded view for the liquid cooling header structure for indicating third preferred embodiment of the present invention.
In this present embodiment, liquid cooling header structure 1 is similar to the liquid cooling header structure 1 shown in Figure 1A and Figure 1B, and identical element numbers
Identical element, structure and function are represented, is repeated no more in this.Different from liquid cooling header structure 1, Yu Ben shown in Figure 1A and Figure 1B
In the liquid cooling header structure 1 of embodiment, ontology 12 further includes a storage tank 120, is set to the one side edge of the ontology 12, liquid cooling head
Structure 1 further includes a light-emitting component 16, is set to storage tank 120, and a radiation source is provided to assemble.Therefore, liquid cooling head knot
Structure 1 is in addition to providing bottom plate 13 and radiating to a heat source surface of heat-generating electronic elements, and the light-emitting component 16 that ontology 12 is added is more
A radiation source is provided, with instruction or decorating liquid cold head structure 1.Simultaneously flowing through the refrigerant fluid of 12 each chamber of ontology also contributes to
The thermal energy given birth at 12 loss light-emitting component 16 of ontology.It is emphasized that in previous embodiment, light-emitting component 16 and storage tank 120
Quantity, size and allocation position be not limit feature of present invention condition, can in practical application regard demand adjust, with
Uniform flow path path provides effective radiating efficiency, while having both instruction or the illumination of decoration.
In conclusion the present invention provides a kind of liquid cooling header structure with uniform flow path path, to solve the prior art
The problem that flow passage route is uneven or heat exchanger effectiveness is bad.Wherein liquid cooling header structure is simple, alternatively, simply and firmly group
On heat source surface assigned in electronic component, and refrigerant liquid is sent with uniform flow path path, avoids the bottom contacted with electronic component
Temperature difference is generated on plate and influences the performance of electronic component.In addition, the part-structure of liquid cooling header structure more can be with a light transmission material
Material is constituted, and adds a light-emitting component, makes the same of the thermal energy that the liquid cooling header structure generates in runaway electron element and light-emitting component
When, a light source illumination functions are more provided.
The present invention, which is obtained, arbitrarily to be conceived by those skilled in the art and carries out various modifications, however neither de- such as attached right
It is required that range.
Claims (14)
1. a kind of liquid cooling header structure with uniform flow path path, including：
One upper cover, including a fluid inlet and a fluid outlet, the wherein fluid inlet form a center even with the fluid outlet
Line；
One ontology, is set to the lower section of the upper cover, and include a upper surface, a lower surface, a first chamber, a second chamber,
One third chamber, one the 4th chamber and one the 5th chamber, the wherein first chamber are adjacent to the upper surface and being somebody's turn to do along part
Central line direction extends, and is connected to the fluid inlet, which is adjacent to the lower surface, and along the center line
Direction extends, and is connected to the first chamber, which runs through the upper surface and the lower surface with the 4th chamber, and divides
It is not set to the two opposite sides of the ontology, and is in mirror symmetry by symmetry axis of the center line, the 5th chamber neighbour sets
In the upper surface, and with the fluid outlet, the third chamber and the 4th chamber；And
One bottom plate, including multiple guide channels, one first groove and one second groove, wherein first groove are distinguished with second groove
The two opposite sides of the bottom plate are set to relative to the third chamber and the 4th chamber, multiple guide channel is parallel to each other, and even
It is connected between first groove and second groove, and relative to the second chamber, wherein the second chamber passes through multiple
Guide channel, first groove and second groove and be connected to the third chamber and the 4th chamber, and in forming one on the bottom plate
Uniform flow path with isometric path.
2. the liquid cooling header structure with uniform flow path path, the wherein second chamber are led with multiple as described in claim 1
Ditch is connected, and the third chamber is connected with first groove and second groove respectively with the 4th chamber.
3. the liquid cooling header structure with uniform flow path path as described in claim 1, the wherein bottom plate further includes a sealing group
Part is set between the bottom plate and the ontology, and is located on the periphery of multiple guide channel and first groove and second groove.
4. the liquid cooling header structure with uniform flow path path, the wherein seal assembly include as claimed in claim 3：
One limit channel, it is recessed in the bottom plate, and it is surrounded on the periphery of multiple guide channel and first groove and second groove；
And
One sealing ring is placed in the limit channel.
5. the liquid cooling header structure with uniform flow path path as described in claim 1, the wherein second chamber are oval with one
Poroid orthographic projection extends along the center line direction, and between the third chamber and the 4th chamber.
6. the liquid cooling header structure with uniform flow path path, wherein the third chamber and the 4th chamber as described in claim 1
Room is respectively provided with a trapezoidal orthographic projection, and a long bottom edge of the trapezoidal orthographic projection is connect with multiple guide channel.
7. the liquid cooling header structure with uniform flow path path as claimed in claim 6, the wherein bottom plate include multiple first locks
Solid hole is adjacent to two end sides of a short top margin of the trapezoidal orthographic projection.
8. the liquid cooling header structure with uniform flow path path as claimed in claim 7, the wherein upper cover have multiple second to lock
Solid hole, multiple first locking hole and the ontology for being respectively relative to the bottom plate have multiple third locking holes, respectively relatively
In multiple first locking hole of the bottom plate.
9. the liquid cooling header structure with uniform flow path path as claimed in claim 8, further includes multiple lock members, respectively
By corresponding first locking hole, second locking hole and the third locking hole and the upper cover that locks, the ontology and the bottom plate.
10. the liquid cooling header structure with uniform flow path path as described in claim 1, the wherein bottom plate is by a metal material
It is constituted.
11. the liquid cooling header structure with uniform flow path path as described in claim 1, the wherein upper cover and the ontology are by one
Light-permeable material is constituted.
12. the liquid cooling header structure with uniform flow path path as claimed in claim 11, further includes a light-emitting component, and should
Ontology further includes a storage tank, is set to the one side edge of the ontology, and wherein the light-emitting component is set to the storage tank, to assemble
One radiation source is provided.
It is worn 13. the liquid cooling header structure with uniform flow path path as described in claim 1, the wherein ontology include multiple lockings
Hole is respectively arranged at multiple periphery extensions of the ontology, mutually to be assembled with multiple locking units, and by the liquid cooling header structure
Secure to a heat source surface of an electronic component.
14. as described in claim 1 with uniform flow path path liquid cooling header structure, wherein the 5th chamber be respectively communicated in
The third chamber is to the fluid outlet and the 4th chamber between the fluid outlet, to constitute a confluence runner, the wherein remittance
The section of runner is flowed respectively by the third chamber and the 5th chamber and the 4th chamber and the 5th chamber
Place is to gradually successively decreasing at the fluid outlet and the 5th chamber.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710040035.1A CN108323092B (en) | 2017-01-18 | 2017-01-18 | Liquid cooling header structure with uniform flow path path |
| TW106107670A TWI628998B (en) | 2017-01-18 | 2017-03-09 | Liquid cooling block head having uniform flowing paths |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710040035.1A CN108323092B (en) | 2017-01-18 | 2017-01-18 | Liquid cooling header structure with uniform flow path path |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108323092A true CN108323092A (en) | 2018-07-24 |
| CN108323092B CN108323092B (en) | 2019-07-19 |
Family
ID=62891428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710040035.1A Expired - Fee Related CN108323092B (en) | 2017-01-18 | 2017-01-18 | Liquid cooling header structure with uniform flow path path |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108323092B (en) |
| TW (1) | TWI628998B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112825010A (en) * | 2019-11-21 | 2021-05-21 | 宇瞻科技股份有限公司 | Liquid cooling heat dissipation structure capable of moving and adjusting |
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| US20060002087A1 (en) * | 2004-07-01 | 2006-01-05 | Bezama Raschid J | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
| CN102014598A (en) * | 2010-11-27 | 2011-04-13 | 上海大学 | Prism-array jet micro-channel radiator |
| CN202836282U (en) * | 2011-11-29 | 2013-03-27 | 陈晃涵 | Plate structure type heat exchanger |
| CN103956888A (en) * | 2014-05-21 | 2014-07-30 | 江铃汽车股份有限公司 | Integrated inverter structure |
| CN104754922A (en) * | 2015-03-19 | 2015-07-01 | 江苏大学 | Radiating device of electronic element |
| US20150364767A1 (en) * | 2013-01-31 | 2015-12-17 | Dongfang Electric Corporation | Porous electrode assembly, liquid-flow half-cell, and liquid-flow cell stack |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM273187U (en) * | 2005-03-04 | 2005-08-11 | Thermaltake Technology Co Ltd | Multi-laminar-flow fluid-cooling box |
| TWM501091U (en) * | 2014-12-05 | 2015-05-11 | Asia Vital Components Co Ltd | Structure of support for temperature-equalisation plate |
| TWM532023U (en) * | 2016-08-10 | 2016-11-11 | Taiwan Microloops Corp | Structure of vapor chamber |
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2017
- 2017-01-18 CN CN201710040035.1A patent/CN108323092B/en not_active Expired - Fee Related
- 2017-03-09 TW TW106107670A patent/TWI628998B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060002087A1 (en) * | 2004-07-01 | 2006-01-05 | Bezama Raschid J | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
| CN102014598A (en) * | 2010-11-27 | 2011-04-13 | 上海大学 | Prism-array jet micro-channel radiator |
| CN202836282U (en) * | 2011-11-29 | 2013-03-27 | 陈晃涵 | Plate structure type heat exchanger |
| US20150364767A1 (en) * | 2013-01-31 | 2015-12-17 | Dongfang Electric Corporation | Porous electrode assembly, liquid-flow half-cell, and liquid-flow cell stack |
| CN103956888A (en) * | 2014-05-21 | 2014-07-30 | 江铃汽车股份有限公司 | Integrated inverter structure |
| CN104754922A (en) * | 2015-03-19 | 2015-07-01 | 江苏大学 | Radiating device of electronic element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112825010A (en) * | 2019-11-21 | 2021-05-21 | 宇瞻科技股份有限公司 | Liquid cooling heat dissipation structure capable of moving and adjusting |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201828799A (en) | 2018-08-01 |
| TWI628998B (en) | 2018-07-01 |
| CN108323092B (en) | 2019-07-19 |
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