CN108323034A - Production method, PCB, CCD camera assembly and the terminal of PCB - Google Patents
Production method, PCB, CCD camera assembly and the terminal of PCB Download PDFInfo
- Publication number
- CN108323034A CN108323034A CN201711423372.5A CN201711423372A CN108323034A CN 108323034 A CN108323034 A CN 108323034A CN 201711423372 A CN201711423372 A CN 201711423372A CN 108323034 A CN108323034 A CN 108323034A
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- China
- Prior art keywords
- pcb
- hole
- electronic component
- patch type
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
Abstract
This application provides a kind of production method of PCB, PCB, CCD camera assembly and terminals.The manufacturing method of the printing board PCB includes：Drilling processing is carried out to PCB, forms the through-hole through PCB upper and lower surfaces；In the side wall of the through-hole, the conductive layer being connected with the circuit in the PCB is set；The electronic component of patch type is placed into the through-hole；The welding end of the electronic component of the patch type and the conductive layer are welded together.Originally the electronic component for the patch type for being placed on PCB surface is arranged in the through-hole through PCB upper and lower surfaces technical solution provided by the present application, the electronic component for not only saving the patch type occupies the area and thickness of PCB, and be easily achieved through the through-hole of PCB upper and lower surfaces by the making that drills, it is easy to implement automated production.
Description
Technical field
This application involves print circuit plates making processing technique fields, and more particularly, to a kind of making side of PCB
Method, PCB, CCD camera assembly and terminal.
Background technology
Printed circuit board (printed circuit board, PCB), also known as printed circuit board.It is the support of electronic component
Body, while being also the carrier of electronic component electrical connection, the design and manufacture of PCB will directly influence entire product.
In traditional PCB, surface mounted component SMD is placed on PCB surface, can occupy the certain volumes of PCB.With production
The miniaturization of product and ultrathin, to the appearance and size of PCB (in terms of area and thickness), higher requirements are also raised.For example, with
The deisgn approach miniaturization and ultrathin, the camera module module component important as mobile phone for current phone also face small
The challenge of type and ultrathin, and the volume of PCB will will have a direct impact on the volume size of camera module.Therefore, reduce PCB
Appearance and size become urgent need to resolve the problem of.
Invention content
This application provides a kind of production method of PCB, PCB, CCD camera assembly and terminals, for solving the prior art
There is the big problem of PCB appearance and sizes.
In a first aspect, a kind of manufacturing method of printing board PCB is provided, including：Drilling processing, shape are carried out to PCB
At the through-hole through PCB upper and lower surfaces；In the side wall of the through-hole, the conductive layer being connected with the circuit in the PCB is set；It will
The electronic component of patch type is placed into the through-hole；The welding end of the electronic component of the patch type and the conductive layer are welded
It is connected together.
The electronic component that the patch type of PCB surface will be placed in above-mentioned technical proposal originally is arranged through PCB or more
In the through-hole on surface, the electronic component for not only saving the patch type occupies the area and thickness of PCB, and is made by drilling
Make to be easily achieved through the through-hole of PCB upper and lower surfaces, is easy to implement automated production.
In one possible implementation, the conductive layer is metal coating.
The conductive layer on through-hole side wall is arranged to metal coating in above-mentioned technical proposal, it is a large amount of due to containing in metal
Free electron, it is easier to conductive.Therefore in the electronic component and PCB of the patch type in through-hole easy to implement between other cablings
Electrical connection.
In one possible implementation, the welding end of the electronic component of the patch type in a manner of solder with it is described
Conductive layer welds together.
Electronic component and conductive layer are welded by the way of solder in above-mentioned technical proposal, the heating temperature of solder
Relatively low, operation is easy, it is easy to accomplish the welding between conductive layer.
In one possible implementation, in the welding end of the electronic component by the patch type and the conductive layer
After welding together, the method further includes：Filling seals the sealing of the electronic component of the patch type in the through-hole
Material.
By the gap between the electronic component and through-hole of sealing material sealing paste chip in above-mentioned technical proposal, avoid
The environmental factors such as steam, dust enter, and connection reliability can be improved.
In one possible implementation, the filling in the through-hole seals the electronic component of the patch type
Sealing material, including：Filling seals the sealing material of the electronic component of the patch type in the through-hole in a manner of for dispensing glue
Material.
Using the electronic component of mode for dispensing glue sealing paste chip in through-holes in above-mentioned technical proposal, due to gluing process
It is of low cost, it is widely used, therefore be easily achieved.
Second aspect provides a kind of printing board PCB, and the PCB upper and lower surfaces are provided through on the PCB
Through-hole, the side wall of the through-hole are provided with the conductive layer being connected with the circuit in the PCB, and the through-hole is internally provided with patch
The electronic component of chip, the welding end of the electronic component of the patch type weld together with the conductive layer.
The electronic component that the patch type of PCB surface will be placed in above-mentioned technical proposal originally is arranged through PCB or more
In the through-hole on surface, the electronic component for not only saving the patch type occupies the area and thickness of PCB, and is made by drilling
Make to be easily achieved through the through-hole of PCB upper and lower surfaces, is easy to implement automated production.
In one possible implementation, the conductive layer is metal coating.
The conductive layer on through-hole side wall is arranged to metal coating in above-mentioned technical proposal, it is a large amount of due to containing in metal
Free electron, it is easier to conductive.Therefore in the electronic component and PCB of the patch type in through-hole easy to implement between other cablings
Electrical connection.
In one possible implementation, the welding end of the electronic component of the patch type in a manner of solder with it is described
Conductive layer welds together.
Electronic component and conductive layer are welded by the way of solder in above-mentioned technical proposal, the heating temperature of solder
Relatively low, operation is easy, it is easy to accomplish the welding between conductive layer.
In one possible implementation, the close of the electronic component for sealing the patch type is also filled in the through-hole
Closure material.
By the gap between the electronic component and through-hole of sealing material sealing paste chip in above-mentioned technical proposal, avoid
The environmental factors such as steam, dust enter, and connection reliability can be improved.
In one possible implementation, the sealing material is glue.
Using the electronic component of glue sealing paste chip in through-holes in above-mentioned technical proposal, due to glue sealing patch
The electronic component of formula is of low cost, is widely used, therefore is easily achieved.
The third aspect, provides a kind of printing board PCB, the PCB such as first aspect or first aspect it is any one
Manufacturing method in the possible realization method of kind is made.
Fourth aspect provides a kind of CCD camera assembly, and including any one of second aspect or second aspect such as may
Realization method in PCB and setting square imaging sensor and camera lens on the pcb.
In one possible implementation, the through-hole is located in the region of PCB covered by described image sensor.
Through-hole is to be located at the PCB region covered by imaging sensor in above-mentioned technical proposal, can save electronic component in quilt
The occupied PCB surface product in beside and thickness of the PCB of imaging sensor covering, reduces the plane of entire camera module
Size and height dimension realize camera module miniaturization.
5th aspect, provides a kind of terminal, includes any one possible realization such as fourth aspect or fourth aspect
CCD camera assembly in mode and the processor for controlling the CCD camera assembly.
Since camera module minimizes in above-mentioned technical proposal, to realize miniaturization, the ultrathin of mobile terminal.
Description of the drawings
Fig. 1 is the schematic flow chart of the manufacturing method of PCB provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of PCB provided in an embodiment of the present invention；
Fig. 3 is the electronic component for the patch type placed in the through-hole provided in an embodiment of the present invention through PCB upper and lower surfaces
Schematic diagram；
Fig. 4 is the schematic diagram of CCD camera assembly provided in an embodiment of the present invention；
Fig. 5 is that CCD camera assembly size provided in an embodiment of the present invention reduces effect contrast figure；
Fig. 6 is the schematic diagram of CCD camera assembly module provided in an embodiment of the present invention.
Specific implementation mode
Below in conjunction with attached drawing, the technical solution in the application is described.
An embodiment of the present invention provides a kind of manufacturing method of PCB, the electronic component that can save patch type occupies PCB
Area, and be easily achieved through the through-holes of PCB upper and lower surfaces by drilling to make.
Fig. 1 is the schematic flow chart of the manufacturing method of PCB provided in an embodiment of the present invention.The manufacturing method of Fig. 1 can be with
Including step 110-140, step 110-140 is described in detail separately below.
In step 110, drilling processing is carried out to printing board PCB, forms the through-hole through PCB upper and lower surfaces.
In the step 120, the conductive layer being connected with the circuit in the PCB is set in the side wall of the through-hole.
The embodiment of the present invention is not specifically limited the material of the conductive layer on the through-hole side wall of PCB upper and lower surfaces, can
To be any material that can realize electrical connection with other cablings in PCB.
Optionally, as an example, it can be metal coating that the conductive layer on the through-hole side wall, which is arranged, can be at this
Through-hole side wall metallizes, and forms welding end.
In step 130, the electronic component of patch type is placed into the through-hole.
The embodiment of the present invention, which does not make the electronic component that the patch type inside the through-hole through PCB upper and lower surfaces is arranged, to be had
Body limits, and optionally, as an example, the electronic component of the patch type can be located in the surface installation of PCB surface
Element (surface mount device, SMD), for example, the SMD elements can be surface-mount type resistive element, surface-mount type capacitance
Element, small outline transistor (small-outline transistor, SOT), small outline integrated circuit (small outline
Integrated circuit, SOIC) element, array chip (such as can be ball grid array (ball grid array, BGA)
Element, micro lead frame frame (micro lead frame, MLF) element).
Surface-mount type resistance, capacity cell can include but is not limited at least one of following model：0201、0402、
0603、 0805、1206、1210、2010.SOT transistors can include but is not limited at least one of following model：
SOT23、 SOT143、SOT89.SOIC elements can include but is not limited at least one of following model：SOIC08、
SOIC14、 SOIC16、SOIC18、SOIC20、SOIC24、SOIC28、SOIC32.BGA elements may include：Baton round grating array
Arrange (plastic ball grid array, PBGA), erasable programmable system stores (erasable programmable
Read only memory, EPROM) element, ceramic ball grid array (ceramic plastic ball grid array,
CBGA)。
In step 140, the welding end of the electronic component of the patch type and the conductive layer are welded together.
The welding end of the electronic component of patch type and the conductive layer on the through-hole side wall of PCB upper and lower surfaces can be welded
Together, the embodiment of the present invention is not specifically limited the mode of welding.As an example, laser spray welding skill can be passed through
Conductive layer on the welding end of the electronic component of patch type and the through-hole side wall is welded together that (the laser spray welding technology can by art
It, can be by spraying solder ball to welding position and laser can be applied simultaneously come needed for realizing to be contactless welding
Connection between welding position).
Welding technique can include but is not limited to cast welding, solder, solder brazing, smithwelding, and the present invention does not do this specifically
It limits.For example, can be by way of solder by the welding end of the electronic component of the patch type and leading on the through-hole side wall
Electric layer welds together.
In the embodiment of the present invention, electronic component and conductive layer are welded by the way of solder, the heating temperature of solder
Spend it is relatively low, operation be easy, it is easy to accomplish the welding between conductive layer.It should be noted that in some embodiments, if
Using laser spray welding technology, the embedded such as BGA elements through PCB upper and lower surface through-holes are only limitted to the element without interior row's pin.
Stated differently, since number of arrays more than 2 element because interior row's pin and the conductive layer on the through-hole are apart from too far, cannot achieve
Welding between the pin of element and the through-hole, therefore, it is possible to use the BGA elements of 2 rows or 2 row.
In the embodiment of the present invention, the electronic component that will be placed on the patch type of PCB surface originally is arranged on PCB
The inside of the through-hole of lower surface not only saves the volume (area and thickness) of the PCB of the electronic component occupancy of the patch type,
And be easily achieved through the through-hole of PCB upper and lower surfaces by the making that drills, it is easy to implement automated production.
Optionally, in some embodiments, the conductive layer is metal coating.
The embodiment of the present invention is not specifically limited the material of metal coating, can be any electrically conductive metal.Example
It such as can be copper, can be aluminium, can also be iron.
In the embodiment of the present invention, the conductive layer on through-hole side wall is arranged to metal coating, it is a large amount of due to containing in metal
Free electron, it is easier to it is conductive.Therefore in the electronic component with PCB of the patch type in through-hole easy to implement other cablings it
Between electrical connection.
It optionally, in some embodiments, can be by the welding end of the electronic component of the patch type and the conductive layer
After welding together, sealing is filled at the electronic component of patch type and the gap between the through-hole of PCB upper and lower surfaces
Material.The embodiment of the present invention is not specifically limited sealing material, can be any electronic component for capableing of sealing paste chip with
The material in the gap between the through-hole.As an example, which can be glue, by mode for dispensing glue at this
The sealing material of the electronic component of sealing paste chip is filled in through-hole.
In the embodiment of the present invention, using the electronic component of mode for dispensing glue sealing paste chip in through-holes, due to dispensing work
Skill is of low cost, is widely used, therefore is easily achieved.
In the embodiment of the present invention, pass through the electronic component of sealing material sealing paste chip and leading to through PCB upper and lower surfaces
Gap between hole avoids the environmental factors such as steam, dust and enters in gap, electrical connection reliability can be improved.
The embodiment of the present invention additionally provides a kind of PCB of small volume, and following table on PCB can be provided through on the PCB
The through-hole in face, the side wall of the through-hole can be provided with the conductive layer being connected with the circuit in the PCB, can be set inside the through-hole
It is equipped with the electronic component of patch type, the welding end of the electronic component of the patch type can weld together with the conductive layer.
As shown in Fig. 2, may include through the through-hole 22 of PCB20 upper and lower surfaces, in through-hole 22 on the PCB20
The electronic component 24 of patch type and the conductive layer 26 on 22 side wall of through-hole.
Optionally, in some embodiments, the conductive layer 26 is metal coating.
Conductive layer 26 on through-hole side wall is arranged to metal coating, due to containing a large amount of free electron in metal, more
It is easy conduction.Therefore the electricity in the electronic component 24 and PCB20 of the patch type in through-hole 22 easy to implement between other cablings
Connection.
Optionally, in some embodiments, the welding end of the electronic component 24 of the patch type is in a manner of solder and institute
Conductive layer 26 is stated to weld together.
Electronic component 24 and conductive layer 26 are welded by the way of solder in above-mentioned technical proposal, the heating of solder
Temperature is relatively low, and operation is easy, it is easy to accomplish with the welding between conductive layer 26.
Optionally, in some embodiments, the electronic component 24 for sealing the patch type is also filled in the through-hole 22
Sealing material.
Optionally, in some embodiments, the sealing material is glue.
The electronic component 24 that glue sealing paste chip in through-hole 22 is used in above-mentioned technical proposal, due to glue sealing
The electronic component 24 of patch type is of low cost, is widely used, therefore be easily achieved.
With reference to specific example, the PCB that is described more fully in the embodiment of the present application.It should be noted that the example of Fig. 3
Just for the sake of helping skilled in the art to understand the embodiment of the present application, and the embodiment of the present application have to be limited to illustrated
Concrete numerical value or concrete scene.Those skilled in the art are according to the example of given Fig. 3, it is clear that can carry out various etc.
The modification or variation of valence, such modification or variation are also fallen into the range of the embodiment of the present application.
A kind of bearing fixture of covering one-faced tapes can be used, PCB can be attached on the jig (viscous by adhesive tape
Patch).Conductive layer can be provided on the through-hole side wall of PCB upper and lower surfaces (can be metal coating on side wall, form gold
Belong to welding end).The electronic component of patch type can be embedded into the through-hole through PCB upper and lower surfaces by conventional automatic device
Interior, the electronic component of the same patch type can also rely on the adhesive tape on PCB bearing fixtures to be pasted.It can use again normal
The automatic laser spray welding apparatus of rule is by the welding end of the electronic component of patch type and on the through-hole side wall of PCB upper and lower surfaces
Metal welding end welds together, and realizes the electrical connection of the electronic component and PCB of the patch type.
It is illustrated by taking the surface-mount type resistance of model 0201, capacity cell as an example.As shown in figure 3, element 30 can be
The chip electronic element of model 0201, a length of 0.60 ± 0.05mm of element 30, width be 0.30 ± 0.05mm, a height of
0.30±0.05mm.Size through the through-hole 32 of PCB upper and lower surfaces can be can embedded components 30, such as through-hole 32
Design size can be：Long 0.75mm, width 0.5mm, chamfer radius 0.27mm.The welding end of element 30 can pass through automatic laser
Spray welding apparatus welds together with conductive layer 34, realizes electrical connection.
It is illustrated by taking the surface-mount type resistance of model 0402, capacity cell as an example.As shown in figure 3, element 31 can be
The electronic component of model 0402, a length of 0.85 ± 0.10mm of element 31, width be 0.50 ± 0.10mm, it is a height of 0.30 ±
0.10mm.Design size through the through-hole 33 of PCB upper and lower surfaces can be can embedded components 31, such as through-hole 33 sets
Counting size can be：Long 1.00mm, width 0.70mm, chamfer radius 0.35mm.The welding end of element 31 can be sprayed by automatic laser
Soldering equipment welds together with conductive layer 35, to realize electrical connection.
It is illustrated by taking EPROM elements as an example.As shown in figure 3, element 36 can be EPROM memory elements, run through PCB
The size of the through-hole 37 of upper and lower surface can be can embedded components 36, such as the design size of through-hole 37 can be：It is long
0.93mm, width 0.85mm, chamfer radius 0.08mm.The welding end of element 36 can pass through automatic laser spray welding apparatus and conductive layer
38 weld together, and realize electrical connection.
A kind of PCB of small volume mentioned above, the PCB can be according to some possible realizations in such as Fig. 1 or Fig. 1
The manufacturing method of mode is made, and can also be made according to other methods.The embodiment of the present invention does not do this specific limit
It is fixed.
Above in association with Fig. 2-Fig. 3, PCB provided in an embodiment of the present invention is described in detail.Below in conjunction with Fig. 4-Fig. 6, in detail
CCD camera assembly provided in an embodiment of the present invention is described.
CCD camera assembly may include PCB, imaging sensor and the camera lens of any embodiment description above, with PCB phases
The description of pass may refer to above, and details are not described herein again.
This application provides a kind of CCD camera assemblies of small volume.The CCD camera assembly includes printing board PCB, with
And square on the pcb imaging sensor and camera lens are set, it can be provided through the PCB upper and lower surfaces on the PCB
Through-hole, the side wall of the through-hole can be provided with the conductive layer being connected with the circuit in the PCB, can be provided with inside the through-hole
The welding end of the electronic component of patch type, the electronic component of the patch type can weld together with the conductive layer.
Fig. 4 is the schematic diagram of CCD camera assembly provided in an embodiment of the present invention.As shown in figure 4, the camera group
Part may include：PCB40, imaging sensor 41, camera lens 43, the PCB40 may include through the logical of the PCB upper and lower surfaces
Hole 42, patch type in through-hole 42 42 side wall of electronic component 44 and through-hole on conductive layer 46.
Imaging sensor 41 can be located at the surface of PCB40, and the embodiment of the present invention does not do the type of imaging sensor 41
It is specific to limit, such as can be charge coupled device (charge-coupled device, CCD) imaging sensor, it can also
It is complementary metal oxide semiconductor (complementary metal oxide semiconductor, CMOS) image sensing
Device can also be electro-optical imaging sensors.
Optionally, in some embodiments, CCD camera assembly can also include holder 45 and infrared filter 47, the holder
45 and infrared filter 47 can be located at imaging sensor 41 top.
Optionally, in some embodiments, CCD camera assembly can also include motor 49, and the embodiment of the present invention is to motor 49
Type be not specifically limited, motor for example can be voice coil motor (voice coil motor, VCM), optical zoom horse
It reaches.Optionally, in some embodiments, through-hole 42 being covered by imaging sensor (image sensor) 41 positioned at PCB40
In the region of lid, the plane and height dimension of entire CCD camera assembly can be reduced, realize the miniaturization of CCD camera assembly.
Fig. 5 is that CCD camera assembly size provided in an embodiment of the present invention reduces effect contrast figure.Referring to Fig. 5, in Fig. 5
(a) it can be CCD camera assembly in the prior art, (b) in Fig. 5 can be camera group provided in an embodiment of the present invention
Part.
The imaging sensor 52 of (a) can be located at the surface of PCB50 in Fig. 5, and the electronic component 54 of patch type can be located at
The surface of PCB50, and positioned at the side of imaging sensor 52.In the embodiment of the present invention, (b's) runs through following table on PCB in Fig. 5
The through-hole 51 in face is located in the region of PCB50 covered by imaging sensor 52, and the electronic component 54 of patch type is located at through-hole 51
It is interior, the evacuation for considering the electronic component 54 of holder (holder) 56 pairs of patch type can not had to.Further save patch type
The area and bulk (thickness) for the PCB50 that electronic component 54 occupies.
The effect that CCD camera assembly size provided in an embodiment of the present invention reduces is carried out with reference to specific example detailed
Thin description.
By taking the SMD elements of model 0201 as an example, the width of element 0201 can be 0.3mm, embedded through following table on PCB
After in the through-hole in face, the size (size of CCD camera assembly) of PCB can reduce >=0.3mm.The height of element 0201
Degree can be 0.3mm, which can be positioned at PCB by the region of imaging sensor covering, and the height of imaging sensor can
Think that 0.2mm, the height of entire CCD camera assembly can reduce >=0.1mm.
In the embodiment of the present invention, can will pass through PCB upper and lower surfaces through-hole 51 be located at PCB50 by imaging sensor
In the region of 52 coverings, it is equivalent to the back side that the electronic component 54 of patch type can be arranged in PCB50, can be reduced entire
The plane and height dimension of CCD camera assembly, realize the miniaturization of CCD camera assembly.
With reference to specific example, it is described more fully the Joining Technology of CCD camera assembly provided by the embodiments of the present application
And structure.It should be noted that the example of Fig. 6 is used for the purpose of helping skilled in the art to understand the embodiment of the present application, and have to
By the embodiment of the present application be limited to illustrated by concrete numerical value or concrete scene.Those skilled in the art are according to given Fig. 6's
Example, it is clear that the modification or variation of various equivalences can be carried out, such modification or variation also fall into the model of the embodiment of the present application
In enclosing.
In the embodiment of the present invention, conventional interconnection technique may be used in the coupling of CCD camera assembly and Joining Technology.
Step 1：The electronic component of patch type can be embedded into the through-hole of PCB upper and lower surfaces, and can passed through
Solder welds together the electronic component of patch type and the conductive layer of the through-hole.
Step 2：Electro-optical imaging sensors can be installed on PCB, and complete wire bonding.
Step 3：Can above electro-optical imaging sensors mounting bracket.
Step 4：Focusing motor and camera lens can be installed above holder.
Step 5：Focusing motor and holder can be welded together by welding manner, such as brazing mode can be passed through
Realize electrical connection.
In the embodiment of the present invention, conventional equipment and mounting process may be used in CCD camera assembly, will not bring system
Additional loss.
In the embodiment of the present invention, camera module structure that the step of can passing through above description assembles as shown in fig. 6,
Camera module shown in fig. 6 may include：PCB and image sensor module 60, holder and infrared filter module 61, light
Learn zoom modules 62, camera lens module 63.
In embodiments of the present invention, PCB and image sensor module 60 may include PCB and image described above
Sensor.Holder and infrared filter module 61 may include holder and infrared filter described above, can be located at figure
As 60 top of sensor assembly.Optical zoom module 62 include optics motor described above, can be located at holder with it is infrared
61 top of optical filtering module.Camera lens module 63 includes camera lens described above, can be located at 62 top of optical zoom module.
Described above specifically is may refer to, details are not described herein again.
Terminal provided in an embodiment of the present invention is described below, which may include any embodiment description above
CCD camera assembly and the CCD camera assembly processor.It may refer to above with the relevant description of CCD camera assembly, herein
It repeats no more.
The terminal that the embodiment of the present invention refers to can be the terminal of any required installation camera module, including but not limited to
Mobile station (mobile station, MS), mobile phone (mobile telephone), user equipment (user
Equipment, UE), mobile phone (handset), portable equipment (portable equipment), cellular phone, wireless phone,
Pager, tablet computer, the Internet/intranet access, Web browser, memo pad, calendar and/or global positioning system
Personal digital assistant (the Personal Digital of (global positioning system, GPS) receiver
Assistant, PDA), with the handheld device of wireless communication function, computing device or be connected to radio modem its
Arbitrary shape in its equipment, mobile unit, wearable device or Internet of Things, terminal device and future network in vehicle net
The terminal device etc. of state.
It should be understood that in embodiments of the present invention, term "and/or" is only a kind of incidence relation of description affiliated partner,
Indicate may exist three kinds of relationships.For example, A and/or B, can indicate：Individualism A exists simultaneously A and B, individualism B
These three situations.In addition, character "/" herein, it is a kind of relationship of "or" to typically represent forward-backward correlation object.
In the above-described embodiments, can come wholly or partly by software, hardware, firmware or any other combination real
It is existing.When implemented in software, it can entirely or partly realize in the form of a computer program product.The computer journey
Sequence product includes one or more computer instructions.When loading on computers and executing the computer program instructions, all
Or it partly generates according to the flow or function described in the embodiment of the present invention.The computer can be all-purpose computer, special
Computer, computer network or other programmable devices.The computer instruction can be stored in computer-readable storage
In medium, or from a computer readable storage medium to the transmission of another computer readable storage medium, for example, described
Computer instruction can pass through wired (such as coaxial cable, light from a web-site, computer, server or data center
Fine, Digital Subscriber Line (digital subscriber line, DSL)) or wireless (such as infrared, wireless, microwave etc.) mode
It is transmitted to another web-site, computer, server or data center.The computer readable storage medium can be with
It is any usable medium that computer can access or the server integrated comprising one or more usable mediums, data
The data storage devices such as center.The usable medium can be magnetic medium (for example, floppy disk, hard disk, tape), optical medium (example
Such as digital video disk (digital video disc, DVD)) or semiconductor medium (such as solid state disk (solid
State disk, SSD)) etc..
Those of ordinary skill in the art may realize that lists described in conjunction with the examples disclosed in the embodiments of the present disclosure
Member and algorithm steps can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are studied carefully
Unexpectedly it is implemented in hardware or software, depends on the specific application and design constraint of technical solution.Professional technique people
Member each specific application can be used different methods to achieve the described function, but it is this realize it is not considered that
Beyond scope of the present application.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In addition, each functional unit in each embodiment of the application can be integrated in a processing unit, it can also
It is that each unit physically exists alone, it can also be during two or more units be integrated in one unit.
The above, the only specific implementation mode of the application, but the protection domain of the application is not limited thereto, it is any
Those familiar with the art can easily think of the change or the replacement in the technical scope that the application discloses, and should all contain
It covers within the protection domain of the application.Therefore, the protection domain of the application should be with the scope of the claims
It is accurate.
Claims (14)
1. a kind of manufacturing method of printing board PCB, which is characterized in that including：
Drilling processing is carried out to PCB, forms the through-hole through PCB upper and lower surfaces；
In the side wall of the through-hole, the conductive layer being connected with the circuit in the PCB is set；
The electronic component of patch type is placed into the through-hole；
The welding end of the electronic component of the patch type and the conductive layer are welded together.
2. manufacturing method as described in claim 1, which is characterized in that the conductive layer is metal coating.
3. manufacturing method as claimed in claim 1 or 2, which is characterized in that the welding end of the electronic component of the patch type is with soft
The mode of soldering welds together with the conductive layer.
4. manufacturing method as claimed any one in claims 1 to 3, which is characterized in that in the electricity by the patch type
After the welding end of subcomponent welds together with the conductive layer, the method further includes：
Filling seals the sealing material of the electronic component of the patch type in the through-hole.
5. manufacturing method as claimed in claim 4, which is characterized in that the filling in the through-hole seals the patch type
Electronic component sealing material, including：
Filling seals the sealing material of the electronic component of the patch type in the through-hole in a manner of for dispensing glue.
6. a kind of printing board PCB, which is characterized in that the through-hole of the PCB upper and lower surfaces is provided through on PCB, it is described
The conductive layer that the side wall of through-hole is provided with All other routes are connected in the PCB, the through-hole are internally provided with the electricity of patch type
Subcomponent, the welding end of the electronic component of the patch type weld together with the conductive layer.
7. PCB as claimed in claim 6, which is characterized in that the conductive layer is metal coating.
8. PCB as claimed in claims 6 or 7, which is characterized in that the welding end of the electronic component of the patch type is with solder
Mode welds together with the conductive layer.
9. the PCB as described in any one of claim 6 to 8, which is characterized in that be also filled with the sealing patch in the through-hole
The sealing material of the electronic component of chip.
10. PCB as claimed in claim 9, which is characterized in that the sealing material is glue.
11. a kind of printing board PCB, which is characterized in that the PCB is used as described in any one of claim 1 to 5
The manufacturing method of PCB is made.
12. a kind of CCD camera assembly, which is characterized in that include the PCB as described in any one of claim 6 to 11, Yi Jishe
Set square on the pcb imaging sensor and camera lens.
13. CCD camera assembly as claimed in claim 12, which is characterized in that the through-hole be located at the PCB by the figure
In the region covered as sensor.
14. a kind of terminal, which is characterized in that including CCD camera assembly as described in claim 12 or 13 and for controlling
State the processor of CCD camera assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711423372.5A CN108323034A (en) | 2017-12-25 | 2017-12-25 | Production method, PCB, CCD camera assembly and the terminal of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711423372.5A CN108323034A (en) | 2017-12-25 | 2017-12-25 | Production method, PCB, CCD camera assembly and the terminal of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108323034A true CN108323034A (en) | 2018-07-24 |
Family
ID=62892501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711423372.5A Pending CN108323034A (en) | 2017-12-25 | 2017-12-25 | Production method, PCB, CCD camera assembly and the terminal of PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN108323034A (en) |
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| CN107825444A (en) * | 2016-09-16 | 2018-03-23 | 天津思博科科技发展有限公司 | Surface note machine hand based on machine vision technique |
| CN108769491A (en) * | 2018-07-25 | 2018-11-06 | 宁波舜宇光电信息有限公司 | Microscope base, camera module and electronic equipment |
| WO2020062915A1 (en) * | 2018-09-30 | 2020-04-02 | 华为技术有限公司 | Camera assembly, assembly method therefor, and terminal |
| CN112995436A (en) * | 2019-12-02 | 2021-06-18 | 晋城三赢精密电子有限公司 | Lens module and electronic device |
| CN114515903A (en) * | 2022-03-04 | 2022-05-20 | 中国电子科技集团公司第三十八研究所 | Laser column planting method for CCGA high-lead welded column |
| US20240089571A1 (en) * | 2022-09-08 | 2024-03-14 | Triple Win Technology(Shenzhen) Co.Ltd. | Camera module and manufacturing method thereof |
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| CN107825444A (en) * | 2016-09-16 | 2018-03-23 | 天津思博科科技发展有限公司 | Surface note machine hand based on machine vision technique |
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| WO2020062915A1 (en) * | 2018-09-30 | 2020-04-02 | 华为技术有限公司 | Camera assembly, assembly method therefor, and terminal |
| CN112995436A (en) * | 2019-12-02 | 2021-06-18 | 晋城三赢精密电子有限公司 | Lens module and electronic device |
| CN114515903A (en) * | 2022-03-04 | 2022-05-20 | 中国电子科技集团公司第三十八研究所 | Laser column planting method for CCGA high-lead welded column |
| US20240089571A1 (en) * | 2022-09-08 | 2024-03-14 | Triple Win Technology(Shenzhen) Co.Ltd. | Camera module and manufacturing method thereof |
| US12047662B2 (en) * | 2022-09-08 | 2024-07-23 | Triple Win Technology(Shenzhen) Co. Ltd. | Camera module and manufacturing method thereof |
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