CN108323022A - One kind being applied to PCB manufactures concatenation single flow exposure device and technological process - Google Patents
One kind being applied to PCB manufactures concatenation single flow exposure device and technological process Download PDFInfo
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- CN108323022A CN108323022A CN201810048664.3A CN201810048664A CN108323022A CN 108323022 A CN108323022 A CN 108323022A CN 201810048664 A CN201810048664 A CN 201810048664A CN 108323022 A CN108323022 A CN 108323022A
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000008569 process Effects 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 166
- 238000012546 transfer Methods 0.000 claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 claims abstract description 44
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 19
- 238000007781 pre-processing Methods 0.000 claims abstract description 15
- 230000003647 oxidation Effects 0.000 claims abstract description 5
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 5
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000003028 elevating effect Effects 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 13
- 238000013461 design Methods 0.000 abstract description 5
- 230000003796 beauty Effects 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000016507 interphase Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The invention discloses one kind being applied to PCB manufactures concatenation single flow exposure device and technological process, reduces the puzzlement limited to the dependence of manpower and place.The present invention includes pre-processing module, and coating line/press mold wire module, concatenation single flow exposure module, etching wire module are sequentially connected behind pre-processing module；PCB manufactures plate sundries such as cleaning plate face oxidation when by pre-processing module, and then by coating a tunic on its surface when coating line/press mold wire module, PCB manufacture plates enter concatenation single flow exposure module and carry out image transfer, unexposed area is rinsed and etched when eventually entering into etching wire module, completes circuit and spacing.The concatenation single flow exposure technology flow of the present invention is that more Full-automatic exposure machines concatenate together, collocation assistance for lifting mechanism, transfer mechanism, it completes more machines and synchronizes exposure, place space reduction makes beauty, and because front and back equipment and Full-automatic exposure machine main body line design, reduce the cost that artificial carrying and trolley etc. control tool.
Description
Technical field
The present invention relates to a kind of PCB manufacture plates to manufacture exposure device, more particularly to concatenation is straight used by a kind of PCB manufactures
Streaming exposure technology flow.
Technical background
In PCB manufacture panel manufacturing apparatus field, there are many apparatus and process collocation flows to PCB manufacture plate exposures,
The common exposure technology of industry is all more manual, semi or fully automatic side-by-side independent operations at present；In process of production
It needs overspending manpower and auxiliary to control tool and completes turnover and caching；Again because side-by-side exposure sources put cause workshop place with
Its front and back device space is limited；All affect operating cost and the puzzlement in workshop place.
Invention content
In order to solve the problem above-mentioned, the present invention provides a kind of PCB reasonable in design to manufacture plate exposure technology stream
Journey, installation facility, does not need artificial feeding, reduces the puzzlement limited to the dependence of manpower and place.
Specific technical solution of the present invention is as follows：
One kind being applied to PCB manufacture concatenation single flow exposure devices, and exposure device includes pre-processing module, pre-treatment mould
Coating line/press mold wire module, concatenation single flow exposure module, etching wire module are sequentially connected behind block；
PCB manufactures plate by pre-processing module, coating line/press mold wire module, concatenation single flow exposure module, etching wire module
Line is concatenated, PCB manufactures plate sundries such as cleaning plate face oxidation when by pre-processing module, and then passes through coating line/film-pressing line
A tunic is coated on its surface when module, PCB manufacture plates enter concatenation single flow exposure module (Full-automatic exposure machine) and carry out shadow
Unexposed area is rinsed and is etched as transfer, when eventually entering into etching wire module and completes circuit and spacing；
It is that more Full-automatic exposure machine combinations are equipped with additional vertical elevating mechanism, horizontal sucker to concatenate single flow exposure module
Transfer mechanism completes PCB manufactures with its front and back equipment (pre-processing module, coating line/press mold wire module, etching wire module) line
Plate, line production, before and after more Full-automatic exposure machines and its between be equipped with vertical lifting mechanism, above more Full-automatic exposure machines
Equipped with horizontal sucker transfer mechanism, connected by horizontal sucker transfer mechanism between front and back neighboring vertical elevating mechanism, interphase
Adjacent vertical lifting mechanism is sequentially connected.
Further, in some embodiments, single flow exposure module is concatenated sequentially to be put before and after more Full-automatic exposure machines
It puts；
Concatenate the first Full-automatic exposure machine, the second fully automatic exposure of single flow exposure module (Full-automatic exposure machine system)
Machine etc. is sequentially overlapped combination；
It includes the first vertical lifting mechanism to concatenate single flow exposure module, and the first vertical lifting mechanism top connects the first water
The first Full-automatic exposure machine, the first Full-automatic exposure machine is arranged below in flat sucker transfer mechanism, first level sucker transfer mechanism
The second vertical lifting mechanism, third vertical lifting mechanism are connected below, and third vertical lifting mechanism top connection second is horizontal to inhale
Disk transfer mechanism, the second horizontal sucker transfer mechanism are arranged below the second Full-automatic exposure machine, behind the second Full-automatic exposure machine
The 4th vertical lifting mechanism is connected, etching wire module is connected behind the 4th vertical lifting mechanism.
Further, in some embodiments, first level sucker transfer mechanism, the second horizontal sucker transfer mechanism structure phase
Together, horizontal sucker transfer mechanism includes that conveying supports, and the first sucker is arranged below in conveying support, and conveying support is equipped with second above
Sucker；
First sucker, the second sucker structure are identical, and the first sucker, the second sucker are equipped with suction disc box, and suction disc box side connects
Mounting base is connect, mounting base is equipped with flexible motor, and the rack to stretch in motor connecting sliding rail, suction disc box side is stretched equipped with sucker
Guide rod, belt conveyor connect suction disc box by mounting base, and mounting base is threaded through sucker and stretches on guide rod, and flexible motor passes through installation
Seat connection suction disc box, horizontal transfer mechanism conveying support are equipped with conveying motor, and conveying motor connects mounting base by belt.
Further, in some embodiments, the first vertical lifting mechanism, the second vertical lifting mechanism, third vertical lift
Mechanism, the 4th vertical lifting mechanism structure are identical, and vertical lifting mechanism includes rack, and central rack is equipped with workbench, workbench
Motor is arranged below, motor connects chain, belt by gear, and workbench is equipped with transmission group wheel, and transmission group wheel passes through belt
Motor is connected, rack is equipped with the vertical pivot guide rod for keeping workbench steadily to lift up and down, and motor passes through chain connecting working table.
One kind being applied to PCB manufacture concatenation single flow exposure technology flows, and technological process is as follows：
S1, PCB manufacture plate sundries such as cleaning plate face oxidation when by pre-processing module；
S2 and then by its surface coating a tunic when coating line/press mold wire module；
S3, PCB manufacture plate enter concatenation single flow exposure module (Full-automatic exposure machine) and carry out image transfer；Concatenate direct current
Formula exposure module is that the combination of more Full-automatic exposure machines is equipped with additional vertical elevating mechanism, horizontal sucker transfer mechanisms, and before it
Equipment (pre-processing module, coating line/press mold wire module, etching wire module) line completes PCB and manufactures plate afterwards, and line production is more
Before and after platform Full-automatic exposure machine and its between be equipped with vertical lifting mechanism, horizontal sucker is equipped with above more Full-automatic exposure machines and is moved
Mounted mechanism；
Single flow exposure module is concatenated sequentially to be put before and after more Full-automatic exposure machines；Coating line/press mold wire module is (preceding
Face equipment) output vertical lifting mechanism, horizontal sucker transfer mechanism of the PCB manufacture plates by collocation, be assigned to correspondence one by one
Concatenation type Full-automatic exposure machine in production；
The PCB manufacture plates that S4, Full-automatic exposure machine have produced are also by vertical lifting mechanism, horizontal sucker transfer mechanism
Distribution is output to etching wire module (back equipment) one by one again；Unexposed area is rinsed and lost when eventually entering into etching wire module
It carves, completes circuit and spacing.
Further, in some embodiments, it in the step S3, hangs down by first when first PCB manufacture plate is come in
It goes straight up to descending mechanism and is sent into the first fully automatic exposure machine operation, operation is completed to be vertically moved up or down by the second vertical lifting mechanism, third
Mechanism is sent to the second horizontal sucker transfer mechanism, and the second horizontal sucker transfer mechanism is transported to the 4th vertical lifting mechanism and is put into again
Next equipment etches wire module operation；
When second PCB manufacture plate is come in, first level sucker transfer mechanism is sent by the first vertical lifting mechanism,
The second fully automatic exposure machine operation is sent by the second vertical lifting mechanism, third vertical lifting mechanism again, operation is completed by the
Four vertical lifting mechanisms are output to next equipment etching wire module operation；
Second vertical lifting mechanism, third vertical lifting mechanism the two vertical lifting mechanism relays conveying, having exposed
It distinguishes and exports with unexposed PCB manufacture plates.
One kind of the present invention being applied to PCB manufacture concatenation single flow exposure technology flows, is applied to PCB manufacture concatenation direct currents
Formula exposure technology flow is that more Full-automatic exposure machines are serially connected and the design of the theory of its front and back equipment line, concatenates direct current
It is same that formula exposure technology flow is more Full-automatic exposure machines concatenations together collocation assistance for lifting mechanism, transfer mechanism completes more machines
Step exposure.The technological process of the present invention is easy, and place space reduction makes beauty, and because of front and back equipment and fully automatic exposure owner
Body line designs, and reduces the cost that artificial carrying and trolley etc. control tool.
The present invention is different from prior art, and using more side-by-side fully automatic exposure machine equipments, (it is very big that side-by-side places needs
The space of width), PCB manufactures plate exposure technology is designed as more Full-automatic exposure machines and connects being aligned by the present invention, and concatenation is together
Arrange in pairs or groups assistance for lifting, transfer mechanism and with its front and back device signal connecting line construction.Completely new technique make its beauty, and because equipment it
Between signal link and concatenation be placed in together；Concatenation single flow exposure module is placed in dustless operating room, can improve people significantly
The puzzlement that the carrying of power and mill construction are limited place.
Description of the drawings
Fig. 1 is the structural schematic diagram of concatenation single flow exposure module of the embodiment of the present invention；
Fig. 2 is the schematic top plan view of concatenation single flow exposure module of the embodiment of the present invention；
Fig. 3 is that the embodiment of the present invention is applied to concatenation single flow exposure technology line flow chart；
Fig. 4 is the structural schematic diagram of the horizontal sucker transfer mechanism of the embodiment of the present invention；
Fig. 5 is the structural schematic diagram of suction disc box of embodiment of the present invention part；
Fig. 6 is the structural schematic diagram of vertical lifting mechanism of embodiment of the present invention part；
Fig. 7 is the process flow diagram of the embodiment of the present invention.
It is marked in figure：
First level sucker transfer mechanism 11, the second horizontal sucker transfer mechanism 12, the first vertical lifting mechanism 13, first
Full-automatic exposure machine 14, the second vertical lifting mechanism 15, third vertical lifting mechanism 16, the second Full-automatic exposure machine 17, the 4th
Vertical lifting mechanism 18, horizontal transfer mechanism conveying support 27, the first sucker 28, the second sucker 29, pre-processing module 31, coating
Line/press mold wire module 32, concatenation single flow exposure module 33 etch wire module 34, and sucker stretches guide rod 51, and suction disc box 52 is defeated
Belt 53 is sent, sliding rail 54, rack 55, stretch motor 56, mounting base 57, conveys motor 58, chain 61, belt 62, rack 63, biography
Defeated wheel 64, motor 65, workbench 66, vertical pivot guide rod 68.
Specific implementation mode
Carry out the embodiment that the present invention will be described in detail below in conjunction with accompanying drawings and embodiments, thereby how the present invention is applied
Technological means solves technical problem and reaches the realization process of technical effect to fully understand and implement.
As shown in figure 3, the embodiment of the present invention, which is applied to a kind of PCB manufacture plates, concatenates single flow exposure technology flow, PCB systems
Plate is made to be concatenated by pre-processing module 31, coating line/press mold wire module 32, concatenation single flow exposure module 33, etching wire module 34
Line, PCB manufactures plate sundries such as cleanable plate face oxidation when by pre-processing module 31, and then passes through coating line/film-pressing line
A tunic can be coated on its surface when module 32, PCB manufacture plates enter concatenation single flow exposure module 33 (Full-automatic exposure machine)
Image transfer is carried out, unexposed area is rinsed and etched when eventually entering into etching wire module 34, completes circuit and spacing.
As shown in Figures 1 and 2, concatenation single flow exposure module 33：It hangs down by first when first PCB manufacture plate is come in
It goes straight up to descending mechanism 13 and is sent into 14 operation of the first Full-automatic exposure machine, operation completion can pass through the second vertical lifting mechanism 15, third
Vertical lifting mechanism 16 is sent to the second horizontal sucker transfer mechanism 12, and the second horizontal sucker transfer mechanism 12 is transported to the 4th and hangs down again
It goes straight up to descending mechanism 18 and is put into next equipment operation.
First level sucker transfer mechanism is sent by the first vertical lifting mechanism 13 when second PCB manufacture plate is come in
11, then 17 operation of the second Full-automatic exposure machine is sent by the second vertical lifting mechanism 15, third vertical lifting mechanism 16, operation is complete
It is output to next equipment operation at by the 4th vertical lifting mechanism 18.
Second vertical lifting mechanism 15, third vertical lifting mechanism 16 the two vertical lifting mechanism relays conveying,
Exposure is distinguished with unexposed PCB manufacture plates and is exported.
Further, in one embodiment, as shown in Fig. 2, the first vertical lifting mechanism 13 connection first level sucker moves
Mounted mechanism 11, first level sucker transfer mechanism 11 are located at 14 top of the first Full-automatic exposure machine, the second horizontal sucker transfer machine
Structure 12 is located at the top of the second Full-automatic exposure machine 17, first level sucker transfer mechanism 11 by the second vertical lifting mechanism 15,
Third vertical lifting mechanism 16 connects the second horizontal sucker transfer mechanism 12.
As shown in Figure 1, Figure 2, Figure 4 shows, the second horizontal sucker transfer mechanism 12 connects the 4th vertical lifting mechanism 18, the first water
11 and second horizontal sucker transfer mechanism 12 (horizontal sucker transfer mechanism) of flat sucker transfer mechanism is two layers of bi-directional design, in water
27 top and bottom of translation mounted mechanism conveying support are respectively provided with the first sucker 28, and the second sucker 29 passes in and out object to dredge PCB manufacture plates
Stream.
Further, in one embodiment, as shown in figure 5, first level sucker transfer mechanism 11, the second horizontal sucker move
12 structure of mounted mechanism is identical：Horizontal sucker transfer mechanism includes conveying support 27, the first sucker 28,29 lateral layout of the second sucker
There is flexible motor 56, flexible motor 56 can be such that the first sucker 28, the second sucker 29 is moved forward and backward in sliding rail 54 by rack 55,
Sliding rail 54 can ensure that the first sucker 28, the second sucker 29 are elastic on one wire, and flexible motor 56 can drive suction disc box
52 are moved to sucker and stretch guide rod 51 other end from sucker 51 one end of guide rod of stretching.
Horizontal sucker transfer mechanism also includes the flexible guide rod 51 of sucker, suction disc box 52, belt conveyor 53.Belt conveyor 53 is logical
It crosses mounting base 57 and connects suction disc box 52,52 both sides of suction disc box are equipped with the flexible guide rod 51 of sucker, and it is flexible that mounting base 57 is threaded through sucker
On guide rod 51, mounting base 57 is equipped with flexible motor 56, and the motor 56 that stretches passes through 57 inside connection suction disc box 52 of mounting base.First inhales
Disk 28, the second sucker 29 are equipped with suction disc box 52.Horizontal transfer mechanism conveying support 27 is equipped with conveying motor 58, conveys motor
58 connect mounting base 57 by belt.Vertical lifting mechanism has the function of that vertical lift is transplanted with horizontal.
Further, in one embodiment, as shown in Fig. 2, PCB manufactures plate come in can be by the first vertical lifting mechanism 13
Plate is conveyed into 11 operation of first level sucker transfer mechanism, operation completion vertically rises through the second vertical lifting mechanism 15, third
Descending mechanism 16 is promoted to designated position, and the first sucker 28 of the second horizontal sucker transfer mechanism 12 stretches out fishplate bar and moves to specific bit
Set that (the second sucker 29 of the second horizontal sucker transfer mechanism 12 moves on to armed bit due to the first sucker 28 leaves fishplate bar position simultaneously
Set), plate is finally taken by the 4th vertical lifting mechanism 18 and is sent to next equipment.
Further, in one embodiment, as shown in fig. 6, vertical lifting mechanism includes rack 63,63 middle part of rack is equipped with
Motor 65 is arranged below in workbench 66, workbench 66, and motor 65 connects chain 61, belt 62 by gear, set on workbench 66
There are transmission group wheel 64, transmission group wheel 64 to connect motor 65 by belt 62, motor 65 drives transmission group wheel 64 to rotate, passes through transmission
64 rotation of group wheel makes PCB manufacture plates be moved on transmission group wheel 64.Rack 63, which is equipped with, keeps about 66 workbench steadily to lift
Vertical pivot guide rod 68, motor 65 rotated by chain 61 by 61 connecting working table 66 of chain, makes workbench 66 in vertical pivot guide rod
Smoothly make elevating movement on 68.All vertical lifting mechanisms：First vertical lifting mechanism 13, the second vertical lifting mechanism
15, third vertical lifting mechanism 16, the 4th vertical lifting mechanism 18, using the above identical structure.
When the first Full-automatic exposure machine 14 just in operation when, PCB manufacture plate can be promoted by the first vertical lifting mechanism 13
To designated position, the first sucker 28 of first level sucker transfer mechanism 11 stretches out fishplate bar and moves to the second vertical lifting mechanism 15
(the second sucker 29 of first level sucker transfer mechanism 11 moves on to armed bit due to the first sucker 28 leaves fishplate bar position simultaneously
Set), the second vertical lifting mechanism 15, which is got, drops to transfer position after plate, and is sent by third vertical lifting mechanism 16 second complete
17 operation of automatic exposure machine can be output to next after the completion of 17 operation of the second Full-automatic exposure machine through the 4th vertical lifting mechanism 18
Equipment manufactures plate into effluent stream to dredge PCB.
The present invention can be applied to how general Full-automatic exposure machine.One kind of the present invention being applied to concatenation single flow and exposes work
Skill flow concatenates more Full-automatic exposure machine combinations even being aligned.Single flow exposure is that PCB manufactures vertical liter of the plate by collocation
Its direct current (direct) is assigned to exposure in corresponding exposure sources by descending mechanism, horizontal sucker transfer mechanism one by one.Single flow exposes
Light technology is that vertical lifting mechanism, the horizontal sucker transfer mechanism that fully automatic exposure machine equipment itself is arranged in pairs or groups with it are exposed with full-automatic
Equipment line production control before and after ray machine.
Above example only expresses several preferred embodiments of the present invention, and the description thereof is more specific and detailed should
Understand that the present invention is not limited to form disclosed herein, be not to be taken as excluding other embodiments, and can be used for each
Kind of other combinations, modification and environment, and above-mentioned introduction or related field can be passed through in the scope of the invention is set forth herein
Technology or knowledge are modified, and therefore can not be interpreted as limitation of the scope of the invention.It should be pointed out that for ability
For the those of ordinary skill in domain, without departing from the inventive concept of the premise, various modifications and improvements can be made, ability
The modifications and changes that domain personnel are carried out do not depart from the spirit and scope of the present invention, these belong to appended claims of the present invention
Protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. one kind being applied to PCB manufacture concatenation single flow exposure devices, exposure device includes pre-processing module (31), feature
It is, the pre-processing module (31) is sequentially connected coating line/press mold wire module (32), concatenation single flow exposure module below
(33), etching wire module (34)；
It is that more Full-automatic exposure machine combinations are equipped with additional vertical elevating mechanism, horizontal sucker to concatenate single flow exposure module (33)
Transfer mechanism, before and after more Full-automatic exposure machines and its between be equipped with vertical lifting mechanism, set above more Full-automatic exposure machines
There is horizontal sucker transfer mechanism, is connected by horizontal sucker transfer mechanism between front and back neighboring vertical elevating mechanism, it is intermediate adjacent
Vertical lifting mechanism is sequentially connected.
2. a kind of PCB that is applied to according to claim 1 manufactures concatenation single flow exposure device, which is characterized in that described
The first Full-automatic exposure machine (14), the second Full-automatic exposure machine (17) of concatenation single flow exposure module (33) are front and back sequentially to be put
It puts；
It includes the first vertical lifting mechanism (13) to concatenate single flow exposure module (33), and the first vertical lifting mechanism (13) top connects
First level sucker transfer mechanism (11) is connect, the first Full-automatic exposure machine is arranged below in first level sucker transfer mechanism (11)
(14), the first Full-automatic exposure machine (14) connects the second vertical lifting mechanism (15), third vertical lifting mechanism (16) below, the
Three vertical lifting mechanisms (16) top connects the second horizontal sucker transfer mechanism (12), under the second horizontal sucker transfer mechanism (12)
Face is equipped with the second Full-automatic exposure machine (17), and the second Full-automatic exposure machine (17) connects the 4th vertical lifting mechanism (18) below,
Connection etches wire module (34) to 4th vertical lifting mechanism (18) below.
3. a kind of PCB that is applied to according to claim 2 manufactures concatenation single flow exposure device, which is characterized in that described
First level sucker transfer mechanism (11), the second horizontal sucker transfer mechanism (12) structure are identical, horizontal sucker transfer mechanism packet
(27) are supported containing conveying, the first sucker (28) is arranged below in conveying support (27), and conveying support (27) is equipped with the second sucker above
(29)；
First sucker (28), the second sucker (29) structure are identical, and the first sucker (28), the second sucker (29) are equipped with suction disc box
(52), suction disc box (52) side connection mounting base (57), mounting base (57) are equipped with flexible motor (56), stretch motor (56) even
The rack (55) in sliding rail (54) is connect, suction disc box (52) side is equipped with the flexible guide rod (51) of sucker, and belt conveyor (53) passes through peace
It fills seat (57) and connects suction disc box (52), mounting base (57) is threaded through sucker and stretches on guide rod (51), and flexible motor (56) passes through peace
It fills seat (57) and connects suction disc box (52), horizontal transfer mechanism conveying support (27) is equipped with conveying motor (58), conveys motor
(58) mounting base (57) is connected by belt.
4. a kind of PCB that is applied to according to claim 2 manufactures concatenation single flow exposure device, which is characterized in that described
First vertical lifting mechanism (13), the second vertical lifting mechanism (15), third vertical lifting mechanism (16), the 4th vertical conveyor
Structure (18) structure is identical, and vertical lifting mechanism includes rack (63), and workbench (66), workbench (66) are equipped in the middle part of rack (63)
Motor (65) is arranged below, motor (65) connects chain (61), belt (62) by gear, and workbench (66) is equipped with transmission group
It takes turns (64), transmission group wheel (64) connects motor (65) by belt (62), and rack (63), which is equipped with, keeps workbench (66) up and down
The vertical pivot guide rod (68) steadily lifted, motor (65) pass through chain (61) connecting working table (66).
5. a kind of technological process being applied to PCB manufacture concatenation single flow exposure devices as described in any one of Claims 1 to 4,
It is characterized in that, technological process is as follows：
S1, PCB manufacture plate sundries such as cleaning plate face oxidation when by pre-processing module (31)；
S2 and then by its surface coating a tunic when coating line/press mold wire module (32)；
S3, PCB manufacture plate enter concatenation single flow exposure module (33) and carry out image transfer；Concatenate single flow exposure module (33)
It is equipped with additional vertical elevating mechanism, horizontal sucker transfer mechanism for more Full-automatic exposure machine combinations, with its front and back equipment：Preceding place
Manage module (31), coating line/press mold wire module (32), etching wire module (34)) line completion PCB manufacture plates, line production；
Single flow exposure module (33) is concatenated sequentially to be put before and after more Full-automatic exposure machines；Coating line/press mold wire module
(32) vertical lifting mechanism, horizontal sucker transfer mechanism of the PCB manufacture plates exported by collocation, are assigned to corresponding string one by one
Connect production in formula Full-automatic exposure machine；
PCB that S4, Full-automatic exposure machine have produced manufacture plate be also by vertical lifting mechanism, horizontal sucker transfer mechanism again by
A distribution is output to etching wire module (34)；Unexposed area is rinsed and etched when eventually entering into etching wire module (34), it is complete
At circuit and spacing.
6. technological process according to claim 5, which is characterized in that in the step S3, when first PCB manufacture plate into
The first Full-automatic exposure machine (14) operation is sent by the first vertical lifting mechanism (13) when coming, operation is completed vertical by second
Elevating mechanism (15), third vertical lifting mechanism (16) are sent to the second horizontal sucker transfer mechanism (12), and the second horizontal sucker moves
Mounted mechanism (12) is transported to the 4th vertical lifting mechanism (18) and is put into next equipment etching wire module (34) operation again；
When second PCB manufacture plate is come in, first level sucker transfer mechanism is sent by the first vertical lifting mechanism (13)
(11), then the second Full-automatic exposure machine (17) is sent by the second vertical lifting mechanism (15), third vertical lifting mechanism (16) to make
Industry, operation are completed to be output to next equipment etching wire module (34) operation by the 4th vertical lifting mechanism (18)；
Second vertical lifting mechanism (15), third vertical lifting mechanism (16) the two vertical lifting mechanism relays conveying,
Exposure is distinguished with unexposed PCB manufacture plates and is exported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810048664.3A CN108323022A (en) | 2018-01-18 | 2018-01-18 | One kind being applied to PCB manufactures concatenation single flow exposure device and technological process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810048664.3A CN108323022A (en) | 2018-01-18 | 2018-01-18 | One kind being applied to PCB manufactures concatenation single flow exposure device and technological process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108323022A true CN108323022A (en) | 2018-07-24 |
Family
ID=62895121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810048664.3A Pending CN108323022A (en) | 2018-01-18 | 2018-01-18 | One kind being applied to PCB manufactures concatenation single flow exposure device and technological process |
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| Country | Link |
|---|---|
| CN (1) | CN108323022A (en) |
Cited By (3)
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| CN109587957A (en) * | 2019-01-07 | 2019-04-05 | 源能智创(江苏)半导体有限公司 | A kind of production line of pcb board |
| CN109729647A (en) * | 2019-02-28 | 2019-05-07 | 东莞市威力固电路板设备有限公司 | Production system suitable for PCB ectonexine exposure process |
| TWI694315B (en) * | 2018-08-31 | 2020-05-21 | 川寶科技股份有限公司 | Double stage exposure machine |
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