CN108323010A - A kind of PCB multilayer board sawing sheet operating system - Google Patents

A kind of PCB multilayer board sawing sheet operating system Download PDF

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Publication number
CN108323010A
CN108323010A CN201810072478.3A CN201810072478A CN108323010A CN 108323010 A CN108323010 A CN 108323010A CN 201810072478 A CN201810072478 A CN 201810072478A CN 108323010 A CN108323010 A CN 108323010A
Authority
CN
China
Prior art keywords
edging
speed
plate thickness
pcb
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810072478.3A
Other languages
Chinese (zh)
Inventor
管术春
段绍华
吴伟辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Original Assignee
JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd filed Critical JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Priority to CN201810072478.3A priority Critical patent/CN108323010A/en
Publication of CN108323010A publication Critical patent/CN108323010A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting

Abstract

The invention belongs to wiring board manufacture fields, and in particular to a kind of PCB multilayer board sawing sheet operating system.It is from operation initiating terminal：Tiered warehouse facility, cutting machine, edging fillet line, washing hair dryer, horizontal oven, perforating press, unloader, AGV warehouse compartments are connected by I/O signal two-by-two between neighbouring device；Three-dimensional warehouse compartment is the equipment of granting and the transport of planning as a whole plate storehouse material；Cutting machine is to cut form by lock to cut PCB copper-clad plates；Edging round-corner cutter is the equipment for carrying out edging or fillet to pcb board by edging knife or fillet knife；Horizontal oven involves high temperature by infrared light and is toasted to pcb board, discharges the stress of pcb board.The method of the invention realizes pcb boards to be automatically finished sawing sheet processing procedure, is greatly improved production efficiency；It solves the common problem of current circuit board industry, realizes the more long term growth of PCB industries, there is great market prospects and economic value.

Description

A kind of PCB multilayer board sawing sheet operating system
Technical field
The invention belongs to wiring board manufacture fields, and in particular to a kind of PCB multilayer board sawing sheet operating system.
Background technology
Currently, in traditional PCB production technology, traditional work mode is：Personnel lead material (copper-clad plate, Paper baseplate, aluminium Piece) → cutting machine carries out cutting one by one → it is artificial be carried to round-corner cutter and carry out fillet → artificial blanking be carried to transport vehicle → artificial Be transported to edge polisher region → artificial loading → edging → board-washing and drying → unloader receives plate → be manually carried to transport vehicle → Transport to oven → artificial progress heap poststack carries out baking sheet → artificial blanking and is carried to transport vehicle → transport to punch area → people again Work is punched out operation → artificial blanking and is carried to transport vehicle → transport to line side storehouse.
It is well known that the above method includes the preparation of auxiliary material from sawing sheet to drilling, it is very complicated troublesome step Suddenly, the problems such as not only people's consumption is larger, but also material rotation repeats, often causes quality abnormal, so with Chinese intelligence The it is proposed of manufacture realizes that intelligence manufacture is also the problem for urgently implementing to solve to PCB industries.
Invention content
For this purpose, technical problem to be solved by the present invention lies in the bottleneck for overcoming the prior art, it is a kind of novel to propose PCB multilayer board sawing sheet operating system.
In order to solve the above technical problems, the invention discloses a kind of PCB multilayer board sawing sheet operating system, the system is from work Industry initiating terminal sequence is：
Tiered warehouse facility, cutting machine, edging fillet line, washing hair dryer, horizontal oven, perforating press, unloader, AGV warehouse compartments, It is connected two-by-two by I/O signal between neighbouring device；
The solid warehouse compartment is the equipment of granting and the transport of planning as a whole plate storehouse material；
The cutting machine is to cut form by lock to cut PCB copper-clad plates.
The edging round-corner cutter is the equipment for carrying out edging or fillet to pcb board by edging knife or fillet knife；
The horizontal oven involves high temperature by infrared light and is toasted to pcb board, discharges the stress of pcb board；
The perforating press is punched out pcb board, is aligned convenient for inner layer exposure machine；
The unloader is to be overlapped the plate of pan feeding by mechanical arm, is then transported to AGV warehouse compartments.
Preferably, the cutting speed of the cutting machine is：
As plate thickness >=2.4mm, speed of cut 6m/min；
As plate thickness 1.5-2.4mm, speed of cut 8m/min；
As plate thickness 1.0-1.5mm, speed of cut 9m/min；
As plate thickness ＜ 1.0mm, speed of cut 10m/min.
Preferably, the edging parameter：
As plate thickness >=2.4mm, edging speed is 5m/min；
As plate thickness 1.5-2.4mm, edging speed is 6.5m/min；
As plate thickness 1.0-1.5mm, edging speed is 8m/min；
As plate thickness ＜ 1.0mm, edging speed is 9m/min.
Preferably, the washing pressure 1.5kg/cm of the washing hair dryer2, washing speed 6m/min.
Preferably, the baking temperature of the oven is 160-180 DEG C.
Preferably, the parameter of the perforating press is：
As plate thickness >=2.4mm, punching speed is 4m/min；
As plate thickness 1.5-2.4mm, punching speed is 4.5m/min；
As plate thickness 1.0-1.5mm, punching speed is 5m/min；
As plate thickness ＜ 1.0mm, punching speed is 6m/min.
Preferably, lead plug nail hole machine is also associated with after the cutting machine.
More preferably, each equipment of the system is connect with EAP systems.
The above technical solution of the present invention has the following advantages over the prior art, solves process integration problems, will be extra Man-handling of materials material flow removal, and can realize line production flow be integrated together, accomplish production of working continuously.Flow How system signal transmission between equipment is completed signal transmission to next station, and in fact when certain single technique is completed The now automatic identification of a station and automatic production；It solves the common problem of current circuit board industry, realizes PCB industries more Long term growth has great market prospects and economic value.
Specific implementation mode
Embodiment
Embodiment 1 is present embodiment discloses a kind of novel PCB multilayer board sawing sheet operating system, and the system is from operation Beginning is sequentially：
Novel PCB multilayer board bus connection method includes tiered warehouse facility, cutting machine, edging fillet line, washing hair dryer, level Oven, perforating press, unloader are connect by I/O signal and with EAP systems, are realized wire body automatic running, are completely abolished artificial work Industry flow.
Three-dimensional warehouse compartment refers to planning as a whole the granting and transport of plate storehouse material by bucket management system；
Cutting machine is that one kind by lock cuts form size cuts PCB copper-clad plates as required, is then transported to lead plug Nail hole machine；
Edging round-corner cutter is to carry out edging and fillet to pcb board by particular tool (edging knife, fillet knife)；
It is that the plate after edging is cleaned and dried up to wash hair dryer, ensures product quality；
Horizontal oven involves high temperature by infrared light and is toasted to pcb board, discharges the stress of pcb board, ensures product Stablize；
Perforating press be it is a kind of pcb board is punched out using particular mold, aligned convenient for inner layer exposure machine；
Unloader refer to it is a kind of the plate of pan feeding is overlapped as required by mechanical arm, then transport to AGV warehouse compartments, It is transported to line side storehouse by AGV vehicles.
Warehouse on demand automatic blending and transport to cutting machine → sawing sheet → edging fillet → board-washing and drying → baking sheet → Punching → receipts plate → AGV is transported to line side storehouse.
Wherein, the parameter of all parts is as follows：
Cutting machine parameter：
Plate thickness Sawing sheet speed
≥2.4mm 6m/min
(1.5-2.4mm being free of) 8m/min
(1.0-1.5mm being free of) 9m/min
＜ 1.0mm 10m/min
Edging parameter：
Plate thickness Edging speed
≥2.4mm 5m/min
(1.5-2.4mm being free of) 6.5m/min
(1.0-1.5mm being free of) 8m/min
＜ 1.0mm 9m/min
Wash hair dryer：
Wash pressure 1.5kg/cm2, washing speed 6m/min.
Oven：
Stove sequence Temperature
1 160℃
2 180℃
3 180℃
4 180℃
5 180℃
6 160℃
Punching parameter：
Plate thickness Punching speed
≥2.4mm 4m/min
(1.5-2.4mm being free of) 4.5m/min
(1.0-1.5mm being free of) 5m/min
＜ 1.0mm 6m/min
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or It changes still within the protection scope of the invention.

Claims (8)

1. a kind of PCB multilayer board sawing sheet operating system, which is characterized in that the system is from operation initiating terminal sequence：
Tiered warehouse facility, cutting machine, edging fillet line, washing hair dryer, horizontal oven, perforating press, unloader, AGV warehouse compartments are adjacent It is connected two-by-two by I/O signal between equipment；
The solid warehouse compartment is the equipment of granting and the transport of planning as a whole plate storehouse material；
The cutting machine is to cut form by lock to cut PCB copper-clad plates.
The edging round-corner cutter is the equipment for carrying out edging or fillet to pcb board by edging knife or fillet knife；
The horizontal oven involves high temperature by infrared light and is toasted to pcb board, discharges the stress of pcb board；
The perforating press is punched out pcb board, is aligned convenient for inner layer exposure machine；
The unloader is to be overlapped the plate of pan feeding by mechanical arm, is then transported to AGV warehouse compartments.
2. the system as claimed in claim 1, which is characterized in that the cutting speed of the cutting machine is：
As plate thickness >=2.4mm, speed of cut 6m/min；
As plate thickness 1.5-2.4mm, speed of cut 8m/min；
As plate thickness 1.0-1.5mm, speed of cut 9m/min；
As plate thickness ＜ 1.0mm, speed of cut 10m/min.
3. system as claimed in claim 2, which is characterized in that the edging parameter：
As plate thickness >=2.4mm, edging speed is 5m/min；
As plate thickness 1.5-2.4mm, edging speed is 6.5m/min；
As plate thickness 1.0-1.5mm, edging speed is 8m/min；
As plate thickness ＜ 1.0mm, edging speed is 9m/min.
4. system as claimed in claim 3, which is characterized in that the washing pressure 1.5kg/cm of the washing hair dryer2, washing Speed 6m/min.
5. system as claimed in claim 4, which is characterized in that the baking temperature of the oven is 160-180 DEG C.
6. system as claimed in claim 5, which is characterized in that the parameter of the perforating press is：
As plate thickness >=2.4mm, punching speed is 4m/min；
As plate thickness 1.5-2.4mm, punching speed is 4.5m/min；
As plate thickness 1.0-1.5mm, punching speed is 5m/min；
As plate thickness ＜ 1.0mm, punching speed is 6m/min.
7. system as claimed in claim 6, which is characterized in that be also associated with lead plug nail hole machine after the cutting machine.
8. system as claimed in claim 7, which is characterized in that each equipment of the system is connect with EAP systems.
CN201810072478.3A 2018-01-25 2018-01-25 A kind of PCB multilayer board sawing sheet operating system Pending CN108323010A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810072478.3A CN108323010A (en) 2018-01-25 2018-01-25 A kind of PCB multilayer board sawing sheet operating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810072478.3A CN108323010A (en) 2018-01-25 2018-01-25 A kind of PCB multilayer board sawing sheet operating system

Publications (1)

Publication Number Publication Date
CN108323010A true CN108323010A (en) 2018-07-24

Family

ID=62887641

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810072478.3A Pending CN108323010A (en) 2018-01-25 2018-01-25 A kind of PCB multilayer board sawing sheet operating system

Country Status (1)

Country Link
CN (1) CN108323010A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103249253A (en) * 2013-05-17 2013-08-14 梅州华盛电路板有限公司 High precision aluminium base material circuit board manufacturing process and system
CN203301868U (en) * 2013-05-17 2013-11-20 梅州华盛电路板有限公司 Manufacturing system for high-precision aluminum-base circuit board
CN103579058A (en) * 2012-07-24 2014-02-12 上海宏力半导体制造有限公司 Method for achieving multi-batch continuous operation
CN104113985A (en) * 2013-04-22 2014-10-22 北大方正集团有限公司 Edge grinding and cleaning method, edge grinding and cleaning system, and printed circuit board hole machining method
CN104968154A (en) * 2015-05-06 2015-10-07 刘地发 Automatic production line of LED aluminum substrate
CN105337947A (en) * 2014-08-13 2016-02-17 无锡华润微电子有限公司 Information diffluence conversion tool, semiconductor production system and communication method thereof
CN105376942A (en) * 2015-10-30 2016-03-02 江苏博敏电子有限公司 Stitching process equipment automatic device
CN105389314A (en) * 2014-09-04 2016-03-09 中芯国际集成电路制造(上海)有限公司 Log file query system and query method
CN106304651A (en) * 2016-09-23 2017-01-04 奥士康科技股份有限公司 Automatization's PCB manufacturing process

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103579058A (en) * 2012-07-24 2014-02-12 上海宏力半导体制造有限公司 Method for achieving multi-batch continuous operation
CN104113985A (en) * 2013-04-22 2014-10-22 北大方正集团有限公司 Edge grinding and cleaning method, edge grinding and cleaning system, and printed circuit board hole machining method
CN103249253A (en) * 2013-05-17 2013-08-14 梅州华盛电路板有限公司 High precision aluminium base material circuit board manufacturing process and system
CN203301868U (en) * 2013-05-17 2013-11-20 梅州华盛电路板有限公司 Manufacturing system for high-precision aluminum-base circuit board
CN105337947A (en) * 2014-08-13 2016-02-17 无锡华润微电子有限公司 Information diffluence conversion tool, semiconductor production system and communication method thereof
CN105389314A (en) * 2014-09-04 2016-03-09 中芯国际集成电路制造(上海)有限公司 Log file query system and query method
CN104968154A (en) * 2015-05-06 2015-10-07 刘地发 Automatic production line of LED aluminum substrate
CN105376942A (en) * 2015-10-30 2016-03-02 江苏博敏电子有限公司 Stitching process equipment automatic device
CN106304651A (en) * 2016-09-23 2017-01-04 奥士康科技股份有限公司 Automatization's PCB manufacturing process

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* Cited by examiner, † Cited by third party
Title
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Application publication date: 20180724