CN108323006B - Pad layout structure of power resistor and battery detection circuit - Google Patents
Pad layout structure of power resistor and battery detection circuit Download PDFInfo
- Publication number
- CN108323006B CN108323006B CN201810187601.6A CN201810187601A CN108323006B CN 108323006 B CN108323006 B CN 108323006B CN 201810187601 A CN201810187601 A CN 201810187601A CN 108323006 B CN108323006 B CN 108323006B
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- pad
- bonding pad
- power resistor
- copper sheet
- bonding
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- 238000001514 detection method Methods 0.000 title claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 47
- 238000003466 welding Methods 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/25—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
- G01R19/2503—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques for measuring voltage only, e.g. digital volt meters (DVM's)
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
- G01R31/385—Arrangements for measuring battery or accumulator variables
- G01R31/387—Determining ampere-hour charge capacity or SoC
- G01R31/388—Determining ampere-hour charge capacity or SoC involving voltage measurements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
Abstract
The invention provides a pad layout structure of a power resistor, which comprises a first pad, a second pad, a third pad, a fourth pad, a fifth pad, a sixth pad, a first through hole pad and a second through hole pad, wherein the first pad, the fourth pad and the sixth pad are connected through a first copper sheet, the second pad, the third pad and the fifth pad are electrically connected through a second copper sheet, the first through hole pad is electrically connected with the fifth pad through a third copper sheet, and the second through hole pad is electrically connected with the sixth pad through a fourth copper sheet; the first through hole bonding pad is isolated from the first copper sheet, the third copper sheet is isolated from the first copper sheet through a first avoidance area, and the second through hole bonding pad is isolated from the second copper sheet, and the fourth copper sheet is isolated from the second copper sheet through a second avoidance area; the invention also provides a battery detection circuit applying the pad layout structure of the power resistor. The invention can reduce voltage detection errors and effectively improve current detection precision.
Description
Technical Field
The invention relates to the technical field of power battery packs of new energy automobiles, in particular to a bonding pad layout structure of a power resistor and a battery detection circuit.
Background
The power battery pack is one of core parts of the new energy automobile and is a main energy source of the new energy automobile. In the charging and discharging process of the power battery pack, if conditions such as overcharge, overdischarge and short circuit exist, the service performance and the service life of the battery pack are seriously affected, so that a battery pack voltage detection circuit is required to be additionally arranged in the power battery pack, the battery pack is subjected to voltage detection in real time, damage to the battery is avoided, and effective protection of the battery pack is formed, so that the service life of the battery pack is prolonged.
The battery detection circuit generally realizes voltage detection of the battery pack by detecting charge-discharge current of the power resistor. The reduction of the voltage detection error and the improvement of the voltage detection precision are related to not only the resistance value of the power resistor but also the pad structure of the welding power resistor. At present, an extremely low value resistor is generally adopted as a power resistor, and the power resistor is detected by using a Kelvin detection technology. How to improve the current detection precision of the battery detection circuit from the aspects of the size and layout design of the bonding pad of the power resistor is a technical problem to be solved at present.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a bonding pad layout structure of a power resistor with low cost, which can reduce voltage detection errors and effectively improve current detection precision.
The technical scheme of the invention is as follows:
the bonding pad layout structure of the power resistor comprises a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, wherein the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad are used for welding the power resistor and are respectively positioned in a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, the first bonding pad and the second bonding pad are symmetrically arranged about a Y axis, and the third bonding pad and the fourth bonding pad are symmetrically arranged about the Y axis.
The pad layout structure further comprises a fifth pad positioned between the second pad and the third pad, a sixth pad positioned between the first pad and the fourth pad, a first through hole pad arranged on the left side of the fifth pad and a second through hole pad arranged on the right side of the sixth pad; the fifth pad and the sixth pad are symmetrically arranged about the Y-axis, the fifth pad being located in the second quadrant and the sixth pad being located in the first quadrant, or the fifth pad being located in the third quadrant and the sixth pad being located in the fourth quadrant.
The vertical distance d between the upper end of the first bonding pad and the lower end of the fourth bonding pad is larger than the vertical distance between the upper end and the lower end of the power resistor R, and the vertical distance d between the lower end of the first bonding pad and the upper end of the fourth bonding pad is smaller than the vertical distance between the upper end and the lower end of the power resistor R; the horizontal distance d between the right end of the first welding disc and the left end of the second welding disc is larger than the horizontal distance between the left end and the right end of the power resistor R, and the horizontal distance d between the left end of the first welding disc and the right end of the second welding disc is smaller than the horizontal distance between the left end and the right end of the power resistor R.
The horizontal distance between the right end of the first welding disc and the left end of the second welding disc, the horizontal distance between the left end of the third welding disc and the right end of the fourth welding disc and the horizontal distance between the left end of the fifth welding disc and the right end of the sixth welding disc are all larger than the horizontal distance between the two welding ends of the power resistor, and the vertical distance between the upper end of the first welding disc and the lower end of the fourth welding disc is larger than the vertical distance between the upper end and the lower end of the power resistor.
The first bonding pad, the fourth bonding pad and the sixth bonding pad are connected through a first copper sheet, the second bonding pad, the third bonding pad and the fifth bonding pad are electrically connected through a second copper sheet, the first through hole bonding pad is electrically connected with the fifth bonding pad through a third copper sheet, and the second through hole bonding pad is electrically connected with the sixth bonding pad through a fourth copper sheet; the first through hole bonding pad is isolated from the second copper sheet through the first avoidance area, the third copper sheet is isolated from the second copper sheet through the second avoidance area, and the fourth copper sheet is isolated from the first copper sheet through the second avoidance area.
The middle part is provided with a first current detection point for detecting the power resistance current to the right on the fifth bonding pad, and the middle part is provided with a second current detection point for detecting the power resistance current to the left on the sixth bonding pad.
Further, the first avoidance area and the second avoidance area are both U-shaped and symmetrically arranged.
Further, the first pad, the second pad, the third pad, the fourth pad, the fifth pad, and the sixth pad are all square, and are symmetrically arranged about the quadrant origin.
The battery detection circuit of the pad layout structure of the power resistor comprises a microcontroller, the power resistor R and a switch power circuit, wherein the power resistor R is welded on the pad layout structure, one end of the power resistor R is connected with a total negative terminal through the switch power circuit, the other end of the power resistor R is connected with a total positive terminal through a battery pack, and a load or a charger is connected between the total positive terminal and the total negative terminal; an analog-to-digital conversion circuit is connected in parallel between the two ends of the power resistor R, and the analog-to-digital conversion circuit is also connected with the microcontroller.
Further, the analog-digital conversion circuit is connected in parallel between two ends of the power resistor R through the resistor R and the resistor R respectively.
When two welding ends of the power resistor are welded to the bonding pad structure, one welding end is welded to the second bonding pad, the fifth bonding pad and the third bonding pad, and the other welding end is welded to the first bonding pad, the sixth bonding pad and the fourth bonding pad; the current is in a state of uneven distribution at different positions on the power resistor, so that the accuracy of current detection acquired by current detection points at different positions on the power resistor is different; when the current detection point is close to the two side parts of the power resistor, the current detection precision is low, and when the voltage detection point is close to the middle part of the power resistor, the voltage detection precision is higher. Therefore, in order to further improve the current detection precision, in the pad structure disclosed by the invention, the middle part of the fifth pad and the middle part of the sixth pad are respectively provided with the first current detection point and the second current detection point, the analog-to-digital conversion circuit is respectively connected to the first current detection point and the second current detection point through two current sampling lines, and the current flowing through the power resistor is detected through the current detection points, so that the current detection precision can be effectively improved.
When the battery pack is externally supplied with power, system current flows in from a first through hole bonding pad (INPUT end), flows out from a second through hole bonding pad (OUTPUT end) through a power resistor, voltage drop is formed between two welding ends of the power resistor by the system current, voltage signals between two ends of the power resistor are collected by an analog-to-digital conversion circuit and are converted into digital signals and sent to a microcontroller, the microcontroller recognizes the digital signals and reads out voltage values, and the current values are obtained according to the voltage values.
The invention has the beneficial effects that:
by welding the power resistor on the bonding pad structure, the cost is low, and the battery detection circuit can be ensured to effectively improve the current detection precision, so that the estimation precision of the battery SOC (residual electric quantity) is effectively improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of a pad layout structure of a power resistor according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing the connection between the pad layout structure of the power resistor and the power resistor R3 according to the embodiment of the present invention;
FIG. 3 is a schematic diagram of a battery detection circuit employing a pad layout structure of a power resistor R3 according to an embodiment of the present invention;
the bonding pad comprises a first bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad, a fifth bonding pad, a sixth bonding pad, a first through hole bonding pad, a second through hole bonding pad, a bonding area, a bonding pad, a first copper sheet, a second copper sheet, a third copper sheet, a fourth copper sheet, a first avoidance area, a second avoidance area, a first current detection point, a second current detection point and a second current detection point, wherein the first bonding pad, the second bonding pad, the third bonding pad, the fourth bonding pad, the fifth bonding pad, the sixth bonding pad, the first through hole bonding pad, the 8, the second through hole bonding pad, the 9, the bonding area, the 10, the first copper sheet, the 11, the second copper sheet, the 12, the third copper sheet, the 13, the fourth copper sheet, the 14, the first avoidance area, the 15, the second avoidance area, the 16, the first current detection point and the second current detection point.
Description of the embodiments
Embodiments of the invention are described in detail below with reference to the attached drawings, but the invention can be implemented in a number of different ways, which are defined and covered by the claims.
As shown in fig. 1 and 2, a pad layout structure of a power resistor includes a first pad 1, a second pad 2, a third pad 3, a fourth pad 4, a fifth pad 5 between the second pad 2 and the third pad 3, a sixth pad 6 between the first pad 1 and the fourth pad 4, a first through-hole pad 7 disposed on the left side of the fifth pad 5, and a second through-hole pad 8 disposed on the right side of the sixth pad 6 for bonding the power resistor, the first pad 1, the second pad 2, the third pad 3, and the fourth pad 4 being disposed in a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant, respectively, the first pad 1 and the second pad 2 being symmetrically disposed about a Y axis, and the third pad 3 and the fourth pad 4 being symmetrically disposed about the Y axis; the first pad 1, the second pad 2, the third pad 3, the fourth pad 4, the fifth pad 5, and the sixth pad 6 are each square-shaped and symmetrically arranged about the origin of quadrants.
The fifth pad 5 and the sixth pad 6 are symmetrically arranged about the Y-axis, the fifth pad 5 being located in the second quadrant and the sixth pad 6 being located in the first quadrant, or the fifth pad 5 being located in the third quadrant and the sixth pad 6 being located in the fourth quadrant.
The vertical distance d5 between the upper end of the first bonding pad 1 and the lower end of the fourth bonding pad 4 is larger than the vertical distance between the upper end and the lower end of the power resistor R3, and the vertical distance d6 between the lower end of the first bonding pad 1 and the upper end of the fourth bonding pad 4 is smaller than the vertical distance between the upper end and the lower end of the power resistor R3; the horizontal distance d1 between the right end of the first bonding pad 1 and the left end of the second bonding pad 2 is larger than the horizontal distance between the left end and the right end of the power resistor R3, and the horizontal distance d2 between the left end of the first bonding pad 1 and the right end of the second bonding pad 2 is smaller than the horizontal distance between the left end and the right end of the power resistor R3.
The first bonding pad 1, the fourth bonding pad 4 and the sixth bonding pad 6 are connected through a first copper sheet 10, the second bonding pad 2, the third bonding pad 3 and the fifth bonding pad 5 are electrically connected through a second copper sheet 11, the first through hole bonding pad 7 and the fifth bonding pad 5 are electrically connected through a third copper sheet 12, and the second through hole bonding pad 8 and the sixth bonding pad 6 are electrically connected through a fourth copper sheet 13; the first through hole bonding pad 7 is isolated from the second copper sheet 11, the third copper sheet 12 is isolated from the second copper sheet 11 through the first avoidance area 14, and the second through hole bonding pad 8 is isolated from the first copper sheet 10, and the fourth copper sheet 13 is isolated from the first copper sheet 10 through the second avoidance area 15; the first avoidance region 14 and the second avoidance region 15 are both U-shaped and symmetrically arranged.
A first current detection point 16 for detecting the power resistance current is arranged at the right position of the upper middle part of the fifth bonding pad 5, and a second current detection point 17 for detecting the power resistance current is arranged at the left position of the upper middle part of the sixth bonding pad 6.
As shown in fig. 3, the battery detection circuit of the pad layout structure applying the power resistor comprises a microcontroller, a power resistor R3 and a switch power circuit, wherein the power resistor R3 is welded on the pad layout structure, one end of the power resistor R3 is connected with a total negative terminal through the switch power circuit, the other end of the power resistor R3 is connected with a total positive terminal through a battery pack, and a load or a charger is connected between the total positive terminal and the total negative terminal; an analog-to-digital conversion circuit is also connected in parallel between the two ends of the power resistor R3, and the analog-to-digital conversion circuit is also connected with the microcontroller; the analog-digital conversion circuit is connected in parallel between two ends of the power resistor R3 through a resistor R1 and a resistor R2 respectively.
Claims (5)
1. The utility model provides a pad overall arrangement structure of power resistor, is including first pad (1), second pad (2), third pad (3) and fourth pad (4) that are used for welding power resistor, first pad (1), second pad (2), third pad (3) and fourth pad (4) are located first quadrant, second quadrant, third quadrant and fourth quadrant respectively, first pad (1) and second pad (2) are arranged about Y axisymmetric, and third pad (3) and fourth pad (4) are arranged about Y axisymmetric, its characterized in that:
the semiconductor device further comprises a fifth bonding pad (5) positioned between the second bonding pad (2) and the third bonding pad (3), a sixth bonding pad (6) positioned between the first bonding pad (1) and the fourth bonding pad (4), a first through hole bonding pad (7) arranged on the left side of the fifth bonding pad (5) and a second through hole bonding pad (8) arranged on the right side of the sixth bonding pad (6); the fifth bonding pad (5) and the sixth bonding pad (6) are symmetrically arranged about the Y-axis, the fifth bonding pad (5) is positioned in the second quadrant and the sixth bonding pad (6) is positioned in the first quadrant, or the fifth bonding pad (5) is positioned in the third quadrant and the sixth bonding pad (6) is positioned in the fourth quadrant;
the vertical distance d5 between the upper end of the first bonding pad (1) and the lower end of the fourth bonding pad (4) is larger than the vertical distance between the upper end and the lower end of the power resistor R3, and the vertical distance d6 between the lower end of the first bonding pad (1) and the upper end of the fourth bonding pad (4) is smaller than the vertical distance between the upper end and the lower end of the power resistor R3; the horizontal distance d1 between the right end of the first bonding pad (1) and the left end of the second bonding pad (2) is larger than the horizontal distance between the left end and the right end of the power resistor R3, and the horizontal distance d2 between the left end of the first bonding pad (1) and the right end of the second bonding pad (2) is smaller than the horizontal distance between the left end and the right end of the power resistor R3;
the horizontal distance d1 between the right end of the first bonding pad and the left end of the second bonding pad, the horizontal distance d2 between the left end of the third bonding pad and the right end of the fourth bonding pad, and the horizontal distance d3 between the left end of the fifth bonding pad and the right end of the sixth bonding pad are all larger than the horizontal distance d4 between the two bonding ends of the power resistor, and the vertical distance d5 between the upper end of the first bonding pad and the lower end of the fourth bonding pad is larger than the vertical distance d6 between the upper end and the lower end of the power resistor;
the first bonding pad (1), the fourth bonding pad (4) and the sixth bonding pad (6) are connected through a first copper sheet (10), the second bonding pad (2), the third bonding pad (3) and the fifth bonding pad (5) are electrically connected through a second copper sheet (11), the first through hole bonding pad (7) is electrically connected with the fifth bonding pad (5) through a third copper sheet (12), and the second through hole bonding pad (8) is electrically connected with the sixth bonding pad (6) through a fourth copper sheet (13); the first through hole bonding pad (7) is isolated from the second copper sheet (11), the third copper sheet (12) is isolated from the second copper sheet (11) through a first avoidance area (14), the second through hole bonding pad (8) is isolated from the first copper sheet (10), and the fourth copper sheet (13) is isolated from the first copper sheet (10) through a second avoidance area (15);
the middle part is provided with a first current detection point (16) for detecting power resistance current on the right side on the fifth bonding pad (5), and a second current detection point (17) for detecting power resistance current is provided on the left side on the middle part on the sixth bonding pad (6).
2. The pad layout structure of a power resistor according to claim 1, wherein the first relief area (14) and the second relief area (15) are both in a "U" shape and symmetrically arranged.
3. The pad layout structure of the power resistor according to claim 1, wherein the first pad (1), the second pad (2), the third pad (3), the fourth pad (4), the fifth pad (5) and the sixth pad (6) are all square and symmetrically arranged about a quadrant origin.
4. A battery detection circuit using the pad layout structure of the power resistor of any one of claims 1 to 3, which is characterized by comprising a microcontroller, a power resistor R3 and a switch power circuit, wherein the power resistor R3 is welded on the pad layout structure, one end of the power resistor R3 is connected to a total negative terminal through the switch power circuit, the other end is connected to a total positive terminal through a battery pack, and a load or a charger is connected between the total positive terminal and the total negative terminal; an analog-to-digital conversion circuit is connected in parallel between the two ends of the power resistor R3, and the analog-to-digital conversion circuit is also connected with the microcontroller.
5. The battery detection circuit of claim 4, wherein the analog-to-digital conversion circuit is connected in parallel between two ends of the power resistor R3 through a resistor R1 and a resistor R2, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810187601.6A CN108323006B (en) | 2018-03-07 | 2018-03-07 | Pad layout structure of power resistor and battery detection circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810187601.6A CN108323006B (en) | 2018-03-07 | 2018-03-07 | Pad layout structure of power resistor and battery detection circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108323006A CN108323006A (en) | 2018-07-24 |
| CN108323006B true CN108323006B (en) | 2024-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810187601.6A Active CN108323006B (en) | 2018-03-07 | 2018-03-07 | Pad layout structure of power resistor and battery detection circuit |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111337726A (en) * | 2020-04-10 | 2020-06-26 | 深圳市欣旺达电气技术有限公司 | Circuit structure based on patch shunt and current detection method |
| CN114286504A (en) * | 2021-12-30 | 2022-04-05 | 四川华拓光通信股份有限公司 | FPC with capacitor bonding pad and preparation method thereof |
Citations (4)
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|---|---|---|---|---|
| JP2010165810A (en) * | 2009-01-15 | 2010-07-29 | Koa Corp | Mounting substrate of current detection resistor, and method of manufacturing the same |
| JP2013187354A (en) * | 2012-03-08 | 2013-09-19 | Koa Corp | Mounting structure of resistor for current detection |
| CN204361202U (en) * | 2014-12-24 | 2015-05-27 | 陕西斯达煤矿安全装备有限公司 | A kind of intrinsic safe battery assembly for Portable Methane Detection Alarm |
| CN106535463A (en) * | 2015-09-15 | 2017-03-22 | 展讯通信（上海）有限公司 | Bonding pad structure and circuit for improving current detection accuracy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI450655B (en) * | 2010-06-28 | 2014-08-21 | Hon Hai Prec Ind Co Ltd | Pcb and method for detecting voltage of electronic component using same |
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2018
- 2018-03-07 CN CN201810187601.6A patent/CN108323006B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010165810A (en) * | 2009-01-15 | 2010-07-29 | Koa Corp | Mounting substrate of current detection resistor, and method of manufacturing the same |
| JP2013187354A (en) * | 2012-03-08 | 2013-09-19 | Koa Corp | Mounting structure of resistor for current detection |
| CN204361202U (en) * | 2014-12-24 | 2015-05-27 | 陕西斯达煤矿安全装备有限公司 | A kind of intrinsic safe battery assembly for Portable Methane Detection Alarm |
| CN106535463A (en) * | 2015-09-15 | 2017-03-22 | 展讯通信（上海）有限公司 | Bonding pad structure and circuit for improving current detection accuracy |
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