CN108323005A - Pad structure and circuit board - Google Patents
Pad structure and circuit board Download PDFInfo
- Publication number
- CN108323005A CN108323005A CN201810167862.1A CN201810167862A CN108323005A CN 108323005 A CN108323005 A CN 108323005A CN 201810167862 A CN201810167862 A CN 201810167862A CN 108323005 A CN108323005 A CN 108323005A
- Authority
- CN
- China
- Prior art keywords
- pad
- mainboard
- flash lamp
- positioning column
- weld part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012216 screening Methods 0.000 claims description 29
- 230000006978 adaptation Effects 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
The present invention relates to a kind of pad structure and circuit boards, the pad structure includes the pad being set on mainboard, the pad includes several grounding pins and functional pin, the mainboard is equipped with several location holes by pad side, the location hole is used to be inserted into for the positioning column of battery tray, the positioning column is grounding leg, and multiple grounding pins are arranged by the location hole.The present invention on pad by being equipped with several grounding pins and functional pin, and the mainboard is equipped with location hole, the positioning column of the battery tray is inserted into the location hole, in each pin in solder pad, multiple grounding pins in the pad are arranged close to the location hole, multiple grounding pins in the pad can be welded together with the positioning column being inserted into the location hole, each grounding pin and the positioning column in pad need not deliberately be avoided, simplify the welding procedure of pad, production efficiency is improved, cost is reduced.
Description
Technical field
The present invention relates to intelligent drive electronics plate technique field, more particularly to a kind of pad structure and circuit board.
Background technology
With the development of science and technology, the use of smart machine is more and more universal in life, by taking smart machine is mobile phone as an example,
Consumer opponent is confidential to ask also higher and higher, and smart mobile phone requires complete machine thin, and battery capacity is big.
Smart mobile phone mainboard is made frivolous, it is desirable to each cell compact package.It connects and is adopted at the FPC pads of subplate
It with board to board connector, is susceptible to and cannot fasten and assemble bad disadvantage, so being welded the FPC of subplate by the way of welding
Disk is set to the one side of mainboard, has the advantages that at low cost and secured；And in assembly, the angle of battery tray is used across mainboard
In battery tray is set to mainboard another side, still, in welding, the angle of battery tray and the FPC pads of subplate are easy overlapping
Weld together, in order to avoid the function foot in the angle of battery tray and the FPC pads of subplate, can make welding procedure difficulty
Increase, extend the production cycle, improves production cost.
Invention content
The technical problem to be solved in the present invention be for the above-mentioned prior art in shortcoming, a kind of pad knot is provided
Structure and circuit board.
The present invention solves the technological means that technical problem uses and is to provide a kind of pad structure, includes the weldering on mainboard
Disk, the pad include several grounding pins and functional pin, and the mainboard is equipped with several location holes by pad side, described fixed
Position hole is used to be inserted into for the positioning column of battery tray, and the positioning column is grounding leg, and multiple grounding pins lean on the location hole
Setting.
Further, the pad is set to mainboard first side, and the battery tray is set to the second side of mainboard, the electricity
The positioning column of stall is inserted into the location hole, and the free end end of the positioning column is higher than the first side.
Further, the pad is that subplate connects pad, and several grounding pins and functional pin are arranged side by side.
Further, further include the first flash lamp pad and the second flash lamp pad being set on mainboard, described first dodges
Light lamp pad and the second flash lamp pad include a positive weld part and two set on the positive weld part side
Two cathode weld parts of cathode weld part, the first flash lamp pad are set to the anode weldering of the first flash lamp pad
Between socket part and the positive weld part of the second flash lamp pad, and the positive weld part of the second flash lamp pad and described the
Two cathode weld parts of one flash lamp pad form third flash lamp pad.
On the other hand, the present invention also provides a kind of circuit board, including mainboard and on mainboard such as above-mentioned pad
Structure.
Further, further include the screening cover being set on the mainboard, the screening cover is equipped with corresponding with the pad suitable
The bit-avoiding slot matched.
Further, the screening cover is detachably assembled on the mainboard.
Further, the screening cover offers the open-work being correspondingly arranged with the capacitance on mainboard.
Further, open-work adaptation corresponding with the position of the function foot of the capacitance and size.
Further, the screening cover is made using metal material.
Using above-mentioned technical proposal, the present invention at least has the advantages that：The embodiment of the present invention passes through on pad
Equipped with several grounding pins and functional pin, and the mainboard is equipped with location hole, and the positioning column insertion of the battery tray is described fixed
In the hole of position, in each pin in solder pad, multiple grounding pins in the pad are arranged close to the location hole, can
To weld together multiple grounding pins in the pad with the positioning column being inserted into the location hole, need not deliberately keep away
Each grounding pin and the positioning column in disk are snapped, the welding procedure of pad is simplified, production efficiency is improved, reduces cost.
Description of the drawings
Fig. 1 is the dimensional structure diagram of pad structure one embodiment of the present invention.
Fig. 2 is the schematic front view of pad structure one embodiment of the present invention.
Fig. 3 is the structural schematic diagram of circuit board one embodiment of the present invention.
Fig. 4 is the enlarged diagram of part A in Fig. 3.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It please refers to Fig.1 to Fig.4, the present invention provides a kind of pad structure 1, includes the pad 11 on mainboard 2, the weldering
Disk 11 includes several grounding pins and functional pin, and the mainboard 2 is equipped with several location holes 22, the positioning by 11 side of pad
Hole 22 is used to be inserted into for the positioning column 31 of battery tray 3, and the positioning column 31 is grounding leg, and multiple grounding pins are by described fixed
Position hole 22 is arranged.
When implementing, the battery tray 3 is set there are two positioning column 31, and the location hole 22 corresponds to the positioning column 31 and is equipped with
Two, specifically, the pad 11 is that subplate connects pad, and several grounding pins and functional pin are arranged side by side, specifically
Ground, multiple grounding pins during several grounding pins are whole or several grounding pins are arranged by the location hole,
The pad 11 is set to 2 first side of mainboard, and the battery tray 3 is set to the second side of mainboard 2, the positioning of the battery tray 3
Column 31 is inserted into the location hole 22, and the free end end of the positioning column 31 is higher than the first side, facilitates realization pair
The welding of the positioning column 31.In each pin in solder pad 11, multiple grounding pins in the pad 11 are close
The location hole 22 is arranged, can by the pad 11 multiple grounding pins and the positioning column that is inserted into the location hole 22
31 weld together, and need not deliberately avoid each grounding pin in pad 11 and positioning column 31, simplify the Welder of pad 11
Skill improves production efficiency, reduces production cost.
In one alternate embodiment, further include the first flash lamp pad 12 being set on mainboard 2 and the weldering of the second flash lamp
Disk 13, the first flash lamp pad 12 and the second flash lamp pad 13 include a positive weld part and set on it is described just
Two cathode weld parts of two cathode weld parts of pole weld part side, the first flash lamp pad 12 are set to described first
Between the positive weld part of flash lamp pad 12 and the positive weld part of the second flash lamp pad 13, and second flash lamp
Two cathode weld parts composition third flash lamp pad (figure of the positive weld part of pad 13 and the first flash lamp pad 12
Non- label), the center of the third flash lamp pad is located on the center line of the camera 21 of mainboard 2.
When implementing, the first flash lamp pad 12 includes the first positive weld part 121 and two the first cathode welding
Portion 122, the second flash lamp pad 13 include the second positive weld part 131 and two the second cathode weld parts 132, and described the
One flash lamp pad 12 and the second flash lamp pad 13 are disposed adjacent, and specifically, the second cathode weld part 132, second is just
Pole weld part 131, the first cathode weld part 122 and the first positive weld part 121 are in that straight line is arranged side by side successively, and described the
Two positive weld parts 131 and the first cathode weld part 122 are adjacent to form third flash lamp pad, and the third is glistened
The center of lamp pad is located on the center line of the camera 21 of mainboard 2.When needs install two double-colored temperature flash lamps on mainboard 2
When, a flash lamp can be respectively welded on the first flash lamp pad 12 and the second flash lamp pad 13；And when needs
When installing single flash lamp on mainboard 2, a flash lamp can be welded on the third flash lamp pad, be welded in described
Flash lamp on third flash lamp pad is placed in the middle relative to camera 21, does not influence the appearance and function of flash lamp.
The present embodiment on mainboard 2 by being arranged the first flash lamp pad 12 and the second flash lamp pad 13, and described first
Flash lamp pad 12 and the second flash lamp pad 13 are all provided with there are one positive weld part and two cathode weld parts, and described second
The positive weld part of flash lamp pad 13 and two cathode weld parts of the first flash lamp pad 12 form third flash lamp
Pad, on the one hand, can be by welding flash lamp on the first flash lamp pad 12 and the second flash lamp pad 13 to complete
In 2 over-assemble of mainboard, two double-colored temperature flash lamps；It on the other hand, can be by being dodged in third when only needing a flash lamp
Flash lamp is welded on light lamp pad to realize, is not required to the mode of setting flash lamp switching FPC pads, is reduced hardware and put into and simplify weldering
Technique is connect, production cost and cost of labor can be effectively reduced.
On the other hand, the present invention also provides a kind of circuit board, including mainboard 2 and on mainboard 2 such as above-mentioned weldering
Dish structure 1.
When implementing, the mainboard 2 is equipped with camera 21 and location hole 22, and the location hole 22 is used for for battery tray 3
Positioning column 31 is inserted into install the fixed battery tray 3, and the pad structure 1 includes pad 11,12 and of the first flash lamp pad
Second flash lamp pad 13, the pad 11 includes several grounding pins and functional pin, wherein several grounding pins are equal
It is arranged by the location hole 22, can the multiple grounding pin and positioning column 31 be directly welded on one when solder pad 11
It rises, simplifies the welding procedure of pad 11；In addition, there are one the first flash lamp pad 12 and the second flash lamp pad 13 be all provided with
The positive weld part of positive weld part and two cathode weld parts, the second flash lamp pad 13 is welded by first flash lamp
Two cathode weld parts of disk 12 are arranged, and the positive weld part of the second flash lamp pad 13 is welded with first flash lamp
Two cathode weld parts of disk 12 form third flash lamp pad, and the center of the third flash lamp pad is located at the camera
It, can be in the first flash lamp pad 12 when needing to install two double-colored temperature flash lamps on mainboard 2 on 21 center line
With a flash lamp is respectively welded on the second flash lamp pad 13, be welded in the first flash lamp pad 12 and the second flash lamp pad
Center line symmetrical setting of two flash lamps relative to camera 21 on 13；And it individually glistens when needing to install on mainboard 2
When lamp, a flash lamp, the sudden strain of a muscle being welded on the third flash lamp pad can be welded on the third flash lamp pad
Light lamp is placed in the middle relative to camera 21, does not influence the appearance and function of flash lamp.
In one alternate embodiment, further include be set to the mainboard 2 on screening cover 23, the screening cover 23 be equipped with
The pad 11 corresponds to the bit-avoiding slot 231 of adaptation.
The present embodiment by mainboard 2 be equipped with screening cover 23, the screening cover 23 cover each component on mainboard 2 with
It realizes function of shielding, improves mainboard operation stability, in addition, being equipped with bit-avoiding slot 231, the bit-avoiding slot 231 on screening cover 23
It is convenient that pad 11 is welded by the setting of the pad 13 for pad 11 to be exposed, reduce production cost.
In one alternate embodiment, the screening cover 23 is detachably assembled on the mainboard 2.
Implement when, the screening cover 23 be surrounded by with 23 vertically disposed side wall (not shown) of screening cover, it is described
Mainboard 2 is equipped with the slot (not shown) of adaptation corresponding with the side wall, and the side wall is inserted into the slot to realize shielding
Assembling between lid 23 and mainboard 2, specifically, can also by by side wall by slot extract to realize screening cover 23 and mainboard
Dismounting between 2.Certainly, the screening cover 23 can also be directly welded on mainboard 2, and specifically, the mainboard 2 is equipped with and institute
The weld part (not shown) that side wall corresponds to adaptation is stated, by the way that sidewall weld on the weld part, is realized screening cover 23 and master
The assembling of plate 2.
In one alternate embodiment, the screening cover 23 offers the open-work being correspondingly arranged with the capacitance on mainboard 2
232。
When implementing, the mainboard 2 is equipped with multiple capacitances, the open-work 232 and the capacitance positions on mainboard 2, size
It is corresponding, it can effectively avoid screening cover 23 from being abutted with the capacitance on mainboard 2, so that the situation of short circuit occurs in capacitance, improve peace
Quan Xing.
In one alternate embodiment, the adaptation corresponding with the position of the function foot of the capacitance and size of the open-work 232.
When implementing, the capacitance includes function foot, grounding leg and the electricity between the function foot and grounding leg
Hold ontology, when the capacitance quantity on mainboard 2 be equipped with it is multiple when, need to open up multiple open-works 232 on screening cover 23 even
The bulk zone of screening cover 23 is cut out, can make the reduced performance of screening cover 23, by the way that open-work 232 to be designed to and capacitance
The position of function foot and size correspond to adaptation, to reduce the size of open-work 232, can effectively avoid the occurrence of capacitance short-circuit and drop
The case where performance of low screening cover 23, improves product quality.
In one alternate embodiment, the screening cover 23 is made using metal material.Screening cover 23 can be effectively improved
Performance and intensity improve product quality.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every utilization
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content is applied directly or indirectly in other correlations
Technical field, be included within the scope of the present invention.
Claims (10)
1. a kind of pad structure, it is characterised in that：Include the pad on mainboard, the pad include several grounding pins and
Functional pin, the mainboard are equipped with several location holes by pad side, and the location hole is used to be inserted into for the positioning column of battery tray,
The positioning column is grounding leg, and multiple grounding pins are arranged by the location hole.
2. pad structure according to claim 1, it is characterised in that：The pad is set to mainboard first side, the electricity
Stall is set to the second side of mainboard, and the positioning column of the battery tray is inserted into the location hole, and the freedom of the positioning column
End is held to be higher than the first side.
3. pad structure according to claim 2, it is characterised in that：The pad is that subplate connects pad, described several
Grounding pin and functional pin are arranged side by side.
4. pad structure according to any one of claim 1 to 3, it is characterised in that：Further include the be set on mainboard
One flash lamp pad and the second flash lamp pad, the first flash lamp pad and the second flash lamp pad include an anode
Weld part and two cathode weld parts set on the positive weld part side, two cathode of the first flash lamp pad
Weld part is set between the positive weld part and the positive weld part of the second flash lamp pad of the first flash lamp pad, and
The positive weld part of the second flash lamp pad and two cathode weld parts composition third of the first flash lamp pad are dodged
Light lamp pad.
5. a kind of circuit board, it is characterised in that：Including mainboard and on mainboard as described in any one of Claims 1-4
Pad structure.
6. circuit board according to claim 5, it is characterised in that：Further include the screening cover being set on the mainboard, it is described
Screening cover is equipped with the bit-avoiding slot of adaptation corresponding with the pad.
7. circuit board according to claim 6, it is characterised in that：The screening cover is detachably assembled on the mainboard.
8. circuit board according to claim 7, it is characterised in that：The screening cover offers corresponding with the capacitance on mainboard
The open-work of setting.
9. circuit board according to claim 8, it is characterised in that：The position of the function foot of the open-work and the capacitance and
Size corresponds to adaptation.
10. according to claim 6 to 9 any one of them circuit board, it is characterised in that：The screening cover uses metal material system
.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810167862.1A CN108323005B (en) | 2018-02-28 | 2018-02-28 | Bonding pad structure and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810167862.1A CN108323005B (en) | 2018-02-28 | 2018-02-28 | Bonding pad structure and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108323005A true CN108323005A (en) | 2018-07-24 |
| CN108323005B CN108323005B (en) | 2024-01-30 |
Family
ID=62900899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810167862.1A Active CN108323005B (en) | 2018-02-28 | 2018-02-28 | Bonding pad structure and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108323005B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112615189A (en) * | 2020-12-03 | 2021-04-06 | 海光信息技术股份有限公司 | Processor socket and mainboard module |
| CN116500427A (en) * | 2023-06-27 | 2023-07-28 | 合肥联宝信息技术有限公司 | Power supply connecting device for motherboard test |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000165023A (en) * | 1998-11-27 | 2000-06-16 | Ando Electric Co Ltd | Burn-in board |
| US20070187141A1 (en) * | 2006-02-15 | 2007-08-16 | Tyco Electronics Corporation | Circuit board with configurable ground link |
| CN101801162A (en) * | 2010-02-25 | 2010-08-11 | 中兴通讯股份有限公司 | Wireless communication module |
| CN203552626U (en) * | 2013-10-22 | 2014-04-16 | 深圳市晶通光电有限公司 | Liquid crystal display screen with novel antistatic structure |
| CN205353536U (en) * | 2015-12-16 | 2016-06-29 | 惠州市桑莱士光电有限公司 | Improve camera module that camera flash light is askew partially |
| CN206821065U (en) * | 2017-03-20 | 2017-12-29 | 惠州市鑫晖源科技有限公司 | A kind of power line quick-inserting structure |
| CN207995500U (en) * | 2018-02-28 | 2018-10-19 | 深圳市沃特沃德股份有限公司 | Pad structure and circuit board |
-
2018
- 2018-02-28 CN CN201810167862.1A patent/CN108323005B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000165023A (en) * | 1998-11-27 | 2000-06-16 | Ando Electric Co Ltd | Burn-in board |
| US20070187141A1 (en) * | 2006-02-15 | 2007-08-16 | Tyco Electronics Corporation | Circuit board with configurable ground link |
| CN101801162A (en) * | 2010-02-25 | 2010-08-11 | 中兴通讯股份有限公司 | Wireless communication module |
| CN203552626U (en) * | 2013-10-22 | 2014-04-16 | 深圳市晶通光电有限公司 | Liquid crystal display screen with novel antistatic structure |
| CN205353536U (en) * | 2015-12-16 | 2016-06-29 | 惠州市桑莱士光电有限公司 | Improve camera module that camera flash light is askew partially |
| CN206821065U (en) * | 2017-03-20 | 2017-12-29 | 惠州市鑫晖源科技有限公司 | A kind of power line quick-inserting structure |
| CN207995500U (en) * | 2018-02-28 | 2018-10-19 | 深圳市沃特沃德股份有限公司 | Pad structure and circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112615189A (en) * | 2020-12-03 | 2021-04-06 | 海光信息技术股份有限公司 | Processor socket and mainboard module |
| CN116500427A (en) * | 2023-06-27 | 2023-07-28 | 合肥联宝信息技术有限公司 | Power supply connecting device for motherboard test |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108323005B (en) | 2024-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101051142B (en) | Backlight assembly and liquid crystal display thereof | |
| US7727007B2 (en) | Mounting apparatus for battery | |
| US20090124127A1 (en) | Conductive cage | |
| CN212115762U (en) | Circuit board assembly and electronic equipment | |
| CN105307420A (en) | PCB and FPC welding method and surface mounting jig | |
| CN107577278A (en) | A kind of display screen component and mobile terminal | |
| CN211830283U (en) | Mobile terminal | |
| KR101411584B1 (en) | method for manufacturing battery protection apparatus and the battery protection apparatus | |
| JP2018518807A (en) | Secondary electrochemical cell with built-in charging circuit | |
| CN210092201U (en) | Battery module and electronic equipment | |
| CN108323005A (en) | Pad structure and circuit board | |
| CN207995500U (en) | Pad structure and circuit board | |
| CN203536500U (en) | Button battery fixing structure | |
| CN104633618B (en) | A kind of electric connection structure, assembly method and the lamps and lanterns of LED lamp panel and power panel | |
| TWM385114U (en) | Electrical connector | |
| CN204090161U (en) | A kind of baseband processing unit | |
| CN1158690A (en) | An electrical connector and a printed circuit board | |
| CN105704271A (en) | Mobile terminal | |
| CN208538961U (en) | A kind of button cell holder for preventing cathode contact piece from deforming | |
| CN208385498U (en) | A kind of battery holder | |
| CN219998489U (en) | Board-mounted plug-in type antenna | |
| CN221901079U (en) | Anti-off-welding structure of printed circuit board | |
| CN205921109U (en) | Metal shrapnel and mobile terminal | |
| CN203787629U (en) | Battery holder | |
| CN221575682U (en) | Patch type integrated circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240103 Address after: 518000 floor 1, building 3, Dexin Chang wisdom Park, No. 23 Heping Road, Qinghua community, Longhua street, Longhua District, Shenzhen, Guangdong Applicant after: Shenzhen waterward Information Co.,Ltd. Address before: 518000, block B, huayuancheng digital building, 1079 Nanhai Avenue, Shekou, Nanshan District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN WATER WORLD Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |