CN108312054A - A kind of novel stainless steel loop and plastic hoop technique for sticking method - Google Patents
A kind of novel stainless steel loop and plastic hoop technique for sticking method Download PDFInfo
- Publication number
- CN108312054A CN108312054A CN201810157226.0A CN201810157226A CN108312054A CN 108312054 A CN108312054 A CN 108312054A CN 201810157226 A CN201810157226 A CN 201810157226A CN 108312054 A CN108312054 A CN 108312054A
- Authority
- CN
- China
- Prior art keywords
- stainless steel
- plastic
- plastic hoop
- cleaned
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
The present invention relates to a kind of novel stainless steel loops and plastic hoop technique for sticking method, and this method comprises the following steps：(1) pre-treatment of stainless steel part and plastic part；(2) plastic part is positioned on special tooling；(3) glue special is smeared；(4) stainless steel part is placed on plastic part and uniformly presses and twists；(5) special tooling is placed above stainless steel part；(6) cure.The process of the present invention realizes the combination of stainless steel and plastics high intensity so that whole to be detached during the use to run at high speed.This characteristic is particularly significant for the planarization process of semiconductor crystal wafer.
Description
Technical field
The process of the present invention is mainly used in grinding wafer processing procedure in prepared by semiconductor crystal wafer, and one is provided for the processing procedure
Plant reliably parts.
Background technology
With the fast development of semicon industry, the stability and reliability of semiconductor equipment and its parts become increasingly
It is important.In semiconductor parts, a kind of novel plastic part and stainless steel part adhesive ring in grinding wafer processing procedure at
For indispensable part.How high intensity is provided, and the adhesive property of high-bond becomes particularly important.
Invention content
The object of the present invention is to provide a kind of plastic parts of high intensity high-bond and stainless steel part technique for sticking.
To achieve the goals above, the technical solution adopted by the present invention is：
A kind of novel stainless steel loop and plastic hoop technique for sticking method,
It is as follows：
(1) stainless steel ring pre-treatment：Stainless steel surface is cleaned using isopropanol, then uses adhesive tape by non-adhesive
Face is covered, and the part Nian Jie with frosting is exposed；Using 100# white fused aluminas, blasting treatment, blasting pressure are carried out to bonding plane
60-80PSI, 45 ° -55 ° of angle, nozzle distance workpiece 10-15cm, movement speed 2-3cm/s, gained face rugosity：50-80μin；
Masking tape is removed, stainless steel part is placed in ultrasonic cleaner, cleans 30s, the extra gravel of removal surface attachment is used
Clear water is cleaned, and is placed in baking oven, and 30min, 110-125 DEG C of oven temperature are toasted；
(2) plastic hoop pre-treatment：Plastics ring surface is cleaned using isopropanol, then uses adhesive tape by non-stick junction
The part Nian Jie with stainless steel surface is exposed in masking；Using 80# garnets, blasting treatment, blasting pressure are carried out to bonding plane
60-80PSI, 45 ° -55 ° of angle, nozzle distance workpiece 10-15cm, movement speed 2-3cm/s, gained face rugosity：50-80μin；
Masking tape is removed, plastic part is placed in ultrasonic cleaner, cleans 30s, removes the extra gravel of surface attachment, then
It is cleaned with clear water, air gun drying；
(3) plastic hoop is placed in tooling：Tooling surface is cleaned with isopropanol；Plastic part Jing Guo pre-treatment is placed in work
It loads onto；Tooling has the function of positioning, ensures that plastic hoop is located at and sink inside platform；
(4) gluing：Using glue rifle by epoxy glue, happy Thailand epoxy glue Magnolia 6375 is uniformly squeezed in plastics according to snakelike
The surface of part；Epoxy glue is smeared uniformly with plastic scrapers, and confirms surface pore-free and caking；
(5) stainless steel ring is fixed with plastic hoop：Stainless steel ring is positioned on plastic hoop and is aligned；Then repeatedly with 5~
10 ° of angle rotates and at the top of jig for pressing, until stainless steel ring is fixed on plastic hoop；Check epoxy glue whether along
It squeezes out to locating ring even circumferential, if uneven, need to dispose all epoxy glues and repeat the above steps；
(6) cure：Stainless steel ring and plastic hoop that each group glues are positioned on platform, when solidification, at most by 10
A fixed ring with fixture is packed together, and the weight of 25kg, normal temperature cure 120 hours are placed on the jig of top；120
It can be combined power detection with removing fixture after hour.
It is an advantage of the invention that：
The present invention realizes the combination of stainless steel and plastics high intensity so that integrally during the use to run at high speed not
It can detach.This characteristic is particularly significant for the planarization process of semiconductor crystal wafer.
Specific embodiment
A kind of novel stainless steel loop and plastic hoop technique for sticking method,
It is as follows：
(1) stainless steel ring pre-treatment：Stainless steel surface is cleaned using isopropanol, then uses adhesive tape by non-adhesive
Face is covered, and the part Nian Jie with frosting is exposed；Using 100# white fused aluminas, blasting treatment, blasting pressure are carried out to bonding plane
60-80PSI, 45 ° -55 ° of angle, nozzle distance workpiece 10-15cm, movement speed 2-3cm/s, gained face rugosity：50-80μin；
Masking tape is removed, stainless steel part is placed in ultrasonic cleaner, cleans 30s, the extra gravel of removal surface attachment is used
Clear water is cleaned, and is placed in baking oven, and 30min, 110-125 DEG C of oven temperature are toasted；
(2) plastic hoop pre-treatment：Plastics ring surface is cleaned using isopropanol, then uses adhesive tape by non-stick junction
The part Nian Jie with stainless steel surface is exposed in masking；Using 80# garnets, blasting treatment, blasting pressure are carried out to bonding plane
60-80PSI, 45 ° -55 ° of angle, nozzle distance workpiece 10-15cm, movement speed 2-3cm/s, gained face rugosity：50-80μin；
Masking tape is removed, plastic part is placed in ultrasonic cleaner, cleans 30s, removes the extra gravel of surface attachment, then
It is cleaned with clear water, air gun drying；
(3) plastic hoop is placed in tooling：Tooling surface is cleaned with isopropanol；Plastic part Jing Guo pre-treatment is placed in work
It loads onto；Tooling has the function of positioning, ensures that plastic hoop is located at and sink inside platform；
(4) gluing：Using glue rifle by epoxy glue, happy Thailand epoxy glue Magnolia 6375 is uniformly squeezed in plastics according to snakelike
The surface of part；Epoxy glue is smeared uniformly with plastic scrapers, and confirms surface pore-free and caking；
(5) stainless steel ring is fixed with plastic hoop：Stainless steel ring is positioned on plastic hoop and is aligned；Then repeatedly with 5~
10 ° of angle rotates and at the top of jig for pressing, until stainless steel ring is fixed on plastic hoop；Check epoxy glue whether along
It squeezes out to locating ring even circumferential, if uneven, need to dispose all epoxy glues and repeat the above steps；
(6) cure：Stainless steel ring and plastic hoop that each group glues are positioned on platform, when solidification, at most by 10
A fixed ring with fixture is packed together, and the weight of 25kg, normal temperature cure 120 hours are placed on the jig of top；120
It can be combined power detection with removing fixture after hour.
Claims (1)
1. a kind of novel stainless steel loop and plastic hoop technique for sticking method, which is characterized in that
It is as follows：
(1) stainless steel ring pre-treatment：Stainless steel surface is cleaned using isopropanol, is then hidden non-stick junction using adhesive tape
It covers, exposes the part Nian Jie with frosting；Using 100# white fused aluminas, blasting treatment, blasting pressure 60- are carried out to bonding plane
80PSI, 45 ° -55 ° of angle, nozzle distance workpiece 10-15cm, movement speed 2-3cm/s, gained face rugosity：50-80μin；It goes
Except masking tape, stainless steel part is placed in ultrasonic cleaner, cleans 30s, the extra gravel of removal surface attachment, with clear
Water is cleaned, and is placed in baking oven, and 30min, 110-125 DEG C of oven temperature are toasted；
(2) plastic hoop pre-treatment：Plastics ring surface is cleaned using isopropanol, is then hidden non-stick junction using adhesive tape
It covers, exposes the part Nian Jie with stainless steel surface；Using 80# garnets, blasting treatment, blasting pressure 60- are carried out to bonding plane
80PSI, 45 ° -55 ° of angle, nozzle distance workpiece 10-15cm, movement speed 2-3cm/s, gained face rugosity：50-80μin；It goes
Except masking tape, plastic part is placed in ultrasonic cleaner, cleans 30s, then the extra gravel of removal surface attachment is used
Clear water is cleaned, air gun drying；
(3) plastic hoop is placed in tooling：Tooling surface is cleaned with isopropanol；Plastic part Jing Guo pre-treatment is placed in tooling
On；Tooling has the function of positioning, ensures that plastic hoop is located at and sink inside platform；
(4) gluing：Epoxy glue is uniformly squeezed on the surface of plastic part according to snakelike using glue rifle；Epoxy glue is applied with plastic scrapers
It smears uniformly, and confirms surface pore-free and caking；
(5) stainless steel ring is fixed with plastic hoop：Stainless steel ring is positioned on plastic hoop and is aligned；Then repeatedly with 5~10 °
At the top of angle rotation and jig for pressing, until stainless steel ring is fixed on plastic hoop；Check epoxy glue whether along positioning
It squeezes out to ring even circumferential, if uneven, need to dispose all epoxy glues and repeat the above steps；
(6) cure：Stainless steel ring and plastic hoop that each group glues are positioned on platform, when solidification, at most by 10 bands
There is the fixed ring of fixture to be packed together, and places the weight of 25kg, normal temperature cure 120 hours on the jig of top；120 hours
After can with removing fixture, be combined power detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157226.0A CN108312054A (en) | 2018-02-24 | 2018-02-24 | A kind of novel stainless steel loop and plastic hoop technique for sticking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157226.0A CN108312054A (en) | 2018-02-24 | 2018-02-24 | A kind of novel stainless steel loop and plastic hoop technique for sticking method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108312054A true CN108312054A (en) | 2018-07-24 |
Family
ID=62900384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810157226.0A Pending CN108312054A (en) | 2018-02-24 | 2018-02-24 | A kind of novel stainless steel loop and plastic hoop technique for sticking method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108312054A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178981A (en) * | 2021-12-20 | 2022-03-15 | 上海江丰平芯电子科技有限公司 | Retaining ring for chemical mechanical polishing and bonding method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049371A (en) * | 1990-09-14 | 1991-02-20 | 陶国延 | The adhering method of fluoroplastics and metal and binding agent |
| CN1840320A (en) * | 2005-03-30 | 2006-10-04 | 联想(北京)有限公司 | Bonding method and device for metal-plastic composite panel |
| CN1896294A (en) * | 2005-07-11 | 2007-01-17 | 佛山市顺德区汉达精密电子科技有限公司 | Pretreatment of physical coating on PC/ABS plastic substrate |
| CN101398025A (en) * | 2008-11-18 | 2009-04-01 | 航天材料及工艺研究所 | Positioning bonding process of circular cylinder composite material piece and metal piece |
| CN106634643A (en) * | 2015-11-03 | 2017-05-10 | 株洲时代新材料科技股份有限公司 | Surface treatment method capable of increasing bonding performance of metal and silicone rubber |
| CN107488842A (en) * | 2017-08-08 | 2017-12-19 | 肥西县通力机械有限公司 | A kind of processing method for improving steel surface bonding characteristic |
| CN107512005A (en) * | 2017-07-31 | 2017-12-26 | 无锡厚发自动化设备有限公司 | A kind of application method of hot pressing device |
-
2018
- 2018-02-24 CN CN201810157226.0A patent/CN108312054A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049371A (en) * | 1990-09-14 | 1991-02-20 | 陶国延 | The adhering method of fluoroplastics and metal and binding agent |
| CN1840320A (en) * | 2005-03-30 | 2006-10-04 | 联想(北京)有限公司 | Bonding method and device for metal-plastic composite panel |
| CN1896294A (en) * | 2005-07-11 | 2007-01-17 | 佛山市顺德区汉达精密电子科技有限公司 | Pretreatment of physical coating on PC/ABS plastic substrate |
| CN101398025A (en) * | 2008-11-18 | 2009-04-01 | 航天材料及工艺研究所 | Positioning bonding process of circular cylinder composite material piece and metal piece |
| CN106634643A (en) * | 2015-11-03 | 2017-05-10 | 株洲时代新材料科技股份有限公司 | Surface treatment method capable of increasing bonding performance of metal and silicone rubber |
| CN107512005A (en) * | 2017-07-31 | 2017-12-26 | 无锡厚发自动化设备有限公司 | A kind of application method of hot pressing device |
| CN107488842A (en) * | 2017-08-08 | 2017-12-19 | 肥西县通力机械有限公司 | A kind of processing method for improving steel surface bonding characteristic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178981A (en) * | 2021-12-20 | 2022-03-15 | 上海江丰平芯电子科技有限公司 | Retaining ring for chemical mechanical polishing and bonding method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180724 |