CN108311344A - A kind of point glue equipment for LED encapsulation - Google Patents
A kind of point glue equipment for LED encapsulation Download PDFInfo
- Publication number
- CN108311344A CN108311344A CN201810338718.XA CN201810338718A CN108311344A CN 108311344 A CN108311344 A CN 108311344A CN 201810338718 A CN201810338718 A CN 201810338718A CN 108311344 A CN108311344 A CN 108311344A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- plate
- placing groove
- side wall
- movable plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 53
- 238000005538 encapsulation Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000000694 effects Effects 0.000 claims abstract description 5
- 239000011324 bead Substances 0.000 claims description 14
- 230000033001 locomotion Effects 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 229960001866 silicon dioxide Drugs 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 230000004224 protection Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a kind of point glue equipments for LED encapsulation, including pedestal, the upper end both sides of the pedestal have been fixedly connected with support plate, the upper end of two support plates is fixedly connected with placement plate, the lower end of the placement plate is equipped with placing groove, it is rotatably connected to threaded rod in the placing groove, it is fixedly connected with servo motor on the side wall of the placement plate, the output shaft end of the servo motor runs through the side wall of placing groove and is fixedly connected with one end of threaded rod, screw thread is socketed with movable plate on the side wall of the threaded rod, the upper end of the movable plate is fixedly connected with guiding mechanism, the upper end of the placement plate is equipped with the loose slot being connected with placing groove, the one end of the guiding mechanism far from movable plate is through loose slot and extends outwardly.Structure of the invention is compact, by the transmission mode of threaded rod, can carry out dispensing to multiple LED in the horizontal direction, and dispensing precision is high, dispensing range is wide, and using effect is good.
Description
Technical field
The present invention relates to LED dispensing technologies field more particularly to a kind of point glue equipments for LED encapsulation.
Background technology
The encapsulation function of LED is to provide chip enough protections, prevents chip exposure for a long time or machinery damage in air
Hinder and fail, to improve the stability of chip, and in LED encapsulation process, needs to LED support and LED mounted thereto
Carry out dispensing processing, dispensing processing is very important a procedure, quality for dispensing glue determine to a certain extent LED at
Quality.But the precision of existing point glue equipment is not high, is easy deviation occur during for dispensing glue, leads to dispensing quality not
Height, and its height inconvenience is adjusted, and can not carry out dispensing work to different types of LED, using effect is not fine.
Invention content
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of of proposition is used for what LED was encapsulated
Point glue equipment.Structure of the invention is compact, by the transmission mode of threaded rod, can be carried out a little to multiple LED in the horizontal direction
Glue, and dispensing precision is high, dispensing range is wide, and using effect is good.
To achieve the goals above, present invention employs following technical solutions：
A kind of point glue equipment for LED encapsulation, including pedestal, the upper end both sides of the pedestal have been fixedly connected with support
The upper end of plate, two support plates is fixedly connected with placement plate, and the lower end of the placement plate is equipped with placing groove, the placing groove
It is inside rotatably connected to threaded rod, servo motor, the output shaft of the servo motor are fixedly connected on the side wall of the placement plate
End is run through the side wall of placing groove and is fixedly connected with one end of threaded rod, and screw thread is socketed with movement on the side wall of the threaded rod
The upper end of plate, the movable plate is fixedly connected with guiding mechanism, and the upper end of the placement plate is equipped with the work being connected with placing groove
Dynamic slot, the one end of the guiding mechanism far from movable plate is through loose slot and extends outwardly, and the upper end both sides of the placement plate are equal
It is fixedly connected with fixed plate, guiding axis is fixedly connected between two fixed plates, the guiding mechanism is far from movable plate
One end is slidably socketed on guiding axis, and the lower end of the movable plate is fixedly connected with connecting plate, and the lower end of the connecting plate is run through
Placing groove simultaneously extends to down, is fixedly connected with support plate on the side wall of the connecting plate, the support plate far from connecting plate one
End both sides have been fixedly connected with limiting plate, and glue applying mechanism, the both sides of two limiting plates are equipped between two limiting plates
It is equipped with multiple retaining mechanisms that glue applying mechanism is fixed.
Preferably, the glue applying mechanism includes dispensing case, and the lower end of the dispensing case is equipped with Glue dripping head, the pedestal it is upper
End is fixedly connected with telescoping mechanism, and the upper end of the telescoping mechanism is fixedly connected with rack, is equidistantly set on the rack
There are multiple LED lamp bead placing grooves.
Preferably, the guiding mechanism includes two connecting rods being fixedly connected on the side wall of movable plate upper end, two institutes
The upper end for stating connecting rod runs through loose slot and is fixedly connected with sliding sleeve, and two sliding sleeves are slidably socketed in guiding axis
On.
Preferably, the telescoping mechanism includes two electric telescopic rods for being fixedly connected on pedestal upper end, two electricity
The telescopic end of dynamic telescopic rod is fixedly connected with loading plate, and the upper end of the loading plate is fixedly connected on the lower end of rack.
Preferably, the opposing sidewalls of two support plates have been fixedly connected with stripe board, the phase of two stripe boards
Sliding slot is equipped with to side wall, the both ends of the rack have been fixedly connected with sliding shoe corresponding with bar shaped Board position, two cunnings
Motion block is slidably connected at respectively in two sliding slots.
Preferably, the lower end of the pedestal is fixedly connected with non-slip mat, and the non-slip mat is self-adhesion silica-gel antiskid pad.
Preferably, the retaining mechanism is lock-screw, and the side wall of the dispensing case is equipped with and lock-screw position pair
The thread groove answered.
Beneficial effects of the present invention：
In the present invention, in the dispensing course of work, it will wait for that LED lamp bead for dispensing glue is placed in LED lamp bead placing groove, according to
LED lamp bead for dispensing glue is waited at a distance from glue applying mechanism, is seted the tone by two electric telescopic rods to carry out one to the height of rack
Section carries out dispensing processing by Glue dripping head to LED lamp bead, starts servo motor, servo motor drives threaded rod rotation, to make
It obtains movable plate to be moved on threaded rod, movable plate drives limiting plate to move by connecting plate, to drive glue applying mechanism to exist
It is moved in horizontal direction, to carry out dispensing to different LED lamp beads.Structure of the invention is compact, passes through the biography of threaded rod
Mode is sent, can dispensing be carried out to multiple LED in the horizontal direction, and dispensing precision is high, dispensing range is wide, using effect
It is good,
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of point glue equipment for LED encapsulation proposed by the present invention；
Fig. 2 is the portion of the threaded rod and movable block junction of a kind of point glue equipment for LED encapsulation proposed by the present invention
Separation structure schematic diagram；
Fig. 3 is placement plate and the glue applying mechanism junction of a kind of point glue equipment for LED encapsulation proposed by the present invention
Partial side elevation view.
In figure：1 pedestal, 2 support plates, 3 placement plates, 4 threaded rods, 5 servo motors, 6 fixed plates, 7 guiding axis, 8 sliding sleeves,
9 dispensing casees, 10 Glue dripping heads, 11 limiting plates, 12 electric telescopic rods, 13 loading plates, 14 racks, 15 LED lamp bead placing grooves, 16
Stripe board, 17 sliding shoes, 18 movable plates, 19 connecting plates, 20 support plates, 21 retaining mechanisms, 22 non-slip mats, 23 connecting rods, 24 are put
Set slot, 25 loose slots, 26 sliding slots.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1-3, a kind of point glue equipment for LED encapsulation, including pedestal 1, the upper end both sides of pedestal 1 are fixed to be connected
It is connected to support plate 2, the upper end of two support plates 2 is fixedly connected with placement plate 3, and the lower end of placement plate 3 is equipped with placing groove 24, places
It is rotatably connected to threaded rod 4 in slot 24, servo motor 5, the output shaft of servo motor 5 are fixedly connected on the side wall of placement plate 3
End is run through the side wall of placing groove 24 and is fixedly connected with one end of threaded rod 4, and servo motor 5 is started, and servo motor 5 drives spiral shell
Rasp bar 4 rotates, and screw thread is socketed with movable plate 18 on the side wall of threaded rod 4, and when threaded rod 4 rotates, movable plate 18 can be in level
It is moved on direction, the upper end of movable plate 18 is fixedly connected with guiding mechanism, and guiding mechanism plays the movement of movable plate 18
Certain guiding role, the upper end of placement plate 3 are equipped with the loose slot 25 being connected with placing groove 24, and guiding mechanism is far from movable plate
18 one end is through loose slot 25 and extends outwardly, and the upper end both sides of placement plate 3 have been fixedly connected with fixed plate 6, two fixations
Guiding axis 7 is fixedly connected between plate 6, the one end of guiding mechanism far from movable plate 18 is slidably socketed on guiding axis 7, movable plate
18 lower end is fixedly connected with connecting plate 19, and the lower end of connecting plate 19 through placing groove 24 and extends to down, and movable plate 18 passes through
Connecting plate 19 drives support plate 20 to move, and support plate 20 is fixedly connected on the side wall of connecting plate 19, support plate 20 is far from connection
One end both sides of plate 19 have been fixedly connected with limiting plate 11, and support plate 20 drives two limiting plates 11 to be moved, two limits
Glue applying mechanism is equipped between plate 11, to drive glue applying mechanism to be moved in the horizontal direction, glue applying mechanism is existing market
Spot gluing equipment used in upper, the both sides of two limiting plates 11 are equipped with multiple retaining mechanisms that glue applying mechanism is fixed
21, retaining mechanism 21 helps to carry out dismounting installation to glue applying mechanism, and glue applying mechanism includes dispensing case 9, and the lower end of dispensing case 9 is set
There are Glue dripping head 10, the upper end of pedestal 1 to be fixedly connected with telescoping mechanism, the upper end of telescoping mechanism is fixedly connected with rack 14, root
According to LED for dispensing glue is waited at a distance from glue applying mechanism, the height of rack 14 can centainly be adjusted by telescoping mechanism, to
Dispensing range is expanded, multiple LED lamp bead placing grooves 15 are equidistantly equipped on rack 14.
In the present invention, guiding mechanism includes two connecting rods 23 being fixedly connected on 18 upper end side wall of movable plate, two
The upper end of connecting rod 23 runs through loose slot 25 and is fixedly connected with sliding sleeve 8, and two sliding sleeves 8 are slidably socketed in guiding axis 7
On, sliding sleeve 8 moves movable plate 18 on guiding axis 7, to play guiding role to the movement of movable plate 18.It is flexible
Mechanism includes being fixedly connected on two electric telescopic rods 12 of 1 upper end of pedestal, and the telescopic end of two electric telescopic rods 12, which is fixed, to be connected
It is connected to loading plate 13, the upper end of loading plate 13 is fixedly connected on the lower end of rack 14, starts two electric telescopic rods 12, electronic
Telescopic rod 12 drives loading plate 13 to move upwards, to carry out certain adjusting to the height of rack 14.Two support plates 2
Opposing sidewalls have been fixedly connected with stripe board 16, and the opposing sidewalls of two stripe boards 16 are equipped with sliding slot 26, and the two of rack 14
End has been fixedly connected with sliding shoe corresponding with 16 position of stripe board 17, and two sliding shoes 17 are slidably connected at two sliding slots respectively
In 26, sliding shoe 17 plays guiding role to the movement of rack 14.The lower end of pedestal 1 is fixedly connected with non-slip mat 22, anti-skidding
Pad 22 is self-adhesion silica-gel antiskid pad.Retaining mechanism 21 is lock-screw, and the side wall of dispensing case 9 is equipped with and lock-screw position pair
The thread groove answered.
In the present invention, in the dispensing course of work, it will wait for that LED lamp bead for dispensing glue is placed in LED lamp bead placing groove 15, root
According to LED lamp bead for dispensing glue is waited at a distance from glue applying mechanism, the height of rack 14 is carried out by two electric telescopic rods 12
It is certain to adjust, so that wait for the progress that LED for dispensing glue contributes to dispensing to work at a distance from glue applying mechanism, it can also be by putting
The adjusting for setting 14 height of frame expands dispensing range；Dispensing processing is carried out to LED lamp bead by Glue dripping head 10, starts servo electricity
Machine 5, servo motor 5 drive threaded rod 4 to rotate, so that movable plate 18 is moved on threaded rod 4, movable plate 18 passes through
Connecting plate 19 drives limiting plate 11 to move, and to drive glue applying mechanism to be moved in the horizontal direction, glue applying mechanism is to same
LED lamp bead on horizontal plane carries out dispensing.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of point glue equipment for LED encapsulation, including pedestal (1), which is characterized in that the upper end both sides of the pedestal (1)
It is fixedly connected with support plate (2), the upper end of two support plates (2) is fixedly connected with placement plate (3), the placement plate
(3) lower end is equipped with placing groove (24), and threaded rod (4), the side of the placement plate (3) are rotatably connected in the placing groove (24)
Be fixedly connected with servo motor (5) on wall, the output shaft end of the servo motor (5) through placing groove (24) side wall and with
One end of threaded rod (4) is fixedly connected, and screw thread is socketed with movable plate (18), the movable plate on the side wall of the threaded rod (4)
(18) upper end is fixedly connected with guiding mechanism, and the upper end of the placement plate (3) is equipped with the activity being connected with placing groove (24)
Slot (25), the one end of the guiding mechanism far from movable plate (18) is through loose slot (25) and extends outwardly, the placement plate (3)
Upper end both sides be fixedly connected with fixed plate (6), be fixedly connected with guiding axis (7) between two fixed plates (6), it is described
The one end of guiding mechanism far from movable plate (18) is slidably socketed on guiding axis (7), and the lower end of the movable plate (18), which is fixed, to be connected
It is connected to connecting plate (19), the lower end of the connecting plate (19) through placing groove (24) and extends to down, the connecting plate (19)
Support plate (20) is fixedly connected on side wall, one end both sides of the support plate (20) far from connecting plate (19) have been fixedly connected with
Limiting plate (11) is equipped with glue applying mechanism between two limiting plates (11), and the both sides of two limiting plates (11) are equipped with
Multiple retaining mechanisms (21) that glue applying mechanism is fixed.
2. a kind of point glue equipment for LED encapsulation according to claim 1, which is characterized in that the glue applying mechanism packet
Include dispensing case (9), the lower end of the dispensing case (9) is equipped with Glue dripping head (10), and the upper end of the pedestal (1) is fixedly connected with flexible
The upper end of mechanism, the telescoping mechanism is fixedly connected with rack (14), and multiple LED are equidistantly equipped on the rack (14)
Lamp bead placing groove (15).
3. a kind of point glue equipment for LED encapsulation according to claim 1, which is characterized in that the guiding mechanism packet
Two connecting rods (23) being fixedly connected on the side wall of movable plate (18) upper end are included, the upper end of two connecting rods (23) is passed through
It wears loose slot (25) and is fixedly connected with sliding sleeve (8), two sliding sleeves (8) are slidably socketed on guiding axis (7).
4. a kind of point glue equipment for LED encapsulation according to claim 2, which is characterized in that the telescoping mechanism packet
Two electric telescopic rods (12) for being fixedly connected on pedestal (1) upper end are included, the telescopic end of two electric telescopic rods (12) is solid
Surely it is connected with loading plate (13), the upper end of the loading plate (13) is fixedly connected on the lower end of rack (14).
5. a kind of point glue equipment for LED encapsulation according to claim 2, which is characterized in that two support plates
(2) opposing sidewalls have been fixedly connected with stripe board (16), and the opposing sidewalls of two stripe boards (16) are equipped with sliding slot
(26), the both ends of the rack (14) have been fixedly connected with sliding shoe (17) corresponding with stripe board (16) position, two cunnings
Motion block (17) is slidably connected at respectively in two sliding slots (26).
6. a kind of point glue equipment for LED encapsulation according to claim 1, which is characterized in that under the pedestal (1)
End is fixedly connected with non-slip mat (22), and the non-slip mat (22) is self-adhesion silica-gel antiskid pad.
7. a kind of point glue equipment for LED encapsulation according to claim 2, which is characterized in that the retaining mechanism
(21) it is lock-screw, the side wall of the dispensing case (9) is equipped with thread groove corresponding with lock-screw position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810338718.XA CN108311344A (en) | 2018-04-16 | 2018-04-16 | A kind of point glue equipment for LED encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810338718.XA CN108311344A (en) | 2018-04-16 | 2018-04-16 | A kind of point glue equipment for LED encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108311344A true CN108311344A (en) | 2018-07-24 |
Family
ID=62897014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810338718.XA Pending CN108311344A (en) | 2018-04-16 | 2018-04-16 | A kind of point glue equipment for LED encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108311344A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109225764A (en) * | 2018-11-01 | 2019-01-18 | 湖州碧宁生物科技有限公司 | A kind of drop medicine device of plaster |
| CN112108327A (en) * | 2020-09-23 | 2020-12-22 | 广西欣亿光电科技有限公司 | High-efficient LED packaging structure with fitting and heat dissipation functions |
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|---|---|---|---|---|
| US20010003968A1 (en) * | 1999-12-16 | 2001-06-21 | Tokyo Electron Limited | Film forming unit |
| CN106076741A (en) * | 2016-08-17 | 2016-11-09 | 洛阳力诺模具有限公司 | A kind of lithium battery pole ear continuous gluing equipment |
| CN107552324A (en) * | 2017-10-26 | 2018-01-09 | 杨月权 | A kind of integrated antenna package spot gluing equipment |
| CN206935689U (en) * | 2017-06-22 | 2018-01-30 | 广东唯信智能科技有限公司 | A kind of single track automatic dispensing machine |
| CN206996984U (en) * | 2017-07-27 | 2018-02-13 | 启东市罗源光伏设备有限公司 | Solar energy automatic sealing robot |
| CN107694845A (en) * | 2017-11-23 | 2018-02-16 | 广东弘景光电科技股份有限公司 | Camera module automatically dropping glue assembly equipment |
-
2018
- 2018-04-16 CN CN201810338718.XA patent/CN108311344A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010003968A1 (en) * | 1999-12-16 | 2001-06-21 | Tokyo Electron Limited | Film forming unit |
| CN106076741A (en) * | 2016-08-17 | 2016-11-09 | 洛阳力诺模具有限公司 | A kind of lithium battery pole ear continuous gluing equipment |
| CN206935689U (en) * | 2017-06-22 | 2018-01-30 | 广东唯信智能科技有限公司 | A kind of single track automatic dispensing machine |
| CN206996984U (en) * | 2017-07-27 | 2018-02-13 | 启东市罗源光伏设备有限公司 | Solar energy automatic sealing robot |
| CN107552324A (en) * | 2017-10-26 | 2018-01-09 | 杨月权 | A kind of integrated antenna package spot gluing equipment |
| CN107694845A (en) * | 2017-11-23 | 2018-02-16 | 广东弘景光电科技股份有限公司 | Camera module automatically dropping glue assembly equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109225764A (en) * | 2018-11-01 | 2019-01-18 | 湖州碧宁生物科技有限公司 | A kind of drop medicine device of plaster |
| CN112108327A (en) * | 2020-09-23 | 2020-12-22 | 广西欣亿光电科技有限公司 | High-efficient LED packaging structure with fitting and heat dissipation functions |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180724 |