CN108307580A - A kind of PCB circuit board and its wiring method - Google Patents
A kind of PCB circuit board and its wiring method Download PDFInfo
- Publication number
- CN108307580A CN108307580A CN201710024391.4A CN201710024391A CN108307580A CN 108307580 A CN108307580 A CN 108307580A CN 201710024391 A CN201710024391 A CN 201710024391A CN 108307580 A CN108307580 A CN 108307580A
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- China
- Prior art keywords
- serial differential
- differential connecting
- connecting line
- circuit board
- pcb circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
Abstract
The present invention provides a kind of PCB circuit board and its wiring methods, are related to electronic circuit technology field.The PCB circuit board, including the first serdes chips being set in PCB circuit board and the 2nd serdes chips；The first serdes chips and the 2nd serdes chips are respectively connected with differential clocks circuit；The first serdes chips and the 2nd serdes chips are connected by a serial differential connecting wire structure；The serial differential connecting wire structure includes multigroup serial differential connecting line, and every group of serial differential connecting line includes that a reception line and one send line；Every group of serial differential connecting line is connected to using AC coupled mode between the first serdes chips and the 2nd serdes chips.The present invention ensures the integrality of high-frequency signal, and without increasing metal cavity, be conducive to the simplicity setting of PCB circuit board it is possible to prevente effectively from crosstalk and electromagnetic interference.
Description
Technical field
The present invention relates to electronic circuit technology field more particularly to a kind of PCB circuit board and its wiring methods.
Background technology
Currently, with the continuous development of electronic circuit technology, printed circuit board (Printed circuit board, abbreviation
PCB it) is widely used in electronic circuit field, such as computer, medical instrument and various electronic surveyings
Instrument etc. is required to be applied to pcb board.Such as in spectrum analyzer, pcb board has obtained a large amount of application.Spectrum analyzer is
A kind of receiver being used for carrying out measured signal spectrum analysis, can measure the correlations such as the frequency, amplitude, distortion of unknown signaling
Parameter usually has very wide frequency and amplitude measurement range.Spectrum analyzer can be by input radio frequency signal by repeatedly becoming
The higher signal of frequency is changed into the accessible low frequency signal of data intermediate frequency module by frequency.
Currently, the bandwidth of digital frequency spectrum analyzer is more and more wider, or even one kind is developed and can handle real time spectrum
Real-time spectrum analyzer.In general, the base band signal process amount of these spectrum analyzers is very big, some base band fast Fourier transforms
(Fast Fourier Transformation, abbreviation FFT) spectrum analyzer even more uses in quick Fu in a short period of time
Leaf transformation calculates the frequency spectrum of base band, these data need the bus of very high bandwidth to carry out field programmable gate array (Field-
Programmable Gate Array, abbreviation FPGA) arrive Digital Signal Processing (Digital Signal Processing, letter
Claim DSP) or arm processor (Advanced RISC Machines, abbreviation ARM) between interaction, it usually needs reach several GB
Transmission rate, if Traditional parallel bus type will reach this rate request, the difficulty of the width of bus, wiring will at double
Increase.(serdes is the letter of English SERializer (serializer)/DESerializer (deserializer) to current serial serdes
Claim, be a kind of time division multiplexing of mainstream (TDM), point-to-point (P2P) serial communication technology.) can be very good to solve to be somebody's turn to do
Problem.The speed of usual serdes can reach 10Gbps, and speed high in this way can meet the data of real-time spectrum analyzer
Transmission rate request, but many challenges also are produced to board design.Under so high speed, how to ensure the letter of serdes
Number integrality is the problem of each high-speed digital circuit plate designer must face.Currently available technology typically uses difference
Line is walked on surface layer, and is covered the corresponding positions serdes of PCB circuit board using metal cavity, prevents external signal from interfering, however
Current metal cavity is complicated, is unfavorable for the simplicity setting of PCB circuit board.
Invention content
The embodiment of the present invention provides a kind of PCB circuit board and its wiring method, to solve currently to ensure serdes
Signal integrity, prevent the interference of external signal, need the metal cavity of application structure complexity by the serdes of PCB circuit board
Chip covers, be unfavorable for PCB circuit board simplicity setting the problem of.
In order to achieve the above objectives, the present invention adopts the following technical scheme that：
A kind of PCB circuit board, including the first serdes chips being set in PCB circuit board and the 2nd serdes chips；
The first serdes chips and the 2nd serdes chips are respectively connected with differential clocks circuit；The first serdes chips and
Two serdes chips are connected by a serial differential connecting wire structure；The serial differential connecting wire structure includes multigroup serial poor
It includes that a reception line and one send line to divide connecting line, every group of serial differential connecting line；Every group of serial differential connecting line uses
AC coupled mode is connected between the first serdes chips and the 2nd serdes chips.
Specifically, the equal length of every group of serial differential connecting line.
Specifically, the serial differential connecting wire structure includes the first ground plane, signals layer, bus plane successively from top to bottom
And second ground plane；Between first ground plane and signals layer, between signals layer and bus plane and bus plane and second
Insulating layer is both provided between ground plane；Every group of serial differential connecting line distribution is set to the signals layer.
Further, every group of serial differential connecting line both sides, the wiring direction along serial differential connecting line is provided with two
Arrange grounding through hole；Each grounding through hole runs through first ground plane, signals layer, bus plane and the second ground plane；The letter
The ground terminal of number floor is connect by the grounding through hole with the first ground plane and the second ground plane, and is grounded.
Specifically, the distance of adjacent grounding through hole is less than or equal to 100mil in every row's grounding through hole.
In addition, the bus plane is loaded with two-way supply voltage so that bus plane is divided into the first supply voltage part and
Two supply voltage parts are provided with power supply boundary between first supply voltage part and second source voltage segment；
The each position that is projected through the power supply has a common boundary of the serial differential connecting line of the signals layer in the bus plane
Place is provided with capacitance；First supply voltage part and second source voltage segment described in the capacitance connection.
A kind of wiring method of PCB circuit board is applied to above-mentioned PCB circuit board, the method includes：
First serdes chips and the 2nd serdes chips are positioned in PCB circuit board；
First serdes chips and the 2nd serdes chips are separately connected differential clocks circuit；
Generate a serial differential connecting wire structure；The serial differential connecting wire structure includes multigroup serial differential connection
Line, every group of serial differential connecting line include that a reception line and one send line；
The first serdes chips and the 2nd serdes chips are connected by serial differential connecting wire structure so that every group serial
Difference connecting line is connected to using AC coupled mode between the first serdes chips and the 2nd serdes chips.
Specifically, one serial differential connecting wire structure of the generation, including：
Every group of serial differential connecting line is done into isometric processing so that the equal length of every group of serial differential connecting line.
Specifically, one serial differential connecting wire structure of the generation, including：
The second ground plane, bus plane, signals layer and first of serial differential connecting wire structure are set gradually from bottom to up
Ground plane；
Every group of serial differential connecting line distribution is set to the signals layer；
Between first ground plane and signals layer, between signals layer and bus plane and bus plane and the second ground plane
Between insulating layer is set；
Every group of serial differential connecting line both sides, two rows of grounding through hole are set along the wiring direction of serial differential connecting line,
And each grounding through hole is run through into first ground plane, signals layer, bus plane and the second ground plane；In every row's grounding through hole
In adjacent grounding through hole distance be less than or equal to 100mil；
The ground terminal of the signals layer is connect by the grounding through hole with the first ground plane and the second ground plane, and is connect
Ground.
In addition, the bus plane is loaded with two-way supply voltage so that bus plane is divided into the first supply voltage part and
Two supply voltage parts are provided with power supply boundary between first supply voltage part and second source voltage segment；
One serial differential connecting wire structure of the generation further includes：
Signals layer serial differential connecting line in the position for being projected through the power supply and having a common boundary of the bus plane
Capacitance is set, the first supply voltage part and second source voltage segment described in the capacitance connection are passed through.
A kind of PCB circuit board provided in an embodiment of the present invention and its wiring method, by using serial differential connecting line
AC coupled mode is connected between the first serdes chips and the 2nd serdes chips, it is possible to prevente effectively from crosstalk and electromagnetism are dry
It disturbs, ensures the integrality of high-frequency signal, and without increasing metal cavity, it can be to avoid currently ensureing the signal of serdes
Integrality prevents the interference of external signal, needs the metal cavity of application structure complexity by the serdes chip lids of PCB circuit board
Firmly, the problem of being unfavorable for the simplicity setting of PCB circuit board.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
With obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram one of PCB circuit board provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram two of PCB circuit board provided in an embodiment of the present invention；
Fig. 3 is the layered structure schematic diagram of the serial differential connecting wire structure in the embodiment of the present invention；
Fig. 4 is the position relationship schematic diagram of the serial differential connecting line and its both sides grounding through hole in the embodiment of the present invention；
Fig. 5 is a kind of flow chart of the wiring method of PCB circuit board provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, the embodiment of the present invention provides a kind of PCB circuit board 10, including be set in PCB circuit board 10 the
One serdes chips 101 and the 2nd serdes chips 102；The first serdes chips 101 and the 2nd serdes chips 102 are
It is connected with differential clocks circuit 103；The first serdes chips 101 and the 2nd serdes chips 102 pass through a serial differential
Connecting wire structure 104 connects；The serial differential connecting wire structure 104 includes multigroup serial differential connecting line 105, and every group serial
Difference connecting line 105 includes that a reception line 106 and one sends line 107；Every group of serial differential connecting line 105 is using exchange coupling
Conjunction mode is connected between the first serdes chips 101 and the 2nd serdes chips 102.
It is worth noting that as shown in Fig. 2, in serial differential connecting wire structure 104, every group of serial differential connects
The length of line 105 can be equal, can ensure that the sequential of each derdes chips is correct in this way, avoid excessive phase error.And
Serial differential connecting wire structure 104 is used for connecting the first serdes chips 101 and the 2nd serdes chips 102.In addition, this is serial
High-speed serial bus can be used in difference connecting line, and bus speed is up to 5bps to 10bps.And above-mentioned differential clocks circuit 103
May be used high stability, low jitter clock.
Specifically, as shown in figure 3, the serial differential connecting wire structure 104 includes the first ground plane successively from top to bottom
201, signals layer 202, bus plane 203 and the second ground plane 204；Between first ground plane 201 and signals layer 202, believe
Number between floor 202 and bus plane 203 and insulating layer is both provided between bus plane 203 and the second ground plane 204 (in figure not show
Go out, which is non-conductive material)；Every group of serial differential connecting line 105 distribution is set to the signals layer 202.
Further, as shown in figure 4, every group of 105 both sides of serial differential connecting line, along the wiring of serial differential connecting line
Direction is provided with two rows of grounding through hole 205.As shown in figure 3, each grounding through hole 205 is through first ground plane 201, signal
Layer 202, bus plane 203 and the second ground plane 204；The signals layer 202 ground terminal (be not shown in figure, under normal circumstances,
In pcb board circuit, it is required to setting ground terminal) by the grounding through hole 205 and the first ground plane 201 and the second ground plane
204 connections, and be grounded.By setting as shown in Figure 4, the ground connection that every group of serial differential connecting line 105 can be passed through both sides
Through-hole ground connection isolation, while both sides are also isolated by the first ground plane and the second ground plane up and down, it in this way can be serially poor by every group
Divide connecting line to be separated with outside, avoid external electromagnetic interference and avoids the electromagnetism between each group serial differential connecting line dry
It disturbs.
Specifically, as shown in figure 4, the distance d of grounding through hole 205 adjacent in every row's grounding through hole 205 is less than or equal to
100mil。
In addition, as shown in figure 3, the bus plane 203 is loaded with two-way supply voltage so that it is first that bus plane 203, which divides,
Supply voltage part 206 and second source voltage segment 207, first supply voltage part 206 and second source voltage portion
Power supply boundary 208 is provided between dividing 207.
As shown in figure 3, the serial differential connecting line 105 of the signals layer 202 is projected through institute in the bus plane 203
Have a common boundary 208 position of power supply is stated to be provided with capacitance 209 and (illustrate only a capacitance 209 in figure 3, but will be appreciated that
, equal in the position for being projected through the power supply boundary 208 of the bus plane 203 in serial differential connecting line 105
Capacitance 209 can be set, which can be 100nF, but be not only limited to this)；The capacitance 209 connects described first
Supply voltage part 206 and second source voltage segment 207.The effect that direct current is hindered by the logical exchange of capacitance 209, may be implemented
The AC coupled mode of every group of serial differential connecting line 105 is connected between the first serdes chips and the 2nd serdes chips,
Crosstalk and electromagnetic interference effectively are avoided, ensures the integrality of high-frequency signal.
A kind of PCB circuit board provided in an embodiment of the present invention, by the way that serial differential connecting line is used AC coupled mode
It is connected between the first serdes chips and the 2nd serdes chips, it is possible to prevente effectively from crosstalk and electromagnetic interference, ensure high frequency
The integrality of signal；In addition, by the way that every group of serial differential connecting line is grounded isolation by the grounding through hole of both sides, while up and down
Both sides are also isolated by the first ground plane and the second ground plane, in this way can separate every group of serial differential connecting line with outside, keep away
Exempt from external electromagnetic interference and avoids the electromagnetic interference between each group serial differential connecting line.And the present invention is without increasing gold
Belong to cavity, can prevent the interference of external signal to avoid the signal integrity of serdes is currently ensured, need application structure
Complicated metal cavity covers the serdes chips of PCB circuit board, the problem of being unfavorable for the simplicity setting of PCB circuit board.
Corresponding to the dependency structure of PCB circuit board shown in above-mentioned Fig. 1 to Fig. 4, as shown in figure 5, the embodiment of the present invention carries
For a kind of wiring method of PCB circuit board, including：
First serdes chips and the 2nd serdes chips are positioned in PCB circuit board by step 301.
First serdes chips and the 2nd serdes chips are separately connected differential clocks circuit by step 302.
Step 303 generates a serial differential connecting wire structure.
Wherein, the serial differential connecting wire structure includes multigroup serial differential connecting line, every group of serial differential connecting line
Line and one, which is received, including one sends line.
Step 304 connects the first serdes chips and the 2nd serdes chips by serial differential connecting wire structure so that
Every group of serial differential connecting line is connected to using AC coupled mode between the first serdes chips and the 2nd serdes chips.
Specifically, in above-mentioned steps 303, a serial differential connecting wire structure is generated, may include following processing mode：
Every group of serial differential connecting line is done into isometric processing so that the equal length of every group of serial differential connecting line.
In addition, in above-mentioned steps 303, a serial differential connecting wire structure is generated, can also include following processing mode：
The second ground plane, bus plane, signals layer and first of serial differential connecting wire structure are set gradually from bottom to up
Ground plane.
Every group of serial differential connecting line distribution is set to the signals layer.
Between first ground plane and signals layer, between signals layer and bus plane and bus plane and the second ground plane
Between insulating layer is set.
Every group of serial differential connecting line both sides, two rows of grounding through hole are set along the wiring direction of serial differential connecting line,
And each grounding through hole is run through into first ground plane, signals layer, bus plane and the second ground plane；In every row's grounding through hole
In adjacent grounding through hole distance be less than or equal to 100mil.
The ground terminal of the signals layer is connect by the grounding through hole with the first ground plane and the second ground plane, and is connect
Ground.
In addition, the bus plane is loaded with two-way supply voltage so that bus plane is divided into the first supply voltage part and
Two supply voltage parts are provided with power supply boundary between first supply voltage part and second source voltage segment.
In above-mentioned steps 303, a serial differential connecting wire structure is generated, can also include following processing mode：
Signals layer serial differential connecting line in the position for being projected through the power supply and having a common boundary of the bus plane
Capacitance is set, the first supply voltage part and second source voltage segment described in the capacitance connection are passed through.
A kind of wiring method of PCB circuit board provided in an embodiment of the present invention is handed over by using serial differential connecting line
Stream coupled modes are connected between the first serdes chips and the 2nd serdes chips, it is possible to prevente effectively from crosstalk and electromagnetism are dry
It disturbs, ensures the integrality of high-frequency signal；In addition, by by every group of serial differential connecting line by the grounding through hole of both sides ground connection every
From, while both sides are also isolated by the first ground plane and the second ground plane up and down, in this way can by every group of serial differential connecting line with
Outside separates, and avoids external electromagnetic interference and avoids the electromagnetic interference between each group serial differential connecting line.And this hair
It is bright to be not necessarily to increase metal cavity, the interference of external signal can be prevented to avoid the signal integrity of serdes is currently ensured,
It needs the metal cavity of application structure complexity to cover the serdes chips of PCB circuit board, is unfavorable for the simplicity of PCB circuit board
The problem of setting.
It should be understood by those skilled in the art that, the embodiment of the present invention can be provided as method, system or computer program
Product.Therefore, complete hardware embodiment, complete software embodiment or reality combining software and hardware aspects can be used in the present invention
Apply the form of example.Moreover, the present invention can be used in one or more wherein include computer usable program code computer
The computer program production implemented in usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
The present invention be with reference to according to the method for the embodiment of the present invention, the flow of equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that can be realized by computer program instructions every first-class in flowchart and/or the block diagram
The combination of flow and/or box in journey and/or box and flowchart and/or the block diagram.These computer programs can be provided
Instruct the processor of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce
A raw machine so that the instruction executed by computer or the processor of other programmable data processing devices is generated for real
The device for the function of being specified in present one flow of flow chart or one box of multiple flows and/or block diagram or multiple boxes.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that instruction generation stored in the computer readable memory includes referring to
Enable the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one box of block diagram or
The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device so that count
Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, in computer or
The instruction executed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in a box or multiple boxes.
Specific embodiment is applied in the present invention, and principle and implementation of the present invention are described, above example
Explanation be merely used to help understand the present invention method and its core concept；Meanwhile for those of ordinary skill in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (10)
1. a kind of PCB circuit board, which is characterized in that including the first serdes chips and second being set in PCB circuit board
Serdes chips；The first serdes chips and the 2nd serdes chips are respectively connected with differential clocks circuit；Described first
Serdes chips and the 2nd serdes chips are connected by a serial differential connecting wire structure；The serial differential connecting wire structure
Including multigroup serial differential connecting line, every group of serial differential connecting line includes that a reception line and one send line；Described every group serial
Difference connecting line is connected to using AC coupled mode between the first serdes chips and the 2nd serdes chips.
2. PCB circuit board according to claim 1, which is characterized in that the length phase of every group of serial differential connecting line
Deng.
3. PCB circuit board according to claim 1, which is characterized in that the serial differential connecting wire structure is from top to bottom
Include the first ground plane, signals layer, bus plane and the second ground plane successively；Between first ground plane and signals layer, believe
Number it is both provided with insulating layer between floor and bus plane and between bus plane and the second ground plane；Every group of serial differential connection
Line distribution is set to the signals layer.
4. PCB circuit board according to claim 3, which is characterized in that every group of serial differential connecting line both sides, along serial
The wiring direction of difference connecting line is provided with two rows of grounding through hole；Each grounding through hole through first ground plane, signals layer,
Bus plane and the second ground plane；The ground terminal of the signals layer is grounded by the grounding through hole and the first ground plane and second
Layer connection, and be grounded.
5. PCB circuit board according to claim 4, which is characterized in that the adjacent grounding through hole in every row's grounding through hole
Distance be less than or equal to 100mil.
6. PCB circuit board according to claim 4, which is characterized in that the bus plane is loaded with two-way supply voltage, makes
It obtains bus plane and is divided into the first supply voltage part and second source voltage segment, first supply voltage part and second source
Power supply boundary is provided between voltage segment；
The serial differential connecting line of the signals layer is set in the position that the power supply has a common boundary that is projected through of the bus plane
It is equipped with capacitance；First supply voltage part and second source voltage segment described in the capacitance connection.
7. a kind of wiring method of PCB circuit board, which is characterized in that be applied to claim 1-6 any one of them PCB circuits
Plate, the method includes：
First serdes chips and the 2nd serdes chips are positioned in PCB circuit board；
First serdes chips and the 2nd serdes chips are separately connected differential clocks circuit；
Generate a serial differential connecting wire structure；The serial differential connecting wire structure includes multigroup serial differential connecting line, often
Group serial differential connecting line includes that a reception line and one send line；
The first serdes chips and the 2nd serdes chips are connected by serial differential connecting wire structure so that every group of serial differential
Connecting line is connected to using AC coupled mode between the first serdes chips and the 2nd serdes chips.
8. the wiring method of PCB circuit board according to claim 7, which is characterized in that one serial differential of the generation connects
Wiring construction, including：
Every group of serial differential connecting line is done into isometric processing so that the equal length of every group of serial differential connecting line.
9. the wiring method of PCB circuit board according to claim 7, which is characterized in that one serial differential of the generation connects
Wiring construction, including：
The second ground plane, bus plane, signals layer and the first ground connection of serial differential connecting wire structure are set gradually from bottom to up
Layer；
Every group of serial differential connecting line distribution is set to the signals layer；
Between first ground plane and signals layer, between signals layer and bus plane and between bus plane and the second ground plane
Insulating layer is set；
Every group of serial differential connecting line both sides, along the two rows of grounding through hole of wiring direction setting of serial differential connecting line, and will
Each grounding through hole runs through first ground plane, signals layer, bus plane and the second ground plane；The phase in every row's grounding through hole
The distance of adjacent grounding through hole is less than or equal to 100mil；
The ground terminal of the signals layer is connect by the grounding through hole with the first ground plane and the second ground plane, and is grounded.
10. the wiring method of PCB circuit board according to claim 9, which is characterized in that the bus plane is loaded with two-way
Supply voltage so that bus plane is divided into the first supply voltage part and second source voltage segment, first supply voltage portion
Divide and is provided with power supply boundary between second source voltage segment；
One serial differential connecting wire structure of the generation further includes：
It is arranged in the position that the power supply has a common boundary that is projected through of the bus plane in the serial differential connecting line of signals layer
Capacitance passes through the first supply voltage part and second source voltage segment described in the capacitance connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710024391.4A CN108307580A (en) | 2017-01-13 | 2017-01-13 | A kind of PCB circuit board and its wiring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710024391.4A CN108307580A (en) | 2017-01-13 | 2017-01-13 | A kind of PCB circuit board and its wiring method |
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| Publication Number | Publication Date |
|---|---|
| CN108307580A true CN108307580A (en) | 2018-07-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710024391.4A Pending CN108307580A (en) | 2017-01-13 | 2017-01-13 | A kind of PCB circuit board and its wiring method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133707A (en) * | 2019-06-24 | 2020-12-25 | 群创光电股份有限公司 | Circuit structure and electronic equipment |
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| US20090180266A1 (en) * | 2008-01-16 | 2009-07-16 | Brian Peter Kirk | Differential pair inversion for reduction of crosstalk in a backplane system |
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| CN104936373A (en) * | 2014-03-21 | 2015-09-23 | 华为技术有限公司 | Circuit board, distribution method of surface-layer difference lines and communication equipment |
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| US20090180266A1 (en) * | 2008-01-16 | 2009-07-16 | Brian Peter Kirk | Differential pair inversion for reduction of crosstalk in a backplane system |
| CN101674704A (en) * | 2009-10-23 | 2010-03-17 | 中兴通讯股份有限公司 | Signal transmission method of printed circuit board (PCB) and printed circuit board |
| CN103260341A (en) * | 2013-04-23 | 2013-08-21 | 青岛海信宽带多媒体技术有限公司 | Printed circuit board and differential signal line wiring method based on printed circuit board |
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