CN108306143B - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN108306143B
CN108306143B CN201810016925.3A CN201810016925A CN108306143B CN 108306143 B CN108306143 B CN 108306143B CN 201810016925 A CN201810016925 A CN 201810016925A CN 108306143 B CN108306143 B CN 108306143B
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heat dissipation
circuit board
electrical connector
shielding shell
shell
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CN108306143A (zh
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林庆其
罗振伟
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Lotes Co Ltd
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Lotes Co Ltd
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Priority to CN201810016925.3A priority Critical patent/CN108306143B/zh
Priority to US15/892,798 priority patent/US10276986B2/en
Publication of CN108306143A publication Critical patent/CN108306143A/zh
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Publication of CN108306143B publication Critical patent/CN108306143B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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    • H01R12/716—Coupling device provided on the PCB
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    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
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    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/732—Printed circuits being in the same plane
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Abstract

本发明公开了一种电连接器，用以电性连接至一电路板，包括：一绝缘本体；多个端子，多个所述端子收容于所述绝缘本体；一屏蔽壳，所述屏蔽壳收容所述绝缘本体，所述屏蔽壳用以安装至所述电路板；至少一散热元件，位于所述屏蔽壳的至少一侧，所述散热元件同时抵接所述电路板和所述屏蔽壳。通过在所述屏蔽壳的一侧或多侧设置所述散热元件，所述散热元件同时抵接所述屏蔽壳和所述电路板，使得所述电连接器工作时产生的热量通过所述屏蔽壳传导至所述散热元件，再借由所述散热元件将热量传导至外界和所述电路板，加快所述电连接器的散热效率，确保所述电连接器稳定工作。

Description

电连接器
技术领域
本发明涉及一种电连接器，尤指一种散热性能好的电连接器。
背景技术
市面上现有的电连接器结构大体包括一绝缘本体，固持于所述绝缘本体上的多个端子，一屏蔽壳收容所述绝缘本体，电连接器在跟对接连接器对接工作时，会产生热量，热量不能及时向外界散发，会导致所述电连接器温度升高，影响所述电连接器的性能，大大缩短电连接器的使用寿命，使所述电连接器不能正常工作，甚至存在起火等安全隐患，同时与所述电连接器位于同一电路板上的其他电子元件也会受到高温影响不能正常工作。
目前，为了增强所述电连接器的散热性能，通常是在所述电连接器上设置一散热元件与所述屏蔽壳接触，使所述电连接器工作时产生的热量借由所述散热元件传导至外界，但随着电路板上的元件越来越多，导致散热元件的体积必须逐渐缩小，造成所述散热元件对所述电连接器的散热效果变得不理想。
因此，有必要设计一种改良的电连接器，以克服上述问题。
发明内容
针对背景技术所面临的问题，本发明的目的在于提供一种散热性能好的电连接器，通过设置一散热元件同时抵接所述电连接器的屏蔽壳和所述电路板，使所述电连接器内部的热量通过所述散热元件传导至外界和所述电路板，加快所述电连接器的散热效率。
为实现上述目的，本发明采用以下技术手段：
一种电连接器，用以电性连接至一电路板，包括：一绝缘本体；多个端子，多个所述端子收容于所述绝缘本体；一屏蔽壳，所述屏蔽壳收容所述绝缘本体，所述屏蔽壳用以安装至所述电路板；至少一散热元件，位于所述屏蔽壳的至少一侧，所述散热元件同时抵接所述电路板和所述屏蔽壳，所述散热元件具有一让位部未与所述电路板抵接，所述让位部与所述电路板之间具有间距形成一让位空间，所述让位空间在远离所述屏蔽壳的横向方向上贯穿所述散热元件形成一第一开口，并且在所述屏蔽壳的纵长方向上贯穿所述散热元件形成一第二开口。
进一步，所述散热元件为一个，所述散热元件仅位于所述屏蔽壳的一侧。
进一步，所述散热元件至少为两个，所述散热元件位于所述屏蔽壳横向方向上的至少二侧，至少两个所述散热元件为一体成型或分离设置。
进一步，所述散热元件为两个，两个所述散热元件分别位于所述屏蔽壳的左侧和右侧，两个所述散热元件为分离设置。
进一步，所述散热元件为两个，两个所述散热元件分别位于所述屏蔽壳的左侧和后侧，两个所述散热元件为一体设置。
进一步，所述散热元件为三个，三个所述散热元件分别位于所述屏蔽壳的左侧、右侧和后侧，三个所述散热元件为一体成型。
进一步，所述散热元件包括至少一第一散热件和至少一第二散热件，所述第一散热件位于所述屏蔽壳横向方向上的至少一侧，所述第二散热元件位于所述屏蔽壳竖直方向上的至少一侧，所述第一散热件和所述第二散热件为一体成型设置或分离设置。
进一步，所述第一散热件位于所述屏蔽壳的后侧，所述第二散热件位于所述屏蔽壳的上侧，所述第一散热件与所述第二散热件分离设置。
进一步，一固定部，所述固定部固定所述散热元件至所述电路板。
进一步，所述散热元件位于所述屏蔽壳的左侧、右侧和后侧，所述散热元件于所述屏蔽壳的左侧和右侧分别延伸出所述固定部，所述固定部具有一固定孔，所述电路板对应所述固定孔设置一通孔，一锁固件穿过所述固定孔和所述通孔。
进一步，所述散热元件位于所述屏蔽壳的上侧或下侧,所述散热元件具有与所述电路板抵接的一第一抵接面,所述散热元件凹陷形成一凹陷空间,所述散热元件具有位于所述凹陷空间内的一第二抵接面,所述屏蔽壳于所述凹陷空间内与所述第二抵接面抵接。
进一步，所述电路板具有一沉板槽，所述屏蔽壳安装于所述沉板槽，所述散热元件位于所述屏蔽壳的下侧。
进一步，所述屏蔽壳包括一内壳和一外壳，所述内壳收容所述绝缘本体，所述外壳套设于所述内壳外，所述外壳具有至少一安装脚，所述安装脚用以固定所述外壳至所述电路板。
进一步，所述电路板具有一金属层，所述屏蔽壳和所述散热元件抵接于所述金属层。
进一步，一对接连接器，所述对接连接器具有一内置板和围设于所述内置板的至少一金属壳，所述内置板上具有一芯片。
进一步，所述金属壳具有至少一抵接部，所述抵接部抵接所述芯片。
进一步，所述绝缘本体具有一基部及自基部向前延伸的一舌板，多个所述端子呈上下两排固持于所述基部，多个所述端子部分显露于所述舌板的上下表面。
本发明还提供了另一技术方案，一种电连接器，用以电性连接至一电路板，包括：一绝缘本体；多个端子，多个所述端子收容于所述绝缘本体；一屏蔽壳，所述屏蔽壳收容所述绝缘本体，所述屏蔽壳用以安装至所述电路板；至少一散热元件，位于所述屏蔽壳的左侧、右侧和下侧中的至少一侧，所述散热元件同时抵接所述电路板和所述屏蔽壳，所述散热元件具有一让位部未与所述电路板抵接，所述让位部与所述电路板之间具有间距形成一让位空间，所述让位空间在远离所述屏蔽壳的横向方向上贯穿所述散热元件形成一第一开口，并且在所述屏蔽壳的纵长方向上贯穿所述散热元件形成一第二开口。
进一步，所述散热元件至少为两个，至少两个所述散热元件分别位于所述屏蔽壳的左侧、右侧和下侧中的至少两侧。
与现有技术相比，本发明具有以下有益效果：
本发明的电连接器通过在所述屏蔽壳的一侧或多侧设置所述散热元件，所述散热元件同时抵接所述屏蔽壳和所述电路板，使得所述电连接器工作时产生的热量通过所述屏蔽壳传导至所述散热元件，再借由所述散热元件将热量传导至外界和所述电路板，加快所述电连接器的散热效率，确保所述电连接器稳定工作，通过所述散热元件同时抵接所述屏蔽壳和所述电路板，可以缩小所述散热元件的体积，节省电路板上的空间。
【附图说明】
图1为本发明电连接器的立体分解图；
图2为本发明电连接器第一实施例的结构示意图；
图3为本发明电连接器第一实施例的另一结构示意图；
图4为本发明电连接器第二实施例的结构示意图；
图5为本发明电连接器第二实施例的另一结构示意图；
图6为本发明电连接器第二实施例的立体分解图；
图7为本发明电连接器第二实施例的另一视角的立体分解图；
图8为本发明电连接器与对接连接器的对接示意图；
图9为本发明电连接器第三实施例的结构示意图；
图10为本发明电连接器第三实施例的另一结构示意图；
图11为本发明电连接器第四实施例的立体分解图；
图12为本发明电连接器第四实施例的另一状态的立体分解图；
图13为本发明电连接器第四实施例的局部剖视图；
图14为本发明电连接器第六实施例的立体分解图；
图15为本发明电连接器第六实施例的另一状态的立体分解图；
图16为本发明电连接器第六实施例的侧视图；
图17为本发明电连接器第七实施例的立体组合图；
图18为本发明电连接器第七实施例的正视图；
图19为本发明电连接器第八实施例的立体组合图。
具体实施方式的附图标号说明：
电连接器100 后壁323 凹陷空间47 金属壳203
绝缘本体1 安装脚324 第二抵接面471 抵接部2031
基部11 散热元件4 电路板5
舌板12 第一散热件41 通孔51
根部121 第二散热件42 金属层52
端子2 鳍片43 沉板槽53
屏蔽壳3 散热空间431 锁固件6
内壳31 固定部44 电子元件7
后盖311 固定孔441 接地片8
外壳32 让位部45 对接连接器200
顶壁321 让位空间451 内置板201
侧壁322 第一抵接面46 芯片202
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
如图1和图2所示，本发明电连接器100，用以电性连接至一电路板5，包括一绝缘本体1，收容于所述绝缘本体1的多个端子2，一屏蔽壳3，收容所述绝缘本体1且用以安装至所述电路板5，至少一散热元件4，位于所述屏蔽壳3的至少一侧，所述散热元件4同时抵接所述屏蔽壳3和所述电路板5。
如图1所示，所述绝缘本体1具有一基部11及自基部11向前延伸的一舌板12，所述舌板12具有一根部121靠近所述基部11，所述根部121的厚度大于所述舌板12的厚度，且所述根部121的厚度小于所述舌板12的厚度。
多个所述端子2呈上下两排固持于所述基部11，多个所述端子2部分显露于所述舌板12的上下表面。
至少一接地片8，在本实施例中，所述接地片8有两个，两个所述接地片8覆盖所述根部121和部分所述基部11，两个所述接地片8卡扣固定至一起。
如图1和图7所示，所述屏蔽壳3包括一内壳31和一外壳32，所述内壳31收容所述绝缘本体1，所述内壳31具有一后盖311，所述后盖311贴覆于所述绝缘本体1的后端面；所述外壳32套设于所述内壳31外，所述外壳32包括一顶壁321、两侧壁322和一后壁323，所述顶壁321贴覆于所述内壳31的顶面，两所述侧壁322自所述顶壁321的两侧分别朝所述内壳31方向弯折延伸形成，所述后壁323自所述顶壁321的后端朝所述后盖311的方向弯折延伸形成，所述后壁323贴覆所述后盖311，所述侧壁322和所述后壁323分别朝下延伸至少一安装脚324，所述电路板5上具有多个安装孔(未图示，下同)，所述安装脚324固定于所述安装孔内用以将所述外壳32固定至所述电路板5。
如图2所示，为本发明的第一实施例，所述散热元件4安装于所述电路板5且抵接所述电路板5，所述散热元件4具有多个鳍片43，相邻两个所述鳍片43之间形成散热空间431，所述散热元件4位于所述内壳31和所述外壳32的一侧，在本实施例中，所述散热元件4位于所述内壳31和所述外壳32的左侧或右侧，所述散热元件4抵接所述侧壁322；如图17所示,在另一实施例中，所述散热元件4位于所述内壳31和所述外壳32的下侧，所述散热元件4抵接于所述内壳31的底面；如图3所示,所述散热元件4还可以位于所述内壳31和所述外壳32的后侧，所述散热元件4抵接所述后壁323；所述散热元件4可以同时抵接所述外壳32和内壳31，属于本发明的保护范围，在此不作进一步解释。
如8所示,所述电连接器100用以与一对接连接器200对接，所述对接连接器200包括一内置板201和围设于所述内置板201的至少一金属壳203，所述内置板201上具有一芯片202，所述金属壳203具有一抵接部2031抵接所述芯片202，所述芯片202工作产生的热量通过所述抵接部2031传导至所述金属壳203，当所述电连接器100与所述对接连接器200对接时，所述金属壳203抵接所述内壳31和所述接地片8，所示金属壳203和所述接地片8抵接增强接地效果,所述金属壳203的热量传导至所述内壳31，所述内壳31再将热量传导至所述外壳32，所述外壳32将热量通过所述散热元件4向外界和所述电路板5传导，加快了所述电连接器100的散热速率，确保所述电连接器100稳定工作。
如图4所示为本发明的第二实施例，与第一实施例不同的是，至少两个所述散热元件4位于所述内壳31和所述外壳32的横向方向上的至少二侧，至少两个所述散热元件4为一体成型或分离设置，本实施例中，所述散热元件4为两个，两个所述散热元件4分别位于所述内壳31和所述外壳32的左侧和右侧，两个所述散热元件4为分离设置；如图5所示,在另一实施例中，两个所述散热元件4分别位于所述内壳31和所述外壳32的左侧和后侧，两个所述散热元件4为一体成型；如图6和图7所示,在另一实施例中，所述散热元件4为三个，三个所述散热元件4分别位于所述内壳31和所述外壳32的左侧、右侧和后侧，三个所述散热元件4为一体成型，通过在所述内壳31和所述外壳32的横向方向上设置多个所述散热元件4，使所述电连接器100内部的热量通过多个所述散热元件4更快速的向外界和所述电路板5传导，加快散热速率，确保所述电连接器100稳定工作。
如图9所示，为本发明的第三实施例，与第二实施例不同的是，所述散热元件4位于所述内壳31和所述外壳32的至少一侧，所述散热元件4包括至少一第一散热件41和至少一第二散热件42，所述第一散热件41和所述第二散热件42为一体成型或分离设置，在本实施例中，所述第一散热件41位于所述内壳31和所述外壳32的后侧，所述第二散热件42位于所述内壳31和所述外壳32的上侧，所述第一散热件41和所述第二散热件42分离设置；如图10所示,在另一实施例中，所述第一散热件41为两个，分别位于所述内壳31和外壳32的左右两侧，所述第二散热件42位于所述内壳31和所述外壳32的上侧，所述第一散热件41和所述第二散热件42分离设置，通过在所述内壳31和所述外壳32的横向方向和竖直方向上设置多个所述散热元件4，使所述电连接器100内部的热量通过多个所述散热元件4更快速的向外界和所述电路板5传导，加快散热速率，确保所述电连接器100稳定工作。
如图11和图12所示，为本发明的第四实施例，与所述第三实施例不同的是，所述第一散热件41位于所述内壳31和所述外壳32的左侧、右侧和后侧，所述第一散热件41抵接所述侧壁322和所述后壁323，所述第一散热件41的左右两侧分别延伸出一固定部44，所述固定部44具有一固定孔441，所述电路板5对应所述固定孔441开设至少一通孔51，一锁固件6，所述锁固件6穿过所述固定孔441和所述通孔51将所述第一散热件41固定于所述电路板5；如图13所示,所述第二散热件42位于所述内壳31和所述外壳32的上侧且抵接所述顶壁321，通过所述锁固件6将所述第一散热件41固定于所述电路板5，安装简单且可拆卸。
如图4所示，为本发明的第五实施例，与所述第四实施例不同的是，所述散热元件4位于所述内壳31和所述外壳32的左侧、右侧和下侧中的至少一侧，在本实施例中具体为，两个所述散热元件4分别位于所述内壳31和所述外壳32的左侧和右侧，两个所述散热元件4分别抵接两个所述侧壁322，由于市面上现有的电连接器未在所述绝缘本体1的后方设置壳体，本实施例更能适用于未在所述绝缘本体1的后方设置壳体的所述电连接器100，使所述电连接器100内部的热量通过所述内壳31和所述外壳32左右两侧的散热元件4传导至外界和所述电路板5；如图18所示,另一实施例中，所述散热元件4位于所述内壳31和所述外壳32的下侧，所述散热元件4抵接于所述内壳31的底面，所述散热元件4位于所述内壳31和所述外壳32的下侧，节省了所述电路板5上方的空间，使所述电路板5上能够设置更多元件。
如图14、图15和图16所示，为本发明的第六实施例，与第五实施例不同的是，所述第一散热件41位于所述内壳31和所述外壳32的左侧、右侧和后侧，所述第一散热件41抵接所述侧壁322和所述后壁323，所述第一散热件41具有一让位部45未与所述电路板5抵接，所述让位部45与所述电路板5间距形成一让位空间451，所述让位空间451用以设置一电子元件7，所述让位空间451用以设置所述电子元件7，充分利用所述电路板5上的空间，使所述电路板5可以设置更多所述电子元件7，所述让位空间451在远离所述屏蔽壳3的横向方向上贯穿所述第一散热件41形成一第一开口，并且在所述屏蔽壳3的纵长方向上贯穿所述第一散热件41形成一第二开口。
如图17和图18所示，为本发明的第七实施例，与第六实施例不同的是，所述散热元件4位于所述内壳31和所述外壳32的上侧或下侧，在本实施例中，所述电路板5具有一沉板槽53，所述电连接器100安装于所述沉板槽53，所述散热元件4位于所述内壳31和所述外壳32的下侧，所述安装脚324穿过所述电路板5上的所述安装孔与所述散热元件4抵接，所述散热元件4具有一第一抵接面46用以抵接所述电路板5，所述散热元件4对应所述内壳31和所述外壳32凹陷形成一凹陷空间47，所述散热元件4具有位于所述凹陷空间47内的一第二抵接面471,所述内壳31的底面于所述凹陷空间47内与所述第二抵接面471抵接，所述散热元件4通过设置所述凹陷空间47，降低所述散热元件4在竖直方向上的高度，使所述散热元件4能适用于更多产品。
如图19所示，为本发明的第八实施例，与所述第七实施例不同的是，所述电路板5上具有一金属层52，在本实施例中，所述金属层52为一铜箔，所述散热元件4和所述电连接器100分别安装于所述金属层52上，且所述散热元件4抵接所述金属层52，所述内壳31与所述外壳32抵接于所述金属层52，所述金属层52增大了所述散热元件4、所述内壳31和所述外壳32的散热面积，使所述电连接器100内部的热量通过所述散热元件4和所述金属层52更快速的向外界和所述电路板5传导，加快散热速率，确保所述电连接器100稳定工作。
综上所述，本发明电连接器100有下列有益效果：
(1)本发明的电连接器100通过在所述屏蔽壳3的一侧或多侧设置所述散热元件4，所述散热元件4同时抵接所述屏蔽壳3和所述电路板5，使得所述电连接器100工作时产生的热量通过所述屏蔽壳3传导至所述散热元件4，再借由所述散热元件4将热量传导至外界和所述电路板5，加快所述电连接器100的散热效率，确保所述电连接器100稳定工作，通过所述散热元件4同时抵接所述屏蔽壳3和所述电路板5，可以缩小所述散热元件4的体积，节省电路板5上的空间；
(2)所述散热元件4位于所述内壳31和所述外壳32的一侧，当所述电连接器100与所述对接连接器200对接时，所述金属壳203抵接所述内壳31和所述接地片8，所述金属壳203的热量传导至所述内壳31，所述内壳31再将热量传导至所述外壳32，所述外壳32将热量通过所述散热元件4向外界和所述电路板5传导，加快了所述电连接器100的散热速率，确保所述电连接器100稳定工作；
(3)所述散热元件4为两个，两个所述散热元件4分别位于所述内壳31和所述外壳32的左侧和右侧，两个所述散热元件4为分离设置，通过在所述内壳31和所述外壳32的横向方向上设置多个所述散热元件4，使所述电连接器100内部的热量通过多个所述散热元件4更快速的向外界和所述电路板5传导，加快散热速率，确保所述电连接器100稳定工作；
(4)所述第一散热件41位于所述内壳31和所述外壳32的后侧，所述第二散热件42位于所述内壳31和所述外壳32的上侧，所述第一散热件41和所述第二散热件42分离设置；通过在所述内壳31和所述外壳32的横向方向和竖直方向上设置多个所述散热元件4，使所述电连接器100内部的热量通过多个所述散热元件4更快速的向外界和所述电路板5传导，加快散热速率，确保所述电连接器100稳定工作；
(5)所述第一散热件41位于所述内壳31和所述外壳32的左侧、右侧和后侧，所述第一散热件41抵接所述侧壁322和所述后壁323，所述第一散热件41的左右两侧分别延伸出所述固定部44，所述固定部44具有所述固定孔441，所述电路板5对应所述固定孔441开设所述通孔51，所述锁固件6穿过所述固定孔441和所述通孔51将所述第一散热件41固定于所述电路板5，通过所述锁固件6将所述第一散热件41固定于所述电路板5，安装简单且可拆卸；
(6)两个所述散热元件4分别位于所述内壳31和所述外壳32的左侧和右侧，两个所述散热元件4分别抵接两个所述侧壁322，由于市面上现有的电连接器未在所述绝缘本体1的后方设置壳体，本设计更适用于未在所述绝缘本体1的后方设置壳体的所述电连接器100，使所述电连接器100内部的热量通过所述内壳31和所述外壳32左右两侧的散热元件4传导至外界和所述电路板5；
(7)所述散热元件4位于所述内壳31和所述外壳32的下侧，所述散热元件4抵接于所述内壳31的底面，所述散热元件4位于所述内壳31和所述外壳32的下侧，节省了所述电路板5上方的空间，使所述电路板5上能够设置更多元件；
(8)所述电路板5具有所述沉板槽53，所述电连接器100安装于所述沉板槽53，所述散热元件4位于所述内壳31和所述外壳32的下侧，所述安装脚324穿过所述电路板5上的所述安装孔与所述散热元件4抵接，所述散热元件4具有一第一抵接面46用以抵接所述电路板5，所述散热元件4对应所述内壳31和所述外壳32凹陷形成一凹陷空间47，所述散热元件4具有位于所述凹陷空间47内的一第二抵接面471,所述内壳31于所述凹陷空间47内与所述第二抵接面471抵接，所述散热元件4通过设置所述凹陷空间47，降低所述散热元件4在竖直方向上的高度，使所述散热元件4能适用于更多产品；
(9)所述电路板5上具有所述金属层52，所述金属层52为一铜箔，所述散热元件4和所述电连接器100分别安装于所述金属层52上，且所述散热元件4抵接所述金属层52，所述内壳31与所述外壳32抵接于所述金属层52，所述金属层52增大了所述散热元件4、所述内壳31和所述外壳32的散热面积，使所述电连接器100内部的热量通过所述散热元件4和所述金属层52更快速的向外界和所述电路板5传导，加快散热速率，确保所述电连接器100稳定工作。
以上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明的专利范围，所以，凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本发明的专利范围内。等效技术变化，均包含于本发明的专利范围内。

Claims (19)

1.一种电连接器，用以电性连接至一电路板，其特征在于，包括：
一绝缘本体；
多个端子，多个所述端子收容于所述绝缘本体；
一屏蔽壳，所述屏蔽壳收容所述绝缘本体，所述屏蔽壳用以安装至所述电路板；
至少一散热元件，位于所述屏蔽壳的至少一侧，所述散热元件同时抵接所述电路板和所述屏蔽壳，所述散热元件具有一让位部未与所述电路板抵接，所述让位部与所述电路板之间具有间距形成一让位空间；
所述让位空间在远离所述屏蔽壳的横向方向上贯穿所述散热元件形成一第一开口，并且在所述屏蔽壳的纵长方向上贯穿所述散热元件形成一第二开口。
2.如权利要求1所述的电连接器，其特征在于：所述散热元件为一个，所述散热元件仅位于所述屏蔽壳的一侧。
3.如权利要求1所述的电连接器，其特征在于：所述散热元件至少为两个，所述散热元件位于所述屏蔽壳横向方向上的至少二侧，至少两个所述散热元件为一体成型或分离设置。
4.如权利要求3所述的电连接器，其特征在于：所述散热元件为两个，两个所述散热元件分别位于所述屏蔽壳的左侧和右侧，两个所述散热元件为分离设置。
5.如权利要求3所述的电连接器，其特征在于：所述散热元件为两个，两个所述散热元件分别位于所述屏蔽壳的左侧和后侧，两个所述散热元件为一体设置。
6.如权利要求3所述的电连接器，其特征在于：所述散热元件为三个，三个所述散热元件分别位于所述屏蔽壳的左侧、右侧和后侧，三个所述散热元件为一体成型。
7.如权利要求1所述的电连接器，其特征在于：所述散热元件包括至少一第一散热件和至少一第二散热件，所述第一散热件位于所述屏蔽壳横向方向上的至少一侧，所述第二散热元件位于所述屏蔽壳竖直方向上的至少一侧，所述第一散热件和所述第二散热件为一体成型设置或分离设置。
8.如权利要求7所述的电连接器，其特征在于：所述第一散热件位于所述屏蔽壳的后侧，所述第二散热件位于所述屏蔽壳的上侧，所述第一散热件与所述第二散热件分离设置。
9.如权利要求1所述的电连接器，其特征在于：一固定部，所述固定部固定所述散热元件至所述电路板。
10.如权利要求9所述的电连接器，其特征在于：所述散热元件位于所述屏蔽壳的左侧、右侧和后侧，所述散热元件于所述屏蔽壳的左侧和右侧分别延伸出所述固定部，所述固定部具有一固定孔，所述电路板对应所述固定孔设置一通孔，一锁固件穿过所述固定孔和所述通孔。
11.如权利要求1所述的电连接器，其特征在于：所述散热元件位于所述屏蔽壳的上侧或下侧,所述散热元件具有与所述电路板抵接的一第一抵接面,所述散热元件凹陷形成一凹陷空间,所述散热元件具有位于所述凹陷空间内的一第二抵接面,所述屏蔽壳于所述凹陷空间内与所述第二抵接面抵接。
12.如权利要求11所述的电连接器，其特征在于：所述电路板具有一沉板槽，所述屏蔽壳安装于所述沉板槽，所述散热元件位于所述屏蔽壳的下侧。
13.如权利要求1所述的电连接器，其特征在于：所述屏蔽壳包括一内壳和一外壳，所述内壳收容所述绝缘本体，所述外壳套设于所述内壳外，所述外壳具有至少一安装脚，所述安装脚用以固定所述外壳至所述电路板。
14.如权利要求1所述的电连接器，其特征在于：所述电路板具有一金属层，所述屏蔽壳和所述散热元件抵接于所述金属层。
15.如权利要求1所述的电连接器，其特征在于：一对接连接器，所述对接连接器具有一内置板和围设于所述内置板的至少一金属壳，所述内置板上具有一芯片。
16.如权利要求15所述的电连接器，其特征在于：所述金属壳具有至少一抵接部，所述抵接部抵接所述芯片。
17.如权利要求1所述的电连接器，其特征在于：所述绝缘本体具有一基部及自基部向前延伸的一舌板，多个所述端子呈上下两排固持于所述基部，多个所述端子部分显露于所述舌板的上下表面。
18.一种电连接器，用以电性连接至一电路板，其特征在于，包括：
一绝缘本体；
多个端子，多个所述端子收容于所述绝缘本体；
一屏蔽壳，所述屏蔽壳收容所述绝缘本体，所述屏蔽壳用以安装至所述电路板；
至少一散热元件，位于所述屏蔽壳的左侧、右侧和下侧中的至少一侧，所述散热元件同时抵接所述电路板和所述屏蔽壳，所述散热元件具有一让位部未与所述电路板抵接，所述让位部与所述电路板之间具有间距形成一让位空间；
所述让位空间在远离所述屏蔽壳的横向方向上贯穿所述散热元件形成一第一开口，并且在所述屏蔽壳的纵长方向上贯穿所述散热元件形成一第二开口。
19.如权利要求18所述的电连接器，其特征在于：所述散热元件至少为两个，至少两个所述散热元件分别位于所述屏蔽壳的左侧、右侧和下侧中的至少两侧。
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