CN108305839A - Plant ball technique and packaging technology - Google Patents
Plant ball technique and packaging technology Download PDFInfo
- Publication number
- CN108305839A CN108305839A CN201710022456.1A CN201710022456A CN108305839A CN 108305839 A CN108305839 A CN 108305839A CN 201710022456 A CN201710022456 A CN 201710022456A CN 108305839 A CN108305839 A CN 108305839A
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- Prior art keywords
- obstacle
- ball
- opening
- technique
- ball technique
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/81024—Applying flux to the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/81051—Forming additional members
Abstract
Ball technique is planted the invention discloses one kind and packaging technology, ball placement technique include：A substrate film is provided, the substrate film includes multiple base board units, and there are one openings for setting on each base board unit, described to be open for realizing the electrical extraction of the base board unit；Obstacle is set between the adjacent opening；Soldered ball is implanted in each opening respectively；Remove the obstacle.The present invention passes through physically-isolated method, by before the step of being implanted into soldered ball, obstacle is provided between the adjacent opening, it can prevent soldered ball from forming " bridge joint " phenomenon, so that the plant ball process window bigger in packaging technology, suitable for finer technique, the finished product yield of the quality and packaging technology of planting ball technique is improved, production cost is reduced.
Description
Technical field
The present invention relates to semiconductor integrated circuit manufacturing process, more particularly to one kind is planted ball technique and packaging technology.
Background technology
Because reverse installation process (Flip-chip technology) has many advantages, such as that at low cost, package dimension is small, partly leading
Using more and more in body integrated circuit fabrication process.I/O (input/output) exit of reverse installation process is distributed in entire substrate
Therefore the surface of piece with the diminution of device size, the continuous improvement of packaging density, needs the surface cloth in the substrate film
The more I/O exits of office, it is necessary to reduce the size of soldered ball and reduce the distance between soldered ball, when the distance between soldered ball increasingly
Hour, it is very easy to the phenomenon that soldered ball is with soldered ball " bridge joint " occur, a series of harmful effects is generated to device, such as exist follow-up broken
The risk of piece；When encapsulating shipment, need manually to turn down the soldered ball of " bridge joint " together, these harmful effects not only make envelope
Filling the finished product yield of technique reduces, and elongates the shipment period, improves packaging cost.
Referring to Fig. 1, being provided with a conductive layer 11 on a wafer 10, a protective layer is provided on the conductive layer 11
12, wherein the protective layer 12 is provided with multiple openings in corresponding position, to expose the conductive layer 11, after the opening is used for
The implantation of continuous soldered ball, the wafer 10, conductive layer 11 and protective layer 12 form a substrate film；Then, it is planted on the substrate film
Enter soldered ball 14, wherein further include the process for being coated with scaling powder 13, between two adjacent soldered balls 14 before being implanted into soldered ball 14
It is easy to happen bridge joint and forms bad soldered ball 14 ' (especially when carrying out reflow operation to the soldered ball 14), in the substrate
On piece, which is implanted into the techniques such as soldered ball 14 and reflow operation, becomes plant ball technique.
Therefore, in view of the above technical problems, it is necessary to be improved to planting ball technique and packaging technology, to prevent soldered ball
There is the phenomenon that " bridge joint ".
Invention content
Technical problem to be solved by the invention is to provide a kind of plant ball technique and packaging technology overcoming above-mentioned phenomenon,
To improve the quality for planting ball technique, prevents " bridge joint " phenomenon occur between soldered ball, improve the finished product yield of packaging technology, reduce encapsulation
Cost.
To solve above-mentioned technical problem and relevant issues, plant ball technique provided by the invention, including：
A substrate film is provided, the substrate film includes multiple base board units, on each base board unit there are one settings
Opening, it is described to be open for realizing the electrical extraction of the base board unit；
Obstacle is set between the adjacent opening；
Soldered ball is implanted in each opening respectively；
Remove the obstacle.
Optionally, in the plant ball technique, the obstacle is barrier glue.
Optionally, in the plant ball technique, the barrier glue is photoresist glue.
Further, in the plant ball technique, between the adjacent opening be arranged obstacle the step of include
By one first web plate the obstacle is coated between the adjacent opening.
Optionally, in the plant ball technique, first web plate has multiple first trepannings, and first trepanning is just
To the position between the adjacent opening, the obstacle is coated by first trepanning.
Further, in the plant ball technique, after having coated the obstacle, 1 minute to 10 minutes is stood, is waited for
After the obstacle solidification, then the soldered ball is implanted in each opening respectively.
Further, in the plant ball technique, the method for removing the obstacle includes：It is removed by cleaning way
The obstacle.
Optionally, in the plant ball technique, the obstacle be barrier mold, the barrier mold with it is described
Be open corresponding through-hole.
Further, in the plant ball technique, between the adjacent opening be arranged obstacle the step of include：
The barrier mold is sticked on the substrate film, the through-hole exposes the opening.
Optionally, in the plant ball technique, the barrier mold is latticed.
Further, in the plant ball technique, the method for removing the obstacle includes：Directly remove the barrier
Mold.
Further, between the adjacent opening be arranged obstacle the step of and the soldered ball is being implanted in respectively
Between step in each opening, further include：Scaling powder is coated in the bottom of each opening.
Optionally, in the plant ball technique, by second web plate with the second trepanning at the bottom of the opening
Portion is coated with the scaling powder, is open described in the second trepanning face.
Further, in the plant ball technique, the soldered ball of implantation is located on the scaling powder.
Optionally, in the plant ball technique, the soldered ball is implanted by a third web plate with third trepanning
In each opening, it is open described in the third trepanning face.
Further, in the step being respectively implanted in the soldered ball in each opening and in the removal obstacle
The step of between, further include：Reflow operation is carried out to the soldered ball by a set temperature.
Optionally, the substrate film includes that the conductive layer and one of a wafer, one on the wafer are located at the conduction
Protective layer on layer, the opening is through the protective layer and exposes at least partly described conductive layer.
Optionally, the substrate film is flip piece, ball grid array base plate piece or windowing type ball grid array substrate piece.
According to another aspect of the present invention, the present invention also provides a kind of packaging technology, the packaging technology includes above-mentioned
The step of planting ball technique.
Optionally, the packaging technology is reverse installation process.
Compared with prior art, the invention has the advantages that：
The plant ball technique of the present invention is provided with multiple opening for realizing electrical extraction (external electrical connections) by providing one
The substrate film of mouth, is arranged obstacle between the adjacent opening；Then it is implanted into soldered ball in said opening；Finally remove again
The obstacle.The present invention is by physically-isolated method, before the step of being implanted into the soldered ball, in the adjacent opening
Between be provided with obstacle, can effectively prevent soldered ball that " bridge joint " phenomenon occurs in subsequent job, especially can be prevented from
Soldered ball liquefaction diffusion forms " bridge joint " phenomenon with adjacent soldered ball in reflow operation so that the plant ball process window in packaging technology
Bigger is suitable for finer technique, improves the finished product yield of the quality and packaging technology of planting ball technique, and reduction is produced into
This.
Further, the obstacle be photoresist glue, the photoresist glue can not only effectively stop adjacent soldered ball it
Between " bridge joint ", and the photoresist glue easily removes, whole operation simple and convenient.In addition, the obstacle can also be barrier
There is through-hole corresponding with the opening, the barrier mold can not only effectively prevent between soldered ball for mold, the barrier mold
" bridge joint ", only need directly to remove when removing the barrier mold, can also reuse, it is more cost-effective.
Description of the drawings
Fig. 1 is traditional corresponding structural schematic diagram of plant ball technique；
Fig. 2 is the process flow chart that ball technique is planted described in the embodiment of the present invention；
Fig. 3 to Fig. 9 is the corresponding structural schematic diagram of each step in the plant ball technique in one embodiment of the invention；
Figure 10 to Figure 12 is the corresponding structural schematic diagram of plant ball technique corresponding steps in another embodiment of the present invention.
Specific implementation mode
The plant ball technique and packaging technology of the present invention are described in more detail below in conjunction with flow chart and schematic diagram,
Which show the preferred embodiment of the present invention, it should be appreciated that and those skilled in the art can change invention described herein,
And still realize the advantageous effects of the present invention.Therefore, following description should be understood as the extensive of those skilled in the art
Know, and is not intended as limitation of the present invention.
The present invention is more specifically described by way of example with reference to attached drawing in the following passage.It is wanted according to following explanation and right
Ask book, advantages and features of the invention that will become apparent from.It should be noted that attached drawing is all made of very simplified form and uses non-
Accurately ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Core of the invention thought is that the present invention provides a plant ball technique, as shown in Fig. 2, ball placement technique packet
Include following steps：
S1, a substrate film is provided, includes multiple base board units on the substrate film, is provided on each base board unit
One opening, it is described to be open for realizing the electrical extraction of the base board unit；
S2, obstacle is set between the adjacent opening；
S3, soldered ball is implanted in each opening respectively；
S4, the removal obstacle.
Correspondingly, another side according to the present invention, the present invention also provides a kind of packaging technology, the packaging technology includes upper
State the step of planting ball technique.
The plant ball technique of the present invention is provided with the substrate film of multiple openings for realizing external electrical connections by offer one,
Obstacle is set between the adjacent opening；Then it is implanted into soldered ball in said opening；Finally the obstacle is removed again.
The present invention is by physically-isolated method, before the step of being implanted into the soldered ball, is provided between the adjacent opening
Obstacle can effectively prevent soldered ball that " bridge joint " phenomenon occurs in subsequent job so that the plant ball process window in packaging technology
Mouth bigger, is suitable for finer technique, improves the finished product yield of the quality and packaging technology of planting ball technique, and reduction is produced into
This.
It is exemplified below the embodiment of ball placement technique and packaging technology, packaging technology as described below is with reverse installation process
Example, clearly to illustrate present disclosure, it is understood that, present disclosure is not restricted to following embodiment, other
By the improvement of the conventional technical means of those of ordinary skill in the art also within the thought range of the present invention.
Fig. 2 to Fig. 9 is please referred to, wherein figure 2 show the process flow charts that ball technique is planted in the embodiment of the present invention, and Fig. 2 is extremely
Fig. 9, which is shown, plants the corresponding structural schematic diagram of each step in ball technique described in an embodiment.
First, referring to Fig. 2, executing step S1, a substrate film is provided, the substrate film includes multiple base board units, often
There are one openings for setting on a base board unit, described to be open for realizing the electrical extraction (external electrical of the base board unit
Connection).Fig. 3 and Fig. 4 are please referred to, Fig. 3 is the vertical view of the substrate film, and Fig. 4 is the sectional structure chart along x1x2, institute in Fig. 3
It includes multiple base board units to state substrate film, and such as substrate film includes first substrate unit A1, second substrate unit A2 and third
Base board unit A3, the substrate film include the conductive layer 21 and one that is located on the wafer 20 of a wafer 20, one be located at it is described
Protective layer 22 on conducting shell 21, the opening is through the protective layer 22 and exposes at least partly described conductive layer 21, such as described
It is arranged on setting opening a2, third base board unit A3 on setting opening a1, second substrate unit A2 on first substrate unit A1 and opens
Mouth a3.Optionally, the substrate film can be flip piece, ball grid array base plate piece or windowing type ball grid array substrate piece
Deng the substrate film is completed jointly by semiconductor front end technique and backend process, is those of ordinary skill in the art institute
Know, not described in detail herein, just enters corresponding packaging technology after completing the making of the substrate film.
Then, step S2 is executed, obstacle is set between the adjacent opening.In one embodiment, the blocking
Object can be barrier glue, it is preferred that the barrier glue is photoresist glue, because the photoresist glue uses frequency in semiconductor technology processing procedure
Rate is higher, and not will produce other negative effects.In the present embodiment, between the adjacent opening the step of setting obstacle
Including：As shown in figure 5, firstly, it is necessary to formulate one first web plate 23, first web plate 23 has specific multiple first trepannings
230, by multiple first trepannings 230 be aligned the protective layer 22 (the adjacent opening of i.e. described first trepanning, 230 face
Between position), the photoresist glue 24 is coated by first trepanning 230 so that form institute between the adjacent opening
Photoresist glue 24 is stated, in order to keep the blocking isolation effect of the photoresist glue 24 more preferable, it usually needs complete the photoresist glue in coating
A few minutes (such as 1 minute to 10 minutes) are stood after 24, and subsequent technique is further continued for after the photoresist glue 24 solidification.
Then, step S3 is executed, soldered ball is implanted in each opening respectively.It is detailed, as shown in Figure 6 to 8,
Before the step of being implanted into the soldered ball, it can be first coated with scaling powder, in order to the fixation soldered ball.As shown in fig. 6, passing through second
Web plate 25 is coated with scaling powder 26, preferably, second web plate 25 has specific second trepanning 250, second trepanning 250
The scaling powder 26 is coated on the bottom of the opening by the position being open described in face from second trepanning 250；Then,
As shown in fig. 7, the step of carrying out implantation soldered ball, preferably, being implanted into soldered ball 28 by third web plate 27, the third web plate 27 has
There is specific third trepanning 270, likewise, the third trepanning 270 is directed at the position of the opening, the soldered ball 28 is passed through
The third trepanning 270 is implanted on the scaling powder 26.In general, after the completion of being implanted into soldered ball 28, by structure as shown in Figure 7
Remove the third web plate 27, in order to enable the soldered ball 28 more to consolidate in said opening, in order to promote the soldered ball
28 and scaling powder 26 linking, can to the soldered ball 28 by a set temperature (such as set temperature can be 220 degrees Celsius) into
Row reflow operation makes 28 High-temperature Liquefaction of the soldered ball.As shown in figure 8, because having the photoresist glue 24 between the soldered ball 28
Isolation, so, in reflow operation, adjacent soldered ball 28 will not form " bridge joint " phenomenon, the photoresist glue 24 because of liquefaction
It effectively prevent soldered ball 28 " bridge joint ".
Finally, step S4 is executed, the obstacle is removed.In the present embodiment, the obstacle is photoresist glue 24, therefore,
Easy cleaning way, which may be used, to get rid of the photoresist glue 24, obtain structure chart as shown in Figure 9.This implementation
Example is used as obstacle using photoresist glue 24, can not only effectively stop between adjacent soldered ball 28 " bridge joint ", and the light
Resistance glue 24 easily removes, whole operation simple and convenient.
To sum up, the finished product yield by the packaging technology of the plant ball technique of the embodiment is high, and packaging cost is low.
One embodiment of the invention as described above, but the present invention is not limited to ranges disclosed above, for example, please referring to figure
10 to Figure 12, wherein in Figure 10 to Figure 12, reference label indicates that statement identical with Fig. 3 to Fig. 9 is identical as an embodiment
Structure.The plant ball technique and the plant ball technique of an embodiment of another embodiment are essentially identical, difference lies in：Step S2
It is different with the specific implementation mode of step S4.In another embodiment, it when executing step S2, is set between the adjacent opening
Obstacle is set, the obstacle is barrier mold 3, and the barrier mold 3 has through-hole 30 corresponding with the opening, such as Figure 10
It is shown, specifically：First, make a reservation for special barrier mold 3, the concrete structure of the barrier mold 3 and the knot of the through-hole 30
Structure need to expose the opening on the substrate film with reference to the structure of the substrate film, the through-hole 30, such as the barrier mold 3
It is latticed；Then, the barrier mold 3 is placed directly against on the substrate film, vertical view as shown in figure 11, along x1x2
Sectional structure chart on direction is as shown in figure 12, i.e., has corresponding obstacle, the obstacle between the adjacent opening
To obstruct mold 3.Then conventional plant ball technique (i.e. the step S3 of an embodiment) is carried out, when going to step S4, is only needed
The barrier mold 3 is directly removed, the barrier mold 3 is removed and removes the obstacle.The barrier mold 3 is not
" bridge joint " that can only effectively prevent between soldered ball only needs directly to remove, the barrier when removing the barrier mold 3
Mold 3 can also reuse, more cost-effective.
To sum up, the finished product yield by the packaging technology of the plant ball technique of another embodiment is also high, and packaging cost is more
It is low.
To sum up, plant ball technique of the invention is provided with multiple for realizing electrical extraction (external electrical connections) by offer one
Opening substrate film, obstacle is set between the adjacent opening；Then it is implanted into soldered ball in said opening；Finally again
Remove the obstacle.The present invention is by physically-isolated method, before the step of being implanted into the soldered ball, described in adjacent
It is provided with obstacle between opening, can effectively prevent soldered ball that " bridge joint " phenomenon occurs in subsequent job, it especially can be to prevent
Only soldered ball liquefaction diffusion forms " bridge joint " phenomenon with adjacent soldered ball in reflow operation so that the plant ball technique in packaging technology
Window bigger is suitable for finer technique, improves the finished product yield of the quality and packaging technology of planting ball technique, reduces production
Cost.
Further, the obstacle be photoresist glue, the photoresist glue can not only effectively stop adjacent soldered ball it
Between " bridge joint ", and the photoresist glue easily removes, whole operation simple and convenient.In addition, the obstacle can also be barrier
There is through-hole corresponding with the opening, the barrier mold can not only effectively prevent between soldered ball for mold, the barrier mold
" bridge joint ", only need directly to remove when removing the barrier mold, can also reuse, it is more cost-effective.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (20)
1. a plant ball technique, which is characterized in that including：
One substrate film is provided, the substrate film includes multiple base board units, opening there are one settings on each base board unit,
It is described to be open for realizing the electrical extraction of the base board unit；
Obstacle is set between the adjacent opening；
Soldered ball is implanted in each opening respectively；
Remove the obstacle.
2. planting ball technique as described in claim 1, which is characterized in that the obstacle is barrier glue.
3. planting ball technique as claimed in claim 2, which is characterized in that the barrier glue is photoresist glue.
4. planting ball technique as claimed in claim 2, which is characterized in that the step of obstacle is arranged between the adjacent opening
Suddenly include：By one first web plate the obstacle is coated between the adjacent opening.
5. planting ball technique as claimed in claim 4, which is characterized in that first web plate has multiple first trepannings, described
Position between the adjacent opening of first trepanning face coats the obstacle by first trepanning.
6. planting ball technique as claimed in claim 4, which is characterized in that after having coated the obstacle, stand 1 minute to 10
Minute, after obstacle solidification, then the soldered ball is implanted in each opening respectively.
7. planting ball technique as claimed in claim 4, which is characterized in that the method for removing the obstacle includes：Pass through cleaning
Mode removes the obstacle.
8. planting ball technique as described in claim 1, which is characterized in that the obstacle is barrier mold, the barrier mold
With through-hole corresponding with the opening.
9. planting ball technique as claimed in claim 8, which is characterized in that the step of obstacle is arranged between the adjacent opening
Suddenly include：The barrier mold is sticked on the substrate film, the through-hole exposes the opening.
10. planting ball technique as claimed in claim 8, which is characterized in that the barrier mold is latticed.
11. planting ball technique as claimed in claim 8, which is characterized in that the method for removing the obstacle includes：Directly remove
The barrier mold.
12. the plant ball technique as described in claim 1 to 11 any one, which is characterized in that between the adjacent opening
The step of obstacle is set and the soldered ball is being implanted in respectively between the step in each opening, is further including：Coating
Scaling powder is in the bottom of each opening.
13. planting ball technique as claimed in claim 12, which is characterized in that by second web plate with the second trepanning in institute
The bottom for stating opening is coated with the scaling powder, is open described in the second trepanning face.
14. planting ball technique as claimed in claim 13, which is characterized in that the soldered ball of implantation is located on the scaling powder.
15. the plant ball technique as described in claim 1 to 11 any one, which is characterized in that there is third trepanning by one
The soldered ball is implanted in each opening by third web plate, is open described in the third trepanning face.
16. the plant ball technique as described in claim 1 to 11 any one, which is characterized in that be respectively implanted into the soldered ball
Step in each opening and between the step of removing the obstacle further includes：By a set temperature to institute
It states soldered ball and carries out reflow operation.
17. the plant ball technique as described in claim 1 to 11 any one, which is characterized in that the substrate film include a wafer,
One is located at the conductive layer on the wafer and one is located at protective layer on the conductive layer, the opening through the protective layer and
Expose at least partly described conductive layer.
18. the plant ball technique as described in claim 1 to 11 any one, which is characterized in that the substrate film is flip
Piece, ball grid array base plate piece or windowing type ball grid array substrate piece.
19. a kind of packaging technology, which is characterized in that the packaging technology includes as described in claim 1 to 18 any one
The step of planting ball technique.
20. packaging technology as claimed in claim 19, which is characterized in that the packaging technology is reverse installation process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710022456.1A CN108305839A (en) | 2017-01-12 | 2017-01-12 | Plant ball technique and packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710022456.1A CN108305839A (en) | 2017-01-12 | 2017-01-12 | Plant ball technique and packaging technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108305839A true CN108305839A (en) | 2018-07-20 |
Family
ID=62872040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710022456.1A Pending CN108305839A (en) | 2017-01-12 | 2017-01-12 | Plant ball technique and packaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108305839A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341746A (en) * | 2020-03-13 | 2020-06-26 | 颀中科技（苏州）有限公司 | Ball-planting structure and preparation process |
| CN114678281A (en) * | 2022-03-02 | 2022-06-28 | 上海季丰电子股份有限公司 | Auxiliary ball-planting carrier and method for implanting solder balls into ball-planting holes in chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461953B1 (en) * | 1998-08-10 | 2002-10-08 | Fujitsu Limited | Solder bump forming method, electronic component mounting method, and electronic component mounting structure |
| CN2919788Y (en) * | 2006-06-13 | 2007-07-04 | 华为技术有限公司 | Ball planting steel mash |
| CN101373718A (en) * | 2007-08-24 | 2009-02-25 | 南亚电路板股份有限公司 | Ball-establishing method for package substrate |
| CN101310374B (en) * | 2005-12-29 | 2011-12-14 | 英特尔公司 | Method for advanced solder bumping and system manufactured by said method |
-
2017
- 2017-01-12 CN CN201710022456.1A patent/CN108305839A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461953B1 (en) * | 1998-08-10 | 2002-10-08 | Fujitsu Limited | Solder bump forming method, electronic component mounting method, and electronic component mounting structure |
| CN101310374B (en) * | 2005-12-29 | 2011-12-14 | 英特尔公司 | Method for advanced solder bumping and system manufactured by said method |
| CN2919788Y (en) * | 2006-06-13 | 2007-07-04 | 华为技术有限公司 | Ball planting steel mash |
| CN101373718A (en) * | 2007-08-24 | 2009-02-25 | 南亚电路板股份有限公司 | Ball-establishing method for package substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341746A (en) * | 2020-03-13 | 2020-06-26 | 颀中科技（苏州）有限公司 | Ball-planting structure and preparation process |
| CN114678281A (en) * | 2022-03-02 | 2022-06-28 | 上海季丰电子股份有限公司 | Auxiliary ball-planting carrier and method for implanting solder balls into ball-planting holes in chip |
| CN114678281B (en) * | 2022-03-02 | 2022-10-14 | 上海季丰电子股份有限公司 | Auxiliary ball-planting carrier and method for implanting solder balls into ball-planting holes in chip |
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Application publication date: 20180720 |