CN108303836A - Graphene heat dissipation film applied to radiating structure of camera build-in chip - Google Patents
Graphene heat dissipation film applied to radiating structure of camera build-in chip Download PDFInfo
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- CN108303836A CN108303836A CN201810280915.0A CN201810280915A CN108303836A CN 108303836 A CN108303836 A CN 108303836A CN 201810280915 A CN201810280915 A CN 201810280915A CN 108303836 A CN108303836 A CN 108303836A
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- support plate
- chip
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- bottom support
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Aviation & Aerospace Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention proposes a kind of graphene heat dissipation film applied to radiating structure of camera build-in chip, including graphene composite layer and the metal heat-conducting layer that is coated on outside graphene composite layer；Metal heat-conducting layer uses the mixture of fine copper, fine aluminium or copper and aluminium to be formed for material preparation；The preparation method of graphene composite layer is：(1) mixture for being by mass percentage uniformly mixed graphene powder 18 32%, silica gel 5 8%, copper powder 9 16% and silicon carbide powder surplus；(2) sinter molding in sintering furnace is added mixture into, after natural cooling；Perfect heat-dissipating of the present invention, firmly installs, and substantially extends the service life of chip.
Description
Technical field
The present invention relates to a kind of heat dissipation film structures, and in particular to a kind of graphite applied to radiating structure of camera build-in chip
Alkene heat dissipation film.
Background technology
Currently, radiator structure can be divided into active heat removal and passive two kinds of heat dissipation.For example air-cooled, water cooling of active heat removal etc., passively
Cooling fin, heat pipe are such as pasted in heat dissipation.In electronic field, the heat dissipation of euthermic chip is using having actively and passively.In general,
The efficiency of active heat removal can only use passive heat dissipation, such as to ring in many cases better than passive heat dissipation, but since condition limits
Stringent local, hermetically sealed, the space limitation etc. of border noise requirements.Infrared waterproof camera, it is internal empty using all-sealed structure
Between it is narrow, this just determines that its inside chip can only use passive heat dissipation, heat remain in inside video camera, and heat dissipation effect is not
It is ideal.If euthermic chip heat dissipation is bad, operating temperature is excessively high, such as dsp chip, will influence the stability of whole system, also
The service life of chip can be shortened.Especially IP video cameras, heat dissipation problem are particularly important.
" CN200820165514.2 " discloses a kind of radiating structure of camera build-in chip.Provide a kind of structure letter
Radiating structure of camera build-in chip that is single, improving system stabilization, improve chip service life.This camera build-in chip dissipates
Heat structure includes mainly euthermic chip, metal plate and camera housing composition, is equipped with outside metal plate, with video camera in camera housing
Shell phase contacts, and is equipped with cooling fin on euthermic chip, metal plate is in contact with cooling fin.The structure generates when can be by chip operation
Heat transfer to camera housing outside air in, be effectively reduced the temperature of infrared waterproof camera inside chip, to
The stability of raising system improves the service life of chip.The heat dissipation being mainly used for inside video camera.
Although the structure has cooling effect, since heat radiating fin structure is relatively simple, heat dissipation effect is bad, installation
Fastness it is bad, instead be easy chip itself is damaged.
Invention content
The present invention proposes a kind of graphene heat dissipation applied to radiating structure of camera build-in chip regarding to the issue above
Film, perfect heat-dissipating firmly install, and substantially extend the service life of chip.
Specific technical solution is as follows：
Applied to the graphene heat dissipation film of radiating structure of camera build-in chip, including graphene composite layer and it is coated on stone
Metal heat-conducting layer outside black alkene composite layer；
Metal heat-conducting layer uses the mixture of fine copper, fine aluminium or copper and aluminium to be formed for material preparation；
The preparation method of graphene composite layer is：
(1) by mass percentage by graphene powder 18-32%, silica gel 5-8%, copper powder 9-16% and silicon carbide powder
The uniformly mixed mixture of surplus；
(2) sinter molding in sintering furnace is added mixture into, after natural cooling.
Above application is in the graphene heat dissipation film of radiating structure of camera build-in chip, wherein the quality of graphene powder
Twice of percentage and copper powder.
Graphene heat dissipation film applied to radiating structure of camera build-in chip, wherein inside its video camera applied
Chip cooling structure, including chip body, graphene cooling mechanism and locking mechanism；
Graphene cooling mechanism includes upper mounted plate and external support board, and heat dissipation is equipped in upper mounted plate and external support board
Chamber, heat dissipation cavity is interior to be equipped with the graphene heat dissipation film being prepared；
Upper mounted plate include the first upper mounted plate, the second upper mounted plate and third upper mounted plate, circular configuration first on
Fixed plate is horizontally disposed, the second upper mounted plate of cirque structure being fixed on the outside of the first upper mounted plate diagonally downward, annulus
The outside for being fixed on the second upper mounted plate of the third upper mounted plate level of shape structure, section are the external support board of cirque structure
The vertical bottom for being fixed on third upper mounted plate；
The inner wall of external support board is equipped with the first bottom support plate and the second bottom support plate, and the first bottom support plate is parallel
Positioned at the top of the second bottom support plate, the second bottom support plate is located at the top 0.2-0.8mm of external support board bottom；The
One bottom support plate include first in bottom support plate and the first outer bottom support plate, circular configuration first in bottom support plate
It is horizontally disposed, the outside for being fixed on bottom support plate in first of the first outer bottom support plate of cirque structure diagonally downward,
Second bottom support plate include second in bottom support plate and the second outer bottom support plate, circular configuration second in bottom support
Plate level is arranged, the second outer bottom support plate of cirque structure diagonally downward be fixed on the outer of bottom support plate in second
Side, it is vertical between the first outer bottom support plate and the second outer bottom support plate to be equipped with several first heat sinks；
The section that is equipped with vertical between the first upper mounted plate at the outer rim of bottom support plate is cirque structure in first
The first inner support plate, the outside of the first inner support plate sequentially coaxially and vertical is equipped with the second inner support plate, third inner support
Plate and the 4th inner support plate；
Several second heat sinks are equipped in first inner support plate, if being equipped between the second inner support plate and the first inner support plate
Dry circle third heat sink, is equipped with the 4th heat sink of several circles, the 4th inner support between third inner support plate and the second inner support plate
The 5th heat sink of several circles is equipped between plate and third inner support plate, if being uniformly provided between external support board and the 4th inner support plate
The 6th heat sink of dry circle；
Locking mechanism includes the upper lockplate of square structure and the lower lockplate of square structure, the length of side of upper lockplate
Less than the length of side of lower lockplate, the bottom of upper lockplate is equipped with chip placing groove, and the bottom of lower lockplate is placed equipped with support plate
Slot, chip body are arranged in chip placing groove and are pressed together on the top of the first upper mounted plate, the plug-type setting of external support board
It in support plate placing groove, is fixedly connected between upper lockplate and lower lockplate by locking connecting rod, locking connecting rod includes
The head rod that is vertically arranged and the second connecting rod and third connecting rod for being horizontally fixed on first connecting rod both ends, make locking connecting rod
Whole C-shaped in configuration, first connecting rod are pressed together on the top of lockplate, and are tightly connected with, and second connecting rod is pressed together on
The top of lower lockplate, and be tightly connected with.
Above application is in the graphene heat dissipation film of radiating structure of camera build-in chip, wherein the top of upper lockplate at
Divergent shape is equipped with several 7th heat sinks, and the 7th heat sink is L-shaped structure plate.
Above application is in the graphene heat dissipation film of radiating structure of camera build-in chip, wherein the first outer bottom support plate
The section of the first heat sink between the second outer bottom support plate is cirque structure, the coaxial arrangement of several first heat sinks and
Uniform diameter increases.
Above application is in the graphene heat dissipation film of radiating structure of camera build-in chip, wherein the section of the second heat sink
Shape is v-shaped structure, and third heat sink and the 5th heat sink are up-small and down-big truncated cone-shaped structure, and the 4th heat sink and the 6th dissipate
Hot plate is up big and down small truncated cone-shaped structure.
Above application is in the graphene heat dissipation film of radiating structure of camera build-in chip, wherein third heat sink, the 4th dissipate
The thickness of hot plate, the 5th heat sink and the 6th heat sink is identical, the thickness G T.GT.GT of the first heat sinks of thickness G T.GT.GT of the second heat sink
The thickness of three heat sinks.
Above application is in the graphene heat dissipation film of radiating structure of camera build-in chip, wherein the height of the second upper mounted plate
Degree h1 is 0.5-2mm.
Beneficial effects of the present invention are：
The present invention is applied to camera build-in chip, and perfect heat-dissipating firmly installs, and substantially extend chip uses the longevity
Life.
Description of the drawings
Fig. 1 is sectional view of the present invention.
Fig. 2 is the upper lockplate vertical view of the present invention,
Fig. 3 is graphene cooling mechanism sectional view of the present invention.
Fig. 4 is external support board sectional view of the present invention.
Fig. 5 is graphene heat dissipation film sectional view of the present invention.
Specific implementation mode
Clear to make technical scheme of the present invention be more clear, the present invention is described further below in conjunction with the accompanying drawings,
Any technical characteristic to technical solution of the present invention carries out the scheme that equivalencing is obtained with conventional reasoning and each falls within guarantor of the present invention
Protect range.
Reference numeral
Chip body 1, graphene cooling mechanism 2, locking mechanism 3, graphene heat dissipation film 4, graphene composite layer 5, metal
Heat-conducting layer 6, upper mounted plate 21, external support board 22, the first upper mounted plate 23, the second upper mounted plate 24, third upper mounted plate 25,
Bottom support plate 28 in one bottom support plate 26, the second bottom support plate 27, first, in the first outer bottom support plate 29, second
Bottom support plate 210, the second outer bottom support plate 211, the first heat sink 212, the first inner support plate 213, the second inner support plate
214, third inner support plate 215, the 4th inner support plate 216, the second heat sink 217, third heat sink 218, the 4th heat sink
219, the 5th heat sink 220, the 6th heat sink 221, upper lockplate 31, the lower lockplate 32 of square structure, chip placing groove
33, support plate placing groove 34, locking connecting rod 35, head rod 36, second connecting rod 37, third connecting rod 38, the 7th heat sink 39.
Embodiment one
Applied to the graphene heat dissipation film of radiating structure of camera build-in chip, including graphene composite layer and it is coated on stone
Metal heat-conducting layer outside black alkene composite layer；
Metal heat-conducting layer uses the mixture of fine copper, fine aluminium or copper and aluminium to be formed for material preparation；
The preparation method of graphene composite layer is：
(1) graphene powder 26%, silica gel 7%, copper powder 12% and silicon carbide powder surplus are mixed by mass percentage
Close uniform mixture, wherein the mass percent of graphene powder and twice of copper powder；
(2) sinter molding in sintering furnace is added mixture into, after natural cooling.
Embodiment two
Applied to the graphene heat dissipation film of radiating structure of camera build-in chip, including graphene composite layer 5 and it is coated on
Metal heat-conducting layer 6 outside graphene composite layer；
Metal heat-conducting layer uses the mixture of fine copper, fine aluminium or copper and aluminium to be formed for material preparation；
The preparation method of graphene composite layer is：
(1) graphene powder 22%, silica gel 5%, copper powder 15% and silicon carbide powder surplus are mixed by mass percentage
Close uniform mixture, wherein the mass percent of graphene powder and twice of copper powder；
(2) sinter molding in sintering furnace is added mixture into, after natural cooling.
The radiating structure of camera build-in chip of above-mentioned graphene heat dissipation film, including chip body 1, stone are applied as shown in the figure
Black alkene cooling mechanism 2 and locking mechanism 3；
Graphene cooling mechanism includes upper mounted plate 21 and external support board 22, is equipped in upper mounted plate and external support board scattered
Hot chamber, heat dissipation cavity is interior to be equipped with graphene heat dissipation film 4；
Upper mounted plate includes the first upper mounted plate 23, the second upper mounted plate 24 and third upper mounted plate 25, circular configuration
First upper mounted plate is horizontally disposed, the second upper mounted plate of cirque structure being fixed on outside the first upper mounted plate diagonally downward
Side, the outside for being fixed on the second upper mounted plate of the third upper mounted plate level of cirque structure, section are cirque structure
The vertical bottom for being fixed on third upper mounted plate of external support board；
The inner wall of external support board is equipped with the first bottom support plate 26 and the second bottom support plate 27, the first bottom support plate
It is parallel positioned at the top of the second bottom support plate, the second bottom support plate is located at the top 0.2-0.8mm of external support board bottom
Place；First bottom support plate include first in bottom support plate 28 and the first outer bottom support plate 29, circular configuration first in
Bottom support plate is horizontally disposed, and the bottom in first that is fixed on of the first outer bottom support plate of cirque structure diagonally downward supports
The outside of plate, the second bottom support plate include bottom support plate 210 and the second outer bottom support plate 211 in second, circular configuration
Second in bottom support plate it is horizontally disposed, the second outer bottom support plate of cirque structure being fixed in second diagonally downward
The outside of bottom support plate, the vertical several circles first that are equipped with dissipate between the first outer bottom support plate and the second outer bottom support plate
Hot plate 212；
The section that is equipped with vertical between the first upper mounted plate at the outer rim of bottom support plate is cirque structure in first
The first inner support plate 213, the outside of the first inner support plate sequentially coaxially and vertical is equipped with the second inner support plate 214, third
Inner support plate 215 and the 4th inner support plate 216；
It is equipped with several second heat sinks 217 in first inner support plate, is set between the second inner support plate and the first inner support plate
There are several circle third heat sinks 218, the 4th heat sink 219 of several circles be equipped between third inner support plate and the second inner support plate,
The 5th heat sink 220 of several circles, external support board and the 4th inner support plate are equipped between 4th inner support plate and third inner support plate
Between be uniformly provided with the 6th heat sink 221 of several circles；
Locking mechanism includes the upper lockplate 31 of square structure and the lower lockplate 32 of square structure, upper lockplate
The length of side is less than the length of side of lower lockplate, and the bottom of upper lockplate is equipped with chip placing groove 33, and the bottom of lower lockplate is equipped with support
Plate placing groove 34, chip body are arranged in chip placing groove and are pressed together on the top of the first upper mounted plate, and external support board is inserted into
The setting of formula is fixedly connected between upper lockplate and lower lockplate by locking connecting rod 35 in support plate placing groove, is locked
It includes that the head rod 36 being vertically arranged and the second connecting rod 37 for being horizontally fixed on first connecting rod both ends and third connect to be close to bar
Bar 38 makes locking connecting rod entirety C-shaped in configuration, and first connecting rod is pressed together on the top of lockplate, and is tightly connected with,
Second connecting rod is pressed together on the top of lower lockplate, and is tightly connected with；The top of upper lockplate is equipped at divergent shape
Several 7th heat sinks 39, the 7th heat sink are L-shaped structure plate.
The section of the first heat sink between first outer bottom support plate and the second outer bottom support plate is cirque structure,
Several first heat sink coaxial arrangements and uniform diameter increase.
The cross sectional shape of second heat sink is v-shaped structure, and third heat sink and the 5th heat sink are up-small and down-big round platform
Shape structure, the 4th heat sink and the 6th heat sink are up big and down small truncated cone-shaped structure.
Third heat sink, the 4th heat sink, the thickness of the 5th heat sink and the 6th heat sink are identical, the thickness of the second heat sink
Spend the thickness of the thickness G T.GT.GT third heat sinks of the first heat sinks of ＞.
The height h1 of second upper mounted plate is 0.5-2mm.
Claims (7)
1. applied to radiating structure of camera build-in chip graphene heat dissipation film, it is characterized in that, including graphene composite layer and
The metal heat-conducting layer being coated on outside graphene composite layer；
Metal heat-conducting layer uses the mixture of fine copper, fine aluminium or copper and aluminium to be formed for material preparation；
The preparation method of graphene composite layer is：
(1) by mass percentage by graphene powder 18-32%, silica gel 5-8%, copper powder 9-16% and silicon carbide powder surplus
Uniformly mixed mixture；
(2) sinter molding in sintering furnace is added mixture into, after natural cooling.
2. it is applied to the graphene heat dissipation film of radiating structure of camera build-in chip as described in claim 1, it is characterized in that, stone
The mass percent of black alkene powder and twice of copper powder；
Graphene heat dissipation film applied to radiating structure of camera build-in chip, wherein its camera build-in chip applied
Radiator structure, including chip body, graphene cooling mechanism and locking mechanism；
Graphene cooling mechanism includes upper mounted plate and external support board, and heat dissipation cavity is equipped in upper mounted plate and external support board, is dissipated
Hot intracavitary is equipped with the graphene heat dissipation film being prepared；
Upper mounted plate includes the first upper mounted plate, the second upper mounted plate and third upper mounted plate, circular configuration first on it is fixed
Plate level is arranged, the second upper mounted plate of cirque structure being fixed on the outside of the first upper mounted plate diagonally downward, circular ring shape knot
The outside for being fixed on the second upper mounted plate of the third upper mounted plate level of structure, section are that the external support board of cirque structure is vertical
The bottom for being fixed on third upper mounted plate；
The inner wall of external support board is equipped with the first bottom support plate and the second bottom support plate, the parallel position of the first bottom support plate
In the top of the second bottom support plate, the second bottom support plate is located at the top 0.2-0.8mm of external support board bottom；First bottom
Portion's support plate includes bottom support plate and the first outer bottom support plate in first, circular configuration first in bottom support plate it is horizontal
Setting, the outside for being fixed on bottom support plate in first of the first outer bottom support plate of cirque structure diagonally downward, second
Bottom support plate include second in bottom support plate and the second outer bottom support plate, circular configuration second in bottom support plate water
Flat setting, the outside for being fixed on bottom support plate in second of the second outer bottom support plate of cirque structure diagonally downward, the
It is vertical between one outer bottom support plate and the second outer bottom support plate to be equipped with several first heat sinks；
In first at the outer rim of bottom support plate between the first upper mounted plate vertical be equipped with that section is cirque structure the
One inner support plate, the outside of the first inner support plate sequentially coaxially and it is vertical be equipped with the second inner support plate, third inner support plate and
4th inner support plate；
It is equipped with several second heat sinks in first inner support plate, several circles are equipped between the second inner support plate and the first inner support plate
Third heat sink, between third inner support plate and the second inner support plate be equipped with the 4th heat sink of several circles, the 4th inner support plate and
It is equipped with the 5th heat sink of several circles between third inner support plate, several circles are uniformly provided between external support board and the 4th inner support plate
6th heat sink；
Locking mechanism includes the upper lockplate of square structure and the lower lockplate of square structure, and the length of side of upper lockplate is less than
The bottom of the length of side of lower lockplate, upper lockplate is equipped with chip placing groove, and the bottom of lower lockplate is equipped with support plate placing groove, core
Piece main body is arranged in chip placing groove and is pressed together on the top of the first upper mounted plate, and the plug-type setting of external support board is being propped up
It in fagging placing groove, is fixedly connected between upper lockplate and lower lockplate by locking connecting rod, locking connecting rod includes vertical
The head rod of setting and the second connecting rod and third connecting rod for being horizontally fixed on first connecting rod both ends keep locking connecting rod whole
C-shaped in configuration, first connecting rod are pressed together on the top of lockplate, and are tightly connected with, and second connecting rod is pressed together on lower lock
The top of fixed board, and be tightly connected with.
3. it is applied to the graphene heat dissipation film of radiating structure of camera build-in chip as claimed in claim 2, it is characterized in that, on
At several 7th heat sinks that are equipped with of divergent shape, the 7th heat sink is L-shaped structure plate at the top of lockplate.
4. it is applied to the graphene heat dissipation film of radiating structure of camera build-in chip as claimed in claim 2, it is characterized in that, the
The section of the first heat sink between one outer bottom support plate and the second outer bottom support plate is cirque structure, and several first dissipate
Hot plate is coaxially disposed and uniform diameter increases.
5. it is applied to the graphene heat dissipation film of radiating structure of camera build-in chip as claimed in claim 2, it is characterized in that, the
The cross sectional shape of two heat sinks is v-shaped structure, and third heat sink and the 5th heat sink are up-small and down-big truncated cone-shaped structure, the 4th
Heat sink and the 6th heat sink are up big and down small truncated cone-shaped structure.
6. it is applied to the graphene heat dissipation film of radiating structure of camera build-in chip as claimed in claim 2, it is characterized in that, the
Three heat sinks, the 4th heat sink, the thickness of the 5th heat sink and the 6th heat sink are identical, and the thickness G T.GT.GT first of the second heat sink dissipates
The thickness of the thickness G T.GT.GT third heat sinks of hot plate.
7. it is applied to the graphene heat dissipation film of radiating structure of camera build-in chip as claimed in claim 2, it is characterized in that, the
The height h1 of two upper mounted plates is 0.5-2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810280915.0A CN108303836A (en) | 2018-04-02 | 2018-04-02 | Graphene heat dissipation film applied to radiating structure of camera build-in chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810280915.0A CN108303836A (en) | 2018-04-02 | 2018-04-02 | Graphene heat dissipation film applied to radiating structure of camera build-in chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108303836A true CN108303836A (en) | 2018-07-20 |
Family
ID=62846797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810280915.0A Withdrawn CN108303836A (en) | 2018-04-02 | 2018-04-02 | Graphene heat dissipation film applied to radiating structure of camera build-in chip |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114096118A (en) * | 2021-11-03 | 2022-02-25 | 武汉华星光电半导体显示技术有限公司 | Heat radiating fin, preparation method thereof and electronic device |
-
2018
- 2018-04-02 CN CN201810280915.0A patent/CN108303836A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114096118A (en) * | 2021-11-03 | 2022-02-25 | 武汉华星光电半导体显示技术有限公司 | Heat radiating fin, preparation method thereof and electronic device |
| WO2023077534A1 (en) * | 2021-11-03 | 2023-05-11 | 武汉华星光电半导体显示技术有限公司 | Heat dissipation sheet, preparation method therefor, and electronic device |
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