CN108300349A - A kind of multistage replys shape memory structure and preparation method thereof - Google Patents
A kind of multistage replys shape memory structure and preparation method thereof Download PDFInfo
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- CN108300349A CN108300349A CN201610854773.5A CN201610854773A CN108300349A CN 108300349 A CN108300349 A CN 108300349A CN 201610854773 A CN201610854773 A CN 201610854773A CN 108300349 A CN108300349 A CN 108300349A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
- B32B2038/0028—Stretching, elongating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
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- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of preparation method of multistage reply shape memory structure, includes the following steps：(1) shape-memory polymer lamella is pre-stretched in a heated condition, keeps pulling force cooling, it is Nian Jie with the first adhesive tape layer in any side of the shape-memory polymer lamella, obtain the first composite construction；(2) first composite construction is pre-stretched in a heated condition, keeps pulling force cooling, it is Nian Jie with the second adhesive tape layer in any side of first composite construction, obtain the second composite construction；(3) and so on, until being bonded last adhesive tape layer to required multistage replys shape memory structure.The beneficial effects of the present invention are, by to the shape-memory polymer lamella Repeat-heating, stretching, cooling, bonded adhesives belt method, multistage has been made and has replied shape memory structure, not only preparation method is simple, easy to operate, but also multistage obtained reply shape memory structure can realize multiple recovery of shape memory.
Description
Technical field
The present invention relates to shape memory structures more particularly to a kind of multistage to reply shape memory structure and preparation method thereof.
Background technology
Shape-memory polymer, which is one kind, " can remember " a permanent shape, and can consolidate under suitable condition
It is set to the polymer of specific temporary shapes, it then,, will be by interim under light, heat or magnetic stimulation in the triggering of specified conditions
Shape is converted to permanent shape, and this property is known as shape memory effect.
For most shape-memory polymers, each there are one temporary shapes and a permanent shape, this kind of shape memories
Polymer is known as two sections of shape memory effect, if material possesses multiple temporary shapes, referred to as multistage shape memory effect.For a long time
Since, multistage shape memory effect is mostly realized by material, is limited to the performance of material itself, has in the application many
It is inconvenient.
Patent document CN 101164770A, patent name are：Bidirectional shape memory polymer composite material and its preparation side
Method is disclosed containing the polymer that at least two superimposed is bonded together, wherein at least one layer of polymer is shape-memory polymer
Material, further include one layer of elastomeric material and/or one layer can flexural deformation and the plastic tab that can actively reply, by adding
More than heat to transition temperature and transition temperature is cooled to hereinafter, realizing two-way reply, this two-way reply is a holding temperature
The effect just having is accomplished that two-way reply memory function, can not realize that multistage replys memory.
In view of drawbacks described above, creator of the present invention obtains the present invention finally by prolonged research and practice.
Invention content
To solve the above problems, the technical solution adopted by the present invention is, a kind of multistage reply shape note is on the one hand provided
The preparation method for recalling structure, includes the following steps：(1) shape-memory polymer lamella is pre-stretched in a heated condition, is kept
Pulling force cools down, Nian Jie with the first adhesive tape layer in any side of the shape-memory polymer lamella, obtains the first composite construction；
(2) first composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in any of first composite construction
Side is Nian Jie with the second adhesive tape layer, obtains the second composite construction；(3) by second composite construction prestretching in a heated condition
It stretches, keeps pulling force cooling, it is Nian Jie with third adhesive tape layer in any side of second composite construction, obtain third composite junction
Structure, and so on, until being bonded last adhesive tape layer to required multistage replys shape memory structure.
On the other hand, one kind multistage made from above-mentioned preparation method is provided and replys shape memory structure.
Further, the transition temperature of the shape-memory polymer lamella is less than first adhesive tape layer to last glue
The transition temperature of any adhesive tape layer in belt.
Further, the temperature relation between the shape-memory polymer lamella and each adhesive tape layer is：
Tg＜ Tn＜ Tn-1... ＜ T3＜ T2＜ T1
Wherein, TgIndicate the transition temperature of the shape-memory polymer lamella, Tn、Tn-1、T3、T2、T1Described in indicating respectively
Last adhesive tape layer, second from the bottom adhesive tape layer, third adhesive tape layer, the second adhesive tape layer and the first adhesive tape layer being bonded.
Further, the shape-memory polymer is polyurethane shape-memory polymer, polycaprolactone-based shape note
Recall polymer, the thermoplasticity shape-memory polymer of epoxies, the thermoset shape memory polymer of epoxies, styryl shape
Shape memory polymer, polyimides shape-memory polymer, cyanate shape-memory polymer, polyether-ether-ketone shape memory are poly-
Close object, rubber analog thermoplastic shape-memory polymer, polyvinyl shape-memory polymer, acrylic shape memory polymers
Object, perfluorinated sulfonic acid-teflon-copolymers shape-memory polymer, polylactic acid base shape memory polymer, PolyTHF
One or more of base shape memory polymer.
Further, any adhesive tape layer material is glue, heat-fusible materials in first adhesive tape layer to last adhesive tape layer
With the one or more of thermoplastic.
Compared with the prior art the beneficial effects of the present invention are：1. the present invention is by the shape-memory polymer piece
Layer Repeat-heating, stretching, cooling, bonded adhesives belt method, multistage has been made and has replied shape memory structure, not only preparation method
Simply, easy to operate, and multistage obtained reply shape memory structure can realize multiple recovery of shape memory, break limitation
In the multistage shape memory effect of material itself, the application range of shape-memory polymer has been widened；2. by the present invention in that shape
Temperature between shape memory polymer lamella and each adhesive tape layer meets relationship Tg＜ Tn＜ Tn-1... ＜ T3＜ T2＜ T1When, it can
Keep the reply number that the multistage replys shape memory structure most, it is best to reply effect.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of multistage reply shape memory structure in the embodiment of the present invention two；
Fig. 2 is the Recovery Process figure of the multistage reply shape memory structure in Fig. 1；
Fig. 3 is a kind of structural schematic diagram of multistage reply shape memory structure in the embodiment of the present invention five；
Fig. 4 is a kind of Recovery Process figure of multistage reply shape memory structure in Fig. 3.
Specific implementation mode
Below in conjunction with attached drawing, the forgoing and additional technical features and advantages are described in more detail.
A kind of multistage replys the preparation method of shape memory structure, includes the following steps：
(1) shape-memory polymer lamella is pre-stretched in a heated condition, pulling force cooling is kept, in the shape memory
Any side of polymer sheet layer is Nian Jie with the first adhesive tape layer, obtains the first composite construction；
(2) first composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in first composite junction
Any side of structure is Nian Jie with the second adhesive tape layer, obtains the second composite construction；
(3) second composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in second composite junction
Any side of structure is Nian Jie with third adhesive tape layer, obtains third composite construction, and so on, until being bonded last adhesive tape layer to institute
The multistage needed replys shape memory structure.
The present invention by the shape-memory polymer lamella Repeat-heating, stretching, cooling, bonded adhesives belt side
Method has been made multistage and has replied shape memory structure, and not only preparation method is simple, easy to operate, but also multistage obtained replys shape
Memory structures can realize multiple recovery of shape memory, broken the multistage shape memory effect for being confined to material itself, widened
The application range of shape-memory polymer.
Embodiment one
A kind of multistage replys the preparation method of shape memory structure, includes the following steps：
(1) shape-memory polymer lamella is pre-stretched in a heated condition, keeps pulling force cooling, it is viscous with the first adhesive tape layer
It connects, obtains the first composite construction；
(2) first composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in first composite junction
The side of the first adhesive tape layer in structure is Nian Jie with the second adhesive tape layer, obtains the second composite construction；
(3) second composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in second composite junction
The side of the second adhesive tape layer in structure is Nian Jie with third adhesive tape layer, obtains third composite construction, and so on, until being bonded last
Adhesive tape layer to required multistage replys shape memory structure.
Multistage is prepared by above-mentioned preparation method and replys shape memory structure, when the shape-memory polymer lamella
Transition temperature be less than the transition temperature of any adhesive tape layer in first adhesive tape layer to last adhesive tape layer, and to each adhesive tape layer
Between flow temperature do not require, shape memory structure is replied to the multistage that is prepared and is heated, can be realized
At least two sections replies.
Embodiment two
Preparation method as described in embodiment one is prepared multistage and replys shape memory structure, and the present embodiment is different from
Place is that the multistage replys the shape-memory polymer lamella in shape memory structure and the temperature between each adhesive tape layer
Relationship is：
Tg＜ Tn＜ Tn-1... ＜ T3＜ T2＜ T1
Wherein, TgIndicate the transition temperature of the shape-memory polymer lamella, Tn、Tn-1、T3、T2、T1Described in indicating respectively
Last adhesive tape layer, second from the bottom adhesive tape layer, third adhesive tape layer, the second adhesive tape layer and the first adhesive tape layer pasted.
When the temperature relation between the shape-memory polymer lamella and each adhesive tape layer meets above formula, to described more
Duan Huifu shape memory structures are gradually warming up to the viscosity flow of the transition temperature and each adhesive tape layer of the shape-memory polymer lamella
Temperature can realize that n times reply deformation, wherein n indicates that the multistage replys the number of plies of shape memory structure.In the present embodiment,
By making the temperature between each layer meet relationship Tg＜ Tn＜ Tn-1... ＜ T3＜ T2＜ T1, the multistage can be made to reply shape
Memory structures reply number is most, and it is best to reply effect.
For two layers of adhesive tape is arranged, as shown in Figure 1, it replys shape for a kind of multistage that one preparation method of embodiment obtains
The structural schematic diagram of shape memory structures, a kind of multistage reply shape memory structure, including the shape memory being cascading are poly-
Object lamella 1, the first adhesive tape layer 2 and the second adhesive tape layer 3 are closed, if the transition temperature of the shape-memory polymer lamella 1 is Tg, institute
The flow temperature for stating the first adhesive tape layer 2 is T1, the flow temperature of second adhesive tape layer 3 is T2, work as Tg<T2<T1When, it is stepped up
Temperature can realize three sections of replies.
Specific Recovery Process is as shown in Fig. 2, it replys the Recovery Process figure of shape memory structure, A for a kind of multistage in Fig. 1
What is indicated is that multistage replys the structural schematic diagram before shape memory structure is replied, and what B was indicated is that multistage replys shape memory structure
The structural schematic diagram that first segment is replied；What C was indicated is the structural schematic diagram that multistage replys that shape memory structure second segment is replied；D
What is indicated is the structural schematic diagram that multistage replys that shape memory structure third section is replied, and Recovery Process is：
(1) multistage reply shape memory structure is heated to TgAbove and it is no more than T2, the multistage reply shape note
Recall structure to deform, be returned to the state that B is indicated in Fig. 2, temperature is reduced, in first adhesive tape layer 2 and second glue
Under the constraint force effect of belt 3, the multistage replys shape memory structure and keeps stable and indeformable, i.e., still keeps B tables in Fig. 2
The state shown；
(2) multistage reply shape memory structure is heated to T2Above and it is no more than T1, second adhesive tape layer 3 by
Elastomeric state is changed into viscous state, is equivalent to the constraint for removing second adhesive tape layer 3, and the multistage replys shape memory structure hair
Change shape, is returned to the state that C is indicated in Fig. 2, reduces temperature, described more under the constraint force effect of first adhesive tape layer 2
Duan Huifu shape memory structures keep stable and indeformable, i.e., still keep the state that C is indicated in Fig. 2；
(3) multistage reply shape memory structure is heated to T1More than, first adhesive tape layer 2 is changed by elastomeric state
For viscous state, it is equivalent to the constraint for removing first adhesive tape layer 2, the multistage replys shape memory structure and deforms, and returns
The state indicated again to D in Fig. 2, reduces temperature, and the multistage replys shape memory structure and keeps stable and indeformable, i.e., still protects
Hold the state that D is indicated in Fig. 2.
Embodiment three
A kind of multistage as described in embodiment one replys the preparation method of shape memory structure, and the present embodiment is different from it
Place, includes the following steps：
(1) shape-memory polymer lamella is pre-stretched in a heated condition, keeps pulling force cooling, it is viscous with the first adhesive tape layer
It connects, obtains the first composite construction；
(2) first composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in first composite junction
The side of shape-memory polymer lamella in structure is Nian Jie with the second adhesive tape layer, obtains the second composite construction；
(3) second composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in second composite junction
The side of the first adhesive tape layer in structure is Nian Jie with third adhesive tape layer, obtains third composite construction, and so on, bonded adhesives belt
When, alternating is adhered to the both sides of composite construction, until being bonded last adhesive tape layer to required multistage replys shape memory structure.
Multistage is prepared by above-mentioned preparation method and replys shape memory structure, when the shape-memory polymer lamella
Transition temperature be less than the transition temperature of any adhesive tape layer in first adhesive tape layer to last adhesive tape layer, and to each adhesive tape layer
Between flow temperature do not require, shape memory structure is replied to the multistage that is prepared and is heated, can be realized
At least two sections replies.
Example IV
A kind of multistage as described in embodiment one and embodiment three replys the preparation method of shape memory structure, the present embodiment
It is different from place, is included the following steps：
(1) shape-memory polymer lamella is pre-stretched in a heated condition, keeps pulling force cooling, it is viscous with the first adhesive tape layer
It connects, obtains the first composite construction；
(2) first composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in first composite junction
The side of shape-memory polymer lamella in structure is Nian Jie with the second adhesive tape layer, obtains the second composite construction；
(3) second composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in second composite junction
The side of the second adhesive tape layer in structure is Nian Jie with third adhesive tape layer, obtains third composite construction, and so on, bonded adhesives belt
When, it is adhered to the arbitrary side of composite construction, until being bonded last adhesive tape layer to required multistage replys shape memory structure.
Multistage is prepared by above-mentioned preparation method and replys shape memory structure, when the shape-memory polymer lamella
Transition temperature be less than the transition temperature of any adhesive tape layer in first adhesive tape layer to last adhesive tape layer, and to each adhesive tape layer
Between flow temperature do not require, shape memory structure is replied to the multistage that is prepared and is heated, can be realized
At least two sections replies.
Embodiment five
Preparation method as described in embodiment three and example IV is prepared multistage and replys shape memory structure, this implementation
Example is different from place and is, the multistage replys shape-memory polymer lamella and each adhesive tape layer in shape memory structure
Between temperature relation be：
Tg＜ Tn＜ Tn-1... ＜ T3＜ T2＜ T1
Wherein, TgIndicate the transition temperature of the shape-memory polymer lamella, Tn、Tn-1、T3、T2、T1Described in indicating respectively
Last adhesive tape layer, second from the bottom adhesive tape layer, third adhesive tape layer, the second adhesive tape layer and the first adhesive tape layer being bonded.
When the temperature relation between the shape-memory polymer lamella and each adhesive tape layer meets above formula, to described more
Duan Huifu shape memory structures are gradually warming up to the viscosity flow of the transition temperature and each adhesive tape layer of the shape-memory polymer lamella
Temperature can realize that n times reply deformation, wherein n indicates that the multistage replys the number of plies of shape memory structure.In the present embodiment,
By making the temperature between each layer meet relationship Tg＜ Tn＜ Tn-1... ＜ T3＜ T2＜ T1, the multistage can be made to reply shape
Memory structures reply number is most, and it is best to reply effect.
For two layers of adhesive tape is arranged, as shown in figure 3, it is one kind that embodiment three or example IV preparation method obtain
Multistage replys the structural schematic diagram of shape memory structure, a kind of multistage reply shape memory structure, including shape-memory polymer
Lamella 1, the first adhesive tape layer 2 and the second adhesive tape layer 3, first adhesive tape layer, 2 and second adhesive tape layer 3 are respectively arranged on the shape note
The both sides of polymer sheet layer 1 are recalled, if the transition temperature of the shape-memory polymer lamella 1 is Tg, first adhesive tape layer 2
Flow temperature is T1, the flow temperature of second adhesive tape layer 3 is T2, work as Tg<T1<T2When, it is stepped up temperature, can realize three
Duan Huifu.
Specific Recovery Process is as shown in figure 4, it replys the Recovery Process figure of shape memory structure, A for a kind of multistage in Fig. 3
What is indicated is that multistage replys the structural schematic diagram before shape memory structure is replied, and what B was indicated is that multistage replys shape memory structure
The structural schematic diagram that first segment is replied；What C was indicated is the structural schematic diagram that multistage replys that shape memory structure second segment is replied；D
What is indicated is the structural schematic diagram that multistage replys that shape memory structure third section is replied, and Recovery Process is：
(1) multistage reply shape memory structure A is heated to TgAbove and it is no more than T1, the multistage reply shape memory
Structure deforms, and is returned to the state of B in Fig. 4；
(2) multistage reply shape memory structure is heated to T1Above and it is no more than T1, the first adhesive tape layer 2 is by high-elastic
State is changed into viscous state, and multistage replys shape memory structure and deforms, and is returned to the state of C in Fig. 4；
(3) multistage reply shape memory structure is heated to T2More than, the second adhesive tape layer 3 is changed into viscosity flow by elastomeric state
State, multistage reply shape memory structure and deform, and are returned to the state of D in Fig. 4.
Embodiment six
A kind of multistage as described above replys shape memory structure, and the present embodiment is different from place and is, described above
Shape-memory polymer be polyurethane shape-memory polymer, polycaprolactone-based shape-memory polymer, epoxies heat
Plasticity shape-memory polymer, the thermoset shape memory polymer of epoxies, styryl shape-memory polymer, polyamides are sub-
Amine shape-memory polymer, cyanate shape-memory polymer, polyether-ether-ketone shape-memory polymer, rubber analog thermoplastic shape
Shape memory polymer, polyvinyl shape-memory polymer, acrylic shape-memory polymer, perfluorinated sulfonic acid-polytetrafluoroethyl-ne
In alkene copolymer shape-memory polymer, polylactic acid base shape memory polymer, PolyTHF base shape memory polymer
It is one or more.
Embodiment seven
A kind of multistage as described above replys shape memory structure, and the present embodiment is different from place and is, and described first
In adhesive tape layer to last adhesive tape layer any adhesive tape layer material be glue, heat-fusible materials and thermoplastic one kind or several
Kind.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, under the premise of not departing from the method for the present invention, can also make several improvement and supplement, these are improved and supplement also should be regarded as
Protection scope of the present invention.
Claims (6)
1. a kind of multistage replys the preparation method of shape memory structure, which is characterized in that include the following steps：
(1) shape-memory polymer lamella is pre-stretched in a heated condition, pulling force cooling is kept, in the shape memory polymers
Any side of object lamella is Nian Jie with the first adhesive tape layer, obtains the first composite construction；
(2) first composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in first composite construction
Any side is Nian Jie with the second adhesive tape layer, obtains the second composite construction；
(3) second composite construction is pre-stretched in a heated condition, pulling force cooling is kept, in second composite construction
Any side is Nian Jie with third adhesive tape layer, obtains third composite construction, and so on, until being bonded last adhesive tape layer to required
Multistage replys shape memory structure.
2. a kind of replying multistage reply shape note made from the preparation method of shape memory structure by multistage described in claim 1
Recall structure.
3. multistage according to claim 2 replys shape memory structure, which is characterized in that the shape-memory polymer
The transition temperature of lamella is less than the transition temperature of any adhesive tape layer in first adhesive tape layer to last adhesive tape layer.
4. multistage according to claim 2 replys shape memory structure, which is characterized in that the shape-memory polymer piece
Layer each adhesive tape layer between temperature relation be：
Tg＜ Tn＜ Tn-1... ＜ T3＜ T2＜ T1
Wherein, TgIndicate the transition temperature of the shape-memory polymer lamella, Tn、Tn-1、T3、T2、T1Indicate described last respectively
One adhesive tape layer, second from the bottom adhesive tape layer, third adhesive tape layer, the second adhesive tape layer and the first adhesive tape layer being bonded.
5. multistage according to claim 2 replys shape memory structure, which is characterized in that the shape-memory polymer
For the thermoplasticity shape memory polymers of polyurethane shape-memory polymer, polycaprolactone-based shape-memory polymer, epoxies
Object, the thermoset shape memory polymer of epoxies, styryl shape-memory polymer, polyimides shape memory polymers
Object, cyanate shape-memory polymer, polyether-ether-ketone shape-memory polymer, rubber analog thermoplastic shape-memory polymer,
Polyvinyl shape-memory polymer, acrylic shape-memory polymer, perfluorinated sulfonic acid-teflon-copolymers shape note
Recall one or more of polymer, polylactic acid base shape memory polymer, PolyTHF base shape memory polymer.
6. multistage according to claim 2 replys the preparation method of shape memory structure, which is characterized in that first glue
In belt to last adhesive tape layer the material of any adhesive tape layer be glue, heat-fusible materials and thermoplastic one kind or several
Kind.
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| CN109203436A (en) * | 2018-07-27 | 2019-01-15 | 河海大学 | The design method of high polymer autofolding is realized in a kind of macro-scale |
| CN112409774A (en) * | 2020-10-08 | 2021-02-26 | 江苏大学 | Composite material of elastomer and shape memory polymer with self-deformability and preparation method thereof |
| CN112454889A (en) * | 2020-11-03 | 2021-03-09 | 吉林大学 | Preparation method of 3D printing shaping-free self-deformation shape memory intelligent material |
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|---|---|---|---|---|
| CN109203436A (en) * | 2018-07-27 | 2019-01-15 | 河海大学 | The design method of high polymer autofolding is realized in a kind of macro-scale |
| CN112409774A (en) * | 2020-10-08 | 2021-02-26 | 江苏大学 | Composite material of elastomer and shape memory polymer with self-deformability and preparation method thereof |
| CN112409774B (en) * | 2020-10-08 | 2023-02-17 | 江苏大学 | Composite material of elastomer and shape memory polymer with self-deformability and preparation method thereof |
| CN112454889A (en) * | 2020-11-03 | 2021-03-09 | 吉林大学 | Preparation method of 3D printing shaping-free self-deformation shape memory intelligent material |
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