CN108281372A - The uniformly IC chip wet treater and method of etching substrate - Google Patents
The uniformly IC chip wet treater and method of etching substrate Download PDFInfo
- Publication number
- CN108281372A CN108281372A CN201810288503.1A CN201810288503A CN108281372A CN 108281372 A CN108281372 A CN 108281372A CN 201810288503 A CN201810288503 A CN 201810288503A CN 108281372 A CN108281372 A CN 108281372A
- Authority
- CN
- China
- Prior art keywords
- cylinder
- supporting body
- substrate
- vibrating device
- attachment structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention proposes a kind of the IC chip wet treater and method of uniform etching substrate, and supporting body is by cylinder attachment structure carry on vibrating device；Cylinder attachment structure includes the first cylinder of the lower end for being set to vibrating device, be set to supporting body upper end the second cylinder, the second cylinder be rotatably connected on the first cylinder and can opposite first cylinder move up and down；Rotation drive machine connects supporting body, to drive supporting body Relative Vibration device by the cylinder attachment structure by rotate；Shaker mechanism connects supporting body, to drive supporting body Relative Vibration device by the cylinder attachment structure by shake up and down, and the range of supporting body shaken up and down be less than or equal to the second cylinder can opposite first cylinder up and down motion range.The IC chip wet treater and method of the uniform etching substrate of the present invention, can promote the uniformity of substrate etching.
Description
Technical field
The present invention relates to IC chip wet process technical field more particularly to a kind of collection of uniform etching substrate
At circuit chip wet treater and method.
Background technology
IC industry be 20th century since make rapid progress development information network technique and microelectric technique basis,
It is the core technology for influencing our daily lifes and each industry, it is closely bound up with our daily life.It is given birth to from current people
Too busy to get away portable computer network living, arrives the research and development of the various vehicles, and the almost development of each industry be unable to do without integrated electricity
Road semiconductor industry, integrated circuit have been deep into the every aspect of life, have been played with the development of social industry's technology
Increasingly important role.
Design of integrated circuit manufacturing industry is the core and main body of IC industry, it is the integrated electricity of accelerated semiconductor
The basis that the development of road industry is created.The processing procedures such as the wet etching cleaning of integrated circuit substrate are applied in entire chip manufacturing
During, occupy 25% or more production link.The many chemical liquids used during substrate wet treatment process are to base
The etch cleaner of piece has increasingly higher demands, and with the continuous improvement of integrated circuit integrated level, line width enters more next
Smaller nanoscale structures ensure that the etching homogeneity of substrate surface nano level structure becomes increasingly heavier in wet clean process
The link wanted.
The inhomogeneities of substrate etching can cause many problems of IC chip, such as can not in sensor chip mechanism
It is effectively built into its crucial bridge like physics sensing arrangement, to influence function and the service life of device；It is higher and higher in integrated level
Integrated circuit in, the inhomogeneities of etching can so that flatness is bad in its PN junction, influences integrated circuit univers parameter；It generates
The problems such as substandard products and high waste paper rate.
Invention content
Technical problem to be solved by the invention is to provide a kind of IC chip wet process dresses of uniform etching substrate
It sets and method, the uniformity of substrate etching can be promoted.
To solve the above problems, the present invention proposes a kind of IC chip wet treater of uniform etching substrate, packet
It includes：Vibrating device, supporting body, rotation drive machine, shaker mechanism and cylinder attachment structure；
Supporting body is by the cylinder attachment structure carry on vibrating device；The cylinder attachment structure includes setting
Be placed in the first cylinder of the lower end of the vibrating device, the upper end for being set to the supporting body the second cylinder, described
Two cylinders are rotatably connected on first cylinder and second cylinder can be above and below relatively described first cylinder
Movement；
The rotation drive machine connects the supporting body, to drive the supporting body to pass through the cylinder attachment structure
And it is rotated relative to the vibrating device；The shaker mechanism connects the supporting body, to drive the supporting body to pass through the circle
Cylinder connection structure and the relatively described vibrating device are shaken up and down, and the range of the supporting body shaken up and down is less than or equal to institute
Stating the second cylinder can first cylinder moves up and down relatively range.
According to one embodiment of present invention, first cylinder is the exterior circular column with hollow space, described the
Two cylinders are the matched inner cylinder of internal diameter of outer diameter and first cylinder；
First cylinder has upper stopper and lower stopper；Second cylinder is set to first cylinder
In hollow space, and the range that opposite can be moved up and down and be moved up and down by the upper stopper and the limitation of lower stopper；The carrying
Body is connect across the lower stopper with second cylinder.
According to one embodiment of present invention, the rotation drive machine and the supporting body are both connected to the shake machine
On structure, shaken together under the action of the shaker mechanism.
According to one embodiment of present invention, the shaker mechanism includes：It cam mechanism, supporting table, guide frame and watches
Take motor；
The rotation drive machine and the supporting body are all connected on the supporting table；Described in the cam mechanism connection
Supporting table；Cam mechanism described in the Serve Motor Control moves so that supporting table described in the cam mechanism driving is trembled up and down
It is dynamic.
According to one embodiment of present invention, the guide frame is at least three guiding being arranged in the supporting table
Column.
According to one embodiment of present invention, the rotation drive machine is connected to the supporting table by a lifting seat
On, the height of the lifting seat makes the position that the rotation drive machine is rotatablely connected with the supporting body be located at the cylinder
Within the scope of the following distance of attachment structure.
According to one embodiment of present invention, the shaker mechanism generates gradually by Serve Motor Control cam mechanism
It is shaken under the control of flash.
According to one embodiment of present invention, further include elevating mechanism,
The vibrating device, rotation drive machine, shaker mechanism are both connected on the elevating mechanism, in the elevator
It is lifted together under the control of structure.
According to one embodiment of present invention, the lower end of the supporting body is provided with several hooks, to be respectively used to carry
The substrate box of several substrates can be housed.
According to one embodiment of present invention, at least described vibrating device is to the vibrating of supporting body, the shaker mechanism pair
The shake timesharing of supporting body carries out.
A kind of IC chip wet processing methods of uniform etching substrate of the present invention, using arbitrary in such as previous embodiment
The IC chip wet treater of uniform etching substrate described in one, this method include：
The substrate box for being equipped with several substrates is obtained by the supporting body, and substrate box is placed in corresponding etching technics
In slot；
The vibrating device work is controlled, the vibrating device is transmitted vibrational energy by the cylinder attachment structure
Onto the supporting body, to be transferred on the substrate；
The shaker mechanism work is controlled, the shaker mechanism drives the supporting body to pass through the cylinder attachment structure
And opposite up-down vibration, to drive the substrate to shake up and down；
The rotation drive machine work is controlled, the rotation drive machine drives the supporting body to be connected by cylinder
Structure and relatively rotate, to drive the substrate to rotate, to change position of the substrate box in etching technics slot；
Wherein, it controls the vibrating device, the shaker mechanism and the rotation drive machine intermittently to work, and at least
The vibrating device to the vibrating of supporting body, the shaker mechanism is carried out at the same time the shake of supporting body.
After adopting the above technical scheme, the present invention has the advantages that compared with prior art：
Vibrating device is connect by cylinder attachment structure with supporting body, and shake, vibration on same structure can be completed
And the wet process mode of rotation, do not interfere with the mechanism of rotation and the shake of supporting body, transmission vibration energy to substrate, prevent with
It dispels due to air content height in chemical reaction or ultrasonic million acoustic cavitations effect or liquid and generates the micro-bubble in substrate surface；
Shaker mechanism can drive supporting body to shake up and down, increase chemical liquids in the fluid relative percentage speed variation of substrate surface, dispel
The micro-bubble that substrate surface is generated due to chemical reaction or ultrasonic million acoustic cavitations effect, accelerates substrate surface evening chemical and carves
The reaction of erosion；And vibrating device and shaker mechanism, supporting body can be enable to occur to vibrate simultaneously and shake, reinforcing goes bubble to imitate
Fruit so that etching is more uniformly distributed；Rotation drive machine drives supporting body rotation and vibrating device is motionless so that is loaded with several bases
The carrying gaily decorated basket of film magazine can use rotation in chemical tank body, change the position that the carrying gaily decorated basket is placed in chemical technology slot, put down
Weighing apparatus is due to unavoidably influence of the objective concentration difference to different location substrate etching rate of groove body internal chemical liquid each region, together
When ensure vibration stability.
Description of the drawings
Fig. 1 is the structural representation of the IC chip wet treater of the uniform etching substrate of one embodiment of the invention
Figure；
The B-B directional profile structural representations of the IC chip wet treater for the uniform etching substrate that Fig. 2 is Fig. 1
Figure；
Fig. 3 is the flow signal of the IC chip wet processing methods of the uniform etching substrate of one embodiment of the invention
Figure.
Description of symbols in figure：
1- vibrating devices, 2- cylinder attachment structures, the first cylinders of 21-, the second cylinders of 22-, 3- supporting bodies, 31-
Rotating junction, 32- shake interconnecting piece, 33- hooks, 4- rotation drive machines, 51- cam mechanisms, 52- supporting tables, 53- guiding
Structure, 6- elevating mechanisms, 7- links, 8- are lifted seat.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.
Many details are elaborated in the following description in order to fully understand the present invention.But the present invention can be with
Much implement different from other manner described here, those skilled in the art can be without prejudice to intension of the present invention the case where
Under do similar popularization, therefore the present invention is not limited to the specific embodiments disclosed below.
Substrate wet process etch cleaner technique is mainly the following method：Substrate box is put into chemical liquids groove body by one,
Direct etching cleans；Two, are shaken up and down using slowly uniform mechanical arm, accelerate the etching reaction of chemical liquids and substrate；Three, are adopted
Substrate rotary motion in chemical liquids in film magazine is driven with the rotation of groove body lower rotation rod, position up and down in compensating groove body
Learn the inconsistent influence to substrate etching homogeneity of liquid concentration；The method that four, are bubbled using liquid circulation overflow and nitrogen, increases
The chemical liquids even concentration at each position of groove body；Five, are transferred to substrate surface using increase ultrasonic wave or megasonic energy, transport
The molecule of substrate surface is removed with bubble cavitation and blasting principle.
First method can such as use sulfuric acid in the substrate etch cleaner wet treatment process not high to the etching uniformity
Hydrogen peroxide or ozone is added to dispel the organic contamination particle again of substrate surface；Compare high technology when having to the substrate etch cleaner uniformity
It is required that when it is necessary to use second, third, the 4th kind of householder method, but the limitation that these methods have its certain because these
Method is all unable to the inevitable existing objective concentration difference phenomenon pair of active balance groove body internal chemical liquid each region concentration
The influence of substrate etching homogeneity can not effectively dispel the micro-bubble (bubble for influencing to be generated in substrate surface etching process
It is due to chemical reaction, gas content is excessively high and generate over the substrate surface in ultrasonic million acoustic cavitations effect and chemical liquid
), to influence to the etching homogeneity of the substrate of different location in film magazine, that is, in film magazine in different film traps substrate quarter
Erosion evening ratio is inconsistent (usual 4 inches to 8 inches film magazines are equipped with 25 substrates, and 12 inch plaques boxes are equipped with 13 substrates).The
Five kinds of methods are that either megasonic energy is transferred to substrate surface with ultrasonic wave or mega sonic wave bubble cavitation using ultrasonic wave
And the molecule of blasting principle stripping substrate surface, but affect substrate surface etching without the micro-bubble of timely explosion
Progress, certain influence is also produced to etching technics and etching homogeneity.
As the fast development of IC industry and integrated level enter smaller and smaller nanoscale structures, the row at present
Industry needs one kind that can improve high etching technics uniformity process yields in wet process, and can guarantee that every batch of substrate high etching is equal
The etching wet processing methods and device of even property.The device and method of the embodiment of the present invention can solve the problems, such as this, Er Qieneng
Micro-bubble explosion and the effect dispelled, are fitted after the effective cavitation of auxiliary ultrasonic or mega sonic wave in wet process etching technics
For solar cell substrates, flat-panel monitor substrate, it is particularly suitable for the wet cleaning processes of semiconductor integrated circuit substrate
In the demand of required high uniformity etching and high yield.
In one embodiment, referring to Fig. 1 and Fig. 2, the IC chip wet treater for uniformly etching substrate can be with
Including：Vibrating device 1, supporting body 3, rotation drive machine 4, shaker mechanism and cylinder attachment structure 2.
Vibrating device 1 for example can be vibrating motor, preferably for be low-frequency vibration motor, such as vibration frequency be 50~
The vibrating motor of 3600Hz may include multigroup vibrating motor.The vibration of vibrating device 1 comes compared with the shake of shaker mechanism
It says, amplitude smaller, the frequency bigger of vibration；And then amplitude bigger, frequency smaller are shaken, frequency is 30-60 times per minute.Vibration
Range is in millimeter section, and shake cannot be carried out at the same time in this inventive structure in Centimeter Level.
Supporting body 3 is by 2 carry of cylinder attachment structure on vibrating device 1, i.e., the described vibrating device 1 is held with described
It is connected by the cylinder attachment structure 2 between carrier 3, and supporting body 3 is located at the lower section of the vibrating device 1, is working
When, vibrating device 1 is fixed with respect to technology groove.Supporting body 3 be for carrying substrates box, such as can be in supporting body 3
Several hooks 33 of lower end setting, e.g. four symmetrical hooks 33 each can be carried with carry substrate box on hook 33 and be spent
Basket (not shown), substrate box, which carries in the gaily decorated basket, can be placed in substrate box, and multiple integrated circuit substrates can be arranged in substrate box.It holds
Carrier 3 can be manipulator, and capturing the substrate box carrying gaily decorated basket by automatically controlled mode is moved in technology groove, and in processing procedure
In, keep the state of carry.
The cylinder attachment structure 2 includes the first cylinder 21 of the lower end for being set to the vibrating device 1, is set to
Second cylinder 22 of the upper end of the supporting body 3.Second cylinder 22 is rotatably connected in first cylinder 21
Upper and described second cylinder 22 can the relatively described up and down motion of first cylinder 21.Due to the first cylinder 21 and the second cylinder
Body 22 is cylinder, as long as thus the relative rotation connection that both can realize of the relationship that is mutually socketed, and the second cylinder
As long as body 22 can first cylinder 21 up and down motion relatively the upper of the second cylinder 22 is then set on the first cylinder 21
Down stroke space.It is connected and fixed between vibrating device 1 and the first cylinder 21, supporting body 3 is connect with the second cylinder 22
It is fixed, thus generable relative motion between the first cylinder 21 and the second cylinder 22, it is vibrating device 1 and supporting body
Generable relative motion between 3.
The rotation drive machine 4 connects the supporting body 3, to drive the supporting body 3 to be connected by the cylinder
Structure 2 and relative to the vibrating device 1 rotate.Since supporting body 3 and vibrating device 1 are rotatably connected, thus rotating
Under the drive of transmission mechanism 4, only supporting body 3 rotates and vibrating device 1 remains stationary as.Rotation drive machine 4 preferably uses corrosion resistant
Chain drive is lost, there is rotating junction 31 on supporting body 3, it e.g. can be with the gear teeth structure of chain interoperation.It is logical
Crossing rotation drive machine 4 drives supporting body 3 to rotate, and the carry substrate box carrying gaily decorated basket will be around carrying on the hook 33 of lower end
The central axis of body 3, to which substrate displaced position in technology groove.
The shaker mechanism connects the supporting body 3, to drive the supporting body 3 to pass through the cylinder attachment structure 2
And relatively described about 1 vibrating device is shaken, and the range of the supporting body 3 shaken up and down is less than or equal to second cylinder
Body 22 can first cylinder 21 moves up and down relatively range.Shake can make the fluid reverse flow around substrate up and down
It is dynamic, accelerate the fluid velocity of substrate surface.
Vibrating device 1 is connect by cylinder attachment structure 2 with supporting body 3, can be completed the shake on same structure, be shaken
Dynamic and rotation wet process mode, does not interfere with the mechanism of rotation and the shake of supporting body, and transmission vibration energy is prevented to substrate
The small gas in substrate surface is generated with dispelling due to air content height in chemical reaction or ultrasonic million acoustic cavitations effect or liquid
Bubble；Shaker mechanism can drive supporting body to shake up and down, increase chemical liquids in the fluid relative percentage speed variation of substrate surface, dispel
Except the micro-bubble that substrate surface is generated due to chemical reaction or ultrasonic million acoustic cavitations effect, accelerate substrate surface evening chemical
The reaction of etching；And vibrating device 1 and shaker mechanism, supporting body can be enable to occur to vibrate simultaneously and shake, bubble is removed in reinforcing
Effect so that etching is more uniformly distributed；Rotation drive machine 4 drives the rotation of supporting body 3 and vibrating device is motionless so that is loaded with several
The carrying gaily decorated basket of a substrate box can use rotation in chemical tank body, change the position that the carrying gaily decorated basket is placed in chemical technology slot
It sets, balance is due to inevitable shadow of the objective concentration difference to different location substrate etching rate in groove body internal chemical liquid each region
It rings, while ensureing the stability of vibration.
In one embodiment, first cylinder 21 is the exterior circular column with hollow space, second cylinder
Body 22 is the matched inner cylinder of internal diameter of outer diameter and first cylinder 21, can have certain mechanical tolerance to coordinate.Certainly,
It can also mutually exchange, i.e. the first cylinder 21 is inner cylinder, and the second cylinder 22 is exterior circular column, as long as the two energy phase
It rotates and moves up and down over the ground.Use the first cylinder 21 for exterior circular column, the second cylinder 22 is inner cylinder, can be with
Second cylinder 22 is more stably moved in the first cylinder 21, enhances the stability of whole device, avoids putting
It is dynamic.Second cylinder 22 is preferably solid inner cylinder, naturally it is also possible to be hollow.
First cylinder 21 has upper stopper and lower stopper.Second cylinder 22 is set to first cylinder
In the hollow space of body 21, and the range that opposite can be moved up and down and be moved up and down by the upper stopper and the limitation of lower stopper.The
Two cylinders 22 are not constrained other than the side wall of the first cylinder 21 and upper stopper and lower crosspiece part by others, ensure rotation
And the freedom to move up and down.The supporting body 3 is connect across the lower stopper with second cylinder 22.On lower crosspiece part
The trepanning that can so that supporting body 3 passes through is set, the limitation to the second cylinder 22 is surely not influenced.
By the mating connection of exterior circular column and inner cylinder, the relative rotation and up and down of supporting body 3 can be realized simultaneously
Movement, and keep stablizing for vibrating device 1 motionless, the overall stability of device is simplified and ensured to structure.
Preferably, the rotation drive machine 4 and the supporting body 3 are both connected on the shaker mechanism, are trembled described
It is shaken together under the action of motivation structure.That is, when shaker mechanism is shaken, rotation drive machine 4 and supporting body 3 are together
Movement, the two is relatively stationary, and can simplify the company of rotation drive machine 4 and the rotating junction 31 of supporting body 3 in this way
It connects, can also realize the rotation of different height position.
In one embodiment, the shaker mechanism may include：Cam mechanism 51, supporting table 52, guide frame 53 and
Servo motor.Certainly, servo motor and vibrating device 1, rotation drive machine 4 controller can be integrated controller or point
The controller of body.
The rotation drive machine 4 and the supporting body 3 are both connected in the supporting table 52；The cam mechanism 51 connects
Connect the supporting table 52；Cam mechanism 51 described in the Serve Motor Control moves so that the cam mechanism 51 drives described
About 52 supporting table is shaken.Specifically, rotation drive machine 4 is mounted in supporting table 52, and supporting table 52 have prolong
Semi-girder, adjutage setting are perforated and are fastenedly connected with the shake interconnecting piece 32 of supporting body 3.
It is appreciated that shaker mechanism is specifically also not necessarily limited to this, it can also use others that can realize in a certain range
The mechanism of up and down motion, only the shaker mechanism in the present embodiment more simplify, cost is lower, and structure is also more stable.Cam mechanism
It can be with left-right rotation so that supporting table can shake up and down, drive about 3 supporting body to shake, the amplitude of shake is according to cam machine
Depending on size, that is, motion amplitude of structure 51.
Preferably, the guide frame 53 is at least two guide posts being arranged in the supporting table 52, is shown in figure
Be two guide posts, naturally it is also possible to be 3 or more.The shake up and down of supporting table 52 is oriented to by guide post, avoids sending out
Offset in raw dither process, enhances the stability of shaker mechanism.
Preferably, the rotation drive machine 4 is connected to by a lifting seat 8 in the supporting table 52, the lifting seat 8
Height make the position that the rotation drive machine 4 and the supporting body 3 are rotatablely connected be located at the cylinder attachment structure 2
Following distance within the scope of, specific distance range is unlimited, as long as not influencing the rotation of cylinder attachment structure 2.It holds
The rotating junction 31 of carrier 3 is located at close to the position of the second cylinder 22, can make rotational stability higher, closer to the second circle
Cylinder 22, then the possibility smaller swung in rotation process.
In fig. 1 and 2 as it can be seen that the rotating junction 31 of supporting body 3 is closer to upper end, and it shakes interconnecting piece 32 then more
Close to intermediate position.
Preferably, the shaker mechanism occurs under the control of the crescendo pulse generated by Serve Motor Control cam mechanism
Shake.Pulsed is shaken up and down, and dynamics crescendo, the shake up and down of substrate can be made to keep having acceleration so that fluid
Velocity variations it is more lasting, more effectively avoid the generation of substrate surface bubble, accelerate the reaction of substrate chemical etching.
In one embodiment, uniformly the IC chip wet treater of etching substrate can also include elevating mechanism
6.Elevating mechanism 6 can be the elevating screw mechanism of servo motor driving, be certainly not limited to this.
The vibrating device 1, rotation drive machine 4, shaker mechanism are both connected on the elevating mechanism 6, in the liter
It is lifted together under the control of descending mechanism 6.That is, uniformly etching the IC chip wet process of substrate in previous embodiment
The apparatus structure that device is included is arranged on elevating mechanism 6, can be lifted by elevating mechanism 6, realizes vertical height
On variation.By elevating mechanism 6, the crescendo pulsed shake of supporting body 3 can be completed on different upright positions and is turned
It is dynamic.
Preferably, the lower end of the supporting body 3 is provided with several hooks 33, and several substrates can be housed to be respectively used to carry
Substrate box.Hook 33 is that the lower end of opposite supporting body 3 is symmetrically arranged, keeps the stability of substrate box, can be on hook 33
The more substrate boxes of carry carry the gaily decorated basket, and it is more to solve all kinds of substrates of integrated circuit (four in chemical element table, five dvielements) more substrates
The problem of the etching homogeneity control hardly possible of film magazine, greatly improves the etching homogeneity of more substrate multi-disc boxes etching substrate surfaces,
The yield for effectively increasing wet process etching technics, reduces production cost.
Preferably, shake point of at least described vibrating device 1 to the vibrating of supporting body 3, the shaker mechanism to supporting body 3
Shi Jinhang.Referring to Fig. 3, it compartment of terrain control supporting body can move within the process time, during this period, can control a position
It sets and carries out the shake up and down of the vibration of vibrating device 1, shaker mechanism, continue to vibrate and shake after then rotating a position, it is this
Motion continuation is spaced to process time completion, enters next step process.
The IC chip wet treater of above-mentioned uniform etching substrate (is made with traditional loading and unloading manipulator device
For supporting body) it is integrated, greatly improve the uniformity of substrate etching, accelerate the speed uniformly etched, change it is semi-automatic and
The traditional function of manipulator, enhances the substrate process such as integrated circuit feasibility and yield in full-automatic wet treatment process equipment.
Referring to Fig. 3, in conjunction with embodiment above-mentioned, a kind of IC chip wet process side of uniform etching substrate of the present invention
Method, using the IC chip wet treater of the uniform etching substrate as described in any one of previous embodiment, the party
Method includes：
The substrate box for being equipped with several substrates is obtained by the supporting body, and substrate box is placed in corresponding etching technics
In slot；
The vibrating device work is controlled, the vibrating device is transmitted vibrational energy by the cylinder attachment structure
Onto the supporting body, to be transferred on the substrate；
The shaker mechanism work is controlled, the shaker mechanism drives the supporting body to pass through the cylinder attachment structure
And opposite up-down vibration, to drive the substrate to shake up and down；
The rotation drive machine work is controlled, the rotation drive machine drives the supporting body to be connected by cylinder
Structure and relatively rotate, to drive the substrate to rotate, to change position of the substrate box in etching technics slot；
Wherein, it controls the vibrating device, the shaker mechanism and the rotation drive machine intermittently to work, and at least
The vibrating device to the vibrating of supporting body, the shaker mechanism is carried out at the same time the shake of supporting body.
The embodiment of the present invention carries the gaily decorated basket with more substrate boxes, is increasing the production of integrated circuit substrate wet process cleaning
While amount, the high uniformity of substrate chemical liquids etching also can guarantee；The pulsed of shaker mechanism is shaken up and down and low frequency shakes
Dynamic device transmits vibration energy to substrate, can increase chemical reaction velocity and its etching homogeneity, and effectively dispel by
The micro-bubble in substrate surface is generated in factors such as chemical reaction, ultrasonic cavitation effects, and these micro-bubbles are to influence
Etch a big main cause of the uniformity.
Facts have proved the method for the present invention and device solve all kinds of substrates of integrated circuit (four in chemical element table, five classes
Element) more substrate multi-disc boxes the difficult problem of etching homogeneity control, greatly improve more substrate multi-disc boxes etching substrate surfaces
Etching homogeneity, effectively increase the yield of wet process etching technics, reduce production cost, and it is one simple again
And apparatus and method easy to spread.This method and apparatus can also be used for flat-panel monitor substrate, solar cell substrates
Etc. in the equipment of wet treatment process.
Although the present invention is disclosed as above with preferred embodiment, it is not for limiting claim, any this field
Technical staff without departing from the spirit and scope of the present invention, can make possible variation and modification, therefore the present invention
Protection domain should be subject to the range that the claims in the present invention are defined.
Claims (11)
1. a kind of IC chip wet treater of uniform etching substrate, which is characterized in that including：Vibrating device, carrying
Body, rotation drive machine, shaker mechanism and cylinder attachment structure；
Supporting body is by the cylinder attachment structure carry on vibrating device；The cylinder attachment structure includes being set to
First cylinder of the lower end of the vibrating device, be set to the supporting body upper end the second cylinder, it is described second circle
Cylinder is rotatably connected on first cylinder and second cylinder can the relatively described first cylinder up and down motion；
The rotation drive machine connects the supporting body, to drive supporting body phase by the cylinder attachment structure by
The vibrating device is rotated；The shaker mechanism connects the supporting body, to drive the supporting body to pass through the cylinder
Connection structure and the relatively described vibrating device are shaken up and down, and the range of the supporting body shaken up and down is less than or equal to described the
Two cylinders can first cylinder moves up and down relatively range.
2. the IC chip wet treater of uniformly etching substrate as described in claim 1, which is characterized in that described the
One cylinder is the exterior circular column with hollow space, and second cylinder is the internal diameter of outer diameter and first cylinder
The inner cylinder matched；
First cylinder has upper stopper and lower stopper；Second cylinder is set to the hollow of first cylinder
In space, and the range that opposite can be moved up and down and be moved up and down by the upper stopper and the limitation of lower stopper；The supporting body is worn
It crosses the lower stopper and is connect with second cylinder.
3. the IC chip wet treater of uniformly etching substrate as described in claim 1, which is characterized in that described turn
Dynamic transmission mechanism and the supporting body are both connected on the shaker mechanism, are shaken together under the action of the shaker mechanism.
4. the IC chip wet treater of uniformly etching substrate as claimed in claim 3, which is characterized in that described to tremble
Motivation structure includes：Cam mechanism, supporting table, guide frame and servo motor；
The rotation drive machine and the supporting body are all connected on the supporting table；The cam mechanism connects the support
Platform；Cam mechanism described in the Serve Motor Control moves so that supporting table described in the cam mechanism driving is shaken up and down.
5. the IC chip wet treater of uniformly etching substrate as claimed in claim 4, which is characterized in that described to lead
It is at least two guide posts being arranged in the supporting table to structure.
6. the IC chip wet treater of uniformly etching substrate as claimed in claim 3, which is characterized in that described turn
On the supporting table by a lifting seat connection, the height of the lifting seat makes the rotation drive machine to dynamic transmission mechanism
It is located within the scope of the following distance of the cylinder attachment structure with the position of supporting body rotation connection.
7. the IC chip wet treater of uniformly etching substrate as claimed in claim 4, which is characterized in that described to tremble
Motivation structure is shaken under the control of the crescendo pulse generated by Serve Motor Control cam mechanism.
8. the IC chip wet treater of uniformly etching substrate as described in claim 1, which is characterized in that further include
Elevating mechanism,
The vibrating device, rotation drive machine, shaker mechanism are both connected on the elevating mechanism, in the elevating mechanism
It is lifted together under control.
9. the IC chip wet treater of uniformly etching substrate as described in claim 1, which is characterized in that described to hold
The lower end of carrier is provided with several hooks, and the substrate box of several substrates can be housed to be respectively used to carry.
10. the IC chip wet treater of uniformly etching substrate as claimed in claim 9, which is characterized in that at least
The vibrating device carries out the shake timesharing of supporting body the vibrating of supporting body, the shaker mechanism.
11. a kind of IC chip wet processing methods of uniform etching substrate, which is characterized in that use such as claim 1-6,
The IC chip wet treater of uniform etching substrate described in any one of 8-10, this method include：
The substrate box for being equipped with several substrates is obtained by the supporting body, and substrate box is placed in corresponding etching technics slot
It is interior；
The vibrating device work is controlled, vibrational energy is transferred to institute by the vibrating device by the cylinder attachment structure
It states on supporting body, to be transferred on the substrate；
The shaker mechanism work is controlled, the shaker mechanism drives supporting body phase by the cylinder attachment structure
To shaking up and down, to drive the substrate to shake up and down；
The rotation drive machine work is controlled, the rotation drive machine drives the supporting body to pass through cylinder attachment structure
And relatively rotate, to drive the substrate to rotate, to change position of the substrate box in etching technics slot；
Wherein, the vibrating device, the shaker mechanism and the rotation drive machine is controlled intermittently to work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810288503.1A CN108281372B (en) | 2018-03-30 | 2018-03-30 | Integrated circuit chip wet processing device and method for uniformly etching substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810288503.1A CN108281372B (en) | 2018-03-30 | 2018-03-30 | Integrated circuit chip wet processing device and method for uniformly etching substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108281372A true CN108281372A (en) | 2018-07-13 |
| CN108281372B CN108281372B (en) | 2023-04-28 |
Family
ID=62811124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810288503.1A Active CN108281372B (en) | 2018-03-30 | 2018-03-30 | Integrated circuit chip wet processing device and method for uniformly etching substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108281372B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931401A (en) * | 2020-01-02 | 2020-03-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box rotating device and wafer box rotating and lifting equipment |
| CN111495858A (en) * | 2020-04-26 | 2020-08-07 | 上海思恩装备科技股份有限公司 | Cleaning method and device for special-shaped component |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10229066A (en) * | 1997-02-14 | 1998-08-25 | Canon Inc | Wafer processor and method thereof, wafer-carrying robot, manufacture of semiconductor substrate, and semiconductor manufacture device |
| US5868898A (en) * | 1996-11-21 | 1999-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fluid dispensing device for wet chemical process tank and method of using |
| US20040152319A1 (en) * | 2002-12-25 | 2004-08-05 | Canon Kabushiki Kaisha | Processing apparatus for processing substrate by process solution |
| KR20050094719A (en) * | 2004-03-24 | 2005-09-28 | (주)울텍 | The apparatus for wet etching |
| US20050241760A1 (en) * | 2004-04-30 | 2005-11-03 | Innolux Display Corp. | Wet etching system |
| CN101924031A (en) * | 2009-06-16 | 2010-12-22 | 倪党生 | System and method for treating substrate by using nano vaporific chemical agent |
| US20130062015A1 (en) * | 2011-09-09 | 2013-03-14 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Wet etching apparatus and method |
| WO2013033932A1 (en) * | 2011-09-09 | 2013-03-14 | 深圳市华星光电技术有限公司 | Wet etching device and method |
-
2018
- 2018-03-30 CN CN201810288503.1A patent/CN108281372B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5868898A (en) * | 1996-11-21 | 1999-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fluid dispensing device for wet chemical process tank and method of using |
| JPH10229066A (en) * | 1997-02-14 | 1998-08-25 | Canon Inc | Wafer processor and method thereof, wafer-carrying robot, manufacture of semiconductor substrate, and semiconductor manufacture device |
| US20040152319A1 (en) * | 2002-12-25 | 2004-08-05 | Canon Kabushiki Kaisha | Processing apparatus for processing substrate by process solution |
| KR20050094719A (en) * | 2004-03-24 | 2005-09-28 | (주)울텍 | The apparatus for wet etching |
| US20050241760A1 (en) * | 2004-04-30 | 2005-11-03 | Innolux Display Corp. | Wet etching system |
| CN101924031A (en) * | 2009-06-16 | 2010-12-22 | 倪党生 | System and method for treating substrate by using nano vaporific chemical agent |
| US20130062015A1 (en) * | 2011-09-09 | 2013-03-14 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Wet etching apparatus and method |
| WO2013033932A1 (en) * | 2011-09-09 | 2013-03-14 | 深圳市华星光电技术有限公司 | Wet etching device and method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931401A (en) * | 2020-01-02 | 2020-03-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box rotating device and wafer box rotating and lifting equipment |
| CN110931401B (en) * | 2020-01-02 | 2022-06-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box rotating device and wafer box rotating and lifting equipment |
| CN111495858A (en) * | 2020-04-26 | 2020-08-07 | 上海思恩装备科技股份有限公司 | Cleaning method and device for special-shaped component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108281372B (en) | 2023-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105195465B (en) | A kind of ultrasonic wave mega sonic wave combination frequency full-automatic optical element cleaning device | |
| KR100772469B1 (en) | Substrate cleaning method, substrate cleaning apparatus and computer-readable recording medium | |
| JP5449953B2 (en) | Substrate processing apparatus and substrate processing method | |
| JP2008091364A (en) | Method and equipment for processing substrate | |
| CN108281372A (en) | The uniformly IC chip wet treater and method of etching substrate | |
| KR20150082303A (en) | Wafer rotation apparatus and method for rotating wafer | |
| CN207993821U (en) | The uniformly IC chip wet treater of etching substrate | |
| CN102496591A (en) | Wafer cleaning device and cleaning method | |
| JP2009049432A (en) | Brush washing apparatus and brush washing method | |
| KR20100054559A (en) | Substrate cleaning method | |
| JP4080584B2 (en) | Cleaning processing equipment | |
| CN207966956U (en) | IC chip wet treater | |
| JP2000173906A (en) | Developing solution feeding method and developing device | |
| JP3808709B2 (en) | Substrate processing equipment | |
| KR20150096052A (en) | Wafer cleaning apparatus | |
| JP2009088227A (en) | Processing apparatus and processing method for substrate | |
| JP4268237B2 (en) | Brush cleaning device | |
| JP4047406B2 (en) | Cleaning processing equipment | |
| JP4955586B2 (en) | Substrate cleaning apparatus and substrate cleaning method | |
| KR20100059549A (en) | Substrate supporting member, substrate processing apparatus having the same and method of processing substrate using the same | |
| KR101927919B1 (en) | Substrate treating apparatus and substrate treating method | |
| KR100868364B1 (en) | Apparatus for generating supersonic and apparatus for cleaning a substrate having the same | |
| JP2916409B2 (en) | Spin cleaning method and apparatus therefor | |
| KR20150068761A (en) | Apparatus for treating substrate | |
| JPH0382778A (en) | Etching device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 201611-1, floor 1, building 2, No. 100, Lane 9, sanbang Road, Songjiang District, Shanghai Applicant after: Shanghai si'en Equipment Technology Co.,Ltd. Address before: 201611-1, floor 1, building 2, No. 100, Lane 9, sanbang Road, Songjiang District, Shanghai Applicant before: SHANGHAI SIEN EQUIPMENT TECHNOLOGY CO.,LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |