CN108260325B - Water-cooling heat dissipation device - Google Patents
Water-cooling heat dissipation device Download PDFInfo
- Publication number
- CN108260325B CN108260325B CN201711258598.4A CN201711258598A CN108260325B CN 108260325 B CN108260325 B CN 108260325B CN 201711258598 A CN201711258598 A CN 201711258598A CN 108260325 B CN108260325 B CN 108260325B
- Authority
- CN
- China
- Prior art keywords
- shell
- water
- radiator
- heat dissipation
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 230000005855 radiation Effects 0.000 claims abstract description 33
- 239000000110 cooling liquid Substances 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 238000005192 partition Methods 0.000 claims description 21
- 238000000926 separation method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to a water-cooling heat dissipation device, which comprises a main heat dissipation body and a heat dissipation head arranged at the upper end face of the main heat dissipation body, wherein the main heat dissipation body comprises a cavity main shell and a first cold plate sealed at the upper end opening of the main shell, and an S-shaped flow channel for cooling liquid to circulate is arranged in the main shell; a plurality of gaps are formed on the surface of the cold plate, a semi-sealing groove is formed in the gaps, and a radiating head capable of extending out is arranged in the semi-sealing groove; the heat radiation head comprises a heat radiation head shell with a cavity and a second cold plate sealed at the upper port of the heat radiation head shell, and an S-shaped heat radiation head runner for cooling liquid circulation is also arranged in the heat radiation head shell; the heat radiation head runner is communicated with the runner through a water inlet pipe. According to the heat dissipation device, the main heat dissipation body conducts range heat dissipation on the device, and the heat dissipation head conducts local secondary heat dissipation, so that the overall heat dissipation effect is better. The device has reasonable structure, can effectively reduce the temperature of the device and can be flexibly adjusted according to different devices.
Description
Technical Field
The application relates to a water cooling device.
Background
With the increase of power of electronic components and semiconductor devices, the power consumption density of electronic devices is increased, and the heat productivity of these electronic components and semiconductor devices is also increased greatly. In order to reduce the heat generated by electronic components and semiconductor assemblies in electronic devices and maintain a stable operating temperature, a cooling device must be used. The cooling device of the traditional electronic equipment comprises a heat radiating piece and a fan, wherein the heat radiating piece is provided with a plurality of heat radiating fins and is directly contacted with the heating part of the electronic element, and the fan is arranged at the upper part of the heat radiating fins and is used for absorbing heat on the heat radiating fins.
With further increases in power of electronic devices, the cooling requirements of today's electronic devices cannot be met by air cooling alone. In order to solve the problem in the prior art, a water cooling system is presented. The existing water cooling system mainly comprises a water cooling head and a water flow passage, wherein the water cooling head is directly attached to the heating component to absorb heat generated by the heating component, and the water flow passage is communicated with the water cooling head and takes away the heat through heat exchange of working fluid, so that the purpose of cooling is achieved.
However, the water cooling system in the prior art cannot radiate heat to the key heating parts, and only can radiate heat in a large area, so that the volume is large, and the water cooling system is inflexible and convenient to use for electric appliances.
Disclosure of Invention
The application aims to provide a water cooling device which can realize regional heat dissipation and can perform secondary heat dissipation on important heating parts.
The application is realized in such a way that: the water cooling device comprises a main radiator and a radiator head arranged at the upper end face of the main radiator, the main radiator comprises a cavity main shell and a first cold plate covered at the upper end opening of the main shell, and an S-shaped flow channel for cooling liquid to circulate is arranged in the main shell; a plurality of gaps are formed on the surface of the cold plate, a semi-sealing groove is formed in the gaps, and a radiating head capable of extending out is arranged in the semi-sealing groove; the heat radiation head comprises a heat radiation head shell with a cavity and a second cold plate sealed at the upper port of the heat radiation head shell, and an S-shaped heat radiation head runner for cooling liquid circulation is also arranged in the heat radiation head shell; the heat radiation head runner is communicated with the runner through a water inlet pipe.
A first partition plate is arranged in the center of the main shell, the main shell is divided into a left cavity and a right cavity, partition plates are alternately arranged in each cavity, and the first partition plate, the partition plates, the left main shell and the left cold plate form a left flow channel together; the first separation plate, the right main shell and the right cold plate jointly form a right flow channel; water valves are arranged at the water inlet ends of the flow channels on the left side and the right side, and are communicated with a water inlet arranged at the main shell.
The water outlet ends of the left and right flow channels are communicated with a water return channel arranged outside the main shell, the water return channel is communicated with the cooling liquid collecting device through a pipeline, and the recovered cooling liquid can be recycled after being radiated by the radiating device
The radiator comprises a cavity radiator shell inserted into the semi-sealing groove, a second cold plate is covered at the upper port of the radiator shell, partition plates are distributed in the radiator shell in a staggered manner, and the second cold plate, the partition plates and the radiator shell form a radiator runner together; the water inlet end of the heat radiation head runner is communicated with the water inlet pipe.
The water outlet end of the radiator flow channel is communicated with a radiator return water channel arranged outside the radiator shell, and the radiator return water channel is communicated with the return water channel through a pipeline.
The telescopic rod is arranged on the bottom surface of the heat dissipation head shell and inserted into the base arranged at the bottom of the semi-sealing groove, and the spring is arranged between the bottom surface of the heat dissipation head shell and the bottom surface of the semi-sealing groove.
The upper end of the heat radiation head is covered with a pressing plate, and the pressing plate is fixedly connected with the first cold plate through a bolt.
Due to the fact that the technical scheme is implemented, the range heat dissipation is carried out on the equipment through the main heat dissipation body, and the local secondary heat dissipation is carried out through the heat dissipation head, so that the overall heat dissipation effect is better. The device has reasonable structure, can effectively reduce the temperature of the device and can be flexibly adjusted according to different devices.
Drawings
The specific structure of the present application is given by the following figures and examples:
FIG. 1 is a schematic cross-sectional view of the present application;
FIG. 2 is a schematic structural view of a heat dissipating head of the present application;
FIG. 3 is a schematic view of a heat sink in the present application when ejected;
FIG. 4 is a schematic view of the internal flow path layout structure of the present application;
fig. 5 is a schematic view of an internal flow path layout mechanism of the heat dissipating head of the present application.
Legend: 1. the heat dissipation head comprises a heat dissipation head, a first cold plate, a water inlet, a first partition plate, a flow passage, a main shell, a pressing plate, bolts, a second cold plate, a heat dissipation head shell, a heat dissipation head flow passage, a heat dissipation head water return passage, a telescopic rod, a base, a water inlet pipe, a spring and a water return passage.
Detailed Description
The present application is not limited by the following examples, and specific embodiments may be determined according to technical solutions and practical situations of the present application.
As shown in fig. 1-5, the water cooling heat dissipation device comprises a main heat dissipation body and a heat dissipation head 1 arranged at the upper end surface of the main heat dissipation body, wherein the main heat dissipation body comprises a cavity main shell 6 and a first cold plate 2 sealed at the upper end port of the main shell 6, and an S-shaped flow channel 5 for cooling liquid circulation is arranged in the main shell 6; a plurality of gaps are formed on the surface of the cold plate 2, a semi-sealing groove is formed in the gaps, and a radiating head 1 capable of extending out is arranged in the semi-sealing groove; the heat radiation head 1 comprises a heat radiation head shell 10 with a cavity and a second cold plate 9 sealed at the upper port of the heat radiation head shell 10, and an S-shaped heat radiation head runner 10-1 for cooling liquid circulation is also arranged in the heat radiation head shell 10; the heat radiation head runner 10-1 is communicated with the runner 5 through a water inlet pipe 13.
As shown in fig. 4, a first partition plate 4 is further arranged at the center of the main casing 6 to divide the interior of the main casing 6 into a left cavity and a right cavity, partition plates are alternately arranged in each cavity, and the first partition plate 4, the partition plates, the left main casing 6 and the left cold plate 2 together form a left flow channel 5; the first partition plate 4, the partition plate, the right main shell 6 and the right cold plate 2 together form a right flow channel 5; water valves are arranged at the water inlet ends of the flow channels 5 on the left side and the right side, and are communicated with a water inlet arranged at the main shell 6.
Further, when the size of the application is large and the application needs to be additionally arranged on large equipment, the water outlet ends of the flow channels 5 on the left side and the right side are communicated with the water return channel 15 arranged on the outer side of the main shell 6, the water return channel 15 is communicated with the cooling liquid collecting device through a pipeline, and the recovered cooling liquid can be recycled after being radiated by the radiating device. The cooling liquid collecting device and the heat dissipating device are in the prior art, for example: the cooling liquid collecting device may be a water storage tank, and the heat dissipating device may be a cooling tower, and are not the points of the present invention, so the specific structure thereof is not described in detail herein.
As shown in fig. 5, further, the heat dissipating head 1 includes a cavity heat dissipating head housing 10 inserted into the semi-sealed groove, a second cold plate 9 is capped at an upper port of the heat dissipating head housing 10, and partition plates are alternately arranged in the heat dissipating head housing 10, and the second cold plate 9, the partition plates and the heat dissipating head housing 10 together form a heat dissipating head flow channel 10-1; the water inlet end of the heat radiation head runner 10-1 is communicated with the water inlet pipe 13, the water outlet end of the heat radiation head runner 10-1 is communicated with the heat radiation head water return channel 10-2 arranged on the outer side of the heat radiation head shell 10, and the heat radiation head water return channel 10-2 is communicated with the water return channel 15 through a pipeline.
As shown in fig. 3, a telescopic rod 11 is mounted on the bottom surface of the heat dissipating head case 10, the telescopic rod 11 is inserted into a base 12 provided at the bottom of the semi-seal groove, and a spring 14 is provided between the bottom surface of the heat dissipating head case 10 and the bottom surface of the semi-seal groove.
As shown in fig. 2, when the heat dissipating head 1 is not needed, the upper end of the heat dissipating head 1 is covered with the pressing plate 7, and the pressing plate 7 is fixedly connected with the first cold plate 2 through the bolts 8.
Before use, a gap is formed according to the part to be cooled, a heat dissipation head 1 is arranged, the heat dissipation head 1 which is not required to be used is covered by a pressing plate 7, the pressing plate 7 is removed by the heat dissipation head 1 which is required to be used, and the heat dissipation head 1 is pushed by a spring 14 to be naturally ejected out so as to be attached to a part to be cooled; whereas the first cold plate 2 on the main housing 6 of the present application serves as the main cooling for a wide range of cooling of the device.
When the heat radiator is used on small-sized equipment, the heat radiator can be directly used as a bottom plate of the small-sized equipment, and the first cold plate 2 and the second cold plate 9 on the heat radiator 1 jointly radiate heat. After the main radiator and the heat radiating head 1 are filled with the cooling liquid, the water valve is closed, and the cooling can be completed by the cooling liquid which is reserved in the main radiator and the heat radiating head 1.
When using on large-scale equipment, laminate first cold plate 2 in large-scale equipment's main part to laminate radiating head 1 in main position that generates heat, the play water end department of runner 5 this moment communicates with return water channel 15 that sets up in the main casing 6 outside, and return water channel 15 switches on with coolant liquid collection device through the pipeline, and the coolant liquid accessible heat abstractor after retrieving recycles.
The technical characteristics form the optimal embodiment of the application, have stronger adaptability and optimal implementation effect, and can increase or decrease unnecessary technical characteristics according to actual needs so as to meet the needs of different situations.
Claims (5)
1. The utility model provides a water-cooling heat abstractor which characterized in that: the cooling device comprises a main radiator and a radiator head arranged at the upper end face of the main radiator, wherein the main radiator comprises a cavity main shell and a first cold plate sealed at the upper end opening of the main shell, and an S-shaped flow passage for cooling liquid to circulate is arranged in the main shell; a plurality of gaps are formed on the surface of the cold plate, a semi-sealing groove is formed in the gaps, and a radiating head capable of extending out is arranged in the semi-sealing groove; the heat radiation head comprises a heat radiation head shell with a cavity and a second cold plate sealed at the upper port of the heat radiation head shell, and an S-shaped heat radiation head runner for cooling liquid circulation is also arranged in the heat radiation head shell; the heat radiation head flow channel is communicated with the flow channel through a water inlet pipe;
a first partition plate is arranged in the center of the main shell, the main shell is divided into a left cavity and a right cavity, partition plates are alternately arranged in each cavity, and the first partition plate, the partition plates, the left main shell and the left cold plate form a left flow channel together; the first separation plate, the right main shell and the right cold plate jointly form a right flow channel; water valves are arranged at the water inlet ends of the flow channels on the left side and the right side, and are communicated with a water inlet arranged at the main shell;
the upper end of the heat radiation head is covered with a pressing plate, and the pressing plate is fixedly connected with the first cold plate through a bolt.
2. The water-cooled heat sink of claim 1, wherein: the water outlet ends of the left and right flow channels are communicated with a water return channel arranged outside the main shell, the water return channel is communicated with the cooling liquid collecting device through a pipeline, and the recovered cooling liquid can be recycled after being radiated by the radiating device.
3. The water-cooled heat sink according to claim 1 or 2, characterized in that: the radiator comprises a cavity radiator shell inserted into the semi-sealing groove, a second cold plate is covered at the upper port of the radiator shell, partition plates are distributed in the radiator shell in a staggered manner, and the second cold plate, the partition plates and the radiator shell form a radiator runner together; the water inlet end of the heat radiation head runner is communicated with the water inlet pipe.
4. A water cooled heat sink as claimed in claim 3, wherein: the water outlet end of the radiator flow channel is communicated with a radiator return water channel arranged outside the radiator shell, and the radiator return water channel is communicated with the return water channel through a pipeline.
5. A water cooled heat sink as claimed in claim 3, wherein: the telescopic rod is arranged on the bottom surface of the heat dissipation head shell and inserted into the base arranged at the bottom of the semi-sealing groove, and the spring is arranged between the bottom surface of the heat dissipation head shell and the bottom surface of the semi-sealing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711258598.4A CN108260325B (en) | 2017-12-04 | 2017-12-04 | Water-cooling heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711258598.4A CN108260325B (en) | 2017-12-04 | 2017-12-04 | Water-cooling heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108260325A CN108260325A (en) | 2018-07-06 |
| CN108260325B true CN108260325B (en) | 2024-02-06 |
Family
ID=62721693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711258598.4A Active CN108260325B (en) | 2017-12-04 | 2017-12-04 | Water-cooling heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108260325B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5862038A (en) * | 1996-08-27 | 1999-01-19 | Fujitsu Limited | Cooling device for mounting module |
| CN201252706Y (en) * | 2008-07-30 | 2009-06-03 | 中国北车集团大连机车研究所有限公司 | Plate-type water radiator |
| CN204634078U (en) * | 2015-06-02 | 2015-09-09 | 岳阳大力神电磁机械有限公司 | A kind of Novel clamp shell type water cooled coil |
| CN107094364A (en) * | 2017-07-05 | 2017-08-25 | 合肥思博特软件开发有限公司 | A kind of electronic equipment modular water cooling and radiation device |
| CN206686504U (en) * | 2017-03-28 | 2017-11-28 | 深圳市迈安热控科技有限公司 | Heat pipe water-cooling heat radiating device |
| CN207692257U (en) * | 2017-12-04 | 2018-08-03 | 国网新疆电力公司吐鲁番供电公司 | Water-cooling heat radiating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6695042B1 (en) * | 2002-07-31 | 2004-02-24 | Hewlett-Packard Development Company, L.P. | Adjustable pedestal thermal interface |
-
2017
- 2017-12-04 CN CN201711258598.4A patent/CN108260325B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5862038A (en) * | 1996-08-27 | 1999-01-19 | Fujitsu Limited | Cooling device for mounting module |
| CN201252706Y (en) * | 2008-07-30 | 2009-06-03 | 中国北车集团大连机车研究所有限公司 | Plate-type water radiator |
| CN204634078U (en) * | 2015-06-02 | 2015-09-09 | 岳阳大力神电磁机械有限公司 | A kind of Novel clamp shell type water cooled coil |
| CN206686504U (en) * | 2017-03-28 | 2017-11-28 | 深圳市迈安热控科技有限公司 | Heat pipe water-cooling heat radiating device |
| CN107094364A (en) * | 2017-07-05 | 2017-08-25 | 合肥思博特软件开发有限公司 | A kind of electronic equipment modular water cooling and radiation device |
| CN207692257U (en) * | 2017-12-04 | 2018-08-03 | 国网新疆电力公司吐鲁番供电公司 | Water-cooling heat radiating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108260325A (en) | 2018-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202816913U (en) | Microchannel liquid-cooled heat sink device | |
| WO2019154083A1 (en) | Liquid cooling pipeline and power supply apparatus | |
| CN208256773U (en) | Liquid-cooling plate type battery modules | |
| CN206118294U (en) | Waterproof heat radiation structure of small -size phased array radar | |
| CN206533676U (en) | A kind of UPS water-filled radiators | |
| CN208189576U (en) | Electronic power components liquid cooling heat radiator device and motor controller of new energy automobile | |
| CN207530085U (en) | A kind of water-filled radiator shell of new energy car battery | |
| CN110278699A (en) | A kind of smart phone liquid-cooling heat radiator | |
| CN207602730U (en) | Water-cooled module | |
| CN108260325B (en) | Water-cooling heat dissipation device | |
| KR102256906B1 (en) | Cold plate assembly for electrical cabinet | |
| CN201069768Y (en) | Device for water cooling/oil cooling computer CPU heat radiation system | |
| CN207399733U (en) | Frivolous cold plate radiator structure | |
| CN113555190B (en) | Inductor and electrical apparatus box assisting in heat dissipation of electronic component | |
| CN103179843B (en) | A kind of radiator structure of high power density variable-frequency converter | |
| CN212970511U (en) | Electrical equipment applying heat dissipation device | |
| CN207692257U (en) | Water-cooling heat radiating device | |
| CN209929439U (en) | Power battery water-cooling module assembly | |
| CN210900093U (en) | Fin radiator | |
| CN210454525U (en) | Three-dimensional radiator and vehicle-mounted power supply | |
| CN113593616A (en) | Heat dissipation device for memory | |
| CN210089192U (en) | Water-cooled condensing device for new energy automobile | |
| CN106847584B (en) | Heat dissipation device for ferrite switch | |
| CN207476101U (en) | It is a kind of to integrate water cooling and air-cooled radiator | |
| CN208063669U (en) | A kind of integrated heat spreader of the vehicle-mounted field operation intelligent Power Station of military vehicle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |