CN108260290A - SMD apparatus detaching devices based on reflow soldering - Google Patents
SMD apparatus detaching devices based on reflow soldering Download PDFInfo
- Publication number
- CN108260290A CN108260290A CN201810172614.6A CN201810172614A CN108260290A CN 108260290 A CN108260290 A CN 108260290A CN 201810172614 A CN201810172614 A CN 201810172614A CN 108260290 A CN108260290 A CN 108260290A
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- China
- Prior art keywords
- smd
- hollow out
- out metal
- metal platform
- devices
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of SMD apparatus detaching devices based on reflow soldering, including a housing (6), a hollow out metal platform (4) is set in the housing (6), the hollow out metal platform (4) is equipped with pcb board fixing device, the hollow out metal platform (4) connects the upper lower inner surface of housing (6) by several springs (2), the fastener of mutual cooperation is respectively equipped between the housing (6) and the hollow out metal platform (4), the hollow out metal platform (4) be subject in pressed status in the position of the fastener, the fastener is connect with the mechanical timer (1) of control fastener release.There is simple device structure, small, low cost, convenient disassembly.
Description
Technical field
The present invention relates to electronic component ancillary equipment fields, and in particular to a kind of SMD devices based on reflow soldering are torn open
Handler.
Background technology
Since information age, each class of electronic devices based on electronic component quickly increases, from mobile phone, computer, family
Electrical appliance is to automobile, aerospace, military issue weapons system etc., as long as electronic equipment, just be unable to do without the presence of electronic component.
Quick increased electronic equipment results in the generation of a large amount of electron wastes simultaneously, contains an a large amount of huge sum of moneys in these electron wastes
Category and toxic material, such as lead, bromine, benzene, cadmium if directly discarding or dealing with improperly, can all make air, soil and groundwater
Into serious pollution, huge hidden danger is brought to human kind sustainable development.
Therefore there is an urgent need for carry out scientifically and rationally recycling to electron wastes.It is discarded in view of most of electronic equipment
The reason of be to update, can not realize that specific function, rehabilitation cost are big etc., and the electronic component function that remains unchanged in part is intact,
This part electronic component dismantle-shaping-test after still can use, the aviation boat particularly with high value
My god, the electronic component in military issue weapons field.
Electronic component has different packing forms, wherein surface mount device (SMD, Surface Mount Device)
Including small outline packages SOP (Small Outline Package), four-armed olfactometer QFP (Quad Flat Package),
BGA Package BGA (Ball Grid Array Package), ceramic package BGA
(Caramic BGA) etc. is most commonly used device in current Electronic Design.SMD devices have packing density it is high,
Device volume is small, light-weight, and 1/10 or so of the generally only traditional inserting element of volume and weight of SMD devices, generally use
After SMD devices, electronic product volume-diminished 40%-60%, weight saving 60%-80%.
SMD devices have compared to DIP devices and are readily disassembled simultaneously, are easy to the features such as shaping reuses.Small lot is torn open
Generally using removing by hand when unloading SMD chips, batch integral demounting lacks the device being simple and efficient.
Invention content
In view of this, it is a primary object of the present invention to provide a kind of SMD apparatus detaching devices based on reflow soldering, with
Phase solves at least one of above-mentioned the technical issues of referring to.
To achieve the above object, technical scheme is as follows：
As one aspect of the present invention, a kind of SMD apparatus detaching devices based on reflow soldering are provided, including a shell
Body, a hollow out metal platform is set in the housing, and the hollow out metal platform is equipped with pcb board fixing device, the hollow out metal platform
Four angles the upper lower inner surface of housing is connected by spring, the opposite flank of the housing and the hollow out metal platform is respectively
Fastener equipped with mutual cooperation, the position of the fastener are subject to the hollow out metal platform and are in pressed status, the card
Fastener is connect with the mechanical timer of control fastener release.
Preferably, the pcb board fixing device is two adjustable spills in position being set on the hollow out metal platform
Card slot.
Preferably, the concave card slot is fixed on by adjusting screw on the hollow out metal platform.
Preferably, the fastener includes being fixed on the bolt in the case inside face and is set to the hollow out gold
Belong to the pilot hole of platform lateral surface.
Preferably, the mechanical timer includes clockwork spring releasing parts and is controlled by the clockwork spring releasing parts to rotate
Graduated time ring, one end of the bolt passes through housing by spring compression on the graduated time ring, and the time carves
One limiting slot is set on scale, and the bolt slips into the limiting slot after graduated time ring turns over an angle.
Preferably, an accommodating box being placed in below the hollow out metal platform is further included.
As another aspect of the present invention, provide a kind of using SMD apparatus detaching devices as described above progress SMD devices
The method of dismounting, includes the following steps：
Step 1：PCB modules are fixed in SMD apparatus detaching devices, make the hollow out metal in SMD apparatus detaching devices
Platform is in pressed status, and mechanical timer is set to start timing；
Step 2：The SMD apparatus detaching devices are heated to melt to for fixing the tinol of SMD devices；
Step 3：Hollow out metal platform is released after timing, and the SMD devices are in its own gravity and hollow out metal platform
Shock effect under detached from PCB modules.
Preferably, in step 2, the SMD devices is placed in reflow soldering and are heated.
Preferably, the SMD devices are transmitted by the conveyer belt of reflow soldering to the high-temperature region of reflow soldering, and will
The timing end time of mechanical timer is set as the time that the SMD devices reach high-temperature region.
Compared with prior art, the beneficial effects of the present invention are：
SMD apparatus detaching devices provided by the invention are used cooperatively with normal reflux brazier, utilize the temperature in reflow soldering
Area makes the solder(ing) paste in the SMD apparatus detaching devices on pcb board reach molten condition, when being discharged afterwards using device inner spring
Its own gravity of active force and SMD devices makes the SMD devices be detached from pcb board, completes disassembly process.With equipment knot
The features such as structure is simple, small, low cost, convenient disassembly.
Description of the drawings
Fig. 1 is the SMD apparatus detaching device structure diagrams of one embodiment of the invention；
Fig. 2 is hollow out metal platform and groove structure schematic diagram in Fig. 1；
Fig. 3 is the structure diagram of the mechanical timer of one embodiment of the invention；
Fig. 4 is the mechanical timer of one embodiment of the invention and the attachment structure schematic diagram of bolt；
Fig. 5 is the mechanical timer of Fig. 4 and the use reference chart of bolt.
Wherein：
1- mechanical timers；
101- push rods；102- first time dials；103- timings identify；
104- springs；105- clockwork spring releasing parts；The second graduated time rings of 106-；
2- springs；
3- bolts；
4- hollow out metal platforms；
401- card slots；
5- concave card slots；
501- adjusting screws；
6- housings；
7- accommodating boxes.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in further detail.
The SMD apparatus detaching devices of one embodiment of the invention include the mechanical timer 1, four in housing 6 and housing 6
Group spring 2, bolt 3, hollow out metal platform 4, concave card slot 5, housing 6 and accommodating box 7.
Hollow out metal platform and groove structure schematic diagram are illustrated in figure 2, is set on hollow out metal platform 4 there are two concave card slot 5
To fix pcb board, the distance between two concave card slots 5 can be adjusted by adjusting screw 501, with the various sizes of PCB of fixation
Plate.
As shown in Figure 1, the top and bottom at four angles of hollow out metal platform 4 connect the Nei Biao up and down of housing 6 by four groups of springs 2
Face.The opposite flank of housing 6 and hollow out metal platform 4 is respectively equipped with the fastener to cooperate, the position of the fastener with
The hollow out metal platform 4 is in subject to pressed status, and the fastener and the mechanical timer 1 of control fastener release connect
It connects.
In a preferred embodiment, the fastener includes being fixed on the bolt 3 of 6 medial surface of housing and being set to engraving
The pilot hole 401 of empty 4 lateral surface of metal platform.
Mechanical type timing device 1 is connected to control bolt 3 from releasing in pilot hole 401 with bolt 3.Implement one
Example in, the structure of mechanical timer 1 as shown in Figures 3 to 5, the mechanical timer 1 include clockwork spring releasing parts 105,
102 and second graduated time ring of first time dial of rotation is controlled by clockwork spring releasing parts 105.
Wherein, on first time dial 102 there is time scale, timing is set on the housing of mechanical timer 1
Mark 103, on the basis of periodically identifying 103, control first time dial 102 rotates certain time scale and is timed.It inserts
One end of pin 3 is pressed in by spring 104 on the second graduated time ring 106 after passing through housing 6, is set on the second graduated time ring 106
A limiting slot is put, bolt 3 is slipped into after the second graduated time ring 106 turns over an angle in limiting slot.One is also associated on bolt 3
Bolt 3 is released limiting slot by push rod 101 by push rod 101, so that 105 and second graduated time ring 106 of clockwork spring releasing parts
It can rotate.
In a preferred embodiment, accommodating box 7 is set below hollow out metal platform 4, to receive the device fallen from pcb board
Part.
SMD apparatus detaching devices provided by the invention are mainly used in reflow soldering, and normal reflux brazier has multi-temperature zone
Function, different classes of reflow soldering are heated the air of place warm area or nitrogen by different modes, and then by the region temperature
Degree control is in setting value.SMD devices and pcb board by pretreatments such as solder printing, patches are by conveyer belt successively by each
Reflow soldering welding procedure is completed after warm area.Device dismantles the inverse process that can be considered welding, with reference to welding process, based on reflux
Brazier increases appropriate device and integral demounting can be completed.
When dismantling device, two processes are mainly considered：Transmit heating process and external force traction process.
Wherein, heating process is transmitted：Completed using the warm area in reflow soldering, in reflow soldering equipped with conveyer belt with
The rate of setting at the uniform velocity moves ahead, and pcb board to be removed is sent to high-temperature region using conveyer belt so that solder(ing) paste reaches molten
Melt state.The present invention devises a box being adapted with reflow soldering size, and hollow out metal is devised in box
The groove of platform and two adjustable widths on hollow out metal platform, to load and fix pcb board.
External force traction process：When the solder(ing) paste on device reaches molten condition, application external force is needed to make device and pcb board
Separation.In the present embodiment, external force is made of two parts：Active force when its own gravity and the spring release of SMD devices.It places
Four apex angles of the hollow out metal platform of pcb board have the both sides up and down that two springs connect box respectively, while have SMD devices
One side be inverted it is downward.It is put into before reflow soldering, entire hollow out metal platform is pressed downward and is stuck with buckle, and uses mechanical timer
Device is timed, which can discharge buckle in setting time, and hollow out metal platform is in four groups of springs at this time
Under the action of start to shake, SMD devices will detach under the active force of its own gravity and spring from pcb board, and disassembly process is complete
Into.
Specifically, the method that the present embodiment carries out SMD device dismountings using SMD apparatus detaching devices as described above, including
Following steps：
First, adjusting screw 501 and concave card slot 5 shown in Fig. 2 are adjusted to fix PCB modules, there is the one of SMD devices
Face need to place downwards；
Secondly, fixed pressing spring 2 lower later, until the bolt 3 in Fig. 1 is caught in hollow out metal platform 4；
Again, it is set according to the speed of reflow soldering conveyer belt and warm area, sets mechanical timer, and by whole device
It places on the conveyer belt with reflow soldering, timer starts timing；
Finally, when device, which reaches, is suitble to warm area, the solder(ing) paste on device reaches molten condition, at this time mechanical timer
1 lucky timing terminates, and discharges bolt 3, and hollow out metal platform 4 starts vertical tremor under the action of four groups of springs, and device isolation is fallen
Fall in accommodating box 7.
Particular embodiments described above has carried out the purpose of the present invention, technical solution and advantageous effect further in detail
Describe in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the protection of the present invention
Within the scope of.
Claims (10)
- A kind of 1. SMD apparatus detaching devices based on reflow soldering, including a housing (6), which is characterized in that the housing (6) A hollow out metal platform (4) is inside set, the hollow out metal platform (4) is equipped with pcb board fixing device, and the hollow out metal platform (4) is logical The upper lower inner surface of several spring connection housings (6) is crossed, is equipped between the housing (6) and the hollow out metal platform (4) mutual The fastener of cooperation, the fastener, which is set to, makes the position of the hollow out metal platform (4) in pressed status, the fastener It is connect with the mechanical timer (1) of control fastener release.
- 2. SMD apparatus detaching devices according to claim 1, which is characterized in that the springs layout is in hollow out metal platform (4) four are diagonal.
- 3. SMD apparatus detaching devices according to claim 1, which is characterized in that the pcb board fixing device includes setting In two adjustable concave card slots in position (5) on the hollow out metal platform (4).
- 4. SMD apparatus detaching devices according to claim 3, which is characterized in that the concave card slot (5) is by adjusting spiral shell Silk (501) is fixed on the hollow out metal platform (4).
- 5. SMD apparatus detaching devices according to claim 1, which is characterized in that the fastener includes being set to described The bolt (3) of housing (6) and the pilot hole (401) for being set to the hollow out metal platform (4).
- 6. SMD apparatus detaching devices according to claim 5, which is characterized in that the mechanical timer includes clockwork spring Releasing parts (105) and the graduated time ring (106) by the clockwork spring releasing parts (105) control rotation, the bolt (3) One end pass through housing (6) and pass through spring (104) and be pressed on the graduated time ring (106), the graduated time ring (106) limiting slot is set on, and the bolt (3) slips into the limiting slot after graduated time ring (106) turns over an angle.
- 7. SMD apparatus detaching devices according to claim 1, which is characterized in that further include one and be placed in the hollow out metal Accommodating box (7) below platform (4).
- 8. a kind of method for carrying out SMD device dismountings using the SMD apparatus detaching devices as described in claim 1 to 7 any one, It is characterized by comprising the following steps：Step 1：PCB modules are fixed in SMD apparatus detaching devices, are made at the hollow out metal platform in SMD apparatus detaching devices In pressed status, and mechanical timer is set to start timing；Step 2：The SMD apparatus detaching devices are heated to melt to for fixing the tinol of SMD devices；Step 3：Hollow out metal platform is released after timing, and the SMD devices are in the shake of its own gravity and hollow out metal platform Action detaches under from PCB modules.
- 9. according to the method described in claim 8, it is characterized in that, in step 2, the SMD devices are placed in reflow soldering It is heated.
- 10. according to the method described in claim 9, it is characterized in that, the SMD devices are passed by the conveyer belt of reflow soldering It send to the high-temperature region of reflow soldering, and the timing end time of mechanical timer is set as the SMD devices and reaches height The time of warm area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810172614.6A CN108260290B (en) | 2018-03-01 | 2018-03-01 | SMD device dismounting device based on reflow oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810172614.6A CN108260290B (en) | 2018-03-01 | 2018-03-01 | SMD device dismounting device based on reflow oven |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108260290A true CN108260290A (en) | 2018-07-06 |
| CN108260290B CN108260290B (en) | 2020-06-09 |
Family
ID=62744557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810172614.6A Active CN108260290B (en) | 2018-03-01 | 2018-03-01 | SMD device dismounting device based on reflow oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108260290B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109332838A (en) * | 2018-11-29 | 2019-02-15 | 威创集团股份有限公司 | Chip method for dismounting and device |
| WO2021103964A1 (en) * | 2019-11-26 | 2021-06-03 | 惠州市成泰自动化科技有限公司 | Assembly line capable of being opened and closed |
| CN113263236A (en) * | 2021-04-29 | 2021-08-17 | 四川航天燎原科技有限公司 | Pin grid array packaging component PGA desoldering process method |
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| KR20030025346A (en) * | 2001-09-20 | 2003-03-29 | 엘지이노텍 주식회사 | Printed circuit board holder |
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2018
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| CN2323396Y (en) * | 1997-12-02 | 1999-06-09 | 名钟机电工业股份有限公司 | Timing device for mechanical timer |
| KR20030025346A (en) * | 2001-09-20 | 2003-03-29 | 엘지이노텍 주식회사 | Printed circuit board holder |
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Non-Patent Citations (1)
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| K.FELDMAN等: "THE PRINTED CIRCUIT BOARD - A CHALLENGE FOR AUTOMATED DISASSEMBLY AND FOR THE DESIGN OF RECYCLABLE INTERCONNECT DEVICES", 《CLEAN ELECTRONICS PRODUCTS AND TECHNOLOGY》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109332838A (en) * | 2018-11-29 | 2019-02-15 | 威创集团股份有限公司 | Chip method for dismounting and device |
| WO2021103964A1 (en) * | 2019-11-26 | 2021-06-03 | 惠州市成泰自动化科技有限公司 | Assembly line capable of being opened and closed |
| CN113263236A (en) * | 2021-04-29 | 2021-08-17 | 四川航天燎原科技有限公司 | Pin grid array packaging component PGA desoldering process method |
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| Publication number | Publication date |
|---|---|
| CN108260290B (en) | 2020-06-09 |
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