CN108260273A - Network communication device and its electronics module and structure of heat dissipation substrate - Google Patents
Network communication device and its electronics module and structure of heat dissipation substrate Download PDFInfo
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- CN108260273A CN108260273A CN201611246957.XA CN201611246957A CN108260273A CN 108260273 A CN108260273 A CN 108260273A CN 201611246957 A CN201611246957 A CN 201611246957A CN 108260273 A CN108260273 A CN 108260273A
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- Prior art keywords
- heat dissipation
- circuit board
- holes
- region
- electronic component
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Abstract
The present invention discloses a kind of network communication device and its electronics module and structure of heat dissipation substrate.To carry an at least electronic component, wherein structure of heat dissipation substrate includes structure of heat dissipation substrate：One circuit board and at least a heat dissipation element.There is circuit board an at least heat dissipation region and at least bearing area being separated from each other with an at least heat dissipation region, at least an electronic component to be arranged on an at least bearing area, and circuit board has multiple through holes in the range of an at least heat dissipation region.An at least heat dissipation element is arranged in an at least heat dissipation region for circuit board.Whereby, heat is by circuit board at least caused by an electronic component, with conduction to multiple through holes and an at least heat dissipation element.Above-mentioned technical proposal proposed by the present invention can reach better heat dissipation effect.
Description
Technical field
The present invention relates to a kind of network communication device and its electronics module and structure of heat dissipation substrate, can more particularly to one kind
Network communication device hot caused by electronic component and its electronics module and heat dissipation base are transmitted by the through hole of heat dissipation region
Harden structure.
Background technology
In network communication device, network speed, bandwidth and the stability of wireless product are the main demands of user.Cause
This, as the demand to wireless product is increasingly cumulative, also shortens frequently the use of the high-power RF element in wireless product.
Furthermore the popularization of the concept with wisdom life wisdom family, all kinds of household appliances can be mutual by Wi-Fi communication system
Connection, thus, which the functionality being endowed of main integrated circuit certainly will increase.Therefore, in high-power electronic component
Under service condition, the heat dissipation for solving the problems, such as high-power components is need to urgently to solve at present.
The heat sink conception of the general prior art is by additionally imposing radiating gasket on integrated circuit component and fin dissipates
Thermal element is exported thermal energy caused by integrated circuit from radiating gasket or heat dissipation element by way of being in direct contact, with drop
The temperature of low integrated circuit in itself.However, heat sink sizes size is not that certain proportional relation is presented with heat dissipation effect.Change speech
It, for the integrated circuit component in network communication device, if the size of integrated circuit increases, the size of radiating gasket is also therewith
Increasing can cause the transmission distance of thermal energy to increase and generate thermal resistance instead, therefore instead so that the hot gas on circuit board can not be effectively
Thermal energy is shed completely by heat transfer.In addition, the heat dissipation element for making large-size also increases the cost of material.
Invention content
The technical problems to be solved by the invention are, provide in view of the deficiencies of the prior art a kind of network communication device and
Its electronics module and structure of heat dissipation substrate.
In order to solve the technical issues of above-mentioned, a wherein technical solution of the present invention is to provide a kind of heat-radiating substrate
Structure, to carry an at least electronic component, wherein the structure of heat dissipation substrate includes：One circuit board and at least one
Heat dissipation element.
The circuit board has an at least heat dissipation region and is separated from each other at least at least one heat dissipation region
One bearing area, wherein, at least one electronic component is arranged at least one bearing area, and the circuit board has
There are multiple through holes in the range of at least one heat dissipation region.
At least one heat dissipation element is arranged at least one heat dissipation region of the circuit board；Wherein, at least
Heat caused by one electronic component is by the circuit board, to conduct to multiple through holes and at least described in one
Heat dissipation element, and multiple through holes at least one of it is exposed by least one heat dissipation element institute.
Preferably, the structure of heat dissipation substrate still further comprises：An at least radiating gasket and at least a fin type dissipates
Warmware.At least one radiating gasket is arranged at least one electronic component；And at least one fin type radiating piece
It is arranged at least one radiating gasket.
Preferably, the aperture of multiple through holes is between 1mm between 5mm, and multiple through holes are to be at least 5
× 5 matrix arrangement.
Preferably, the inner wall of each through hole and at least one heat dissipation region are formed with heat-conducting metal
Layer.
Preferably, at least one heat dissipation element includes multiple multiple through holes for corresponding to the circuit board respectively
Trepanning.
Preferably, the structure of heat dissipation substrate still further comprises an at least fin type radiating piece, and at least one is described scattered
Thermal element includes extending outwardly to contact an at least bridge connector for at least one fin type radiating piece.
Preferably, the material of at least one heat dissipation element is one of metal, ceramics and graphene three.
In order to solve the technical issues of above-mentioned, another technical solution of the present invention is to provide a kind of electronics module,
It is characterized in that, the electronics module includes：An at least electronic component；An and structure of heat dissipation substrate.
The structure of heat dissipation substrate includes a circuit board and a heat dissipation element；
Wherein, the circuit board has an at least heat dissipation region and is separated from each other at least one heat dissipation region
An at least bearing area, at least one electronic component are arranged at least one bearing area, and the circuit board has
Multiple through holes in the range of at least one heat dissipation region,
And the heat dissipation element is arranged at least one heat dissipation region of the circuit board；Wherein, at least one institute
Heat caused by electronic component is stated by the circuit board, with conduction to multiple through holes and at least one heat dissipation
Element, and multiple through holes at least one of it is exposed by least one heat dissipation element institute.
Preferably, the structure of heat dissipation substrate still further comprises an at least radiating gasket, at least one radiating gasket
It is arranged at least one electronic component；And an at least fin type radiating piece, at least one fin type radiating piece setting
On at least one radiating gasket.
In order to solve the technical issues of above-mentioned, yet another aspect of the present invention is to provide a kind of network communication dress
It puts, the network communication device uses
One electronics module, which is characterized in that the electronics module includes an at least electronic component；
An and structure of heat dissipation substrate.The structure of heat dissipation substrate includes a circuit board and a heat dissipation element.Wherein,
It is described
Circuit board has an at least heat dissipation region and what is be separated from each other at least one heat dissipation region at least one hold
Region is carried, at least one electronic component is arranged at least one bearing area, and the circuit board has at least one
Multiple through holes in the range of the heat dissipation region, and the heat dissipation element is arranged at least described in one of the circuit board
In heat dissipation region；Wherein, heat caused by least one electronic component is by the circuit board, to conduct to multiple described
Through hole and at least one heat dissipation element, multiple through holes at least one of by least one heat dissipation element
Institute is exposed.
The beneficial effects of the present invention are, network communication device and its electronics module that technical solution of the present invention is provided with
Structure of heat dissipation substrate by " circuit board is with multiple through holes in the range of heat dissipation region " and " can be arranged on
The technical characteristic of heat dissipation element in heat dissipation region " so that heat caused by electronic component is by circuit board, to conduct at most
A through hole and heat dissipation element.
For the enabled feature and technology contents for being further understood that the present invention, please refer to below in connection with the present invention specifically
Bright and attached drawing, however the attached drawing provided is only for reference and description, and is not intended to limit the present invention.
Description of the drawings
Fig. 1 is the decomposition diagram of the structure of heat dissipation substrate of first embodiment of the invention.
Fig. 2 is the combination diagram of the structure of heat dissipation substrate of first embodiment of the invention.
Fig. 3 is the diagrammatic cross-section of the structure of heat dissipation substrate of first embodiment of the invention.
Fig. 4 is the decomposition diagram of the electronics module of second embodiment of the invention.
Fig. 5 is the combination diagram of the electronics module of second embodiment of the invention.
Fig. 6 is the combination diagram of the electronics module of third embodiment of the invention.
Fig. 7 is the combination diagram of the electronics module of fourth embodiment of the invention.
Fig. 8 is the combination diagram of the electronics module of fifth embodiment of the invention.
Fig. 9 is the combination diagram of the electronics module of sixth embodiment of the invention.
Figure 10 is the combination diagram of the electronics module of seventh embodiment of the invention.
Figure 11 is the electronic die combination diagram of eighth embodiment of the invention.
Figure 12 is that the electronics module of ninth embodiment of the invention is applied to the functional block diagram of network communication device.
Specific embodiment
Be below illustrated by specific specific example it is presently disclosed related " network communication device and its electronic die
Group and structure of heat dissipation substrate " embodiment, those skilled in the art can be by the content understanding present invention's disclosed in this specification
Advantage and effect.The present invention can be embodied or practiced by other different specific embodiments, and the items in this specification are thin
Section may be based on different viewpoints and application, in the lower various modifications of progress without departing from the spirit and change.In addition, this hair
Bright attached drawing is only simple schematically illustrate, not according to the description of actual size, is stated.Following embodiment will be further
The relevant technologies content that the present invention will be described in detail, but disclosure of that is not to limit the scope of the present invention.
First embodiment
Please refer to Fig.1 to Fig.3, by above-mentioned figure it is found that first embodiment of the invention provides a kind of structure of heat dissipation substrate S,
It is carrying an at least electronic component 3, and structure of heat dissipation substrate S includes：One circuit board 1 and at least a heat dissipation element 2.
First, coordinate shown in Fig. 1 and Fig. 2, circuit board 1 has at least a heat dissipation region 10 and at least a bearing area
20, an at least heat dissipation region 10 is separated from each other with an at least bearing area 20, and in an at least heat dissipation region 10 for circuit board 1
In the range of, there are multiple through holes 100.Furthermore an at least heat dissipation element 2 is provided at least one heat dissipation of circuit board 1
On region 10, and an at least electronic component 3 is provided on an at least bearing area 20.
According to first embodiment, from Fig. 1 to Fig. 2 it can be seen that, circuit board 1 have a heat dissipation region 10 and a supporting region
Domain 20, heat dissipation region 10 and bearing area 20 are separated from each other, and are arranged at intervals with a preset distance.By such as Fig. 1 and Fig. 2
Configuration, the structure of heat dissipation substrate of the present embodiment can take heat, and be transferred to heat dissipation region out of from heat source.In order to more clearly say
It is bright, please refer to Fig. 3.As shown in figure 3, in bearing area 20, through heat caused by electronic component 3, heat transfer can be passed through
Approach, by the heat of 3 surrounding of electronic component via multiple through holes 100 that heat dissipation region 10 is transmitted to inside circuit board 1 and
The heat dissipation element 2 being arranged in heat dissipation region 10.At this point, the heat for being transmitted to multiple through holes 100 and heat dissipation element 2 can be with heat
The mode of convection current dissipates to the external world.That is, heat can coordinate " the heat provided by heat dissipation element 2 caused by electronic component 3
Pathway " and " mode for carrying out thermal convection current with the external world by multiple through holes 100 and heat dissipation element 2 " are first to promote electronics
The heat dissipation effect of part 3.
It is noted that Fig. 1 to Fig. 3 is one heat dissipation region of display, 10, bearing areas 20, a corresponding radiating area
One heat dissipation element 2 in domain 10 and an electronic component 3 of a corresponding bearing area 20 illustrate, but the present invention for example
It is not limited thereto.In other words, as shown in Figures 4 and 5, there are one 10, two bearing areas of heat dissipation region for the tool of circuit board 1
20th, a heat dissipation element 2 and two electronic components 3.It is noted that in the case of two bearing areas 20, heat dissipation
Region 10 is still respectively separated from each other setting with two bearing areas.Preferably, heat dissipation region 10 can be arranged on to two bearing areas
Between 20, and with each bearing area 20 apart from identical.Similarly, when heat dissipation region 10 is arranged on two or multiple bearing areas
When between 20, the heat that is generated by two or multiple electronic components 3 can be by the heat conduction path in circuit board 1, will
The heat dissipation element 2 that most heat is transferred to multiple through holes 100 of heat dissipation region 10 and is arranged in heat dissipation region 10, most
Heat is radiated with thermal convection current and heat exchange pattern by multiple through holes 100 and heat dissipation element 2 again afterwards.
Similarly, heat dissipation region 10 can be arbitrary shape, such as circle, quadrangle, polygon or irregular shape.At this
In embodiment, using square as embodiment, however the present invention is not limited thereto.
On the other hand, in order to increase the efficiency of heat transfer and thermal convection current, each through hole 100 in heat dissipation region 10
Inner wall 105 and the surface of the heat dissipation region 10 be all formed with heat-conducting metal layer.Heat-conducting metal layer can be directly with plating side
Inner wall 105 of the formula on the surface of heat dissipation region 10 and multiple through holes 100 of circuit board 1 plates the good metal material of thermal conductivity
Matter.The good metal material of thermal conductivity includes but not limited to, copper, aluminium, gold, silver etc..Preferable metal material is copper.Therefore, it radiates
The inner wall 105 of through hole 100 in region 10 and the range of heat dissipation region 10 can be with copper facing, so as to form one in appearance
Not by the naked copper area of the solder mask of circuit board (solder mask are often visually green) covering.It is completely golden by this
Belong to the heat dissipation region 10 of layers of copper covering, the heat of circuit board 1 can more be effectively transmitted to heat dissipation region 10 and be arranged on scattered
Heat dissipation element 2 on thermal region 10, effectively circuit board is dissipated to by thermal convection current and the addition of heat transfer by heat
Outside.
Furthermore multiple through holes 100 in the range of heat dissipation region 10 are arranged with arbitrary aperture arbitrary form, can also be made
Those through holes 100 are in the matrix form with constant aperture proper alignment.According to the present embodiment, the aperture of multiple through holes 100 is situated between
In 1mm between 5mm, and multiple through holes are to be at least 5 × 5 matrix arrangement.In detail, positive four for corresponding the present embodiment
Side shape heat dissipation region 10, so the aperture of the through hole 100 in the range of heat dissipation region 10 is between 5mm between 1mm, and
With 6 × 6 matrix forms arrangement of every row 6, totally 6 row.Through hole 100 or 5 × 5,7 × 7 or 8 × 8 matrix arrangement.Through
It crosses after test, it is found that aperture is 2mm and is that the matrix arrangements of 6 × 6 through holes can have preferable thermal convection current effect.Pass through
Through hole 100 and its 105 copper-plated design of inner wall can improve the heat history problem of 1 lower section of circuit board, and heat can be by running through
Channel that hole 100 is provided and rise to 1 top of circuit board upwards naturally, the copper metal layer of inner wall 105 can also strengthen air stream
The out-of-date thermal convection current effect for taking away heat.
Meanwhile heat dissipation element 2 can be arbitrary shape and arbitrary material, can also correspond to the shape design of heat dissipation region 10.It lifts
It for example, but is not limited to, heat dissipation element 2 can be plate, sheet fin-type, pin fins type or other moulding fins.Heat dissipation
The material of element 2 can be then one of metal, ceramics and graphene three.In addition, heat dissipation element 2 can expose multiple pass through
Perforation 100 at least one of or some of multiple through holes 100 or the whole of multiple through holes 100.In the same manner, it dissipates
Thermal element 2 can not cover multiple through holes 100 with 10 place of connecing of heat dissipation region.As shown in Figure 1 to Figure 3, the heat dissipation member of the present embodiment
Part 2 can be plate type metal plate, and with the multiple trepannings 200 for the through hole 100 for corresponding to heat dissipation region 10.From figure 3, it can be seen that
Multiple trepannings 200 correspond to through hole 100, can be equal to or greater than and passed through with the aperture of 6 × 6 matrix arrangement, and trepanning 200
The aperture of perforation 100 so that thermal convection current can be dissipated unimpededly by through hole 100.It in addition to this, can be such as Fig. 6 to figure
Shown in 11, heat dissipation element 2 can be designed with arbitrary form, for example, shape of the mouth as one speaks radiator, more fin slices radiators, the heat dissipation of shape of the mouth as one speaks fin
The radiator that device, block heat sink or the aforementioned shape of the mouth as one speaks are combined with fin.The configuration of heat dissipation element 2 connects with heat dissipation region 10
Tactile setting has no specific form.Multiple through holes 100 of main permeable heat dissipation region 10 drive thermal convection current to radiate with profit
It can.Main principle is that it is noted that whether with which kind of fansink designs, heat dissipation element 2 and heat dissipation region 10 connect place but
Multiple through holes 100 that heat dissipation region 10 can't be covered in are preferred.If so through the design of the heat dissipation element 2 of more fins
(such as shown in Figure 11), since fin has been array fin form, the surface area that such fin is contacted with air increases.Herein
In the case of, heat dissipation element 2 can cover multiple through holes 100 of heat dissipation region 10 partially or in whole.
Second embodiment
Fig. 4 and Fig. 5 is please referred to, second embodiment of the invention provides a kind of electronics module E, including at least electronics member
3 and one structure of heat dissipation substrate S of part.The structure of heat dissipation substrate S of the present embodiment include a circuit board 1, a heat dissipation region 10, with
And two bearing areas 20.The part similar to previous embodiment is, in structure of heat dissipation substrate S, a heat dissipation element 2 is right
A heat dissipation region 10 is answered to set, and the top of two bearing areas 20 carries two electronic components 3.With aforementioned first embodiment phase
Seemingly, multiple through holes 100 are provided in the range of heat dissipation region 10, and multiple trepannings 200 of heat dissipation element 2 also expose multiple pass through to the open air
Perforation 100, makes trepanning 200 be connected with multiple through holes 100.In addition to this, structure of heat dissipation substrate S still further comprises at least one
Radiating gasket 4 and at least a fin type radiating piece 5.It is two radiating gaskets 4 and two fin type heat dissipations in the present embodiment
Part 5, two electronic components 3 all corresponded on two bearing areas 20 are set.In detail, as shown in figure 4, two electronic components 3
It is separately positioned on two bearing areas 20, two radiating gaskets 4 are separately positioned on two electronic components 3, and two fins
Formula radiating piece 5 is separately positioned on two radiating gaskets 4.Heat dissipation region 10 is then arranged between two bearing areas 20 and difference
Fixed range is spaced with each bearing area 20.
Radiating gasket 4 can be good, light, easy processing the sheet metal of thermal conductivity or thermal grease of any conventional.Preferably
It can be thermal grease, be coated on electronic component 3 and be connected with fin type radiating piece 5.In other words, radiating gasket 4 is setting
Between electronic component 3 and fin type radiating piece 5.By such setting, heat caused by electronic component 3 more can by with
Being in direct contact for radiating gasket 4 and fin type radiating piece 5, is radiated in the form of heat transfer.
In order to efficiently transferring heat energy, in electronics module E disclosed in second embodiment of the invention, heat-radiating substrate
The heat dissipation element 2 of structure S further includes at least one and extends outwardly with the bridge connector 205 for contacting fin type radiating piece 5.Such as Fig. 4 and
Shown in Fig. 5, in order to correspond to two electronic components 3 and two fin type radiating pieces 5, heat dissipation element 2 is included respectively to supporting region
Two bridge connectors 205 that domain 10 extends.From attached drawing it will be evident that the length of bridge connector 205 may extend to bearing area 10
In the range of so that the one end of bridge connector 205 far from 2 ontology of heat dissipation element can contact fin type radiating piece 5.Preferably, bridge connector
One end of 205 ontologies far from heat dissipation element 2 is provided between radiating gasket 4 and fin type radiating piece 5 so that heat dissipation member
Part 2 is in direct contact between radiating gasket 4 and fin type radiating piece 5.The material of bridge connector 205 can be metal, ceramics and stone
One of black alkene three, it is therefore preferable to metal.Thus, by aforementioned set-up mode, electronic component in electronics module E
It is hot caused by 3, not only can efficiently it be transferred heat between bearing area 20 by the heat conduction path in circuit board 1
Heat dissipation region 10 and heat dissipation element 2, and pass through and connect through hole 100 and trepanning 200 so that thermal energy is dissipated by thermal convection current
Go out circuit board 1, it can also directly will be hot by the heat transfer of the bridge connector 205 between fin type radiating piece 5 and heat dissipation element 2
Export.In this way, it may be such that structure of heat dissipation substrate S has more excellent heat sinking function.
3rd embodiment
Fig. 6 is please referred to, third embodiment of the invention also provides a kind of electronics module E, equally includes at least electronics member
3 and one structure of heat dissipation substrate S of part.The element of third embodiment of the invention is identical with the element of second embodiment, in addition to heat dissipation
Except the configuration of element 2.Identical element please refers to previous explanation.The shape of the heat dissipation element 2 of third embodiment of the invention
It is raised for surrounding, internal recessed shape of the mouth as one speaks radiator.2 bottom of heat dissipation element have multiple trepannings 200, and trepanning 200 with it is multiple
Through hole 100 connects.
Fourth embodiment
Fig. 7 is please referred to, fourth embodiment of the invention also provides a kind of electronics module E, equally includes at least electronics member
3 and one structure of heat dissipation substrate S of part.The element of fourth embodiment of the invention is identical with the element of second embodiment, in addition to heat dissipation
Except the configuration of element 2.Identical element please refers to previous explanation.The shape of the heat dissipation element 2 of fourth embodiment of the invention
It is surrounded for surrounding with multiple fins, inside has the radiator of multiple trepannings 200.The trepanning 200 of 2 bottom of heat dissipation element with it is multiple
Through hole 100 connects.
5th embodiment
Fig. 8 is please referred to, fifth embodiment of the invention also provides a kind of electronics module E, equally includes at least electronics member
3 and one structure of heat dissipation substrate S of part.Other than heat dissipation element 2, remaining element of fifth embodiment of the invention and aforementioned second
The element of embodiment is identical.Identical element please refers to previous explanation.The shape of the heat dissipation element 2 of fifth embodiment of the invention
And surrounding is surrounded with multiple fins, inside has the radiator of multiple trepannings 200.So exist with previous embodiment difference
In the present embodiment digs out a big opening for running through circuit board 1, the opening and 2 bottom of heat dissipation element in heat dissipation region 1
Shape is consistent.Heat dissipation element 2, which is directly plugged into, to be arranged among heat dissipation region 1.Before the trepanning 200 of 2 bottom of heat dissipation element can be used as
The effect of multiple through holes are identical is stated, heat caused by electronic component is made to be conducted by circuit board to the trepanning of heat dissipation element 2
200。
Sixth embodiment
Fig. 9 is please referred to, sixth embodiment of the invention also provides a kind of electronics module E, equally includes at least electronics member
3 and one structure of heat dissipation substrate S of part.The element of sixth embodiment of the invention is identical with the element of fourth embodiment, wherein radiating
The shape of element 2 is also identical with the heat dissipation element of fourth embodiment 2.Only exist in place of the difference of the present embodiment and fourth embodiment
In the material of bridge connector 205 is graphene.
7th embodiment
0 is please referred to Fig.1, seventh embodiment of the invention also provides a kind of electronics module E, equally includes at least electronics member
3 and one structure of heat dissipation substrate S of part.The element of the present embodiment is identical with the element of second embodiment, in addition to the structure of heat dissipation element 2
Except type.Identical element please refers to previous explanation.The shape of the heat dissipation element 2 of the present embodiment is with a thickness, centre
Block heat sink with multiple trepannings 200.In the same manner, the trepanning 200 of heat dissipation element 2 is connected with multiple through holes 100, so that
The heat conduction path obtained in circuit board 1 efficiently transfers heat to heat dissipation element 2, and pass through through hole 100 and trepanning 200
Thermal energy is dissipated into out circuit board 1.
8th embodiment
1 is please referred to Fig.1, eighth embodiment of the invention provides another electronics module E again, equally includes at least electronics member
3 and one structure of heat dissipation substrate S of part.The element of the present embodiment is identical with the element of second embodiment, in addition to the structure of heat dissipation element 2
Except type.Identical element please refers to previous explanation.The shape of the heat dissipation element 2 of the present embodiment is the more fin heat dissipations of array
Device.The array of more fins of heat dissipation element 2 can be aligned heat dissipation region 10 multiple through holes 100 arrangement setting, also can with through
Hole 100 is staggered.Preferably, the fin of heat dissipation element 2 is staggered with multiple through holes 100.If but correspond to multiple pass through
100 setting of perforation also can reach effective heat dissipation effect.This is because since fin has been array fin form, such fin
The surface area contacted with air increases, in the same manner, can be by circuit base through the setting of through holes 100 multiple in heat dissipation region 10
Heat caused by plate 1 is dissipated out by thermal convection current and heat transfer.
In order to which the structure of heat dissipation substrate S for further confirming the present invention is imitated compared to conventional heat dissipating method with more effectively heat dissipation
Fruit, the present invention carry out heat dissipation experiment with the electronics module of the electronics module E with structure of heat dissipation substrate S and routine.Such as Fig. 5 extremely
Described in Figure 11 and second embodiment to the 8th embodiment, electronics module E includes structure of heat dissipation substrate S and two electronics members
Part 3, and the heat dissipation element 2 including various various configurations, using as experimental group.On the other hand, control group has two to be similary
A electronic component 3 and it is respectively equipped with radiating gasket and fin type radiating piece thereon, so without the trepanning of heat dissipation region design
Electronics module.
The heat dissipation result of table 1, structure of heat dissipation substrate provided by the invention
As a result table 1 is please referred to, table 1 is the heat dissipation result table through structure of heat dissipation substrate provided by the invention.It can be bright from table 1
Aobvious to find out, the temperature of the electronic component 3 of the bearing area 20 of experimental group is the temperature low 2 to 3 of the electronic component 3 compared with control group
Degree.For overall efficiency, exothermic temperature improves about 3 percent.The results show that the electricity on structure of heat dissipation substrate S of the present invention
The temperature of subcomponent is below the temperature of the electronic component of control group (being not provided with heat dissipation region).In other words, according to this hair
Bright disclosed structure of heat dissipation substrate passes through the through hole 100 of heat dissipation region 10 and the heat dissipation member being arranged in heat dissipation region 10
Part 2, no matter the shape or material of heat dissipation element 2 why, can obtain excellent heat dissipation effect.
9th embodiment
2 are please referred to Fig.1, is that the electronics module E of ninth embodiment of the invention is applied to the function side of network communication device D
Block diagram.As shown in figure 12, the present invention further provides a kind of electronics module E applied to network communication device D.Electronics module E
Including the structure of heat dissipation substrate S as shown in earlier figures 1 to Figure 11 and an at least electronic component 3.Equally, structure of heat dissipation substrate S
Also including the circuit board 1 with heat dissipation region 10 and bearing area 20, heat dissipation region 10 has multiple through holes 100, and
Heat dissipation element 2 is arranged in heat dissipation region 10, heat dissipation element 2 can have with multiple 100 corresponding trepannings 200 of through hole, whereby
It may be such that electronic component 3 reaches heat dissipation effect by circuit board 3 and through hole 100.Network communication device D may include, but
It is not limited to, modem, portable personal call, base transceiver etc..
The advantageous effect of embodiment
The beneficial effects of the present invention are, network communication device D and its electronics module E that the embodiment of the present invention is provided with
Structure of heat dissipation substrate S can pass through " multiple through holes 100 " in circuit board 1 in the range of heat dissipation region 10 and " setting
The technical characteristic of heat dissipation element 2 " in heat dissipation region 10 so that heat caused by electronic component 3 by circuit board 1, with
It conducts to multiple through holes 100 and heat dissipation element 2.
That is, network communication device and its electronics module and structure of heat dissipation substrate that the embodiment of the present invention is provided,
Heat caused by electronic component 3 can coordinate " heat conduction path provided by heat dissipation element 2 " and " by multiple through hole 100
And heat dissipation element 2 and the extraneous mode for carrying out thermal convection current " to promote the heat dissipation effect of electronic component 3.
Content disclosed above is only the preferred possible embodiments of the present invention, and the right for not thereby limiting to the present invention will
The protection domain asked, so every equivalence techniques variation done with description of the invention and accompanying drawing content, is both contained in this
In the scope of the claims of invention.
Claims (13)
1. a kind of structure of heat dissipation substrate, to carry an at least electronic component, which is characterized in that the structure of heat dissipation substrate packet
It includes：
One circuit board, the circuit board have an at least heat dissipation region and are separated from each other at least one heat dissipation region
An at least bearing area, wherein, at least one electronic component is arranged at least one bearing area, and the circuit
Substrate has multiple through holes in the range of at least one heat dissipation region；And
An at least heat dissipation element, at least one heat dissipation element are arranged at least one heat dissipation region of the circuit board
On；
Wherein, heat caused by least one electronic component is by the circuit board, with conduction to multiple through holes
And at least one heat dissipation element.
At least one of 2. structure of heat dissipation substrate according to claim 1, which is characterized in that multiple through holes
It is exposed by at least one heat dissipation element institute.
3. structure of heat dissipation substrate according to claim 1, which is characterized in that the structure of heat dissipation substrate also further wraps
It includes：
An at least radiating gasket, at least one radiating gasket are arranged at least one electronic component；And
An at least fin type radiating piece, at least one fin type radiating piece are arranged at least one radiating gasket.
4. structure of heat dissipation substrate according to claim 1, which is characterized in that the aperture of multiple through holes is between 1mm
To between 5mm, and multiple through holes are to be at least 5 × 5 matrix arrangement.
5. structure of heat dissipation substrate according to claim 1, which is characterized in that the inner wall of each through hole and extremely
A few heat dissipation region is all formed with heat-conducting metal layer.
6. structure of heat dissipation substrate according to claim 1, which is characterized in that at least one heat dissipation element includes multiple points
The trepanning of multiple through holes of the circuit board is not corresponded to.
7. structure of heat dissipation substrate according to claim 2, which is characterized in that the structure of heat dissipation substrate still further comprises
An at least fin type radiating piece, and at least one heat dissipation element includes extending outwardly to contact at least one fin type heat dissipation
An at least bridge connector for part.
8. structure of heat dissipation substrate according to claim 1, which is characterized in that the material of at least one heat dissipation element is gold
One of category, ceramics and graphene three.
9. a kind of electronics module, which is characterized in that the electronics module includes：
An at least electronic component；And
One structure of heat dissipation substrate, the structure of heat dissipation substrate include a circuit board and a heat dissipation element；
Wherein, the circuit board has an at least heat dissipation region and is separated from each other at least at least one heat dissipation region
One bearing area, at least one electronic component are arranged at least one bearing area, and the circuit board has extremely
Multiple through holes in the range of a few heat dissipation region, and the heat dissipation element is arranged at least the one of the circuit board
In the heat dissipation region；
Wherein, heat caused by least one electronic component is by the circuit board, with conduction to multiple through holes
And at least one heat dissipation element.
10. electronics module according to claim 9, which is characterized in that multiple through holes at least one of quilt
At least one heat dissipation element institute is exposed.
11. electronics module according to claim 9, which is characterized in that the structure of heat dissipation substrate further comprises：
An at least radiating gasket, at least one radiating gasket are arranged at least one electronic component；And
An at least fin type radiating piece, at least one fin type radiating piece are arranged at least one radiating gasket.
12. a kind of network communication device, the network communication device uses an electronics module, which is characterized in that the electronic die
Group includes：
An at least electronic component；And
One structure of heat dissipation substrate, the structure of heat dissipation substrate include a circuit board and a heat dissipation element；
Wherein, the circuit board has an at least heat dissipation region and is separated from each other at least at least one heat dissipation region
One bearing area, at least one electronic component are arranged at least one bearing area, and the circuit board has extremely
Multiple through holes in the range of a few heat dissipation region, and the heat dissipation element is arranged at least the one of the circuit board
In the heat dissipation region；
Wherein, heat caused by least one electronic component is by the circuit board, with conduction to multiple through holes
And at least one heat dissipation element.
13. network communication device according to claim 12, which is characterized in that at least one among multiple through holes
It is a exposed by at least one heat dissipation element institute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611246957.XA CN108260273A (en) | 2016-12-29 | 2016-12-29 | Network communication device and its electronics module and structure of heat dissipation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611246957.XA CN108260273A (en) | 2016-12-29 | 2016-12-29 | Network communication device and its electronics module and structure of heat dissipation substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108260273A true CN108260273A (en) | 2018-07-06 |
Family
ID=62719122
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611246957.XA Pending CN108260273A (en) | 2016-12-29 | 2016-12-29 | Network communication device and its electronics module and structure of heat dissipation substrate |
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| CN (1) | CN108260273A (en) |
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| CN102421272A (en) * | 2010-09-27 | 2012-04-18 | 富瑞精密组件（昆山）有限公司 | Portable electronic device and heat radiation module thereof |
| CN203015265U (en) * | 2012-11-08 | 2013-06-19 | 深圳市中孚能电气设备有限公司 | Heat radiation type PCB |
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| CN1889255A (en) * | 2005-06-27 | 2007-01-03 | 富士通株式会社 | Electronic component package including joint material for higher heat conductivity |
| CN2904597Y (en) * | 2006-05-15 | 2007-05-23 | 番禺得意精密电子工业有限公司 | Radiating device |
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