CN108258151A - Packaging film, flexible display apparatus and packaging film forming method - Google Patents
Packaging film, flexible display apparatus and packaging film forming method Download PDFInfo
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- CN108258151A CN108258151A CN201810055107.4A CN201810055107A CN108258151A CN 108258151 A CN108258151 A CN 108258151A CN 201810055107 A CN201810055107 A CN 201810055107A CN 108258151 A CN108258151 A CN 108258151A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H10K50/844—Encapsulations
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Abstract
The present invention provides packaging films, flexible display apparatus and packaging film forming method, the packaging film includes the first inorganic layer, organic layer and the second inorganic layer, the organic layer includes the first sub- organic layer contacted with first inorganic layer, the the second sub- organic layer contacted with second inorganic layer and the sub- organic layer of third being arranged between the described first sub- organic layer and the second sub- organic layer, the organic layer includes high molecular material, wherein, value of the degree of polymerization of the high molecular material in the sub- organic layer of the third is not more than in the described first sub- organic layer, value in the second sub- organic layer, and at least one of value in the described first sub- organic layer and the second sub- organic layer is more than the value in the sub- organic layer of the third.In packaging film forming method provided by the invention, the described first sub- organic layer, the sub- organic layer of the third and the second sub- organic layer are further formed using iCVD techniques.
Description
Technical field
The present invention relates to encapsulation and display technology field more particularly to packaging film, flexible display apparatus and packaging films
Forming method.
Background technology
Thin film encapsulation technology can be used for protecting the diode or device to external factor such as moisture or oxygen sensitive.
Diode or device such as organic electroluminescent (the Organic Light Emitting that can be protected by thin film encapsulation technology
Diode, OLED) device, solar cell etc..Wherein, OLED device is because of the characteristic of wherein display unit (or lighting unit)
It may be degenerated, encapsulation performance be required very high due to environmental aspect such as outside moisture, oxygen etc..Traditional glass cover or
Metal cover encapsulation can realize preferable effect, but be not properly suited for some important or potential application scenarios, for example push up
Emit OLED display technologies, flexibility OLED display technologies etc..
The development and application of thin film encapsulation technology greatly meet requirement of the OLED device to encapsulation performance, existing one kind
Thin-film packing structure for the multiple-level stack of OLED device layer encapsulation may include successively from inside to outside：1) substrate, the layer can wrap
Include rigid substrate (such as glass) or flexible substrate (such as plastic material)；2) OLED device layer, specifically for example including R
(red), G (green), three colors of B (indigo plant) array distribution multiple OLED light emitting units, each OLED light emitting unit is for example including along base
Lower electrode, organic material and the top electrode that bottom surface is formed；3) packaging film.
The more general packaging film for thin film encapsulation technology is a kind of including inorganic layer/organic layer/inorganic at present
The multilayer lamination structure of layer.Wherein, the deposition of inorganic layer mainly uses chemical vapor deposition (Plasma Enhanced
Chemical Vapor Deposition, PECVD), atomic layer deposition (Atomic Layer Deposition, ALD), and have
The depositional mode of machine layer mainly utilizes inkjet printing (Ink Jet Printing, IJP) mode.
But inventor is the study found that packaging film and its formation side using current inorganic layer/organic layer/inorganic layer
After method is packaged OLED device layer, when carrying out crooked test, since the strain (amount of tension) of packaging film is by internal layer
(close to OLED device layer side) outer layers are to gradually increase (far from device layer side), and the wherein elasticity modulus of inorganic layer
(modulus ofelasticity) is typically larger than 10GPa, but (its molecular weight is in 10000- by common high molecular material
Between 200000) form organic layer elasticity modulus only about 0.1GPa.Larger elastic modulus difference causes packaging film to exist
Stress can generate larger stress concentration when bending in film layer, even result in inorganic fault rupture.It is therefore desirable to thinner package
Film and forming method thereof is improved.
Invention content
The purpose of the present invention is improving existing packaging film and forming method thereof, reduce bullet between organic layer and inorganic layer
Property modulus difference, decline the stress mismatch at inorganic layer and organic layer interface, it is flexible to promote such as OLED after encapsulating
The bending resistance of display device.
To achieve the above object, on the one hand, the present invention provides a kind of packaging film, first including stacking gradually is inorganic
Layer, organic layer and the second inorganic layer, the organic layer include the first sub- organic layer contacted with first inorganic layer, with it is described
The the second sub- organic layer and be arranged between the described first sub- organic layer and the second sub- organic layer that second inorganic layer contacts
The sub- organic layer of third, which is characterized in that the organic layer include high molecular material, wherein, the polymerization of the high molecular material
The value in the sub- organic layer of the third is spent no more than the value in the described first sub- organic layer, the second sub- organic layer, and
And at least one of value in the described first sub- organic layer and the second sub- organic layer be more than have in third
Value in machine layer.
Optionally, the described first sub- organic layer include several macromolecule layers stacked gradually, and from first nothing
The macromolecule layer of machine layer contact to the macromolecule layer contacted with the sub- organic layer of the third, the degree of polymerization of the high molecular material by
It is decrescence small；And/or the second sub- organic layer include several macromolecule layers stacked gradually, and from second inorganic layer
To the macromolecule layer contacted with the sub- organic layer of the third, the degree of polymerization of the high molecular material gradually subtracts the macromolecule layer of contact
It is small.
Optionally, elasticity of the high molecular material in the described first sub- organic layer and/or the second sub- organic layer
Modulus is 0.2-20GPa, and the elasticity modulus in the sub- organic layer of the third is 0.1-20GPa.
Optionally, the high molecular material is PASMa (polymaleic anhydride aminostyryl), P (GMA-co-DFHA) (gathers
Glycidyl methacrylate dodecafluorhe-ptylacrylate), P (npMA-co-EGDA) (penta diacrylate second two of polyacrylic acid
Alcohol ester) in one kind or combination thereof.
Using packaging film provided by the invention, wherein organic layer includes a kind of high molecular material, the high molecular material
Value of the degree of polymerization in the sub- organic layer of the third be not more than in the described first sub- organic layer, the second sub- organic layer
Value, and at least one of value in the described first sub- organic layer and the second sub- organic layer is more than in the third
Value in sub- organic layer, thus at least one of high molecular material in the first sub- organic layer and the second sub- organic layer
Molecule is big compared with the molecule of the high molecular material in the sub- organic layer of third, and being conducive to the first sub- organic layer of raising and/or the second son has
The elasticity modulus of high molecular material in machine layer, so as to improve organic layer and the interface of the first inorganic layer and/or the second inorganic layer
Strain intensity, packaging film can be improved when stress is bent in the first inorganic layer and/or the second inorganic layer and organic stratum boundary
Stress concentration is led to the problem of at face.
On the other hand, the present invention also provides a kind of flexible display apparatus, the flexible display apparatus includes substrate, is formed
Above-mentioned thinner package is used in the device layer in the substrate and the packaging film of the covering device layer, the packaging film
Film, so as to improve the bending resistance of flexible display apparatus.
In another aspect, the present invention also provides a kind of packaging film forming method, include the following steps：
Form the first inorganic layer, the first inorganic layer covering device layer；Organic layer is formed, the organic layer is included in institute
Belong to the first inorganic layer surface and sequentially form the first sub- organic layer, the sub- organic layer of third and the second sub- organic layer, wherein, the high score
Value of the degree of polymerization of sub- material in the sub- organic layer of the third is not more than organic in the described first sub- organic layer, second son
Value in layer, and at least one of value in the described first sub- organic layer and the second sub- organic layer is more than in institute
State the value in the sub- organic layer of third；And the second inorganic layer is formed, second inorganic layer covers the second sub- organic layer.
Optionally, the described first sub- organic layer, the sub- organic layer of the third and second son are formed using iCVD techniques
Organic layer.
Optionally, when forming the first sub- organic layer, the sub- organic layer of third and the second sub- organic layer using iCVD techniques, Xiang Zhen
The initiator of gas phase is passed through in plenum chamber and monomer is used to form the high molecular material, wherein, the initiator and the list
Value of the ratio between the molal quantity of body when forming the first sub- organic layer, the second sub- organic layer, which is more than or equal to, to be formed
Value during the sub- organic layer of the third.
Optionally, the first sub- organic layer is being formed and/or during the second sub- organic layer, the initiator and described
The ratio between molal quantity of monomer increases with the time of formation and is gradually reduced.
Optionally, the device layer is OLED device layer.
Using packaging film forming method provided by the invention, sequentially form the first sub- organic layer, the sub- organic layer of third and
Second sub- organic layer, wherein, the value of the degree of polymerization of the high molecular material in the sub- organic layer of the third is not more than described
Value in first sub- organic layer, the second sub- organic layer, and in the described first sub- organic layer and the second sub- organic layer
In at least one of value be more than value in the sub- organic layer of the third, so as to reduce the described first sub- organic layer
With first inorganic layer and/or the second sub- organic layer and the elastic modulus difference of the second inorganic layer interface, make
Stress mismatch declines, and improves the bending resistance of formed packaging film.
Further, the described first sub- organic layer, the sub- organic layer of the third and described second are formed using iCVD techniques
Sub- organic layer changes the degree of polymerization of high molecular material by changing the ratio between molal quantity of initiator and monomer in reaction chamber.
After being packaged to OLED device layer, the bending test yield of formed OLED device can be improved.
Description of the drawings
Fig. 1 is the diagrammatic cross-section of the packaging film of the embodiment of the present invention.
Fig. 2 is the flow diagram of the packaging film forming method of the embodiment of the present invention.
Fig. 3 is the diagrammatic cross-section of the flexible display apparatus of the embodiment of the present invention.
Reference sign：
100- packaging films；The first inorganic layers of 10-；20- organic layers；The second inorganic layers of 30-；The first sub- organic layers of 21-；
The second sub- organic layers of 23-；The sub- organic layer of 22- thirds；210- device layers.
Specific embodiment
For the purpose of the present invention, technical solution and advantage is more clearly understood, develop simultaneously embodiment referring to the drawings,
The present invention is described in more detail.It should be noted that attached drawing uses very simplified form and uses non-accurate ratio
Example, only to purpose that is convenient, lucidly aiding in illustrating the utility model embodiment.
In following embodiment, term " first " " second " between similar element for distinguishing, and be not necessarily to be used for
Certain order or time sequencing are described.It is appreciated that in the appropriate case, these terms so used are replaceable, such as can make
Invention as described herein embodiment can be different from as described herein or shown other and sequentially operate.Similar, such as
Fruit method described herein includes series of steps, and the sequence of these steps presented herein is not necessarily that can perform this
The unique order of a little steps, and other steps that the step described in some can be omitted and/or some are not described here can be added
It is added to this method.
Elasticity modulus (also known as coefficient of elasticity, Young's modulus) is a kind of most important, most feature mechanics of elastic material
Property, it can be used for characterizing the ability that material resists flexible deformation, and numerical values recited reflects the difficulty or ease of elastic properties of materials deformation
Degree.The numerical value of the present embodiment Elastic Modulus refers to stress of the organic or inorganic material under small deformation in encapsulated layer
The ratio of (the mainly stress of draw direction) with corresponding strain.In the present embodiment, elasticity modulus is specifically used for description and encapsulates
The ability of film resistance bending of its layers of material when stress is bent, generally refers to tensile modulus of elasticity.
For macroscopic perspective, elasticity modulus is to weigh the scale that object resists elastic deformability's size, from microcosmic angle
Then it is the reaction of bond strength between atom, lewis' acid for degree.All factors for influencing bond strength can influence material
Elasticity modulus, such as molecular linkage mode, crystal structure, chemical composition, microstructure, temperature.Common inorganic material
Elasticity modulus is larger, such as elasticity modulus about 28~200GPa of SiNx (silicon nitride), in contrast, common high molecular material
The elasticity modulus of (molecular weight is between 10000-200000) only about 0.1GPa.
Inventor is the study found that one side, inorganic layer/organic layer/inorganic layer in using existing thin film encapsulation technology
Multilayer lamination structure to device layer carry out thin-film package when, using existing method for example IJP techniques formed organic layer in
The degree of polymerization of high molecular material, so as to which its elasticity modulus is also uniform, at the interface contacted with inorganic layer, has to be uniformly distributed
The elastic modulus difference of machine layer and inorganic layer is larger, if be bent to this multilayer lamination structure, due to answering for packaging film
It is linear distribution (far from device layer side) to become (tensile elongation) by internal layer (close to device layer side) outer layers, then inorganic
The interface of layer and organic layer can generate larger stress concentration, can usually cause the fracture of inorganic layer, and cause packaging effect
It is deteriorated, leads to packed component failure.
Further, at present in the multilayer lamination structure of inorganic layer/organic layer/inorganic layer, the deposition of inorganic layer is mainly adopted
With chemical vapor deposition (PECVD) or atomic layer deposition (ALD) technique, and the depositional mode of organic layer mainly utilizes inkjet printing
(IJP) mode.But macromolecule membrane preparation method mode such as inkjet printing, dip-coating, spin coating of traditional liquid phase is more difficult
Film thickness is controlled, is difficult to form uniform film on complicated surface, simultaneously as macromolecular structure is complicated, molecular weight
Greatly, it is easily decomposed under high temperature, therefore the method for manufacturing thin film such as traditional chemical and physical vapor deposition can not be used.Though
So there is report that can prepare macromolecule membrane using plasma activated chemical vapour deposition (PECVD) technique, but utilize this technique
The chemical constitution of macromolecule membrane obtained can not be controlled accurately.
In view of the above problems, inventor passes through test of many times and creative work, it is proposed that technical scheme of the present invention, with
Under in conjunction with the embodiments to the present invention packaging film, flexible display apparatus and packaging film forming method be described.
The present embodiment provides firstly a kind of packaging film 100.Fig. 1 show the packaging film 100 of the embodiment of the present invention
Diagrammatic cross-section.Fig. 2 is the flow diagram of the packaging film forming method of the embodiment of the present invention.It should be noted that this
Although the packaging film forming method is employed in embodiment forms the packaging film 100, the envelope in the present embodiment
Dress film 100 can also use other film-forming process to be formed, without using the packaging film forming method described in the present embodiment.
The packaging film 100 and packaging film forming method of the present embodiment are done below in conjunction with Fig. 1 and Fig. 2 further in detail
It describes in detail bright.
As shown in Figure 1, the packaging film 100 of the present embodiment includes the first inorganic layer 10,20 and second inorganic layer of organic layer
30 laminated construction.Wherein, there is the first adjacent with the first inorganic layer 10 and the second inorganic layer 30 respectively son of organic layer 20 to have
21 and second sub- organic layer 22 of machine layer, organic layer 20 also have the be arranged between the first inorganic layer 10 and the second inorganic layer 30
Three sub- organic layers 23.
In the present embodiment, the first inorganic layer 10 and the second inorganic layer 30 can be identical material or different materials
Material, the first inorganic layer 10 and the second inorganic layer 30 may include SiNx、Al2O3(aluminium oxide), ZrO2(zirconium oxide), SnOx(tin oxide)
Wait material of main parts and SnF2(tin fluoride), P2O5(phosphorus pentoxide), WO3One or more auxiliary materials such as (tungstic acid).
In the present embodiment, organic layer 20 includes a kind of high molecular material, specifically e.g. PASMa (polymaleic anhydride amino
Styrene), P (GMA-co-DFHA) (poly (glycidyl methacrylate) dodecafluorhe-ptylacrylate), P (npMA-co-
EGDA) one kind or combination thereof in (penta ethylene glycol diacrylate of polyacrylic acid).According to the common knowledge of this field,
High molecular molecular weight is related with the degree of polymerization of corresponding monomer, i.e., the molecular weight of same high molecular material can be according to the degree of polymerization
It is different and different.In the present embodiment, the degree of polymerization of the high molecular material in organic layer 20 is not equally distributed, but
The first sub- organic layer 21 being in contact respectively with the first inorganic layer 10 and/or the second son being in contact with the second inorganic layer 30 are organic
The degree of polymerization in layer 22 is larger, and positioned at the first sub- organic layer 21 and the sub- organic layer 23 of third between the second inorganic layer 30
In, the value of the degree of polymerization of the high molecular material is relatively small compared with the value in the first sub- 21 and second sub- organic layer 22 of organic layer.
The degree of polymerization (the present embodiment refers specifically to high molecular average degree of polymerization in a certain layer) of the high molecular material is first
It may be the same or different in sub- 21 and second sub- organic layer 22 of organic layer.Also, in the first sub- 21 and second son of organic layer
In organic layer 22, the degree of polymerization of the high molecular material, which can not be, to be uniformly distributed, but along towards the side of the sub- organic layer 23 of third
To being gradually reduced.In preferred embodiment, the first sub- organic layer 21 include several macromolecule layers stacked gradually, and from the first nothing
The macromolecule layer that is contacted to organic layer 23 sub- with third of macromolecule layer that machine layer 10 contacts, the degree of polymerization of the high molecular material with
Linear or step-wise manner is gradually reduced；And/or second sub- organic layer 22 include several macromolecule layers stacked gradually, and from
The macromolecule layer contacted with the macromolecule layer that the second inorganic layer 30 contacts to organic layer 23 sub- with third, the high molecular material gather
It is right to be gradually reduced with linear or step-wise manner.By above-mentioned preferred embodiment, the first sub- 21 and/or second son of organic layer is organic
Layer 22 is in the table contacted respectively with the surface that the first inorganic layer 10 and/or the second inorganic layer 30 contact to organic layer 23 sub- with third
Face, the degree of polymerization of the high molecular material are gradually reduced, so as to improve the first sub- 21 and/or second sub- organic layer 22 of organic layer
High molecular Adapter Property between organic layer 23 sub- with third.
It should be noted that the molecule due to high molecular material is polymerized by several monomers (or repetitive unit), for
A certain floor height molecular material, the degree of polymerization of ingredient is generally not identical, can be on its ingredient
The average value of number of monomers represents the degree of polymerization of high molecular material, and therefore, the above-mentioned degree of polymerization to the high molecular material can be with
The high molecular average degree of polymerization being interpreted as in the high molecular material.
Specifically, in the present embodiment, which is, for example, PASMa, inventor the study found that PASMa have compared with
Wide elasticity modulus adjustable extent, different according to the degree of polymerization of monomer, elasticity modulus is between 0.1-20GPa.The height
Molecular material is in the first sub- organic layer 21 and second sub- organic layer 22 adjacent with the first inorganic layer 10 and the second inorganic layer 30
Molecular weight for 10000-600000, and the molecular weight of the sub- organic layer 23 of third is about 5000-600000, in above-mentioned molecular weight
In the range of, the molecular weight of PASMa is bigger, i.e., the degree of polymerization is bigger, then elasticity modulus is bigger.Also, PASMa is in the present embodiment
The elasticity modulus of one sub- 21 and second sub- organic layer 22 of organic layer is more than the elasticity modulus in the sub- organic layer 23 of third.
In the present embodiment, the overall thickness of the organic layer is 0.4-4.0 microns, the first sub- organic layer and/or described
The thickness of second sub- organic layer is 0.1-2.0 microns.With with same thickness, be made of identical high molecular material but the degree of polymerization is
The equally distributed existing organic layer for packaging film is compared, springform of the high molecular material in the sub- organic layer 23 of third
Amount can be less than or equal to the elasticity modulus in existing organic layer, and in the first sub- 21 and second sub- organic layer 22 of organic layer
In the elasticity modulus of at least one high molecular material be more than elasticity modulus in existing organic layer.It should be noted that
It is the organic layer 20 in the present embodiment, is not that the degree of polymerization is bigger although its molecular weight increase can improve elasticity modulus,
Elasticity modulus is bigger, it should according to the performance of selected high molecular material, specifically design it in the first sub- organic layer 21 and
The degree of polymerization in two sub- organic layers 22.
In preferred embodiment, the first sub- organic layer 21 include several macromolecule layers stacked gradually, and from it is described
The macromolecule layer that the macromolecule layer of first inorganic layer 10 contact is contacted to organic layer 23 sub- with the third, the high molecular material
Elasticity modulus be gradually reduced with linear or step-wise manner；And/or the second sub- organic layer 22 includes several being parallel to the
The macromolecule layer on two inorganic layers, 30 surface, and from the macromolecule layer that second inorganic layer 30 contacts to the third son
The macromolecule layer that organic layer 23 contacts, the elasticity modulus of the high molecular material are gradually reduced with linear or step-wise manner.It is logical
Cross above-mentioned preferred embodiment, the first sub- 21 and/or second sub- organic layer 22 of organic layer respectively with the first inorganic layer 10 and/or second
The surface that the surface that inorganic layer 30 contacts is contacted to organic layer 23 sub- with third, the elasticity modulus of the high molecular material gradually subtract
It is small, high molecular between the first sub- 21 and/or second sub- organic layer 22 of organic layer organic layer 23 sub- with third be adapted to can be improved
Performance, and still maintain high molecular material and preferably strain elasticity.
Packaging film 100 described in the present embodiment can be used for protecting to external factor such as moisture or oxygen sensitive
Diode or device, such as OLED device, solar cell etc., but not limited to this, packaging film 100 can be used for any tool
There is the component of thin-film package demand.And when in view of the purposes of specific packaging film, above-mentioned packaging film 100 also may be used
It, in certain embodiments, can also be by above-mentioned packaging film 100 to remove above-mentioned a certain inorganic layer or increase additional layer
It is formed organic including above-mentioned first inorganic layer 10, the first sub- organic layer 21, sub- the 23, second son of organic layer of third with more layers
The film or structure of the 22, second inorganic layer 30 of layer, wherein the layer that the thickness per layer film can be included by considering film
Number or the purposes of film control.
As shown in Fig. 2, the present embodiment additionally provides a kind of packaging film forming method, can be used for making above-mentioned thinner package
Film specifically comprises the following steps：
S1：Form the first inorganic layer 10, the 10 covering device layer of the first inorganic layer；
S2：Organic layer 20 is formed, the organic layer 20 is included in first that affiliated first inorganic layer, 10 surface sequentially forms
The sub- 23 and second sub- organic layer 22 of organic layer of sub- organic layer 21, third, the organic layer 20 include high molecular material, wherein, institute
Value of the degree of polymerization of high molecular material in the sub- organic layer 23 of the third is stated to be not more than in the described first sub- organic layer 21 and institute
State the value in the second sub- organic layer 22, and in the described first sub- organic layer 21 and the second sub- organic layer 22 at least its
One of value be more than value in the sub- organic layer 23 of the third；And
S3：The second inorganic layer 30 is formed, second inorganic layer 30 covers the described second sub- organic layer 22.
Specifically, in step S1 and S3, OLED that the device layer is formed in a plasticity or flexible substrate in this way
Device layer, in other embodiments of the present invention, device layer can also be that other have the region of thin-film package demand.
It deposits to form the first inorganic layer 10 and the second inorganic layer 30, the first inorganic layer specifically, pecvd process may be used
10 and second inorganic layer 30 may include SiNx、Al2O3、ZrO2、SnOxWait material of main parts and SnF2、P2O5、WO3Deng a kind of or more
Auxiliary material is planted, the thickness of the first inorganic layer 10 and the second inorganic layer 30 is, for example, 10~300 nanometers in the present embodiment.
In step s 2, the first sub- organic layer 21 described in iCVD process deposits, the sub- organic layer 23 of the third may be used
With the described second sub- organic layer 22.
Specifically, in iCVD techniques, the initiator (initiator) and list of the high molecular material will be used to form
Body (monomer) is introduced into a manner of gas phase in a vacuum reaction chamber, and is contacted with resistance heating wire, the initiator of activation by
Free radical (such as 100~300 DEG C of initiator heating temperature) is thermally decomposed into, free radical makes monomer polymerization and is deposited on device layer
First inorganic layer, 10 surface.
In the present embodiment, which is, for example, PASMa, and monomer is Ma (first maleic anhydride) and 4-AS (maleic acids
Acid anhydride), TBP (tert-butyl peroxide, tert-butyl hydroperoxide) may be selected in initiator, and degree of polymerization distribution is in order to obtain
Intermediate PASMa high, both sides are low can have when forming PASMa using iCVD techniques in the first sub- organic layer 21, third
Machine layer 23, the second sub- organic layer 22 sedimentation time in, change the ratio that initiator and monomer enter the molal quantity of vacuum chamber,
The degree of polymerization for making the monomer in the first sub- 21 and/or second sub- organic layer 22 of organic layer is larger, single in the sub- organic layer 23 of third
The degree of polymerization of body is smaller, such as can be when depositing the first sub- organic layer 21 and the second sub- organic layer 22 so that initiator
It is more than the ratio between molal quantity of initiator and monomer when depositing the third sub- organic layer 23 with the ratio between the molal quantity of monomer, so as to
Improve the degree of polymerization of monomer.
In preferred embodiment, when forming the first sub- organic layer 21 and/or the second sub- organic layer 23, the initiation
The ratio between molal quantity of agent and the monomer is increased with the time of formation and is gradually reduced, such as subtracted with linear or step-wise manner
It is small, be conducive to improve macromolecule between the first sub- 21 and/or second sub- organic layer 22 of organic layer and the sub- organic layer 23 of third in this way
Adapter Property.
PASMa can be changed in organic layer 20 not by the degree of polymerization for changing the monomer of PASMa in different sedimentation times
With the elasticity modulus (being referred mainly in the present embodiment for tensile modulus of elasticity) of position, and then form molecular size and elasticity modulus
Not equally distributed organic layer 20.PASMa is in point of the first sub- 21 and/or second sub- organic layer 22 of organic layer in the present embodiment
Son amount is 10000-600000, elasticity modulus 0.2-20GPa, and the molecular weight in the sub- organic layer 23 of third is 5000-
600000, elasticity modulus 0.1-20GPa, the first sub- organic layer 21, the second sub- organic layer 22 and sub- 23 three of organic layer of third
Overall thickness be about 0.4-4 microns.
Using above-mentioned iCVD techniques, compared with Traditional liquid phase preparation process, polymeric membrane dense uniform made from iCVD methods,
Thickness is controllable, compared with PECVD, does not need to introduce the plasma of high-energy, can preferably retain needed for high molecular material
Functional group.
Using the method for above-mentioned thin-film package, can be formed in substrate to be packaged has 10/ organic layer of the first inorganic layer
The packaging film 100 of the laminated construction of 20/ second inorganic layer 30, the packaging film 100 are flexibility, can be bent, and
When stress is bent, the degree of polymerization of the PASMa in the first sub- 21 and/or second sub- organic layer 22 of organic layer has compared in third
The degree of polymerization in machine layer 23 is big, so as to the elasticity modulus of the PASMa in the first sub- 21 and/or second sub- organic layer 22 of organic layer
Elasticity modulus compared with the PASMa in the sub- organic layer 23 of third is big so that in the first inorganic layer 10 and the first sub- organic layer 21 and/or
The difference for the interface elasticity modulus that second inorganic layer 30 is contacted with the second inorganic layer 30 reduces, and in the sub- organic layer 23 of third
The elasticity modulus of PASMa can be less than or equal to the elasticity modulus for the PASMa that prior art is formed, thus can make inorganic layer
The stress mismatch of (the present embodiment includes the first inorganic layer 10 and/or the second inorganic layer 30) and 20 interface of organic layer declines,
The bending resistance of packaging film 100 is improved.
The present embodiment additionally provides a kind of flexible display apparatus.The flexible display apparatus includes substrate 200, is formed in institute
State the packaging film 100 of the device layer 210 and the covering device layer 210 in substrate.
Fig. 3 is the diagrammatic cross-section of the flexible display apparatus of the embodiment of the present invention.As shown in figure 3, the substrate 200 can be with
It is rigid basement (such as glass) or flexible substrates, when substrate 200 is flexible substrates, polyether sulfone (PES) can be selected, gathered
Acrylate (PAR), polyetherimide (PEI), poly- naphthalene dimethyl glycol ester (PEN), polyethylene terephthalate
(PET), polyphenylene sulfide (PPS), polyarylate, polyimides, makrolon (PC), cellulose triacetate (TAC) and acetic acid third
Material in the group of acid cellulose (CAP) composition.Device layer 210, the device layer 210 are formed in the substrate 200
Such as include R (red), G (green), three colors of B (indigo plant) array distribution multiple OLED light emitting units, each OLED light emitting unit is for example
Including lower electrode, organic material and the top electrode formed along 200 surface of substrate.
Those skilled in the art are it should also be understood that OLED flexible display apparatus can be wherein image along towards substrate
The bottom emissive type that 200 direction is formed shows equipment, and substrate 200 should be formed by transparent material at this time.However, when OLED is soft
Property display device be wherein image along far from substrate 200 (i.e. towards packaging film 100) direction formation top emission structure
When showing equipment, substrate 200 need not include transparent material, such as lighttight metal may be selected in substrate 200, at this time packaging film
100 need to have excellent light transmittance.Also, it may also be formed with multiple OLED light emitting units of array distribution on a substrate 200
Corresponding thin film transistor (TFT) TFT, to be used for driving the OLED light emitting unit.About forming thin film transistor (TFT) on a substrate 200
The technique of TFT and device layer 210 can be existing technique, and details are not described herein again.
In flexible display apparatus in the present embodiment, device layer 210 is formed in the substrate 200, it is described flexible aobvious
Showing device further includes the packaging film 100 for covering the device layer 210, and the packaging film 100 is aforementioned using the present embodiment
Packaging film 100, including the first inorganic layer 10,20 and second inorganic layer 30 of organic layer being sequentially overlapped, wherein organic layer 20 wraps
It is PASMa in the present embodiment containing a kind of high molecular material, the organic layer 20 includes first son adjacent with the first inorganic layer 10
Organic layer 21, the adjacent with the second inorganic layer 30 second sub- organic layer 22 and it is set to the first inorganic layer 10 and the second inorganic layer
The sub- organic layer 23 of third between 30, the high molecular material is in the first sub- organic layer 21 and/or the second sub- organic layer 22
The degree of polymerization be more than the degree of polymerization in the sub- organic layer 23 of third.
The packaging film 100 can prevent outside moisture and oxygen from entering device to be packaged to device layer 210
Layer 210, such as the influence of moisture and oxygen to OLED luminescent devices can be prevented, the packaging film 100 can be with effective protection
Device layer 210 is to avoid component failure.
The method for forming packaging film 100 in the present embodiment on flexible display apparatus can utilize the side of above-mentioned thin-film package
Method, but in other embodiments, other techniques can also be utilized to form the packaging film 100 of covering device layer 210.
The flexible display apparatus of the present embodiment is OLED flexible display apparatus, forms device layer 210 on a substrate 200, and
And device layer 210 is packaged using the packaging film 100 described in the present embodiment, curved to the progress of OLED flexible display apparatus
During song test, relative to prior art, the organic layer 20 and inorganic layer in the packaging film 100 are (including the first inorganic layer 10
With the second inorganic layer 30) elastic modulus difference of interface reduces, and the stress mismatch at inorganic layer and organic layer interface declines, can
To improve the bending resistance of OLED flexible display apparatus.
It is understood that above example is only unrestricted to describe technical scheme of the present invention, for any ripe
For knowing those skilled in the art, without departing from the scope of the technical proposal of the invention, all using the skill of the disclosure above
Art content makes technical solution of the present invention possible changes and modifications or is revised as the equivalent embodiment of equivalent variations.Therefore,
Every content without departing from technical solution of the present invention, technical spirit according to the present invention are made to the above embodiment any simple
Modification, equivalent variations and modification, in the range of still falling within technical solution of the present invention protection.
Claims (10)
1. a kind of packaging film, including the first inorganic layer, organic layer and the second inorganic layer stacked gradually, the organic layer includes
The first sub- organic layer for being contacted with first inorganic layer, the second sub- organic layer contacted with second inorganic layer and setting
The sub- organic layer of third between the described first sub- organic layer and the second sub- organic layer, which is characterized in that the organic layer
Comprising high molecular material, wherein, the value of the degree of polymerization of the high molecular material in the sub- organic layer of the third is not more than in institute
The value in the first sub- organic layer, the second sub- organic layer is stated, and organic in the described first sub- organic layer and second son
At least one of value in layer is more than the value in the sub- organic layer of the third.
2. packaging film as described in claim 1, which is characterized in that the first sub- organic layer includes several stack gradually
Macromolecule layer, and from the macromolecule layer that first inorganic layer contacts to the macromolecule contacted with the sub- organic layer of the third
Layer, the degree of polymerization of the high molecular material are gradually reduced；And/or
The second sub- organic layer includes several macromolecule layers stacked gradually, and from the height contacted with second inorganic layer
To the macromolecule layer contacted with the sub- organic layer of the third, the degree of polymerization of the high molecular material is gradually reduced molecular layer.
3. packaging film as described in claim 1, which is characterized in that the high molecular material is in the described first sub- organic layer
And/or the elasticity modulus in the second sub- organic layer is 0.2-20GPa, the elasticity modulus in the sub- organic layer of the third is
0.1-20GPa。
4. packaging film as claimed any one in claims 1 to 3, which is characterized in that the high molecular material is PASMa, P
(GMA-co-DFHA) and one kind or combination thereof in P (npMA-co-EGDA).
5. a kind of flexible display apparatus, the flexible display apparatus include substrate, the device layer being formed in the substrate and
Cover the packaging film of the device layer, which is characterized in that the packaging film is used such as any one of claims 1 to 4 institute
The packaging film stated.
6. a kind of packaging film forming method, which is characterized in that include the following steps：
Form the first inorganic layer, the first inorganic layer covering device layer；
Organic layer is formed, the organic layer is included in the first sub- organic layer, the third that affiliated first inorganic layer surface sequentially forms
Sub- organic layer and the second sub- organic layer, the organic layer include high molecular material, wherein, the degree of polymerization of the high molecular material exists
Value in the sub- organic layer of third no more than the value in the described first sub- organic layer, the second sub- organic layer, and
At least one of value in the first sub- organic layer and the second sub- organic layer is more than in the sub- organic layer of the third
In value；And
The second inorganic layer is formed, second inorganic layer covers the second sub- organic layer.
7. packaging film forming method as claimed in claim 6, which is characterized in that first son is formed using iCVD techniques
Organic layer, the sub- organic layer of the third and the second sub- organic layer.
8. packaging film forming method as claimed in claim 7, which is characterized in that the initiation of gas phase is passed through into vacuum chamber
Agent and monomer are used to form the high molecular material, wherein, the ratio between molal quantity of the initiator and the monomer is forming institute
Value when stating the first sub- organic layer, the second sub- organic layer is more than or equal in the sub- organic layer of the formation third
Value.
9. packaging film forming method as claimed in claim 8, which is characterized in that formed the first sub- organic layer and/
Or during the second sub- organic layer, the ratio between molal quantity of the initiator and the monomer increases with the time of formation and gradually subtracts
It is small.
10. the packaging film forming method as described in any one of claim 6 to 9, which is characterized in that the device layer is
OLED device layer.
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| CN110459565A (en) * | 2019-08-01 | 2019-11-15 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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| CN108258151B (en) | 2019-09-17 |
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