CN108257982A - Flexible substrate substrate and its manufacturing method, flexible panel and electronic equipment - Google Patents
Flexible substrate substrate and its manufacturing method, flexible panel and electronic equipment Download PDFInfo
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- CN108257982A CN108257982A CN201810064676.5A CN201810064676A CN108257982A CN 108257982 A CN108257982 A CN 108257982A CN 201810064676 A CN201810064676 A CN 201810064676A CN 108257982 A CN108257982 A CN 108257982A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention provides a kind of flexible substrate substrate, the flexible substrate substrate includes at least one layer of flexible body layer and at least one layer of enhancement layer, every layer of enhancement layer corresponds to one layer of flexible body layer, the enhancement layer is arranged on corresponding flexible body layer surface or is embedded in corresponding flexible body layer, and the position of the enhancement layer is corresponding with the position of the functional areas, and the rigidity of the enhancement layer is more than the rigidity of the flexible body layer.The present invention also provides a kind of flexible panel, a kind of electronic equipment and a kind of manufacturing methods of flexible substrate substrate.The flexible panel can mitigate the damage to the electronic device in the flexible panel when towards its flexible base board curving.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly, to a kind of flexible substrate substrate for flexible panel,
A kind of flexible panel, a kind of electronic equipment and a kind of manufacturing method of flexible substrate substrate.
Background technology
Various flexible flexible panels (such as flexible display panels, flexible touch panel have been developed in recent years
Deng).Flexible substrate substrate, flexible substrate substrate and carrying are typically formed on bearing substrate (such as pyroceram substrate)
The adjacent one side of substrate is commonly referred to as bottom surface, and opposite side is commonly referred to as top surface.Then in the top surface of flexible substrate substrate
Upper other steps for forming electronic device (such as thin film transistor (TFT), resistance, capacitance etc.) and making flexible panel, finally will be soft
Property panel is stripped down from bearing substrate.
Often be bent flexible panel due to the use of person, can generate after a period of use, in flexible panel broken string it is bad, because
This, appearance broken string becomes the technical issues of this field is urgently to be resolved hurrily during how avoiding use.
Invention content
The purpose of the present invention is to provide a kind of flexible substrate substrate for flexible panel, a kind of include the flexible substrate
It is the flexible panel of substrate, a kind of including the flexible panel electronic equipment and a kind of manufacturing method of the flexible substrate substrate.It is described
When being bent towards its flexible substrate substrate, the probability that electronic device therein is damaged is lowered flexible panel.
To achieve the above object, as the first aspect of the invention, a kind of flexible substrate for flexible panel is provided
Substrate, the flexible substrate substrate include the top and bottom at through-thickness interval, and the top surface includes setting electronics
The functional areas of device layer, wherein, the flexible substrate substrate includes at least one layer of flexible body layer and at least one layer of enhancement layer, often
The layer enhancement layer corresponds to one layer of flexible body layer, and the enhancement layer is arranged on corresponding flexible body layer surface or embedding
Enter in corresponding flexible body layer, the position of the enhancement layer is corresponding with the position of the functional areas, and the reinforcement
The rigidity of layer is more than the rigidity of the flexible body layer.
Preferably, the enhancement layer is whole face structure or network.
Preferably, the flexible substrate substrate further includes water vapor barrier layer, the surface setting of at least one layer of flexible body layer
There is the water vapor barrier layer.
Preferably, the flexible substrate substrate includes flexible body layer described in enhancement layer described in multilayer and multilayer, multilayer institute
It states enhancement layer to correspond with flexible body layer described in multilayer, the enhancement layer is embedded in corresponding flexible body layer.
Preferably, the flexible substrate substrate includes enhancement layer described in multilayer, is arrived along the top surface of the flexible substrate substrate
The direction of bottom surface, the rigidity of enhancement layer is sequentially reduced described in multilayer.
Preferably, orthographic projection of the functional areas on the enhancement layer is no more than the boundary of the enhancement layer.
As the second aspect of the invention, a kind of flexible panel is provided, the flexible panel includes flexible substrate substrate
With the electronic device layer being arranged on the flexible substrate substrate, which is characterized in that the flexible substrate substrate is institute of the present invention
The above-mentioned flexible substrate substrate provided, the electronic device layer are arranged in the functional areas of the flexible substrate substrate.
Preferably, the rigidity of the enhancement layer is less than the rigidity of the electronic device layer.
As the third aspect of the invention, a kind of electronic equipment is provided, the electronic equipment includes flexible panel,
In, the flexible panel is above-mentioned flexible panel provided by the present invention.
As the fourth aspect of the invention, a kind of manufacturing method of flexible substrate substrate, the flexible liner base are provided
Plate is used for flexible panel, and the flexible substrate substrate includes the top and bottom at through-thickness interval, and the top surface includes using
In the functional areas of setting electronic device layer, wherein, the manufacturing method include the step of forming at least one layer of flexible body layer and
The step of forming at least one layer of enhancement layer, wherein, every layer of enhancement layer corresponds to one layer of flexible body layer, the enhancement layer
It is arranged on corresponding flexible body layer surface or is embedded in corresponding flexible body layer, and the position of the enhancement layer and institute
The position for stating functional areas is corresponding, and the rigidity of the enhancement layer is more than the rigidity of the flexible body layer.
Enhancement layer is increased in the flexible body of flexible substrate substrate, therefore, it is relatively large soft to be finally obtained rigidity
Property underlay substrate.In the functional areas of flexible substrate substrate provided by the present invention, setting includes the electronic device of multiple electronic devices
Layer, to obtain flexible panel.Due to the flexible substrate substrate of flexible panel provided by the present invention, to include rigidity relatively large
Enhancement layer, and including only having the flexible panel of underlay substrate of flexible body layer to compare, when including the flexibility
When the flexible panel of underlay substrate is to far from flexible substrate substrate curving, neutral surface can be to far from flexible substrate substrate side
It is mobile.It is easily understood that the part being located in flexible panel above neutral surface is by tensile stress, and below the neutral surface
Part is by compression.As mentioned above it is possible, when including the flexible panel of the flexible substrate substrate to far from flexible liner base
During plate curving, neutral surface can be moved to far from flexible substrate substrate side, and therefore, the electrode device of flexible panel is at least big
Part can be located at the lower section of neutral surface, that is, the tensile stress meeting that electronic device at the flexible panel inner curve position is subject to
Reduce or compression can be converted into.For electronic device, easily break when receiving tensile stress, rupture etc. and is existing
As.For the situation by tensile stress, phenomena such as being less likely to occur to break when electronic device is by compression, rupture.
Therefore, it sets enhancement layer that can reduce flexible panel in flexible substrate substrate when to flexible substrate substrate curving to occur
Electrical undesirable probability.
Description of the drawings
Attached drawing is to be used to provide further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention, but be not construed as limiting the invention together.In the accompanying drawings：
Attached drawing is to be used to provide further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention, but be not construed as limiting the invention together.In the accompanying drawings：
Fig. 1 is a kind of sectional view of specific embodiment of flexible substrate substrate provided by the present invention；
Fig. 2 is the sectional view of another specific embodiment of flexible substrate substrate provided by the present invention；
Fig. 3 is a kind of sectional view of the specific embodiment for the flexible panel for including flexible substrate substrate shown in Fig. 2；
Fig. 4 is sectional view of the flexible panel shown in Fig. 3 when towards its flexible substrate substrate curving；
Fig. 5 is the sectional view of another specific embodiment of flexible substrate substrate provided by the present invention；
Fig. 6 is the sectional view of another specific embodiment of flexible substrate substrate provided by the present invention；
Fig. 7 is a kind of sectional view of the specific embodiment for the flexible panel for including the flexible substrate substrate shown in Fig. 6；
Fig. 8 is sectional view of the flexible panel shown in Fig. 7 when towards its flexible substrate substrate curving；
Fig. 9 is the sectional view of another specific embodiment of flexible substrate substrate provided by the present invention；
Figure 10 is a kind of specific embodiment flow chart of the manufacturing method of flexible substrate substrate provided by the present invention；
Figure 11 is the flow chart of another specific embodiment of the manufacturing method of flexible substrate substrate provided by the invention.
Reference sign
01：Bearing substrate 02：Enhancement layer
03：Flexible body layer 04：Water vapor barrier layer
051：Source contact area 052：Drain contact region
053：Gate insulating layer 054：Grid
055：Interlayer insulating film 056：Source electrode
057：Drain electrode 058：Passivation layer
06：Anode 07：Luminous material layer
08：Cathode layer 09：Encapsulated layer
10：Neutral surface
Specific embodiment
The specific embodiment of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
The specific embodiment of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
Through the present inventor repeatedly the study found that for existing flexible panel, when it is towards its flexible substrate
During substrate curving, neutral surface is normally at the bottom surface side towards flexible substrate substrate of electronic device therein, also
It is that at this moment electronic device it is bad to be easy to cause broken string etc. by tensile stress.
In view of this, as the first aspect of the invention, a kind of flexible substrate substrate for flexible panel is provided,
In, as shown in Figure 1, the flexible substrate substrate includes the top and bottom at through-thickness interval, top surface includes setting
The functional areas of electronic device layer.
It should be pointed out that the bearing substrate 01 for manufacturing above-mentioned flexible substrate substrate is also shown in Fig. 1.
Specifically, the bottom surface of the flexible substrate substrate be its face adjacent with bearing substrate 01, the flexible liner base
The plate face opposite with bottom surface is the top surface of the flexible substrate substrate.
The flexible substrate substrate includes at least one layer of flexible body layer 03 and at least one layer of enhancement layer 02, every layer of enhancement layer
02 corresponds to one layer of flexible body layer 03, and enhancement layer 02 is arranged on corresponding 03 surface of flexible body layer or is embedded in corresponding soft
In property body layer 03, and the position of enhancement layer 02 is corresponding with the position of the functional areas, and the rigidity of enhancement layer 02 is more than
The rigidity of flexible body layer 03.
For any one material, Young's modulus can be used to characterize its rigidity.The rigidity of enhancement layer 02 is more than soft
Property body layer 03 rigidity namely enhancement layer 02 Young's modulus be more than flexible body layer 03 Young's modulus.
Enhancement layer 02 is increased in the flexible body of flexible substrate substrate, therefore, it is relatively large to be finally obtained rigidity
Flexible substrate substrate.As shown in figure 3, setting includes multiple electronics devices in the functional areas of flexible substrate substrate provided by the present invention
The electronic device layer of part, to obtain flexible panel.Since the flexible substrate substrate of flexible panel provided by the present invention includes
The relatively large enhancement layer of rigidity is compared with the flexible panel including the underlay substrate only with flexible body layer, when
When flexible panel including the flexible substrate substrate is to far from flexible substrate substrate curving, as shown in figure 4, neutral surface 10
It can be moved to far from flexible substrate substrate side.It is easily understood that in flexible panel be located at neutral surface above part by
Tensile stress, and the part below neutral surface is by compression.As mentioned above it is possible, when including the flexible substrate substrate
When flexible panel is to far from flexible substrate substrate curving, neutral surface 10 can be moved to far from flexible substrate substrate side, because
This, the electrode device of flexible panel is at least most of to be located at the lower section of neutral surface 10, that is, be bent in the flexible panel
The tensile stress that electronic device at position is subject to can reduce or can be converted into compression.For electronic device, when receiving
Phenomena such as easily breaking during tensile stress, rupturing.For the situation by tensile stress, electronic device is by compression
When phenomena such as being less likely to occur to break, rupturing.Therefore, it sets enhancement layer that can reduce flexible panel in flexible substrate substrate to exist
To the electrical undesirable probability of generation during flexible substrate substrate curving.
Flexible substrate substrate shown in Fig. 1 and Fig. 5 includes one layer of enhancement layer 02 and one layer of flexible body layer 03, and
In the embodiment, enhancement layer 02 is embedded in flexible body 03.
As another embodiment of the invention, the flexible substrate substrate includes multilayer enhancement layer 02 and layer flexible
Body layer 03, multilayer enhancement layer 02 are corresponded with layer flexible body layer 03, and enhancement layer 02 is embedded in corresponding flexible body
In layer 03.
It is to be understood that multilayer enhancement layer 02 herein refers to layer flexible body layer 03 " one-to-one correspondence ", strengthen
The number of plies of layer 02 is identical with the number of plies of flexible body layer 03.When the flexible substrate substrate includes two sheets of flexible body layer 03,
The flexible substrate substrate also includes two layers of enhancement layer 02.When flexible substrate substrate includes three layers of flexible body layer 03, the flexibility
Underlay substrate also includes three layers of enhancement layer.And so on, it is no longer exhaustive here.
Flexible substrate substrate shown in Fig. 2 and Fig. 6 includes two sheets of flexible body layer 03, in every layer of flexible body layer 03
Embedded corresponding enhancement layer 02.
In Fig. 1 and flexible substrate substrate shown in fig. 5, including one layer of flexible body layer 03 and one layer of enhancement layer 02, two
Person is corresponding.Enhancement layer 02 is embedded in flexible body layer 03.
Specifically, in Fig. 2 and flexible substrate substrate shown in fig. 6, including two sheets of flexible body layer and two layers of enhancement layer,
Wherein every layer of enhancement layer 02 respectively corresponds to one layer of flexible body layer 03.Two layers of enhancement layer 03 is respectively embedded in corresponding flexible body
In layer 03.
Specifically, in flexible substrate substrate shown in Fig. 9, including three layers of flexible body layer 03 and two layers of enhancement layer 02,
Wherein every layer of enhancement layer 02 respectively corresponds to one layer of flexible body layer 03.Positioned at the flexible body layer 03 of the flexible substrate substrate bottom surface
Enhancement layer 02 is not corresponded to.In flexible substrate substrate shown in Fig. 9, every layer of enhancement layer 02 is arranged on corresponding flexible body layer
03 surface.
In the present invention, the concrete structure of enhancement layer 02 is not done specifically limited.For example, enhancement layer 02 is whole face structure
(that is, flood material does not include the structures such as hole, slot) or network.For example, the enhancement layer 02 shown in Fig. 1, Fig. 2 and Fig. 9
For whole face structure, shown enhancement layer 02 is network in fig. 5 and fig..
In contrast, for the enhancement layer of whole face structure 02, manufacturing process is simpler；Reinforcement for network
Layer since its internal stress is eased, is more advantageous to the structural stability of overall flexibility underlay substrate.User can have
Body situation selects the enhancement layer 02 with Facad structure or the enhancement layer with network 02.
Preferably, the flexible substrate substrate further includes water vapor barrier layer 04, the surface of at least one layer of flexible body layer 03
It is provided with water vapor barrier layer 04.
Specifically, it is both provided with multilayer water vapor barrier layer 04 in the flexible substrate substrate shown in Fig. 2, Fig. 6 and Fig. 9.
Water vapor barrier layer 04 is for example by the nitride (SiN of siliconx) and/or silicon oxide (SiOx) be made.
Since the electronic device subsequently formed on flexible substrate substrate includes metal parts more, water vapor barrier layer is set
It can prevent steam and oxygen from entering electronic device from flexible substrate substrate, and further prevent electronic device by steam, oxygen
Gas corrosion improves the service life of flexible panel.
Need the those skilled in the art illustrated that can water vapor barrier layer 04 be set as one layer or more according to actual needs
Layer, the present invention do not limit this.
Preferably, such as shown in fig. 6, the flexible substrate substrate includes enhancement layer 02 described in multilayer, along the flexibility
The top surface of underlay substrate is to the direction of bottom surface, and the rigidity of enhancement layer is sequentially reduced described in multilayer.Also, near the reinforcement of top surface
The rigidity of layer is less than the rigidity of electronic device layer in the flexible panel for including the flexible substrate substrate.
In this way, it may be such that in flexible substrate substrate, along the direction of vertical flexible substrate substrate bottom surface, flexible liner base
The gradient of the stress of intralamellar part is more smooth, is conducive to the structural stability inside flexible substrate substrate.
The structure of flexible substrate substrate is simpler and manufacturing process is simpler to make, and those skilled in the art are similary
Multilayer enhancement layer 02 can be set as being made of identical material, it is also identical so as to the rigidity of each layer enhancement layer 02.
Preferably, orthographic projection of the functional areas on the enhancement layer is no more than the boundary of the enhancement layer.In this way,
The flexible panel made on this flexible substrate substrate, when it is by towards flexible substrate substrate curving, repertoire area
Corresponding neutral surface can be deviated to electronic device thereon, so as to protect the electronic device in repertoire area.
Those skilled in the art can equally be set, and the radius of curvature being only bent in the application in follow-up flexible panel is smaller
The corresponding position in functional areas setting enhancement layer, can so save the material cost for enhancement layer.
In the present invention, special limitation is not done to the specific material of flexible body layer 03, for example, flexible body layer 03
Resin material, such as polyimides (PI), polyethylene terephthalate (PET), poly- naphthalenedicarboxylic acid second two can generally be chosen
One or more combinations in the materials such as alcohol ester (PEN).
Enhancement layer 02 can choose the material that any rigidity is more than flexible body layer 03, such as enhancement layer 02 can be by metal
Film made of material.
Preferably, it is advantageous in this way as shown in figure 9, the bottom surface of flexible substrate substrate is made of entire flexible body layer 03
In subsequent stripping technology.
As the second aspect of the invention, a kind of flexible panel is provided, wherein, as shown in Figure 3 and Figure 7, flexible panel
Including flexible substrate substrate and the electronic device layer being arranged on the flexible substrate substrate, wherein, which is this
Invent the above-mentioned flexible substrate substrate that is provided, the function that the electronic device layer is arranged on the flexible substrate substrate is gone.
As mentioned above it is possible, since flexible substrate substrate includes the relatively large enhancement layer 02 of rigidity, including flexibility
The flexible panel of underlay substrate bending when, neutral surface moves up, so as to ensure electronic device layer be located at neutral surface and in
Property face below place of safety in, so as to avoid electronic device by tensile stress, and prevent electronic device bending when be damaged.
In the present invention, special restriction is not done to the electronic device in electronic device layer.For example, electronic device can be with
Including Organic Light Emitting Diode, thin film transistor (TFT), capacitance, resistance etc..Fig. 3 and flexible panel shown in Fig. 7 are flexible organic
LED display panel.As shown in figure 3, electronic device includes thin film transistor (TFT) and Organic Light Emitting Diode.Wherein, film
Transistor includes the active layer with source contact area 051 and drain contact region 052, grid 054, is arranged on grid 054 and has
Gate insulating layer 053, source electrode 056 and drain electrode 057 between active layer.Organic Light Emitting Diode is included by running through passivation layer 058
Via and drain electrode 057 anode 06, the luminous material layer 07 that are electrically connected (including hole transmission layer, luminescent layer and electron transfer layer)
With cathode layer 08.Encapsulated layer 09 is additionally provided in the outermost layer of the flexibility OLED display panel.
When the flexible panel faces away from flexible substrate substrate curving, as shown in Figure 4 and Figure 8, neutral surface 10
It is moved to the direction of the bottom surface far from flexible substrate substrate, that is, the tensile stress that thin film transistor (TFT) 05 is subject at this time can reduce,
Even become compression.In this way, 05 undesirable probability of thin film transistor (TFT) can be effectively reduced.
Preferably, the rigidity of the enhancement layer 02 is less than the equivalent stiffness of the flexible panel thin film transistor (TFT) entirety, from
And in flexible device bend, neutral line is moved to rigidity compared with general orientation, is received so as to protecting flexible device thin film transistor (TFT)
Tensile stress reduces or switchs to by compression
As the third aspect of the invention, a kind of electronic equipment is also provided, including flexible panel provided by the invention.Electricity
Sub- equipment is such as mobile phone, tablet computer, Intelligent bracelet.
As the fourth aspect of the invention, a kind of manufacturing method of flexible substrate substrate is also provided.The flexible substrate
Substrate is used for flexible panel, and the flexible substrate substrate includes the top and bottom at through-thickness interval, and the top surface includes
For setting the functional areas of electronic device layer, the manufacturing method, which is included on bearing substrate, forms at least one layer of flexible body layer
The step of and the step of form at least one layer of enhancement layer, wherein, every layer of enhancement layer corresponds to one layer of flexible body layer, institute
Enhancement layer is stated to be arranged on corresponding flexible body layer surface or be embedded in corresponding flexible body layer, and the enhancement layer
Position is corresponding with the position of the functional areas, and the rigidity of the enhancement layer is more than the rigidity of the flexible body layer.
The flexibility that the first aspect of the present invention is provided can be manufactured using above-mentioned manufacturing method provided by the present invention
Underlay substrate.
A kind of manufacturing method of flexible substrate substrate is introduced referring to Figure 10, is included the following steps.Each enhancement layer therein with
Illustrate for metal material.The flexible panel is flexible OLED display panel.
Specifically, in a step 11, one layer of metallic film is deposited on bearing substrate, light then is carried out to the metallic film
The patterning process such as carve to obtain first layer enhancement layer.Corresponding to flexible substrate substrate shown in FIG. 1, metallic film is through graphical
En-block construction is presented later.Corresponding to flexible substrate substrate shown in fig. 5, latticed knot is presented after graphical in metallic film
Structure.
In step s 12, first layer flexible body layer is formed on first layer enhancement layer.
Specifically, flexible body material, such as polyimides (PI) are coated on first layer enhancement layer, it is carried out later
Planarization and curing process.Obtain product as shown in Figure 1 and Figure 5.
In another embodiment, the manufacturing process of flexible substrate substrate is completed to this, can proceed with electronics
The subsequent techniques such as the manufacture of device.
In step s 13, first layer water vapor barrier layer is formed on first layer flexible body layer.
Specifically, one layer of SiO is deposited for example, by using chemical vapor deposition method2Film.It should be noted that this step is
Optional step.
In another embodiment, the manufacturing process of flexible substrate substrate is completed to this, can proceed with electronics
The subsequent techniques such as the manufacture of device.
In step S14, second layer enhancement layer is formed on first layer water vapor barrier layer.
Specifically, one layer of metallic film is deposited on first layer water vapor barrier layer, photoetching then is carried out to the metallic film
Patterning process is waited to form the shape of the metallic film.Corresponding flexible substrate substrate shown in Fig. 2, metallic film is through graphical
En-block construction is presented later.Fenestral fabric is presented after graphical in corresponding flexible substrate substrate shown in fig. 6, metallic film.
In step S15, second layer flexible body layer is formed on second layer enhancement layer.
Specific method is identical with step S12.
In step s 16, second layer water vapor barrier layer is formed on second layer flexible body layer.
Specific method is identical with step S14.It should be noted that this step is also optional step.After the completion of this step
Product form referring to shown in Fig. 2 and Fig. 6.
So far, the manufacture of the flexible substrate substrate is completed, it is possible to further continue to complete flexible OLED display surfaces
Plate dorsulum and vapor deposition packaging technology, and removed from bearing substrate 01 flexible OLED display panel using 308nm laser.Stripping
It is shown in Figure 7 from preceding product form.Due to the method that this field routine can be used in this step, and with the present invention purport without
It closes, therefore does not repeat.
A kind of manufacturing method of flexible substrate substrate is introduced referring to Figure 11, is included the following steps.
In the step s 21, first layer flexible body layer is formed on bearing substrate.
In step S22, first layer water vapor barrier layer is formed on first layer flexible body layer.This step is optional step
Suddenly.
In step S23, formed on first layer water vapor barrier layer and add first layer enhancement layer.
In step s 24, second layer flexible body layer is formed on the surface of first layer enhancement layer.
In step s 25, second layer enhancement layer is formed on the surface of second layer flexible body layer.
In step S26, third layer flexible body layer is formed on the surface of second layer enhancement layer.
In step s 27, water vapor barrier layer is formed on third layer flexible body layer.
The product form after step S27 is completed for example shown in Fig. 9.
It notices in entire technical process, each enhancement layer is both formed in the surface of flexible body layer.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of flexible substrate substrate for flexible panel, the flexible substrate substrate includes the top surface at through-thickness interval
And bottom surface, the top surface include the functional areas for setting electronic device layer, which is characterized in that the flexible substrate substrate includes
At least one layer of flexible body layer and at least one layer of enhancement layer, every layer of enhancement layer corresponds to one layer of flexible body layer, described
Enhancement layer is arranged on corresponding flexible body layer surface or is embedded in corresponding flexible body layer, the position of the enhancement layer
It is corresponding with the position of the functional areas, and the rigidity of the enhancement layer is more than the rigidity of the flexible body layer.
2. flexible substrate substrate according to claim 1, which is characterized in that the enhancement layer is whole face structure or grid knot
Structure.
3. flexible substrate substrate according to claim 1, which is characterized in that the flexible substrate substrate further includes steam resistance
Barrier, the surface of at least one layer of flexible body layer are provided with the water vapor barrier layer.
4. flexible substrate substrate according to claim 1, which is characterized in that the flexible substrate substrate is included described in multilayer
Flexible body layer described in enhancement layer and multilayer, enhancement layer described in multilayer are corresponded with flexible body layer described in multilayer, described to add
Strong layer is embedded in corresponding flexible body layer.
5. flexible substrate substrate as claimed in any of claims 1 to 4, which is characterized in that the flexible liner base
Plate includes enhancement layer described in multilayer, and along the top surface of the flexible substrate substrate to the direction of bottom surface, enhancement layer is firm described in multilayer
Degree is sequentially reduced.
6. flexible substrate substrate as claimed in any of claims 1 to 4, which is characterized in that the functional areas are in institute
State the boundary that the orthographic projection on enhancement layer is no more than the enhancement layer.
7. a kind of flexible panel, the flexible panel includes flexible substrate substrate and the electricity being arranged on the flexible substrate substrate
Sub- device layer, which is characterized in that the flexible substrate substrate is the flexible liner base described in any one in claim 1-6
Plate, the electronic device layer are arranged in the functional areas of the flexible substrate substrate.
8. flexible panel according to claim 7, which is characterized in that the rigidity of the enhancement layer is less than the electronic device
The rigidity of layer.
9. a kind of electronic equipment, the electronic equipment includes flexible panel, which is characterized in that the flexible panel is claim
Flexible panel described in 7 or 8.
10. a kind of manufacturing method of flexible substrate substrate, the flexible substrate substrate is used for flexible panel, the flexible liner base
Plate includes the top and bottom at through-thickness interval, and the top surface includes the functional areas for setting electronic device layer, special
Sign is that the manufacturing method includes the step of forming at least one layer of flexible body layer and the step for forming at least one layer of enhancement layer
Suddenly, wherein, every layer of enhancement layer corresponds to one layer of flexible body layer, and the enhancement layer is arranged on corresponding flexible body layer
Surface is embedded in corresponding flexible body layer, and the position of the enhancement layer is corresponding with the position of the functional areas,
And the rigidity of the enhancement layer is more than the rigidity of the flexible body layer.
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