CN111653607B - Flexible display panel - Google Patents

Flexible display panel Download PDF

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Publication number
CN111653607B
CN111653607B CN202010616114.4A CN202010616114A CN111653607B CN 111653607 B CN111653607 B CN 111653607B CN 202010616114 A CN202010616114 A CN 202010616114A CN 111653607 B CN111653607 B CN 111653607B
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layer
organic
display panel
flexible display
organic film
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CN111653607A (en
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孙垒涛
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment

Abstract

The application provides a flexible display panel and flexible display panel preparation method, including organic rete and resilience supporting layer, make the material of organic rete is organic material, the resilience supporting layer set up in the organic rete, wherein, the resilience performance of resilience supporting layer is greater than the resilience performance of organic rete. Through be in set up resilience performance in the organic rete and be greater than the resilience supporting layer of organic rete makes flexible display panel is buckling the in-process that the back was expanded, the resilience supporting layer is greater than because its self resilience performance organic rete can be at the in-process of self resilience simultaneously to other retes of flexible display panel provide supplementary restoring force, make flexible display panel can resume the state of flattening completely after buckling, avoid producing long-term crease, improved flexible display panel's reliability.

Description

Flexible display panel
Technical Field
The application relates to the technical field of display, in particular to a flexible display panel.
Background
With the development of display technology, users have made various demands on display devices. In order to meet different use requirements, various display products with different characteristics are applied accordingly. In particular, consumers now pursue a simple large screen, and expect a large screen and better portability, and therefore, flexible and foldable display panels are used. However, in practical applications, after the flexible foldable display panel is bent for a long time, the deformation of the bending region cannot be completely recovered, and a crease is generated.
Disclosure of Invention
According to a first aspect of embodiments of the present application, there is provided a flexible display panel including:
the organic film layer is made of organic materials;
the rebound supporting layer is arranged in the organic film layer;
wherein the resilience of the resilient support layer is greater than the resilience of the organic film layer.
In one embodiment, the resilient support layer is in the shape of a grid.
In one embodiment, the material from which the resilient support layer is made is a metal.
In one embodiment, the metal from which the resilient support layer is made is titanium.
In an embodiment, the flexible display panel includes a plurality of organic film layers, the resilient support layers are respectively disposed in at least two of the organic film layers, and orthogonal projections of meshes of the resilient support layers located in different layers on the same organic film layer are staggered with each other.
In one embodiment, the flexible display panel includes a flexible substrate layer, the flexible substrate layer includes a first flexible substrate and a second flexible substrate, a first inorganic buffer layer is disposed between the first flexible substrate and the second flexible substrate, the first flexible substrate and the second flexible substrate are both the organic film layer, and a resilient support layer is disposed in each of the first flexible substrate and the second flexible substrate.
In one embodiment, the flexible display panel further includes a thin film transistor layer, an organic light emitting device layer, and a thin film encapsulation layer sequentially stacked on the flexible substrate layer, wherein a planarization layer is disposed between the thin film transistor layer and the organic light emitting device layer, the planarization layer is the organic film layer, and a resilient support layer is disposed in the planarization layer.
In one embodiment, the thin film encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer, which are stacked, the organic encapsulation layer is the organic film layer, and the resilient support layer is disposed in the organic encapsulation layer.
In one embodiment, the grid of the resilient support layer comprises routing portions and hollowed-out portions, the routing portions enclosing to form the hollowed-out portions; the organic light-emitting device layer comprises a plurality of light emergent regions and non-light emergent regions, and the regions among the light emergent regions are the non-light emergent regions;
the flexible display panel is top-emitting, and the projection of the wiring part of the rebound supporting layer arranged on the organic packaging layer on the organic light-emitting device layer is positioned in the non-light-emitting area; or the like, or, alternatively,
the flexible display panel is bottom-emitting, and the projections of the wiring parts of the springback supporting layer arranged on the flexible substrate layer and the planarization layer in the organic light-emitting device layer are located in the non-light-emitting area.
According to a second aspect of the embodiments of the present application, there is provided a method for manufacturing a flexible display panel, including:
providing a substrate;
coating organic glue on the substrate to form a first organic film layer;
depositing metal on the first sublayer of the organic film layer, and carrying out exposure, development and etching on the metal to form a rebound supporting layer;
and coating organic glue on the organic film layer first sub-layer and the rebound supporting layer to form an organic film layer second sub-layer.
The embodiment of the application provides a flexible display panel and flexible display panel manufacturing method, including organic rete and resilience supporting layer, make the material of organic rete is organic material, the resilience supporting layer set up in the organic rete, wherein, the resilience performance of resilience supporting layer is greater than the resilience performance of organic rete. Through be in set up resilience performance in the organic rete and be greater than the resilience supporting layer of organic rete makes flexible display panel is buckling the in-process that the back was expanded, the resilience supporting layer is greater than because its self resilience performance organic rete can be at the in-process of self resilience simultaneously to other retes of flexible display panel provide supplementary restoring force, make flexible display panel can resume the state of flattening completely after buckling, avoid producing long-term crease, improved flexible display panel's reliability.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
Fig. 1 is a schematic cross-sectional view of a flexible display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic top view of a resilient support layer of a flexible display panel according to another embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view of a flexible display panel according to yet another embodiment of the present application;
fig. 4 is a schematic top view of a resilient support layer of a flexible display panel according to yet another embodiment of the present application;
fig. 5 is a schematic cross-sectional view of a flexible display panel according to yet another embodiment of the present application;
fig. 6 is a schematic cross-sectional view of a flexible display panel according to yet another embodiment of the present application;
fig. 7 is a flowchart of a method for manufacturing a flexible display panel according to another embodiment of the present disclosure.
Description of reference numerals:
a flexible display panel 100;
an organic film layer 1; an organic film layer first sublayer 11; an organic film layer second sub-layer 12;
a rebound support layer 2; a routing portion 21; a hollowed-out portion 22;
a flexible substrate layer 3; a first flexible substrate 31; a first inorganic buffer layer 32; a second flexible substrate 33;
a thin-film transistor layer 4; a thin film transistor 41; a gate electrode 411; a source 412; a drain 413; a semiconductor layer 414; a gate insulating layer 42; a capacitor dielectric layer 43; a passivation layer 44;
a planarization layer 5;
an organic light-emitting device layer 6; a light exit region 61; a non-light-exiting region 62; an anode 63; a light-emitting layer 64; a pixel isolation pillar 65; a pixel defining layer 66;
a thin film encapsulation layer 7; an inorganic encapsulating layer 71; an organic encapsulation layer 72;
a second inorganic buffer layer 8;
third inorganic buffer layer 9
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "plurality" includes two, and is equivalent to at least two. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The following describes the display panel and the display device in the embodiments of the present application in detail with reference to the accompanying drawings. The features of the following examples and embodiments can be supplemented by or combined with each other without conflict.
The present embodiment provides a flexible display panel 100. Referring to fig. 1, the flexible display panel 100 includes an organic film layer 1 and a resilient support layer 2, the organic film layer 1 is made of an organic material, the resilient support layer 2 is disposed in the organic film layer 1, and a resilience of the resilient support layer 2 is greater than a resilience of the organic film layer 1.
This embodiment is through set up resilience performance in organic rete 1 and be greater than organic rete 1's resilience supporting layer 2 makes flexible display panel 100 is buckling the in-process that the back was expanded, resilience supporting layer 2 is greater than organic rete 1 can be in the in-process of self resilience simultaneously to other rete of flexible display panel 100 provide supplementary resilience, make flexible display panel 100 can resume the state of flattening completely after buckling, avoid producing long-term crease, improved flexible display panel 100's reliability.
In another embodiment, with continued reference to fig. 1, the flexible display panel 100 is an Active matrix organic light-emitting diode (Active matrix organic light-emitting diode) display panel, and the flexible display panel 100 can be bent, specifically, the flexible display panel 100 can be a display panel bent along a fixed axis, and can also be a display panel that can be bent at will without limitation to the axis. The flexible display panel 100 includes one or more organic film layers, the material for making the organic film layers is an organic material, and specifically, the material for making the organic film layers may be polyimide.
In another embodiment, with continued reference to fig. 1 and 2, the resilient support layer 2 is in the form of a grid. Specifically, the grid of the resilient support layer 2 comprises a routing part 21 and a hollow part 22, and the routing part 21 encloses the hollow part 22. The hollowed-out portion 22 may include one or more of a rectangular shape, a diamond shape, a circular shape, an oval shape, and the like. The organic film layer 1 is wrapped around the wiring part 21. The material of the rebound support layer 2 is metal. Specifically, the metal of the resilient support layer 2 is titanium. In this embodiment, the rebounding support layer 2 is disposed in the organic film layer 1, so that the routing portion 21 is completely wrapped by the organic film layer 1, and the rebounding support layer 2 is better bonded to the film layer of the flexible display panel 100 by using the good buffering performance and bonding performance of the material of the organic film layer 1. And the latticed resilience supporting layer 2 can better release stress in the bending process, so that the local accumulation of stress is avoided, and the risks of breakage of the resilience supporting layer 2 and peeling of the film layer are reduced, so that the resilience supporting layer 2 provides restoring force for the flexible display panel 100 to ensure the self reliability of the resilience supporting layer 2 while the flexible display panel 100 can be restored to a flat state, and further the bending reliability of the flexible display panel 100 is integrally improved.
In another embodiment, referring to fig. 2 to 6, the flexible display panel 100 includes a plurality of organic film layers, at least two organic film layers of the plurality of organic film layers are respectively provided with the resilient support layer 2, and orthogonal projections of grids of the resilient support layer 2 located in different layers on the same organic film layer are staggered with each other. In particular, the meshes of the resilient support layer 2 located in the different layers may be arranged in the shape as shown in fig. 2 and 4, respectively. The grids of the rebound supporting layers 2 on different layers are arranged in a staggered mode, so that the stress of the rebound supporting layers 2 on different layers can be dispersed when the support is bent, and the problems of breakage and the like caused by stress concentration are avoided.
In a conventional hard-screen display panel, a hard material such as glass is generally used as a substrate material, the glass has a sufficient supporting function for a display array disposed on an upper side thereof, and in a bending display field, in order to meet a bending requirement, the glass substrate is replaced with a flexible substrate. However, the strength of the flexible substrate is low, so that the flexible substrate has a limited supporting effect on the display array disposed on the upper side of the flexible substrate, and after being bent for a long time or bent for a large angle, the flexible substrate may be subjected to inelastic deformation, so that the flexible substrate cannot provide a restoring force for restoring itself to a flat state.
In another embodiment, with continued reference to fig. 1, the flexible display panel 100 includes a flexible substrate layer 3, and a thin film transistor layer 4, an organic light emitting device layer 6, and a thin film encapsulation layer 7 are sequentially stacked on the flexible substrate layer 3. The flexible substrate layer 3 is the organic film layer 1, the flexible substrate layer 3 is made of polyimide, the rebound support layer 2 is arranged in the flexible substrate layer 3, and the rebound performance of the rebound support layer 2 is greater than that of the organic film layer 1. Due to the fact that the rebound support layer 2 is arranged in the flexible substrate layer 3, after the flexible display panel 100 is bent for a long time or bent at a large angle, the rebound support layer 2 can provide an auxiliary restoring force for the flexible substrate layer 3, so that the flexible substrate is restored to a flat state, and the flexible display panel 100 is prevented from generating creases.
Further, referring to fig. 3, the flexible substrate layer 3 includes a first flexible substrate 31 and a second flexible substrate 33, a first inorganic buffer layer 32 is disposed between the first flexible substrate 31 and the second flexible substrate 33, both the first flexible substrate 31 and the second flexible substrate 33 are the organic film layers, and both the first flexible substrate 31 and the second flexible substrate 33 are provided with a resilient support layer 2. The grids of the resilient support layer 2 disposed in the first flexible substrate 31 and the second flexible substrate 33 are staggered with each other in the orthographic projection of the first flexible substrate 31.
In another embodiment, referring to fig. 5 and fig. 6, a planarization layer 5 is disposed between the thin-film transistor layer 4 and the organic light emitting device layer 6, the planarization layer 5 is the organic film layer, and a resilient support layer 2 is disposed in the planarization layer 5.
In another embodiment, referring to fig. 5 and fig. 6, the thin film encapsulation layer 7 includes an inorganic encapsulation layer 71 and an organic encapsulation layer 72, which are stacked, the organic encapsulation layer 72 is the organic film layer, and the resilient support layer 2 is disposed in the organic encapsulation layer 72.
In another embodiment, with continuing reference to fig. 5 and 6, the organic light emitting device layer 6 includes a plurality of light exiting regions 61 and non-light exiting regions 62, and the regions between the plurality of light exiting regions 61 are the non-light exiting regions 62. Referring to fig. 5, the flexible display panel 100 is top-emitting, and the projection of the wire traces 21 of the resilient support layer 2 disposed on the organic encapsulation layer 72 on the organic light emitting device layer 6 is located in the non-light-emitting area 62. Referring to fig. 6, the flexible display panel 100 is bottom emission, and the projections of the wire traces 21 of the resilient support layer 2 disposed on the flexible substrate layer 3 and the planarization layer 5 on the organic light emitting device layer 6 are located in the non-light emitting area 62. Thus, the rebound support layer 2 does not block light of the organic light emitting device.
In another embodiment, please refer to fig. 7, a method for manufacturing a flexible display panel 100 is provided. The method comprises the following steps: providing a substrate; coating organic glue on the substrate to form an organic film layer first sub-layer 11; depositing metal on the first sublayer 11 of the organic film layer, and carrying out exposure, development and etching on the metal to form a rebound supporting layer 2; and coating organic glue on the organic film first sub-layer 11 and the rebound supporting layer 2 to form an organic film second sub-layer 12.
Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.

Claims (8)

1. A flexible display panel, comprising:
the organic film layer is made of organic materials;
the rebound supporting layer is arranged in the organic film layer;
wherein the resilience of the resilient support layer is greater than the resilience of the organic film layer,
the shape of the springback supporting layer is a grid shape;
the flexible display panel comprises a plurality of layers of organic film layers, wherein at least two layers of the organic film layers are respectively provided with the rebound supporting layers, and orthographic projections of grids of the rebound supporting layers on different layers on the same organic film layer are mutually staggered.
2. The flexible display panel of claim 1, wherein the material from which the resilient support layer is made is a metal.
3. The flexible display panel of claim 2, wherein the metal of which the resilient support layer is made is titanium.
4. The flexible display panel according to claim 1, wherein the flexible display panel comprises a flexible substrate layer, the flexible substrate layer comprises a first flexible substrate and a second flexible substrate, a first inorganic buffer layer is disposed between the first flexible substrate and the second flexible substrate, the first flexible substrate and the second flexible substrate are both the organic film layers, and a resilient support layer is disposed in each of the first flexible substrate and the second flexible substrate.
5. The flexible display panel of claim 4, further comprising a thin film transistor layer, an organic light emitting device layer, and a thin film encapsulation layer sequentially stacked on the flexible substrate layer, wherein a planarization layer is disposed between the thin film transistor layer and the organic light emitting device layer, the planarization layer is the organic film layer, and a resilient support layer is disposed in the planarization layer.
6. The flexible display panel of claim 5, wherein the thin film encapsulation layer comprises an inorganic encapsulation layer and an organic encapsulation layer stacked together, the organic encapsulation layer is the organic film layer, and the resilient support layer is disposed in the organic encapsulation layer.
7. The flexible display panel of claim 6,
the grids of the springback supporting layer comprise routing parts and hollow parts, and the routing parts are enclosed to form the hollow parts; the organic light-emitting device layer comprises a plurality of light emergent regions and non-light emergent regions, and the regions among the light emergent regions are the non-light emergent regions;
the flexible display panel is top-emitting, and the projection of the wiring part of the rebound supporting layer arranged on the organic packaging layer on the organic light-emitting device layer is positioned in the non-light-emitting area; or the like, or a combination thereof,
the flexible display panel is bottom-emitting, and the projections of the wiring parts of the springback supporting layer arranged on the flexible substrate layer and the planarization layer in the organic light-emitting device layer are located in the non-light-emitting area.
8. A method for manufacturing a flexible display panel is characterized by comprising the following steps:
providing a substrate;
coating organic glue on the substrate to form an organic film layer first sub-layer;
depositing metal on the first sublayer of the organic film layer, and carrying out exposure, development and etching on the metal to form a rebound supporting layer;
coating organic glue on the organic film first sub-layer and the rebound support layer to form an organic film second sub-layer,
wherein the shape of the rebound supporting layer is a grid shape;
the flexible display panel comprises a plurality of layers of organic film layers, wherein at least two layers of the organic film layers are respectively provided with the rebound supporting layers, and orthographic projections of grids of the rebound supporting layers on different layers on the same organic film layer are mutually staggered.
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US20240107864A1 (en) * 2021-02-19 2024-03-28 Google Llc Foldable device with bezel located camera
CN114241908B (en) * 2021-12-14 2024-02-09 Tcl华星光电技术有限公司 Film structure and display device

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CN106783912A (en) * 2016-11-11 2017-05-31 武汉华星光电技术有限公司 Flexible display panels and flexible display apparatus
CN107743340A (en) * 2017-11-20 2018-02-27 武汉华星光电半导体显示技术有限公司 Flexible PCB and display screen
CN108257982A (en) * 2018-01-23 2018-07-06 京东方科技集团股份有限公司 Flexible substrate substrate and its manufacturing method, flexible panel and electronic equipment
CN109192876A (en) * 2018-08-02 2019-01-11 昆山国显光电有限公司 Thin-film packing structure, flexible display screen and the display device of flexible display screen
CN110475452A (en) * 2019-08-21 2019-11-19 武汉华星光电半导体显示技术有限公司 Cover board and display panel

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Publication number Priority date Publication date Assignee Title
CN102496684A (en) * 2011-12-27 2012-06-13 昆山龙腾光电有限公司 Flexible display
CN106783912A (en) * 2016-11-11 2017-05-31 武汉华星光电技术有限公司 Flexible display panels and flexible display apparatus
CN107743340A (en) * 2017-11-20 2018-02-27 武汉华星光电半导体显示技术有限公司 Flexible PCB and display screen
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