CN108254585B - MEMS accelerometer - Google Patents
MEMS accelerometer Download PDFInfo
- Publication number
- CN108254585B CN108254585B CN201810109838.2A CN201810109838A CN108254585B CN 108254585 B CN108254585 B CN 108254585B CN 201810109838 A CN201810109838 A CN 201810109838A CN 108254585 B CN108254585 B CN 108254585B
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- China
- Prior art keywords
- substrate
- pin
- fixedly arranged
- metal pin
- lower substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 33
- 230000001133 acceleration Effects 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
Abstract
The invention discloses an MEMS accelerometer, which comprises an upper substrate and a lower substrate, wherein a radiating side substrate is fixedly arranged on the outer surface of one side of the upper substrate, a metal pin is fixedly arranged on one side of the outer surface of the upper end of the upper substrate, a screw is arranged on the outer surface of the upper end of the upper substrate, which is close to one side of the metal pin, a pin rubber cap is movably arranged at the upper end of the metal pin, a pull ring is fixedly arranged on the outer surface of the upper end of the pin rubber cap, a lantern ring is fixedly arranged on the outer surface of the pin rubber cap, which is close to the metal pin, and a frame is arranged on the outer surface of the lower substrate, which is close to the radiating side substrate. The MEMS accelerometer is provided with the pin rubber cap, the radiating side substrate and the thermistor, so that the pins can be prevented from being damaged during transportation, heat generated by the instrument can be radiated, an internal circuit can be protected, and a better application prospect is brought.
Description
Technical Field
The invention relates to the field of speed measurement, in particular to an MEMS accelerometer.
Background
The accelerometer is an inertial sensor, and can measure the acceleration force of an object, wherein the acceleration force is the force acting on the object in the acceleration process of the object, the inclination angle of the device relative to the horizontal plane can be calculated by measuring the acceleration caused by gravity, and the moving mode of the device can be analyzed by analyzing the dynamic acceleration; the existing MEMS accelerometer has certain defects when in use, pins of the accelerometer are needle-shaped, personnel can be scratched in the transportation and installation processes, the pins can be damaged due to external acting force, heat generated in the instrument cannot be timely emitted, the service life can be reduced, the internal elements can be damaged due to abnormality of an external circuit, and certain influence is brought to the use of the accelerometer.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an MEMS accelerometer.
In order to solve the technical problems, the invention provides the following technical scheme:
The invention relates to an MEMS accelerometer, which comprises an upper substrate and a lower substrate, wherein a heat radiation side substrate is fixedly arranged on one side outer surface of the upper substrate, a metal pin is fixedly arranged on one side of the outer surface of the upper end of the upper substrate, a screw is arranged on the outer surface of the upper end of the upper substrate, which is close to one side of the metal pin, a pin rubber cap is movably arranged at the upper end of the metal pin, a pull ring is fixedly arranged on the outer surface of the upper end of the pin rubber cap, a lantern ring is fixedly arranged on the outer surface of the pin rubber cap, which is close to the metal pin, the lower substrate is arranged below the upper substrate, a frame is arranged on the outer surface of the lower substrate, which is close to the heat radiation side substrate, the lower substrate is fixedly connected with the upper substrate through the frame and the heat radiation side substrate, an amplifier is fixedly arranged at the inner middle position of the lower substrate, an acceleration sensor is fixedly arranged on the outer surface of the upper end of the lower substrate, which is close to one side of the amplifier, a chip is fixedly arranged on the outer surface of the front end of the amplifier, a thermistor is fixedly arranged on the inner wall of the lower substrate, and a wire is fixedly arranged between the chip and the chip.
Preferably, through holes are formed in the outer surface of the heat dissipation side substrate, the number of the heat dissipation side substrates is four, and the number of the through holes is a plurality of groups.
Preferably, the length of the pin rubber cap is one half of the length of the metal pin, the inner diameter of the pin rubber cap is equal to the outer diameter of the metal pin, and the number of the metal pin and the number of the pin rubber cap are all several groups.
Preferably, the outer surface of the lower end of the lower substrate is provided with an anti-magnetic interference outer cover, the outer surface of the anti-magnetic interference outer cover is provided with a mounting screw hole, and the inner surface of the upper substrate is provided with a waterproof interlayer.
Preferably, the number of the screws is two, the outer surface of the lantern ring is provided with anti-skid stripes, and the number of the anti-skid stripes is a plurality of groups.
Preferably, the thermistor is electrically connected with the chip, and the acceleration sensor is electrically connected with the amplifier.
The beneficial effects achieved by the invention are as follows: this MEMS accelerometer through the pin rubber cap that sets up, can cover it on the surface of metal pin, not only can prevent that metal pin from scratching personnel, also can protect metal pin not destroyed, through the radiating side substrate of setting, can in time give off the heat that the component produced, prolong accelerometer's life, through the thermistor of setting, when external circuit is unusual, can block the circuit, protection internal element, whole device is simple, convenient operation, the result of use is better for traditional mode.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a partial view of the present invention;
FIG. 3 is an enlarged view of FIG. 2A in accordance with the present invention;
fig. 4 is an interior view of a lower substrate of the present invention.
In the figure: 1. an upper substrate; 2. a screw; 3. a metal pin; 4. a heat-dissipating side substrate; 5. a frame; 6. a lower substrate; 7. a pin rubber cap; 8. a pull ring; 9. a collar; 10. a thermistor; 11. a wire; 12. a chip; 13. an acceleration sensor; 14. a torquer; 15. an amplifier.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Example 1
As shown in fig. 1-4, a MEMS accelerometer comprises an upper substrate 1 and a lower substrate 6, wherein a heat dissipation side substrate 4 is fixedly installed on one side outer surface of the upper substrate 1, a metal pin 3 is fixedly installed on one side of the outer surface of the upper end of the upper substrate 1, a screw 2 is arranged on the outer surface of the upper end of the upper substrate 1, which is close to one side of the metal pin 3, a pin rubber cap 7 is movably installed on the upper end of the metal pin 3, a pull ring 8 is fixedly installed on the outer surface of the upper end of the pin rubber cap 7, a lantern ring 9 is fixedly installed on the outer surface of the pin rubber cap 7, the lower substrate 6 is arranged below the upper substrate 1, a frame 5 is arranged on the outer surface of the lower substrate 6, which is close to the heat dissipation side substrate 4, the lower substrate 6 is fixedly connected with the upper substrate 1 through the frame 5 and the heat dissipation side substrate 4, an amplifier 15 is fixedly installed at the inner middle position of the lower substrate 6, a moment device 14 is fixedly installed on the inner wall of the lower substrate 6, a moment device 13 is fixedly installed on the outer surface of the upper end of the side of the amplifier 15, a pull ring 8 is fixedly installed on the outer surface of the upper end of the side of the amplifier 15, a chip 12 is fixedly installed on the front end of the amplifier 15, a chip 12 is fixedly installed on the inner wall 12 of the lower substrate, a thermistor 10 is fixedly installed on the inner wall 12 is fixedly installed on the inner wall of the chip 12, and a position between the chip 12 and a thermistor 10 is fixedly installed on the chip.
The outer surface of the radiating side substrate 4 is provided with through holes, the number of the radiating side substrates 4 is four groups, and the number of the through holes is a plurality of groups; the length of the pin rubber cap 7 is one half of the length of the metal pin 3, the inner diameter of the pin rubber cap 7 is equal to the outer diameter of the metal pin 3, and the number of the metal pin 3 and the number of the pin rubber cap 7 are all a plurality of groups; the outer surface of the lower end of the lower substrate 6 is provided with an anti-magnetic interference outer cover, the outer surface of the anti-magnetic interference outer cover is provided with a mounting screw hole, and the inner surface of the upper substrate 1 is provided with a waterproof interlayer; the number of the screws 2 is two, the outer surface of the lantern ring 9 is provided with anti-skid stripes, and the number of the anti-skid stripes is a plurality of groups; the thermistor 10 is electrically connected with the chip 12, and the acceleration sensor 13 is electrically connected with the amplifier 15.
When the MEMS accelerometer is used, the upper substrate 1, the lower substrate 6 and the frame 5 form an integral structure of the accelerometer, the screw 2 enables the upper substrate 1 and the lower substrate 6 to form a whole, the pin rubber cap 7 is taken off from the surface of the metal pin 3, otherwise, the sleeve ring 9 is downwards twisted to enable the pin rubber cap 7 to cover the surface of the metal pin 3, the metal pin 3 can be prevented from being scratched, the metal pin 3 can be protected from being damaged, the accelerometer is arranged on a corresponding external instrument through the metal pin 3, the acceleration sensor 13 can sense the change of speed, the amplifier 15 can amplify the sensed signal, the thermistor 10 can block a current circuit in the lead 11 when the external circuit is abnormal, the internal chip 12 is protected, the internal circuit is prevented from being influenced by the external circuit, the stability of the accelerometer is increased, the original structure of the accelerometer is changed into a structure capable of carrying out gas communication with the outside because the surface of the heat radiation side substrate 4 is provided with through holes, the heat generated by the element can be prevented, the service life of the accelerometer is prolonged, and the accelerometer is a practical model of the accelerometer is 2002, and the service life of the accelerometer is prolonged, and the sensor is a practical model 13.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. MEMS accelerometer comprising an upper substrate (1) and a lower substrate (6), characterized in that: a radiating side substrate (4) is fixedly arranged on one outer surface of one side of the upper substrate (1), a metal pin (3) is fixedly arranged on one outer surface of one side of the upper end of the upper substrate (1), a screw (2) is arranged on the outer surface of the upper end of one side of the upper substrate (1) close to the metal pin (3), a pin rubber cap (7) is movably arranged at the upper end of the metal pin (3), a pull ring (8) is fixedly arranged on the outer surface of the upper end of the pin rubber cap (7), a lantern ring (9) is fixedly arranged on the outer surface of the lower substrate (7) close to the metal pin (3), a frame (5) is arranged on the outer surface of the lower substrate (6) close to the radiating side substrate (4), the lower substrate (6) is fixedly connected with the upper substrate (1) through the frame (5) and the radiating side substrate (4), an amplifier (15) is fixedly arranged at the inner middle position of the lower substrate (6), an inner wall (14) close to the amplifier (15) is fixedly arranged on the inner surface of the upper substrate (6), an acceleration sensor (14) is fixedly arranged on the outer surface of the lower substrate (6) close to the front side of the amplifier (15), and an acceleration sensor (14) is fixedly arranged on the outer surface of the sensor (12), the inner wall of the lower substrate (6) close to one side of the chip (12) is fixedly provided with a thermistor (10), and a wire (11) is fixedly arranged at the position between the chip (12) and the thermistor (10);
the length of the pin rubber cap (7) is one half of the length of the metal pin (3), the inner diameter of the pin rubber cap (7) is equal to the outer diameter of the metal pin (3), and the number of the metal pin (3) and the number of the pin rubber caps (7) are all a plurality of groups;
An anti-magnetic interference outer cover is arranged on the outer surface of the lower end of the lower substrate (6), a mounting screw hole is formed in the outer surface of the anti-magnetic interference outer cover, and a waterproof interlayer is arranged on the inner surface of the upper substrate (1);
The thermistor (10) is electrically connected with the chip (12), and the acceleration sensor (13) is electrically connected with the amplifier (15).
2. A MEMS accelerometer as claimed in claim 1, wherein: the outer surface of the heat dissipation side substrate (4) is provided with through holes, the number of the heat dissipation side substrates (4) is four groups, and the number of the through holes is a plurality of groups.
3. A MEMS accelerometer as claimed in claim 1, wherein: the number of the screws (2) is two, the outer surface of the lantern ring (9) is provided with anti-skid stripes, and the number of the anti-skid stripes is a plurality of groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810109838.2A CN108254585B (en) | 2018-02-05 | 2018-02-05 | MEMS accelerometer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810109838.2A CN108254585B (en) | 2018-02-05 | 2018-02-05 | MEMS accelerometer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108254585A CN108254585A (en) | 2018-07-06 |
| CN108254585B true CN108254585B (en) | 2024-05-31 |
Family
ID=62743696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810109838.2A Active CN108254585B (en) | 2018-02-05 | 2018-02-05 | MEMS accelerometer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108254585B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200174572Y1 (en) * | 1999-10-11 | 2000-03-15 | 카오스주식회사 | Gas sensor with a protection cap |
| KR20010061781A (en) * | 1999-12-29 | 2001-07-07 | 박종섭 | Ball grid array package |
| FR2821432A1 (en) * | 2001-06-28 | 2002-08-30 | Siemens Automotive Sa | Accelerometer for detection of combustion engine pinking is attached using adhesive to save cost, reduce sensor size and improve vibration transfer to the sensor elements |
| CN206118247U (en) * | 2016-08-19 | 2017-04-19 | 东莞市佳骏电子科技有限公司 | Use heat abstractor's triode |
| CN207964857U (en) * | 2018-02-05 | 2018-10-12 | 安徽微泰导航电子科技有限公司 | A kind of mems accelerometer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005064118A (en) * | 2003-08-08 | 2005-03-10 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
| US8872015B2 (en) * | 2012-08-27 | 2014-10-28 | Avedis Zildjian Co. | Cymbal transducer using electret accelerometer |
-
2018
- 2018-02-05 CN CN201810109838.2A patent/CN108254585B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200174572Y1 (en) * | 1999-10-11 | 2000-03-15 | 카오스주식회사 | Gas sensor with a protection cap |
| KR20010061781A (en) * | 1999-12-29 | 2001-07-07 | 박종섭 | Ball grid array package |
| FR2821432A1 (en) * | 2001-06-28 | 2002-08-30 | Siemens Automotive Sa | Accelerometer for detection of combustion engine pinking is attached using adhesive to save cost, reduce sensor size and improve vibration transfer to the sensor elements |
| CN206118247U (en) * | 2016-08-19 | 2017-04-19 | 东莞市佳骏电子科技有限公司 | Use heat abstractor's triode |
| CN207964857U (en) * | 2018-02-05 | 2018-10-12 | 安徽微泰导航电子科技有限公司 | A kind of mems accelerometer |
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| Publication number | Publication date |
|---|---|
| CN108254585A (en) | 2018-07-06 |
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