CN111060154A - Semiconductor device storage box - Google Patents
Semiconductor device storage box Download PDFInfo
- Publication number
- CN111060154A CN111060154A CN201911364845.8A CN201911364845A CN111060154A CN 111060154 A CN111060154 A CN 111060154A CN 201911364845 A CN201911364845 A CN 201911364845A CN 111060154 A CN111060154 A CN 111060154A
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- temperature
- semiconductor device
- humidity
- device storage
- data
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
Abstract
The invention provides a semiconductor device storage box, and belongs to the technical field of semiconductors. Semiconductor device storage box, including the box body and with the lid that the box body matches, semiconductor device storage box still includes: the temperature and humidity sensor is arranged on one side, facing the box body, of the cover body; the wireless communication unit is connected with the temperature and humidity sensor; and the power supply unit is connected with the temperature and humidity sensor and the wireless communication unit. According to the technical scheme, in the silicon wafer transportation process and the silicon wafer storage process, the temperature and the humidity in the storage box can be detected through the temperature and humidity sensor, data are recorded, and the influence of the temperature and the humidity on the quality of the silicon wafer can be analyzed by utilizing the recorded data.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor device storage box.
Background
At present, in the silicon wafer industry, the change of temperature and humidity has very important influence on the quality of the silicon wafer.
However, in the prior art, when the silicon wafers are stored and transported, the temperature and humidity changes of the environment where the silicon wafers are located cannot be monitored in real time, and then the detection equipment cannot obtain sufficient data to analyze the quality changes of the silicon wafers.
Disclosure of Invention
The invention aims to provide a semiconductor device storage box, which can detect the temperature and humidity in the storage box through a temperature and humidity sensor in the transportation process and the storage process of silicon wafers, record data and analyze the influence of the temperature and the humidity on the quality of the silicon wafers by utilizing the recorded data.
To solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, an embodiment of the present invention provides a semiconductor device storage box, including a box body and a cover body matched with the box body, where the semiconductor device storage box further includes:
the temperature and humidity sensor is arranged on one side, facing the box body, of the cover body;
the wireless communication unit is connected with the temperature and humidity sensor;
and the power supply unit is connected with the temperature and humidity sensor and the wireless communication unit.
Optionally, a clamping groove for fixing the semiconductor device is formed in a central region of the cover body, and the temperature and humidity sensor is arranged on the periphery of the clamping groove.
Optionally, a side surface of the cover facing the box body is rectangular, the length of the surface is 2a, a distance between the center of the temperature and humidity sensor and a long side of the rectangle is 0.55a-0.65a, and a distance between the center of the temperature and humidity sensor and a short side of the rectangle is 0.25a-0.35 a.
Optionally, the temperature and humidity sensor comprises:
a temperature and humidity sensing module;
a data storage and transmission module connected to the wireless communication unit.
Optionally, the housing of temperature and humidity sensing module is cylindric, the housing of data storage and emission module is cylindric, temperature and humidity sensor still includes: connect temperature and humidity response module with the link module of data storage and emission module, link module's shell is cylindricly, just the diameter of link module's shell all is less than the diameter of temperature and humidity response module with the shell of data storage and emission module.
Optionally, the wireless communication unit employs a bluetooth communication unit.
Optionally, the bluetooth communication unit further includes a USB interface.
Optionally, the method further comprises:
the cover body is arranged on the box body, and the display screen is used for displaying data of the temperature and humidity sensor.
Optionally, the lid with the department of meeting of box body is equipped with sealed the pad, sealed pad is hollow ring silica gel pad.
Optionally, the semiconductor device is a silicon wafer.
Optionally, the semiconductor device storage case further comprises:
and the prompting unit is used for prompting when the temperature data and/or the humidity data acquired by the temperature and humidity sensor reach a set value.
Optionally, the prompting unit includes:
a first color indicator light for illuminating when said temperature data is in a first temperature range indicating that uploading of said semiconductor device storage cartridge is prohibited;
a second color indicator light for indicating the prohibition of mounting the semiconductor device storage box when the temperature data is in a second temperature range and the humidity data is in a second humidity range;
a third color indicator light for indicating inhibition of uploading and loading of the semiconductor device storage case when the temperature data is in a third temperature range and the humidity data is in a third humidity range;
a fourth color indicator light for illuminating when said temperature data is in a fourth temperature range and said humidity data is in a fourth humidity range, indicating that uploading and loading of said semiconductor device storage cassette is permitted;
wherein the first color, the second color, the third color, and the fourth color are different.
The embodiment of the invention has the following beneficial effects:
in the above scheme, set up temperature and humidity sensor on the lid of semiconductor device storage box, the humiture change and the automatic record data in can the real-time supervision semiconductor device storage box transmit to data receiving equipment through wireless communication unit, obtain digital record, can draw the curve and combine semiconductor device surface particle detection equipment to analyze according to humiture change data like this, the analysis obtains the influence of temperature and humidity to the semiconductor device quality. Wherein, temperature and humidity sensor does not produce any granule itself, consequently can not cause the pollution to the semiconductor device of semiconductor device storage box the inside, and temperature and humidity sensor volume is less, and weight is less, can zonulae occludens with the lid of semiconductor device storage box, can not cause the influence to the transportation of semiconductor device storage.
Drawings
FIG. 1 is a schematic view of a cover according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a cover according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a portion of a cover according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a wireless communication unit and a temperature and humidity sensing module according to an embodiment of the present invention.
The reference numerals are explained below:
1 cover body
2 card slot
3 temperature and humidity sensor
4 prompting unit
10 radio communication unit
20 USB interface
30 data storage and transmission module
40 temperature and humidity sensing module
50 connection module
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
At present, in the silicon wafer industry, the change of temperature and humidity has very important influence on the quality of the silicon wafer.
Wherein, the influence of the humidity on the silicon wafer is as follows: when the humidity is higher, the water molecule content in the air is higher, and dust particles in the air are easily adsorbed on the water molecules in the air and are attached to the surface of the silicon wafer. Meanwhile, the higher content of water molecules in the air is not beneficial to removing original tiny particles on the surface of the silicon wafer. When the humidity is lower, the electrostatic action is strengthened, so that the tiny particles in the air are easy to be adsorbed on the surface of the silicon wafer, and the performance of the silicon wafer can be seriously influenced by the existence of the tiny particles on the surface of the silicon wafer. The effect of humidity on the wafer is very important.
The effect of temperature on the silicon wafer is: the change of temperature can influence the change of silicon chip surface flatness and the change of the inside humidity of storage box (FOSB), and when the temperature was higher, the storage box took place to warp easily, has the fish tail when getting the silicon chip, and high temperature can lead to the storage box to separate out the pollutant, and surface flatness also can seriously influence the performance of silicon chip in addition, and the humidity change that causes because of the temperature also can seriously influence the performance of silicon chip, so the temperature is very important to the influence of silicon chip.
At present, FOSB in the silicon wafer industry has no temperature and humidity sensor or similar devices in a box. Therefore, the temperature and humidity changes in the FOSB cannot be monitored in real time during the storage and transportation of the silicon wafers. The detection equipment cannot obtain sufficient data to analyze the change of the quality of the silicon wafer.
The embodiment of the invention provides a semiconductor device storage box, which can detect the temperature and humidity in the storage box through a temperature and humidity sensor in the transportation process and the storage process of a silicon wafer, record data and analyze the influence of the temperature and the humidity on the quality of the silicon wafer by utilizing the recorded data.
An embodiment of the present invention provides a semiconductor device storage box, including a box body and a cover body matched with the box body, as shown in fig. 1 to 4, the semiconductor device storage box further includes:
a temperature and humidity sensor 3 arranged on one side of the cover body 1 facing the box body;
a wireless communication unit 10 connected to the temperature and humidity sensor 1;
and a power supply unit (not shown) connected to the temperature/humidity sensor 3 and the wireless communication unit 10.
In this embodiment, set up temperature and humidity sensor on the lid of semiconductor device storage box, the humiture change in can the real-time supervision semiconductor device storage box and automatic record data, transmit to data receiving equipment through wireless communication unit, obtain digital record, can draw the curve and combine semiconductor device surface particle detection equipment to analyze according to humiture change data like this, the analysis obtains the influence of temperature and humidity to the semiconductor device quality. Wherein, temperature and humidity sensor does not produce any granule itself, consequently can not cause the pollution to the semiconductor device of semiconductor device storage box the inside, and temperature and humidity sensor volume is less, and weight is less, can zonulae occludens with the lid of semiconductor device storage box, can not cause the influence to the transportation of semiconductor device storage.
Before utilizing semiconductor device storage box storage semiconductor device, need use hot water (about 60 degrees) to wash semiconductor device storage box, after wasing, the humidity of semiconductor storage box is about 20 degrees, the temperature is about 40 degrees, the humidity and the temperature that need a period of time semiconductor storage box can reach the standard of depositing semiconductor device, current storage box does not set up temperature humidity transducer, rely on the experience of operator and engineer to judge the opportunity of depositing semiconductor device completely, if judge the mistake, semiconductor device's performance will be influenced. In the embodiment, the temperature and humidity sensor is arranged in the semiconductor storage box, so that accurate temperature data and humidity data of the semiconductor storage box can be obtained, and the semiconductor device can be stored in the semiconductor device storage box at a proper time.
Further, as shown in fig. 2, the semiconductor device storage case may further include:
and the prompting unit 4 is used for prompting when the temperature data and the humidity data collected by the temperature and humidity sensor reach set values, and when the temperature data and the humidity data collected by the temperature and humidity sensor reach the set values, the humidity and the temperature of the semiconductor storage box reach the standards for storing semiconductor devices.
Specifically, the prompting unit 4 may employ an indicator light, such as a red indicator light when the humidity and temperature of the semiconductor storage case are not suitable for storing the semiconductor device, and a green indicator light when the humidity and temperature of the semiconductor storage case are suitable for storing the semiconductor device. Of course, the prompting unit is not limited to the indicator light, and other types of devices, such as a voice device, may be used to prompt the time for storing the semiconductor device by voice.
In a specific embodiment, the prompting unit 4 includes:
a first color indicator light for illuminating when said temperature data is in a first temperature range indicating that uploading of said semiconductor device storage cartridge is prohibited;
a second color indicator light for indicating the prohibition of mounting the semiconductor device storage box when the temperature data is in a second temperature range and the humidity data is in a second humidity range;
a third color indicator light for indicating inhibition of uploading and loading of the semiconductor device storage case when the temperature data is in a third temperature range and the humidity data is in a third humidity range;
a fourth color indicator light for illuminating when said temperature data is in a fourth temperature range and said humidity data is in a fourth humidity range, indicating that uploading and loading of said semiconductor device storage cassette is permitted;
wherein the first color, the second color, the third color, and the fourth color are different.
In a specific example, the first color is yellow, the second color is blue, the third color is red, and the fourth color is green. The using process of the semiconductor device storage box can be divided into three steps of uploading- > loading- > downloading, wherein uploading refers to the operation of putting the semiconductor device storage box into a loading port of the equipment, and loading refers to the operation of putting the semiconductor device into the semiconductor device storage box. The uploading process needs to ensure that the box is not deformed, so that the uploading process only has requirements on temperature; in the mounting process, the temperature and the humidity are required to reach the standard, if the temperature reaches the standard and the humidity does not reach the standard, a user needs to wait until the green light is turned on; the downloading process is not required because it is immediately followed by the mounting process. The user can be explicitly informed of the operation that can be currently performed on the semiconductor device storage case by the four color indicator lamps.
Specifically, when the acquired temperature data is higher than 24 ℃ and lower than 0 ℃, the yellow indicator light is turned on to indicate that uploading is forbidden, because the semiconductor device storage box deforms due to thermal expansion and cold contraction, the yellow indicator light cannot be stably matched with a contact point of an equipment feeding port in the uploading process, so that the uploading is unstable, and the semiconductor device is easily scratched in the subsequent process of taking and delivering the semiconductor device; when the collected temperature data is 0-24 ℃, the humidity data is more than 50% and less than 30%, the blue prompting lamp is turned on to indicate that the mounting of the semiconductor device is forbidden, because the semiconductor device is easily polluted by water mist when the humidity is too high and the semiconductor device is taken and sent, on the other hand, organic matters (such as hydrocarbon, heavy organic matters and the like) can be separated out from the semiconductor device storage box when the humidity is high and the semiconductor device is polluted, and when the humidity is too low, the semiconductor device is taken and sent to generate static electricity, so that the semiconductor device is more easily adsorbed with particles and the pollution is caused; when the collected temperature data is more than 24 ℃, less than 0 ℃, and the humidity data is more than 50% and less than 30%, the red prompt lamp is turned on to indicate that uploading and mounting are forbidden; when the collected temperature data is 30-50 ℃ and the humidity data is 0-24%, a green prompting lamp is turned on to indicate that uploading and loading are allowed.
As shown in fig. 1, a card slot 2 for fixing a semiconductor device is disposed in a central region of the cover 1, and the temperature and humidity sensor 3 is disposed at a periphery of the card slot 2, so that humidity and temperature data of the semiconductor device can be accurately obtained by using the temperature and humidity sensor 3.
In an exemplary embodiment, as shown in fig. 2, a side surface of the cover facing the case is rectangular, and the surface has a length of 2a, so that the temperature and humidity sensor 3 can obtain accurate humidity and temperature data of the semiconductor device, a distance between a center of the temperature and humidity sensor 3 and a long side of the rectangle may be 0.55a to 0.65a, and a distance between the center of the temperature and humidity sensor 3 and a short side of the rectangle may be 0.25a to 0.35 a. Specifically, the distance between the center of the temperature and humidity sensor 3 and the long side of the rectangle may be 0.6a, and the distance between the center of the temperature and humidity sensor 3 and the short side of the rectangle may be 0.3 a.
As shown in fig. 3 and 4, the temperature and humidity sensor 3 includes:
a temperature and humidity sensing module 40;
a data storage and transmission module 30 connected to the wireless communication unit 10.
Specifically, the shell of temperature and humidity sensing module 40 is cylindrical, the shell of data storage and transmitting module 30 is cylindrical, and the temperature and humidity sensor further comprises: connect temperature and humidity response module 40 with the link module 50 of data storage and emission module 30, link module 50's shell is cylindricly, just the diameter of link module 50's shell all is less than the diameter of temperature and humidity response module 40 with the shell of data storage and emission module 30.
Specifically, as shown in fig. 3, the diameter of the housing of the connection module 50 may be 4mm, the diameter of the housing of the temperature and humidity sensing module 40 may be 6mm, the diameter of the housing of the data storage and transmission module 30 may be 8mm, and the maximum diameter of the receiving portion of the cover 1 for receiving the temperature and humidity sensor 3 may be 10 mm.
Wherein, data storage and emission module 30 and wireless communication unit 10 can be connected through wireless mode, also can be connected through wired mode, data storage and emission module 30 sends the data that temperature and humidity response module 40 gathered for wireless communication unit 10, send the data analysis equipment for the outside by wireless communication unit 10, outside data analysis equipment can be stored and analyzed the data that temperature and humidity response module 40 gathered, data monitoring semiconductor device's storage and transportation process through temperature and humidity response module 40 gathers, when semiconductor device pollutes the superscript, can judge the opportunity that leads to semiconductor device to pollute through the data that analysis temperature and humidity response module 40 gathers, and then can optimize storage and transportation process, improve semiconductor device's yield.
The wireless communication unit 10 may be a bluetooth communication unit, and of course, the wireless communication unit 10 is not limited to the bluetooth communication unit, and other types of wireless communication units may be used.
Further, as shown in fig. 4, the bluetooth communication unit may further include a USB interface 20, so that the temperature and humidity data of the semiconductor device may also be acquired from the bluetooth communication unit 10 through the USB interface 20.
Further, the semiconductor device storage case may further include:
the cover body is arranged on the box body, and the display screen is used for displaying data of the temperature and humidity sensor. Therefore, the humidity and temperature data of the semiconductor device can be quickly and intuitively acquired through the display screen.
Further, the lid with the department of meeting of box body is equipped with sealed the pad, sealed pad is hollow ring silica gel pad, can make box body and lid combine closely like this, avoids in external steam and the foreign particle entering semiconductor device storage box.
In the above embodiments, the semiconductor device may be specifically a silicon wafer, but is not limited to a silicon wafer, and may also be another type of semiconductor device. Through the semiconductor device storage box of this embodiment, in semiconductor device storage and transportation, survey temperature and humidity in the semiconductor device storage box through temperature humidity transducer 3 to the record data can obtain semiconductor device's temperature humidity curve, combines other influence factor, helps the influence of analysis temperature and humidity to semiconductor device in the semiconductor device storage box, for example silicon chip surface particle count and flatness and the relation between temperature and humidity.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
1. A semiconductor device storage case comprising a case body and a lid body fitted to the case body, characterized in that the semiconductor device storage case further comprises:
the temperature and humidity sensor is arranged on one side, facing the box body, of the cover body;
the wireless communication unit is connected with the temperature and humidity sensor;
and the power supply unit is connected with the temperature and humidity sensor and the wireless communication unit.
2. The semiconductor device storage case according to claim 1, wherein a central region of the lid body is provided with a card slot for fixing a semiconductor device, and the temperature and humidity sensor is provided at a periphery of the card slot.
3. The semiconductor device storage case according to claim 1, wherein a side surface of the lid body facing the case body has a rectangular shape, the surface has a length of 2a, a distance between a center of the temperature and humidity sensor and a long side of the rectangular shape is 0.55a to 0.65a, and a distance between a center of the temperature and humidity sensor and a short side of the rectangular shape is 0.25a to 0.35 a.
4. The semiconductor device storage cartridge of claim 1, wherein the temperature humidity sensor comprises:
a temperature and humidity sensing module;
a data storage and transmission module connected to the wireless communication unit.
5. The semiconductor device storage cartridge of claim 4, wherein the housing of the temperature and humidity sensing module is cylindrical, the housing of the data storage and transmission module is cylindrical, the temperature and humidity sensor further comprising: connect temperature and humidity response module with the link module of data storage and emission module, link module's shell is cylindricly, just the diameter of link module's shell all is less than the diameter of temperature and humidity response module with the shell of data storage and emission module.
6. The semiconductor device storage cartridge according to claim 1, wherein the wireless communication unit employs a bluetooth communication unit.
7. The semiconductor device storage cartridge of claim 6, wherein the Bluetooth communication unit further comprises a USB interface.
8. The semiconductor device storage cartridge of claim 1, further comprising:
the cover body is arranged on the box body, and the display screen is used for displaying data of the temperature and humidity sensor.
9. The semiconductor device storage box according to claim 1, wherein a sealing gasket is provided at a joint of the lid body and the box body, and the sealing gasket is a hollow ring silicone gasket.
10. A semiconductor device storage case according to any one of claims 1 to 9, wherein the semiconductor device is a silicon wafer.
11. The semiconductor device storage cartridge of any one of claims 1-9, further comprising:
and the prompting unit is used for prompting when the temperature data and/or the humidity data acquired by the temperature and humidity sensor reach a set value.
12. The semiconductor device storage cartridge of claim 11, wherein the cue unit comprises:
a first color indicator light for illuminating when said temperature data is in a first temperature range indicating that uploading of said semiconductor device storage cartridge is prohibited;
a second color indicator light for indicating the prohibition of mounting the semiconductor device storage box when the temperature data is in a second temperature range and the humidity data is in a second humidity range;
a third color indicator light for indicating inhibition of uploading and loading of the semiconductor device storage case when the temperature data is in a third temperature range and the humidity data is in a third humidity range;
a fourth color indicator light for illuminating when said temperature data is in a fourth temperature range and said humidity data is in a fourth humidity range, indicating that uploading and loading of said semiconductor device storage cassette is permitted;
wherein the first color, the second color, the third color, and the fourth color are different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911364845.8A CN111060154A (en) | 2019-12-26 | 2019-12-26 | Semiconductor device storage box |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911364845.8A CN111060154A (en) | 2019-12-26 | 2019-12-26 | Semiconductor device storage box |
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| CN111060154A true CN111060154A (en) | 2020-04-24 |
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