CN108254078B - A kind of thermal infrared imager blind pixel detection method - Google Patents
A kind of thermal infrared imager blind pixel detection method Download PDFInfo
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- G—PHYSICS
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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- G—PHYSICS
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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Abstract
The invention discloses a kind of thermal infrared imager blind pixel detection methods, comprising: adjustment and write-in thermal infrared imager configuration parameter guarantee thermal infrared imager work in normal state；Make thermal infrared imager work in a certain constant ambient temperature, changes the temperature of black matrix in its visual field, multiple temperature spots are demarcated；Calculate noise, heat sensitivity and the actual voltage value of each pixel of thermal infrared imager；According to computed information before, blind element detection is carried out using corresponding decision criteria, and do merger operation；Change the environment temperature of thermal infrared imager work, repeats above step, and merger operation is carried out to the blind element determined at a temperature of varying environment.The method of the present invention effectively increases the blind element detection success rate of thermal infrared imager, while testing process of the present invention can realize that time needed for can reducing detection process and cost, this method may be used in actual production by way of full software implementation.
Description
Technical field
The invention belongs to thermal infrared imager thermometry fields, detect more particularly, to a kind of thermal infrared imager blind element
Method.
Background technique
Blind element be response abnormality in infrared detector, can not normal output voltage pixel.In the life of thermal infrared imager
In producing and actually using, there is the phenomenon that blind element influences thermometric performance.It shows as the increase of thermometric deviation, noise increases, very
To thermometric value mistake, bright spot or dim spot are shown as on the image.Since infrared detector technique is limited and design feature, blind element are asked
Topic not can avoid, it is therefore desirable to which quick, accurate, low drain inspection method goes to quantity and the position of detection blind element.
Existing blind pixel detection method is divided into based on Image neighborhood judgement and blackbody demarcation, and the two, which exists to detect blind element, leaks
The problem of inspection and erroneous detection, causes thermal infrared imager to have the defects that thermometric is not allowed to fluctuate with thermometric excessive.
Summary of the invention
For the disadvantages described above and Improvement requirement of the prior art, the invention proposes a kind of thermal infrared imager blind element detection sides
Method effectively increases the blind element detection success rate of thermal infrared imager, while the testing process of full software implementation reduces detection method
Required time and system reform cost.
To achieve the goals above, the present invention provides a kind of thermal infrared imager blind pixel detection method, include the following steps:
(1) configuration parameter of thermal infrared imager is adjusted and/or is written, so that thermal infrared imager work is working normally
State；
(2) make the thermal infrared imager work in a certain constant ambient temperature, under the constant ambient temperature described in change
The temperature of black matrix in thermal infrared imager visual field obtains the full frame under multiple and different blackbody temperatures by the thermal infrared imager
Numerical matrix；
(3) thermal infrared imager is calculated multiple and different according to the full frame numerical matrix under multiple and different blackbody temperatures
The noise of each pixel, heat sensitivity and actual voltage value under blackbody temperature；
(4) according to the thermal infrared imager under multiple and different blackbody temperatures the noise of each pixel, heat sensitivity with
And actual voltage value, carry out blind element detection using preset blind element decision criteria, obtain respectively corresponding noise, heat sensitivity and
The preliminary blind element testing result of actual voltage value, and merger operation is carried out to the preliminary blind element testing result, it obtains described red
Synthesis blind element testing result of the outer thermal imaging system under the constant ambient temperature；
(5) change the constant ambient temperature of thermal infrared imager work, repeating said steps (2)-(4), described in acquisition
Synthesis blind element testing result of the thermal infrared imager under different constant ambient temperatures；
(6) the synthesis blind element testing result to the thermal infrared imager under different constant ambient temperatures carries out merger behaviour
Make, obtains the final blind element testing result of the thermal infrared imager.
In one embodiment of the present of invention, the step (2) specifically:
(2.1) operating ambient temperature for adjusting the thermal infrared imager makes the thermal infrared imager work in constant environment
Temperature E0In；
(2.2) after the thermal infrared imager reaches thermal balance, black matrix is placed at thermal infrared imager imaging clearly, and
Make the black matrix full of the entire imaging surface of the thermal infrared imager；
(2.3) stablize the blackbody temperature in temperature T0, record the temperature T of the black matrix0At this moment with thermal infrared imager
The full frame numerical matrix E of output0T0, and continuously acquire N frame full frame numerical matrix；
(2.4) change blackbody temperature to Tj, repeat step (2.3), obtain E0Tj；Wherein, M described in j=1~M-1 is to adjust
The number of the blackbody temperature.
In one embodiment of the present of invention, the step (3) is according to the full frame number under the multiple different blackbody temperatures
Value matrix calculates the noise of the thermal infrared imager each pixel under multiple and different blackbody temperatures, specifically:
It is T that (3.1.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0Tj
In each pixel noise, calculation formula is as follows:
Wherein σ (E0Tj)k,hIndicate the noise of pixel；K, h indicate the pixel of row k, h column；N indicates continuous N frame
Full frame numerical matrix, n indicate the sequence number of continuous N frame full frame numerical matrix；μ(E0Tj)k,hIndicate current pixel point even
Average value in continuous N frame number value；TjIndicate blackbody temperature.
(3.1.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel under different blackbody temperatures
Noise σ (E0Tj)k,h, j=1~M-1.
In one embodiment of the present of invention, the step (3) is according to the full frame number under the multiple different blackbody temperatures
Value matrix calculates the heat sensitivity of the thermal infrared imager each pixel under multiple and different blackbody temperatures, specifically:
It is T that (3.2.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0Tj
In each pixel heat sensitivity, calculation formula is as follows:
Wherein δ (E0Tj)k,hIndicate the heat sensitivity of current pixel point；K, h indicate the pixel of row k, h column；μ
(E0Tj)k,hIndicate average value of the current pixel point in continuous N frame number value；TjIndicate blackbody temperature.
(3.2.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel under different blackbody temperatures
Heat sensitivity δ (E0Tj)k,h, j=1~M-1.
In one embodiment of the present of invention, the step (3) is according to the full frame number under the multiple different blackbody temperatures
Value matrix calculates the actual voltage value of the thermal infrared imager each pixel under multiple and different blackbody temperatures, specifically:
It is T that (3.3.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0Tj
In each pixel actual voltage value, calculation formula is as follows:
V(E0Tj)k,h=μ (E0Tj)k,h*L/2B
Wherein V (E0Tj)k,hIndicate the actual voltage value of current pixel point；K, h indicate the pixel of row k, h column；μ
(E0Tj)k,hIndicate average value of the current pixel point in continuous N frame number value；The range of L expression digital-to-analogue conversion device；B indicates number
The digit of mode converter part, TjIndicate blackbody temperature.
(3.3.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel under different blackbody temperatures
Actual voltage value V (E0Tj)k,h, j=1~M-1.
In one embodiment of the present of invention, in (4) according to the thermal infrared imager under multiple and different blackbody temperatures
Noise, heat sensitivity and the actual voltage value of each pixel carry out blind element detection using preset blind element decision criteria, obtain
To the preliminary blind element testing result for respectively corresponding noise, heat sensitivity and actual voltage value, specifically:
(4.1) to blackbody temperature TjUnder each pixel noise σ (E0Tj)k,hBe ranked up, remove th maximum value and
Minimum value seeks residual pixel spot noise mean value σ (E0Tj), determine that noise is greater than Aσ*σ(E0Tj) pixel be blind element, be denoted as and make an uproar
Sound blind element table badpixel (E0Tjσ), AσFor preset value；Seek different blackbody temperature TjUnder noise blind element table badpixel
(E0Tjσ), and to the different blackbody temperature TjUnder noise blind element table badpixel (E0TjIt σ) merges operation and obtains the perseverance
Determine environment temperature E0Under noise blind element table badpixel (E0σ)；
(4.2) to blackbody temperature TjUnder each pixel sensitivity δ (E0Tj)k,hIt is ranked up, removes th maximum value
And minimum value, seek residual pixel point heat sensitivity mean value δ (E0Tj), determine that sensitivity is greater than A* σ (E0Tj) or less than B* σ (E0Tj)
Pixel be blind element, be denoted as heat sensitivity blind element table badpixel (E0Tjδ), and to the different blackbody temperature TjUnder heat
Sensitivity blind element table badpixel (E0TjIt δ) merges operation and obtains constant ambient temperature E0Under heat sensitivity blind element table
badpixel(E0δ)；
(4.3) to blackbody temperature TjUnder each pixel actual voltage value V (E0Tj)k,hIt is counted, according to detector
Illustrate in handbook, determining that actual voltage value is greater than max (V) or the pixel less than min (V) is blind element, is denoted as actual voltage value
Blind element table badpixel (E0TjV), wherein max (V) is virtual voltage maximum value, and min (V) is virtual voltage minimum value；And to institute
State different blackbody temperature TjUnder actual voltage value blind element table badpixel (E0TjV it) merges operation and obtains the constant environment
Temperature E0Under actual voltage value blind element table badpixel (E0V)；
Wherein blind element table is the matrix of line number K, columns H, and matrix size is identical as thermal infrared imager resolution ratio, and th is setting
Threshold value；The union operation are as follows: if the pixel is in any blackbody temperature TjIt is down blind element, then the pixel is in the constant environment
Temperature E0It is down blind element.
In one embodiment of the present of invention, merger operation is carried out to the preliminary blind element testing result in the step (4),
Synthesis blind element testing result of the thermal infrared imager under the constant ambient temperature is obtained, specifically:
To the constant ambient temperature E0Under three kinds of blind element tables: heat sensitivity blind element table badpixel (E0δ), heat-sensing
Spend blind element table badpixel (E0δ) and actual voltage value blind element table badpixel (E0V merger operation) is carried out, if certain pixel
It is that non-blind element is then determined as non-blind element in three kinds of blind element tables, is otherwise determined as blind element, remembers that this blind element determines that result is perseverance
Determine environment temperature E0Under blind element table badpixel (E0)。
In one embodiment of the present of invention, the selection of the blackbody temperature based on the temperature-measuring range of the thermal infrared imager,
Multiple and different blackbody temperatures are evenly distributed in the thermal infrared imager temperature-measuring range.
In one embodiment of the present of invention, the step (6) specifically:
To the blind element table badpixel (E at a temperature of varying environmenti) merger operation is carried out, if certain pixel is in varying environment
At a temperature of blind element table badpixel (Ei) in be that non-blind element is then determined as non-blind element, be otherwise determined as blind element.
In one embodiment of the present of invention, the temperature interval of the difference constant ambient temperature is 20 DEG C, different constant rings
Border temperature value is -10 DEG C, 10 DEG C, 30 DEG C, 50 DEG C.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, have following beneficial to effect
Fruit:
Thermal infrared imager blind pixel detection method traversal varying environment temperature and blackbody temperature provided by the invention, pass through calculating
The noise of each pixel, heat sensitivity, actual voltage value and thresholding is judged to determine whether the pixel is blind accordingly
Member, this method have traversed thermal infrared imager operating ambient temperature and target scene temperature working environment and target scene, ensure that
The success rate and low drain of blind element detection examine characteristic.Testing process of the present invention can be realized by way of full software implementation simultaneously, can
With time and cost needed for reducing detection process, this method may be used in actual production.
Detailed description of the invention
Fig. 1 is a kind of schematic illustration of thermal infrared imager blind pixel detection method in the embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
As shown in Figure 1, including the following steps: the present invention provides a kind of thermal infrared imager blind pixel detection method
(1) configuration parameter of thermal infrared imager is adjusted and/or is written, so that thermal infrared imager work is working normally
State；
Specifically, parameters of infrared cameras can be adjusted to desired value according to needed for the product type of production, and by the group
Thermal infrared imager is written in parameter, or is adjusted to the parameter of thermal infrared imager.
(2) make the thermal infrared imager work in a certain constant ambient temperature, under the constant ambient temperature described in change
The temperature of black matrix in thermal infrared imager visual field obtains the full frame under multiple and different blackbody temperatures by the thermal infrared imager
Numerical matrix；
The temperature T of black matrix in the thermal infrared imager visual fieldjIt chooses and is based on thermal infrared imager temperature-measuring range, can generally choose
8, to guarantee TjEven cloth is in thermal infrared imager temperature-measuring range.In this way, the value of j is then j=0...7.
Specifically, the step (2) includes:
(2.1) operating ambient temperature for adjusting the thermal infrared imager makes the thermal infrared imager work in constant environment
Temperature E0In；
(2.2) after the thermal infrared imager reaches thermal balance, black matrix is placed at thermal infrared imager imaging clearly, and
Make the black matrix full of the entire imaging surface of the thermal infrared imager；
(2.3) stablize the blackbody temperature in temperature T0, record the temperature T of the black matrix0At this moment with thermal infrared imager
The full frame numerical matrix E of output0T0, and continuously acquire N frame full frame numerical matrix；
Generally, the N is preferably 16.
(2.4) change blackbody temperature to Tj, repeat step (2.3), obtain E0Tj；Wherein, M described in j=1~M-1 is to adjust
The number of the blackbody temperature.
(3) thermal infrared imager is calculated multiple and different according to the full frame numerical matrix under multiple and different blackbody temperatures
The noise of each pixel, heat sensitivity and actual voltage value under blackbody temperature；
(3.1) specifically, the infrared heat is calculated according to the full frame numerical matrix under the multiple different blackbody temperatures
As the noise of instrument each pixel under multiple and different blackbody temperatures, comprising:
It is T that (3.1.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0Tj
In each pixel noise, calculation formula is as follows:
Wherein σ (E0Tj)k,hIndicate the noise of pixel；K, h indicate the pixel of row k, h column；N indicates continuous N frame
Full frame numerical matrix, n indicate the sequence number of continuous N frame full frame numerical matrix；μ(E0Tj)k,hIndicate current pixel point even
Average value in continuous N frame number value；TjIndicate blackbody temperature.
(3.1.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel under different blackbody temperatures
Noise σ (E0Tj)k,h, j=1~M-1.
(3.2) thermal infrared imager is calculated more according to the full frame numerical matrix under the multiple different blackbody temperatures
The heat sensitivity of each pixel under a difference blackbody temperature, comprising:
It is T that (3.2.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0Tj
In each pixel heat sensitivity, calculation formula is as follows:
Wherein δ (E0Tj)k,hIndicate the heat sensitivity of current pixel point；K, h indicate the pixel of row k, h column；μ
(E0Tj)k,hIndicate average value of the current pixel point in continuous N frame number value；TjIndicate blackbody temperature.
(3.2.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel under different blackbody temperatures
Heat sensitivity δ (E0Tj)k,h, j=1~M-1.
(3.3) thermal infrared imager is calculated more according to the full frame numerical matrix under the multiple different blackbody temperatures
The actual voltage value of each pixel under a difference blackbody temperature, specifically:
It is T that (3.3.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0Tj
In each pixel actual voltage value, calculation formula is as follows:
V(E0Tj)k,h=μ (E0Tj)k,h*L/2B
Wherein V (E0Tj)k,hIndicate the actual voltage value of current pixel point；K, h indicate the pixel of row k, h column；μ
(E0Tj)k,hIndicate average value of the current pixel point in continuous N frame number value；The range of L expression digital-to-analogue conversion device；B indicates number
The digit of mode converter part, TjIndicate blackbody temperature.
(3.3.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel under different blackbody temperatures
Actual voltage value V (E0Tj)k,h, j=1~M-1.
(4) according to the thermal infrared imager under multiple and different blackbody temperatures the noise of each pixel, heat sensitivity with
And actual voltage value, carry out blind element detection using preset blind element decision criteria, obtain respectively corresponding noise, heat sensitivity and
The preliminary blind element testing result of actual voltage value, and merger operation is carried out to the preliminary blind element testing result, it obtains described red
Synthesis blind element testing result of the outer thermal imaging system under the constant ambient temperature；
Specifically, according to the thermal infrared imager under multiple and different blackbody temperatures the noise of each pixel, heat-sensing
Degree and actual voltage value carry out blind element detection using preset blind element decision criteria, obtain respectively corresponding noise, heat sensitivity
And the preliminary blind element testing result of actual voltage value, comprising:
(4.1) to blackbody temperature TjUnder each pixel noise σ (E0Tj)k,hBe ranked up, remove th maximum value and
Minimum value seeks residual pixel spot noise mean value σ (E0Tj), determine that noise is greater than Aσ*σ(E0Tj) pixel be blind element, be denoted as and make an uproar
Sound blind element table badpixel (E0Tjσ), AσFor preset value；Seek different blackbody temperature TjUnder noise blind element table badpixel
(E0Tjσ), and to the different blackbody temperature TjUnder noise blind element table badpixel (E0TjIt σ) merges operation and obtains the perseverance
Determine environment temperature E0Under noise blind element table badpixel (E0σ)；
Specifically, for removing th maximum value and minimum value, general th is chosen for entire image planes pixel quantity
5%.
(4.2) to blackbody temperature TjUnder each pixel sensitivity δ (E0Tj)k,hIt is ranked up, removes th maximum value
And minimum value, seek residual pixel point heat sensitivity mean value δ (E0Tj), determine that sensitivity is greater than A* σ (E0Tj) or less than B* σ (E0Tj)
Pixel be blind element, be denoted as heat sensitivity blind element table badpixel (E0Tjδ), and to the different blackbody temperature TjUnder heat
Sensitivity blind element table badpixel (E0TjIt δ) merges operation and obtains constant ambient temperature E0Under heat sensitivity blind element table
badpixel(E0δ)；
Preferably for the heat sensitivity A* σ (E0Tj) and B* σ (E0Tj), A, which can be chosen for 2, B, to be chosen for
0.5。
(4.3) to blackbody temperature TjUnder each pixel actual voltage value V (E0Tj)k,hIt is counted, according to detector
Illustrate in handbook, determining that actual voltage value is greater than max (V) or the pixel less than min (V) is blind element, is denoted as actual voltage value
Blind element table badpixel (E0TjV), wherein max (V) is virtual voltage maximum value, and min (V) is virtual voltage minimum value；And to institute
State different blackbody temperature TjUnder actual voltage value blind element table badpixel (E0TjV it) merges operation and obtains the constant environment
Temperature E0Under actual voltage value blind element table badpixel (E0V)；
Wherein blind element table is the matrix of line number K, columns H, and matrix size is identical as thermal infrared imager resolution ratio, and th is setting
Threshold value；The union operation are as follows: if the pixel is in any blackbody temperature TjIt is down blind element, then the pixel is in the constant environment
Temperature E0It is down blind element.
Generally, in blind element table, it can indicate that the pixel is blind element labeled as 0 in corresponding position, be labeled as 1 table
Show that changing pixel is non-blind element.It can certainly be the value of other settings.
Further, merger operation is carried out to the preliminary blind element testing result, obtains the thermal infrared imager in the perseverance
Determine the synthesis blind element testing result under environment temperature, specifically:
To the constant ambient temperature E0Under three kinds of blind element tables: heat sensitivity blind element table badpixel (E0δ), heat-sensing
Spend blind element table badpixel (E0δ) and actual voltage value blind element table badpixel (E0V merger operation) is carried out, if certain pixel
It is that non-blind element is then determined as non-blind element in three kinds of blind element tables, is otherwise determined as blind element, remembers that this blind element determines that result is perseverance
Determine environment temperature E0Under blind element table badpixel (E0)。
(5) change the constant ambient temperature of thermal infrared imager work, repeating said steps (2)-(4), described in acquisition
Synthesis blind element testing result of the thermal infrared imager under different constant ambient temperatures；
Specifically, changing the constant ambient temperature of thermal infrared imager work, temperature interval generally takes 20 DEG C, such as
Environment temperature is chosen for -10 DEG C, 10 DEG C, 30 DEG C, 50 DEG C.
(6) the synthesis blind element testing result to the thermal infrared imager under different constant ambient temperatures carries out merger behaviour
Make, obtains the final blind element testing result of the thermal infrared imager.
Specifically, to the blind element table badpixel (E at a temperature of varying environmenti) merger operation is carried out, if certain pixel exists
Blind element table badpixel (E at a temperature of varying environmenti) in be that non-blind element is then determined as non-blind element, be otherwise determined as blind element.
Thermal infrared imager blind pixel detection method traversal varying environment temperature and blackbody temperature provided by the invention, pass through calculating
The noise of each pixel, heat sensitivity, actual voltage value and thresholding is judged to determine whether the pixel is blind accordingly
Member, this method have traversed thermal infrared imager operating ambient temperature and target scene temperature working environment and target scene, ensure that
The success rate and low drain of blind element detection examine characteristic.Testing process of the present invention can be realized by way of full software implementation simultaneously, can
With time and cost needed for reducing detection process, this method may be used in actual production.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (6)
1. a kind of thermal infrared imager blind pixel detection method, which comprises the steps of:
(1) configuration parameter of thermal infrared imager is adjusted and/or is written, so that thermal infrared imager work is working normally shape
State；
(2) make the thermal infrared imager work in a certain constant ambient temperature, change under the constant ambient temperature described infrared
The temperature of black matrix in thermal imaging system visual field obtains the full frame numerical value under multiple and different blackbody temperatures by the thermal infrared imager
Matrix；
(3) thermal infrared imager is calculated in multiple and different black matrixes according to the full frame numerical matrix under multiple and different blackbody temperatures
At a temperature of each pixel noise, heat sensitivity and actual voltage value；Specifically,
The thermal infrared imager is calculated multiple and different black according to the full frame numerical matrix under the multiple different blackbody temperatures
The noise of each pixel under temperature, specifically:
It is T that (3.1.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0TjIn it is each
The noise of a pixel, calculation formula are as follows:
Wherein σ (E0Tj)k,hIndicate the noise of pixel；K, h indicate the pixel of row k, h column；N indicates that continuous N frame is drawn entirely
Face numerical matrix, n indicate the sequence number of continuous N frame full frame numerical matrix；μ(E0Tj)k,hIndicate current pixel point in continuous N frame
Average value in numerical value；TjIndicate blackbody temperature；
(3.1.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel spot noise σ under different blackbody temperatures
(E0Tj)k,h, j=1~M-1；
The thermal infrared imager is calculated multiple and different black according to the full frame numerical matrix under the multiple different blackbody temperatures
The heat sensitivity of each pixel under temperature, specifically:
It is T that (3.2.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0TjIn it is each
The heat sensitivity of a pixel, calculation formula are as follows:
Wherein δ (E0Tj)k,hIndicate the heat sensitivity of current pixel point；K, h indicate the pixel of row k, h column；μ(E0Tj)k,h
Indicate average value of the current pixel point in continuous N frame number value；TjIndicate blackbody temperature；
(3.2.2) traverses the full frame numerical matrix under different blackbody temperatures, obtains the pixel heat spirit under different blackbody temperatures
Sensitivity δ (E0Tj)k,h, j=1~M-1；
The thermal infrared imager is calculated multiple and different black according to the full frame numerical matrix under the multiple different blackbody temperatures
The actual voltage value of each pixel under temperature, specifically:
It is T that (3.3.1), which is calculated in blackbody temperature,jShi Suoshu thermal infrared imager continuously exports N frame full frame numerical matrix E0TjIn it is each
The actual voltage value of a pixel, calculation formula are as follows:
V(E0Tj)k,h=μ (E0Tj)k,h*L/2B
Wherein V (E0Tj)k,hIndicate the actual voltage value of current pixel point；K, h indicate the pixel of row k, h column；μ
(E0Tj)k,hIndicate average value of the current pixel point in continuous N frame number value；The range of L expression digital-to-analogue conversion device；B indicates number
The digit of mode converter part, TjIndicate blackbody temperature；
(3.3.2) traverses the full frame numerical matrix under different blackbody temperatures, and the pixel obtained under different blackbody temperatures is practical
Voltage value V (E0Tj)k,h, j=1~M-1；
(4) according to the thermal infrared imager under multiple and different blackbody temperatures the noise of each pixel, heat sensitivity and reality
Border voltage value carries out blind element detection using preset blind element decision criteria, obtains respectively corresponding noise, heat sensitivity and reality
The preliminary blind element testing result of voltage value, and merger operation is carried out to the preliminary blind element testing result, obtain the infrared heat
As synthesis blind element testing result of the instrument under the constant ambient temperature；Specifically,
(4.1) to blackbody temperature TjUnder each pixel noise σ (E0Tj)k,hIt is ranked up, removes th maximum value and minimum
Value, seeks residual pixel spot noise mean value σ (E0Tj), determine that noise is greater than Aσ*σ(E0Tj) pixel be blind element, it is blind to be denoted as noise
First table badpixel (E0Tjσ), AσFor preset value；Seek different blackbody temperature TjUnder noise blind element table badpixel (E0Tjσ),
And to the different blackbody temperature TjUnder noise blind element table badpixel (E0TjIt σ) merges operation and obtains the constant environment
Temperature E0Under noise blind element table badpixel (E0σ)；
(4.2) to blackbody temperature TjUnder each pixel sensitivity δ (E0Tj)k,hIt is ranked up, removes th maximum value and most
Small value seeks residual pixel point heat sensitivity mean value δ (E0Tj), determine that sensitivity is greater than A* σ (E0Tj) or less than B* σ (E0Tj) picture
Vegetarian refreshments is blind element, is denoted as heat sensitivity blind element table badpixel (E0Tjδ), and to the different blackbody temperature TjUnder heat-sensing
Spend blind element table badpixel (E0TjIt δ) merges operation and obtains constant ambient temperature E0Under heat sensitivity blind element table
badpixel(E0δ)；
(4.3) to blackbody temperature TjUnder each pixel actual voltage value V (E0Tj)k,hIt is counted, according to detector handbook
Middle explanation, determining that actual voltage value is greater than max (V) or the pixel less than min (V) is blind element, is denoted as actual voltage value blind element
Table badpixel (E0TjV), wherein max (V) is virtual voltage maximum value, and min (V) is virtual voltage minimum value；And to it is described not
With blackbody temperature TjUnder actual voltage value blind element table badpixel (E0TjV it) merges operation and obtains the constant ambient temperature
E0Under actual voltage value blind element table badpixel (E0V)；
Wherein blind element table is the matrix of line number K, columns H, and matrix size is identical as thermal infrared imager resolution ratio, and th is setting threshold
Value；The union operation are as follows: if the pixel is in any blackbody temperature TjIt is down blind element, then the pixel is in the constant environment temperature
Spend E0It is down blind element；
(5) change the constant ambient temperature of the thermal infrared imager work, repeating said steps (2)-(4) obtain described infrared
Synthesis blind element testing result of the thermal imaging system under different constant ambient temperatures；
(6) the synthesis blind element testing result to the thermal infrared imager under different constant ambient temperatures carries out merger operation, obtains
To the final blind element testing result of the thermal infrared imager.
2. thermal infrared imager blind pixel detection method as described in claim 1, which is characterized in that the step (2) specifically:
(2.1) operating ambient temperature for adjusting the thermal infrared imager makes the thermal infrared imager work in constant ambient temperature E0
In；
(2.2) after the thermal infrared imager reaches thermal balance, black matrix is placed at thermal infrared imager imaging clearly, and makes institute
Black matrix is stated full of the entire imaging surface of the thermal infrared imager；
(2.3) stablize the blackbody temperature in temperature T0, record the temperature T of the black matrix0It is exported at this moment with thermal infrared imager
Full frame numerical matrix E0T0, and continuously acquire N frame full frame numerical matrix；
(2.4) change blackbody temperature to Tj, repeat step (2.3), obtain E0Tj；Wherein, M described in j=1~M-1 is described in adjusting
The number of blackbody temperature.
3. thermal infrared imager blind pixel detection method as described in claim 1, which is characterized in that described in the step (4)
Preliminary blind element testing result carries out merger operation, obtains synthesis blind element inspection of the thermal infrared imager under the constant ambient temperature
Survey as a result, specifically:
To the constant ambient temperature E0Under three kinds of blind element tables: heat sensitivity blind element table badpixel (E0δ), heat sensitivity is blind
First table badpixel (E0δ) and actual voltage value blind element table badpixel (E0V merger operation) is carried out, if certain pixel is three
It is that non-blind element is then determined as non-blind element in kind blind element table, is otherwise determined as blind element, remembers that this blind element determines that result is constant ring
Border temperature E0Under blind element table badpixel (E0)。
4. thermal infrared imager blind pixel detection method as described in claim 1, which is characterized in that the selection base of the blackbody temperature
In the temperature-measuring range of the thermal infrared imager, multiple and different blackbody temperatures are evenly distributed on the thermal infrared imager temperature-measuring range
It is interior.
5. thermal infrared imager blind pixel detection method as claimed in claim 1 or 2, which is characterized in that the step (6) is specific
Are as follows:
To the blind element table badpixel (E at a temperature of varying environmenti) merger operation is carried out, if certain pixel is in varying environment temperature
Under blind element table badpixel (Ei) in be that non-blind element is then determined as non-blind element, be otherwise determined as blind element.
6. thermal infrared imager blind pixel detection method as claimed in claim 1 or 2, which is characterized in that the difference constant environment
The temperature interval of temperature is 20 DEG C, and different constant ambient temperature values are -10 DEG C, 10 DEG C, 30 DEG C, 50 DEG C.
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