CN108233980B - Radio frequency transmission device - Google Patents
Radio frequency transmission device Download PDFInfo
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- CN108233980B CN108233980B CN201810050790.2A CN201810050790A CN108233980B CN 108233980 B CN108233980 B CN 108233980B CN 201810050790 A CN201810050790 A CN 201810050790A CN 108233980 B CN108233980 B CN 108233980B
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 174
- 239000007769 metal material Substances 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
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- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a radio frequency transmission device, which comprises a plurality of conductive layers sequentially distributed from a top layer to a bottom layer, wherein the plurality of conductive layers comprise: one or more first signal layers, each for forming circuit elements and circuit wires other than the transmission line and the ground line; the transmission layers form transmission lines for transmitting radio frequency signals, and the line width and/or the thickness of each transmission layer are/is greater than or equal to the line width and/or the thickness of each first signal layer; and a ground layer for forming a ground line to provide a reference ground potential, the ground layer being located between the one or more transmission layers and the one or more first signal layers to isolate the one or more transmission layers and the one or more first signal layers. The radio frequency transmission device reduces the difficulty of layout and wiring and ensures the transmission quality of the transmission line.
Description
Technical Field
The present invention relates to the field of wireless communications, and more particularly, to a radio frequency transmission device.
Background
In radar and wireless communication systems, due to the characteristics of the radio frequency signal itself, it is often necessary to provide a radio frequency transmission device for transmitting the radio frequency signal, which generally includes a transmission line for transmitting the radio frequency signal and a ground line for providing a reference ground potential.
In the rf integrated circuit, the rf transmission device is mainly implemented by a plurality of interconnectable metal layers sequentially distributed from a top layer to a bottom layer, for example, one existing integrated circuit process can implement more than eight interconnectable metal layers. The metal layer on the top layer is typically higher in line width and thickness than the other metal layers, while the metal layer on the bottom layer is typically lower in line width and thickness than the other metal layers.
Fig. 1 is a schematic structural view showing a conventional radio frequency transmission device.
As shown in fig. 1, in a conventional radio frequency transmission device 10, in order to reduce transmission loss of a transmission line, the transmission line is generally formed by using a metal layer 11 located at a top layer, and a ground line is formed by using a metal layer 12 located at a bottom layer.
However, in order to reduce interference to the radio frequency signal, other circuit wires and circuit modules in the system are far away from the region where the transmission line is located as far as possible, so that the layout area of the radio frequency integrated circuit is difficult to reduce, the time cost and the space cost of layout and wiring are increased, and inconvenience is brought to the design and the production of the radio frequency integrated circuit.
In order to solve the above-mentioned problems, based on the structure of the conventional rf transmission device, one prior art forms the transmission line by using the metal layer located at the sub-top layer, and uses the metal layer at the top layer as the signal layer for forming other circuit modules and wires. However, in this prior art, since the metal layer on the top layer generally has a larger line width and thickness than the metal layer on the second top layer in the manufacturing process of the integrated circuit, a large area of metal that transmits other circuit signals is placed near the transmission line of the metal layer on the second top layer, which inevitably affects the transmission quality of the transmission line.
Another prior art is based on conventional rf transmission devices, using a metal layer at the bottom layer as a signal layer to form other circuit modules and wires, and using a metal layer at the sub-bottom layer or higher to form a ground line, so that the ground line can isolate the signal layer from the top metal layer used to form the transmission line. However, in this prior art, since the metal layer located at the bottom layer generally has the smallest line width and thickness compared with other metal layers, the signal connection line formed using the metal layer located at the bottom layer has a limited current-carrying capacity, so that the application of the radio frequency transmission device of this prior art is limited.
Therefore, a new radio frequency transmission device is desired, so that the related technicians do not need to avoid the region where the transmission line is located when laying out and wiring other circuit wires and circuit modules, the transmission quality of the transmission line is ensured, and circuit elements and circuit wires except the transmission line and the grounding line can have certain current bearing capacity.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a radio frequency transmission device which can reduce the difficulty of layout and wiring, so that related personnel do not need to avoid the area of the transmission line of the radio frequency transmission device when laying out and wiring circuit wires and elements outside the transmission line and the grounding line, the requirement on the current bearing capacity is reduced, and the transmission quality of the transmission line is ensured.
The invention provides a radio frequency transmission device, which comprises a plurality of conductive layers sequentially distributed from a top layer to a bottom layer, wherein the conductive layers comprise: one or more first signal layers, each of the first signal layers being for forming circuit elements and circuit connections other than transmission lines and ground lines, the transmission lines being for transmitting radio frequency signals; the transmission layers are integrally formed into the transmission line, and the line width and/or thickness of each transmission layer is greater than or equal to the line width and/or thickness of each first signal layer; and a ground layer for forming the ground line to provide a reference ground potential, the ground layer being located between the one or more transmission layers and the one or more first signal layers to isolate the one or more transmission layers and the one or more first signal layers.
Preferably, the plurality of conductive layers further includes one or more second signal layers, which are used together with the one or more first signal layers to form circuit elements and circuit connections outside the transmission line and the ground line, the one or more transmission layers being located between the ground layer and the one or more second signal layers.
Preferably, the line width and/or thickness of each second signal layer is less than or equal to the line width and/or thickness of each transmission layer.
Preferably, the one or more transmission layers are distributed adjacently in the conductive layers in sequence, and every two adjacent transmission layers are connected in parallel wholly or partially in parallel through interconnection.
Preferably, each transmission layer is provided with a plurality of interconnection nodes which are distributed evenly, and the interconnection nodes corresponding to the positions of every two adjacent transmission layers are electrically connected.
Preferably, the conductive layer located at the top layer serves as the first signal layer, and the conductive layer located at the second top layer serves as the ground layer.
Preferably, the line widths and/or thicknesses of the plurality of conductive layers sequentially distributed from the top layer to the bottom layer have a decreasing trend.
Preferably, the plurality of conductive layers are respectively made of a metal material.
The radio frequency transmission device provided by the invention has the advantages that the grounding layer for providing the reference ground voltage is arranged between the transmission layer for forming the transmission line and the signal layer for forming the element and circuit connection, so that the grounding layer can effectively isolate the signal layer from the transmission layer, and the transmission quality of the transmission line formed by the transmission layer is not influenced by signals transmitted in the signal layer; in the radio frequency transmission device provided by the embodiments of the present invention, the conductive layer with a larger line width and/or thickness is used as the signal layer, so that the elements and circuit wires formed in the signal layer can allow larger current, and the difficulty in layout and wiring of the circuit is reduced.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural view showing a conventional radio frequency transmission device.
Fig. 2 shows a schematic structural diagram of a radio frequency transmission device according to a first embodiment of the present invention.
Fig. 3 shows a schematic structural diagram of a radio frequency transmission device according to a second embodiment of the present invention.
Fig. 4 shows a schematic structural diagram of a radio frequency transmission device according to a third embodiment of the present invention.
Fig. 5 shows a schematic structural diagram of a radio frequency transmission device according to a fourth embodiment of the present invention.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. Like elements are denoted by like reference numerals throughout the various figures. For clarity, the various features of the drawings are not drawn to scale. Furthermore, some well-known portions may not be shown in the drawings.
Numerous specific details of the invention, such as device structures, materials, dimensions, processing techniques and technologies, are set forth in the following description in order to provide a thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
In the description of the present invention, "above" refers to a location closer to the top layer and "below" refers to a location closer to the bottom layer.
The radio frequency transmission device of the embodiment of the invention comprises a plurality of conductive layers sequentially distributed from the top layer to the bottom layer, and the line widths and/or thicknesses of the plurality of conductive layers sequentially distributed from the top layer to the bottom layer are reduced, for example, the conductive layer closer to the bottom layer has the same or smaller line widths and/or thicknesses than the conductive layer closer to the top layer. Typically, the plurality of conductive layers are each made of a metal material, and an insulating layer is present between two adjacent conductive layers, and different conductive layers may be interconnected by a via.
Wherein the plurality of conductive layers includes one or more first signal layers, one or more transmission layers, and a ground layer.
One or more transmission layers are integrally used to form a transmission line of a radio frequency transmission device. When the transmission line is realized by a plurality of transmission layers which are sequentially and continuously distributed, every two adjacent transmission layers are wholly or partially connected in parallel, so that the plurality of transmission layers can be connected in parallel to form the transmission line with very low resistivity, thereby reducing the transmission loss and improving the transmission quality.
Each first signal layer is used for forming an element and/or a circuit connection wire, and a ground layer is used for forming a ground wire to provide a reference ground potential, wherein the ground layer is positioned between each transmission layer and each first signal layer to isolate the element and the connection wire formed in the transmission line and the first signal layer.
In some preferred embodiments, the plurality of conductive layers further includes one or more second signal layers, which are used in conjunction with the respective first signal layers to form the elements and the wiring.
Based on this, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 2 shows a schematic structural diagram of a radio frequency transmission device according to a first embodiment of the present invention.
As shown in fig. 2, the rf transmission device 100 according to the first embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from top layer to bottom layer.
The plurality of conductive layers includes a first signal layer 110, a ground layer 120, and a transmission layer 130. The conductive layer on the top layer serves as the first signal layer 110, the conductive layer on the second top layer serves as the ground layer 120, and any one of the conductive layers below the ground layer 120 serves as the transmission layer 130. Preferably, a conductive layer located at the bottom layer or sub-bottom layer is used as the transmission layer 130.
In the present embodiment, since the ground layer 120 is located below the first signal layer 110 and above the transmission layer 130, even if the line width and/or thickness of the first signal layer 110 is greater than the line width and/or thickness of the transmission layer 130, the ground layer 120 grounded to provide the reference ground potential can effectively isolate the first signal layer 110 and the transmission layer 130, so that the transmission quality of the transmission line formed by the transmission layer 130 is not affected by the first signal layer 110; the conductive layer (serving as the first signal layer 110) on the top layer has a larger line width and thickness, so that the circuit elements and circuit wires formed in the first signal layer 110 can allow larger current, and the difficulty in layout and wiring of the circuit is reduced; since the transmission line can be laid in a large area in the transmission layer 130, even if the conductive layer of the bottommost layer or the sub-bottom layer is used as the transmission layer 130, the transmission line can have a low resistivity, and the transmission quality of the transmission line is ensured.
Further, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 110 positioned over the ground layer 120.
Fig. 3 shows a schematic structural diagram of a radio frequency transmission device according to a second embodiment of the present invention.
As shown in fig. 3, the rf transmission device 200 according to the second embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from top layer to bottom layer.
The plurality of conductive layers includes a first signal layer 210, a ground layer 220, and a plurality of transmission layers 230. The conductive layer on the top layer serves as the first signal layer 210, the conductive layer on the sub-top layer serves as the ground layer 220, and a plurality of conductive layers disposed under the ground layer 220 and distributed in succession serve as a plurality of transmission layers 230, respectively. Wherein, at least partial parallel connection of every two adjacent transmission layers 230 is realized through interconnection, that is, a plurality of interconnection nodes are respectively distributed on each transmission layer 230, and the interconnection nodes corresponding to the positions on every two upper and lower adjacent transmission layers 230 are electrically connected, so that the adjacent transmission layers 230 in every two positions can be integrally or partially parallel connected, thereby reducing the transmission loss of the transmission line. Preferably, the interconnect nodes on each transport layer 230 are evenly distributed.
In the present embodiment, as in the above-described embodiments, the ground layer 220 can effectively isolate the first signal layer 210 and each of the transmission layers 230, so that the transmission quality of the transmission line formed by each of the transmission layers 230 is not affected by the first signal layer; the conductive layer (as the first signal layer 210) on the top layer has a larger line width and thickness, so that the circuit elements and circuit wires formed in the first signal layer 210 can allow a larger current, and the difficulty in layout and wiring of the circuit is reduced.
Further, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 210 located above the ground layer 220.
Fig. 4 shows a schematic structural diagram of a radio frequency transmission device according to a third embodiment of the present invention.
As shown in fig. 4, the rf transmission device 300 according to the third embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from top layer to bottom layer.
The plurality of conductive layers includes a first signal layer 310, a ground layer 320, a plurality of transmission layers 330, and a second signal layer 340. The conductive layer at the top layer serves as a first signal layer 310, the conductive layer at the second top layer serves as a ground layer 320, the conductive layer at the bottom layer serves as a second signal layer 340, and a plurality of conductive layers disposed in series between the ground layer 320 and the second signal layer 340 serve as a plurality of transmission layers 330. The adjacent transmission layers 330 at every two positions are at least partially connected in parallel through interconnection, that is, a plurality of interconnection nodes are respectively distributed on each transmission layer 330, and the interconnection nodes corresponding to the positions on the adjacent transmission layers 330 at every two positions are electrically connected, so that the adjacent transmission layers 330 at every two positions can be integrally connected in parallel or partially connected in parallel, and the transmission loss of the transmission line is reduced. Preferably, the interconnect nodes on each transport layer 330 are evenly distributed.
In the present embodiment, as in the above-described embodiments, the ground layer 320 can effectively isolate the first signal layer 310 and each of the transmission layers 330, so that the transmission quality of the transmission line formed by each of the transmission layers 330 is not affected by the first signal layer; the conductive layer (serving as the first signal layer 310) on the top layer has a larger line width and thickness, so that the circuit elements and circuit wires formed in the first signal layer 310 can allow larger current, and the difficulty in layout and wiring of the circuit is reduced; since the line width and/or thickness of the conductive layer positioned at the bottom layer is generally smaller than the line width and/or thickness of each of the transmission layers 330, the transmission quality of the transmission line is weakly affected by the signal in the second signal layer 340 formed using the conductive layer positioned at the bottom layer.
Further, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 310 located above the ground layer 320 and a plurality of second signal layers 340 located below the respective transmission layers 330.
Fig. 5 shows a schematic structural diagram of a radio frequency transmission device according to a fourth embodiment of the present invention.
As shown in fig. 5, the rf transmission device 400 according to the fourth embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from top layer to bottom layer.
The plurality of conductive layers includes a first signal layer 410, a ground layer 420, a transmission layer 430, and a second signal layer 440. The conductive layer on the top layer serves as the first signal layer 410, the conductive layer on the second top layer serves as the ground layer 420, the conductive layer on the bottom layer serves as the second signal layer 440, and any conductive layer between the second signal layer 440 and the ground layer 420 serves as the transmission layer 430. Preferably, a conductive layer located at the sub-bottom layer is used as the transmission layer 430.
In the present embodiment, as in the above-described embodiments, the ground layer 420 can effectively isolate the first signal layer 410 and the transmission layer 430, so that the transmission quality of the transmission line formed by the transmission layer 430 is not affected by the first signal layer; the conductive layer (serving as the first signal layer 410) on the top layer has a larger line width and thickness, so that the circuit elements and the circuit wires formed in the first signal layer 410 can allow larger current, and the difficulty in carrying out layout and wiring on the circuit is reduced; since the line width and/or thickness of the conductive layer at the bottom layer is generally smaller than the line width and/or thickness of the transmission layer 430, the transmission quality of the transmission line is weakly affected by the signal in the second signal layer 440 formed using the conductive layer at the bottom layer.
Further, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 410 located above the ground layer 420 and a plurality of second signal layers 440 located below the transmission layer 430.
The radio frequency transmission device provided by the embodiments of the invention has the advantages that the grounding layer for providing the reference ground voltage is arranged between the transmission layer for forming the transmission line and the signal layer for forming the element and circuit connection, so that the grounding layer can effectively isolate the signal layer from the transmission layer, and the transmission quality of the transmission line formed by the transmission layer is not influenced by signals transmitted in the signal layer; in the radio frequency transmission device provided by the embodiments of the present invention, the conductive layer with a larger line width and/or thickness is used as the signal layer, so that the elements and circuit wires formed in the signal layer can allow larger current, and the difficulty in layout and wiring of the circuit is reduced.
It should be noted that in this document relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Embodiments in accordance with the present invention, as described above, are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (7)
1. A radio frequency transmission device for radar, comprising a plurality of conductive layers sequentially distributed from a top layer to a bottom layer, wherein the plurality of conductive layers comprises:
one or more first signal layers, each of the first signal layers being for forming circuit elements and circuit connections other than transmission lines and ground lines, the transmission lines being for transmitting radio frequency signals;
One or more transmission layers integrally forming the transmission line, wherein the line width and/or thickness of each transmission layer is smaller than/equal to the line width and/or thickness of each first signal layer; and
A ground layer for forming the ground line to provide a reference ground potential, the ground layer being located between the one or more transmission layers and the one or more first signal layers to isolate the one or more transmission layers and the one or more first signal layers,
The line widths and/or thicknesses of the conductive layers sequentially distributed from the top layer to the bottom layer are in a decreasing trend.
2. The radio frequency transmission device for a radar according to claim 1, wherein the plurality of conductive layers further includes one or more second signal layers, which are used together with the one or more first signal layers to form circuit elements and circuit wirings other than the transmission line and the ground line,
The one or more transmission layers are located between the ground layer and the one or more second signal layers.
3. The radio frequency transmission device for radar according to claim 2, wherein a line width and/or a thickness of each of the second signal layers is equal to or less than a line width and/or a thickness of each of the transmission layers.
4. The radio frequency transmission device for radar according to claim 1, wherein the one or more transmission layers are distributed adjacently in order among the plurality of conductive layers, and the transmission layers adjacent to each two positions are integrally connected in parallel or partially connected in parallel by interconnection.
5. The radio frequency transmission device for radar according to claim 4, wherein each of the transmission layers has a plurality of interconnection nodes distributed uniformly, and the interconnection nodes corresponding to each two adjacent transmission layers are electrically connected.
6. The radio frequency transmission device for radar according to claim 1, wherein the conductive layer at a top layer serves as the first signal layer, and the conductive layer at a sub-top layer serves as the ground layer.
7. The radio frequency transmission device for radar according to claim 1, wherein the plurality of conductive layers are each made of a metal material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810050790.2A CN108233980B (en) | 2018-01-18 | 2018-01-18 | Radio frequency transmission device |
| CN202410799357.4A CN118677472A (en) | 2018-01-18 | 2018-01-18 | Radio frequency integrated circuit and radar |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810050790.2A CN108233980B (en) | 2018-01-18 | 2018-01-18 | Radio frequency transmission device |
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| CN202410799357.4A Division CN118677472A (en) | 2018-01-18 | 2018-01-18 | Radio frequency integrated circuit and radar |
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| CN108233980A CN108233980A (en) | 2018-06-29 |
| CN108233980B true CN108233980B (en) | 2024-07-19 |
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| CN201810050790.2A Active CN108233980B (en) | 2018-01-18 | 2018-01-18 | Radio frequency transmission device |
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| CN114844519B (en) * | 2022-04-06 | 2023-10-10 | 杭州海康威视数字技术股份有限公司 | Isolation device for intrinsic safety circuit and non-intrinsic safety circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206611628U (en) * | 2017-03-02 | 2017-11-03 | 东莞市同川精密五金有限公司 | A kind of novel high-frequency impedance FPC plates |
| CN207706179U (en) * | 2018-01-18 | 2018-08-07 | 加特兰微电子科技(上海)有限公司 | Radio frequency transmission device |
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| JP2009224638A (en) * | 2008-03-18 | 2009-10-01 | Nec Corp | Transmission line structure of mounting substrate |
| CN202870676U (en) * | 2012-08-27 | 2013-04-10 | 百度在线网络技术（北京）有限公司 | Server mainboard |
| CN203279328U (en) * | 2013-04-15 | 2013-11-06 | 竞陆电子(昆山)有限公司 | Asymmetric pressing control warping structure of multi-layer printed circuit board |
| CN105072800B (en) * | 2015-06-25 | 2016-04-06 | 北京中微普业科技有限公司 | A kind of pcb board different aspects realize the pcb board structure of microwave coaxial transmission |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206611628U (en) * | 2017-03-02 | 2017-11-03 | 东莞市同川精密五金有限公司 | A kind of novel high-frequency impedance FPC plates |
| CN207706179U (en) * | 2018-01-18 | 2018-08-07 | 加特兰微电子科技(上海)有限公司 | Radio frequency transmission device |
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| CN118677472A (en) | 2024-09-20 |
| CN108233980A (en) | 2018-06-29 |
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