CN108233980B - Radio frequency transmission device - Google Patents

Radio frequency transmission device Download PDF

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CN108233980B
CN108233980B CN201810050790.2A CN201810050790A CN108233980B CN 108233980 B CN108233980 B CN 108233980B CN 201810050790 A CN201810050790 A CN 201810050790A CN 108233980 B CN108233980 B CN 108233980B
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transmission
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radio frequency
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CN108233980A (en
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刘正东
陈嘉澍
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Calterah Semiconductor Technology Shanghai Co Ltd
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Calterah Semiconductor Technology Shanghai Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits

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  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a radio frequency transmission device, which comprises a plurality of conductive layers sequentially distributed from a top layer to a bottom layer, wherein the plurality of conductive layers comprise: one or more first signal layers, each for forming circuit elements and circuit wires other than the transmission line and the ground line; the transmission layers form transmission lines for transmitting radio frequency signals, and the line width and/or the thickness of each transmission layer are/is greater than or equal to the line width and/or the thickness of each first signal layer; and a ground layer for forming a ground line to provide a reference ground potential, the ground layer being located between the one or more transmission layers and the one or more first signal layers to isolate the one or more transmission layers and the one or more first signal layers. The radio frequency transmission device reduces the difficulty of layout and wiring and ensures the transmission quality of the transmission line.

Description

射频传输装置Radio frequency transmission device

技术领域Technical Field

本发明涉及无线通信领域,更具体地,涉及一种射频传输装置。The present invention relates to the field of wireless communications, and more particularly to a radio frequency transmission device.

背景技术Background technique

在雷达和无线通信系统中,由于射频信号自身的特点,通常需要设置射频传输装置对射频信号进行传输,射频传输装置通常包括用于传递射频信号的传输线和用于提供参考地电位的接地线。In radar and wireless communication systems, due to the characteristics of radio frequency signals themselves, it is usually necessary to set up a radio frequency transmission device to transmit the radio frequency signals. The radio frequency transmission device usually includes a transmission line for transmitting radio frequency signals and a grounding line for providing a reference ground potential.

在射频集成电路中,射频传输装置主要由从顶层至底层依次分布的多个可互连的金属层实现,例如一种现有的集成电路工艺能够实现八层以上的可互连金属层。位于顶层的金属层通常在线宽和厚度上都高于其他金属层,而位于底层的金属层通常在线宽和厚度上都低于其他金属层。In a radio frequency integrated circuit, the radio frequency transmission device is mainly realized by a plurality of interconnected metal layers distributed in sequence from the top layer to the bottom layer. For example, an existing integrated circuit process can realize more than eight interconnected metal layers. The metal layer at the top layer is usually higher in line width and thickness than other metal layers, while the metal layer at the bottom layer is usually lower in line width and thickness than other metal layers.

图1示出了传统的射频传输装置的结构示意图。FIG. 1 shows a schematic structural diagram of a conventional radio frequency transmission device.

如图1所示,在传统的射频传输装置10中,为了降低传输线的传输损耗,通常采用位于顶层的金属层11形成传输线,同时采用位于底层的金属层12形成接地线。As shown in FIG. 1 , in a conventional radio frequency transmission device 10 , in order to reduce the transmission loss of the transmission line, a metal layer 11 located at the top layer is usually used to form the transmission line, and a metal layer 12 located at the bottom layer is used to form a ground line.

然而,为了减小对射频信号的干扰,系统中的其他电路连线和电路模块尽量远离传输线所在的区域,导致射频集成电路的版图面积很难缩小,并且也增加了布局布线的时间成本和空间成本,为射频集成电路的设计和生产带来不便。However, in order to reduce interference with RF signals, other circuit connections and circuit modules in the system are kept as far away from the transmission line as possible, which makes it difficult to reduce the layout area of the RF integrated circuit. It also increases the time and space costs of layout and wiring, bringing inconvenience to the design and production of RF integrated circuits.

为了解决上述问题,基于传统的射频传输装置的结构,一种现有技术采用位于次顶层的金属层形成传输线,而采用顶层的金属层作为信号层以用于形成其他电路模块和连线。但是在这种现有技术中,由于在集成电路的制造工艺中,位于顶层的金属层与位于次顶层的金属层相比,通常具有更大的线宽和厚度,因此,由位于次顶层的金属层的传输线附近将会放置有大面积的、且传输其他电路信号的金属,这将不可避免地影响到传输线的传输质量。In order to solve the above problems, based on the structure of the traditional radio frequency transmission device, one prior art adopts the metal layer located at the second top layer to form the transmission line, and adopts the metal layer at the top layer as the signal layer to form other circuit modules and connections. However, in this prior art, since in the manufacturing process of the integrated circuit, the metal layer located at the top layer usually has a larger line width and thickness than the metal layer located at the second top layer, a large area of metal that transmits other circuit signals will be placed near the transmission line of the metal layer located at the second top layer, which will inevitably affect the transmission quality of the transmission line.

另一种现有技术在传统的射频传输装置的基础上,采用位于底层的金属层作为信号层以形成其他电路模块和连线,并采用位于次底层的金属层或更上层的金属层形成接地线,使得接地线能够隔离信号层和用于形成传输线的顶层金属层。但是在这种现有技术中,由于位于底层的金属层与其他金属层相比通常具有最小的线宽和厚度,因此,采用位于底层的金属层形成的信号连线对电流的承受能力有限,使得这种现有技术的射频传输装置的应用受到限制。Another prior art uses a metal layer at the bottom layer as a signal layer to form other circuit modules and connections based on a traditional radio frequency transmission device, and uses a metal layer at the second bottom layer or a higher layer to form a ground line, so that the ground line can isolate the signal layer from the top metal layer used to form the transmission line. However, in this prior art, since the metal layer at the bottom layer usually has the smallest line width and thickness compared with other metal layers, the signal connection formed by the metal layer at the bottom layer has limited current bearing capacity, which limits the application of the radio frequency transmission device of this prior art.

因此,期待一种新的射频传输装置,使得相关技术人员在对其他电路连线和电路模块进行布局布线时不需要避开传输线所在区域、保证传输线的传输质量并且使得传输线和接地线之外的电路元件和电路连线能够具有一定的电流承受能力。Therefore, a new radio frequency transmission device is expected, which enables relevant technicians to layout and route other circuit connections and circuit modules without having to avoid the area where the transmission line is located, ensure the transmission quality of the transmission line, and enable circuit elements and circuit connections other than the transmission line and the ground wire to have a certain current-carrying capacity.

发明内容Summary of the invention

为了解决上述现有技术存在的问题,本发明提供一种射频传输装置,其能够降低布局布线的难度,使得相关人员在对传输线和接地线之外的电路连线和元件进行布局布线时不需要避开射频传输装置的传输线所在区域,并且降低了对电流承受能力的要求,保证了传输线的传输质量。In order to solve the problems existing in the above-mentioned prior art, the present invention provides a radio frequency transmission device, which can reduce the difficulty of layout and wiring, so that relevant personnel do not need to avoid the area where the transmission line of the radio frequency transmission device is located when laying out and wiring circuit connections and components other than the transmission line and the ground wire, and reduces the requirements for current carrying capacity, thereby ensuring the transmission quality of the transmission line.

本发明提供了一种射频传输装置,包括依次分布于顶层至底层的多个导电层,其中,所述多个导电层包括:一个或多个第一信号层,每个所述第一信号层用于形成传输线和接地线之外的电路元件和电路连线,所述传输线用于传输射频信号;一个或多个传输层,所述一个或多个传输层整体形成所述传输线,各所述传输层的线宽和/或厚度大于等于各所述第一信号层的线宽和/或厚度;以及接地层,用于形成所述接地线以提供参考地电位,所述接地层位于所述一个或多个传输层与所述一个或多个第一信号层之间以隔离所述一个或多个传输层和所述一个或多个第一信号层。The present invention provides a radio frequency transmission device, comprising a plurality of conductive layers sequentially distributed from a top layer to a bottom layer, wherein the plurality of conductive layers include: one or more first signal layers, each of the first signal layers being used to form circuit elements and circuit connections other than a transmission line and a ground line, the transmission line being used to transmit radio frequency signals; one or more transmission layers, the one or more transmission layers forming the transmission line as a whole, the line width and/or thickness of each of the transmission layers being greater than or equal to the line width and/or thickness of each of the first signal layers; and a ground layer, being used to form the ground line to provide a reference ground potential, the ground layer being located between the one or more transmission layers and the one or more first signal layers to isolate the one or more transmission layers from the one or more first signal layers.

优选地,所述多个导电层还包括一个或多个第二信号层,与所述一个或多个第一信号层共同用于形成所述传输线和所述接地线之外的电路元件和电路连线,所述一个或多个传输层位于所述接地层与所述一个或多个第二信号层之间。Preferably, the multiple conductive layers also include one or more second signal layers, which are used together with the one or more first signal layers to form circuit elements and circuit connections other than the transmission line and the ground line, and the one or more transmission layers are located between the ground layer and the one or more second signal layers.

优选地,各所述第二信号层的线宽和/或厚度小于等于各所述传输层的线宽和/或厚度。Preferably, the line width and/or thickness of each of the second signal layers is less than or equal to the line width and/or thickness of each of the transmission layers.

优选地,所述一个或多个传输层在所述多个导电层中依次相邻分布,且每两个位置相邻的所述传输层通过互连实现整体并联或部分并联。Preferably, the one or more transmission layers are distributed adjacent to each other in the multiple conductive layers in sequence, and every two adjacent transmission layers are connected in parallel as a whole or in part through interconnection.

优选地,各所述传输层分别具有平均分布的多个互联节点,每两个位置相邻的所述传输层中位置对应的所述互联节点电相连。Preferably, each of the transmission layers has a plurality of evenly distributed interconnection nodes, and the interconnection nodes corresponding to positions in every two adjacent transmission layers are electrically connected.

优选地,位于顶层的所述导电层作为所述第一信号层,位于次顶层的所述导电层作为所述接地层。Preferably, the conductive layer located on the top layer serves as the first signal layer, and the conductive layer located on the second top layer serves as the ground layer.

优选地,从顶层至底层依次分布的所述多个导电层的线宽和/或厚度呈下降趋势。Preferably, the line width and/or thickness of the plurality of conductive layers sequentially distributed from the top layer to the bottom layer presents a decreasing trend.

优选地,所述多个导电层分别由金属材料制成。Preferably, the plurality of conductive layers are respectively made of metal materials.

本发明提供的射频传输装置将用于提供参考地电压的接地层设置在用于形成传输线的传输层和用于形成元件和电路连线的信号层之间,从而接地层能够有效地将信号层和传输层隔离,因此由传输层形成的传输线的传输质量不会受到信号层中传输的信号的影响;在本发明各实施例提供的射频传输装置中,将线宽和/或厚度较大的导电层作为信号层,从而形成于信号层中的元件和电路连线能够允许较大的电流,降低了对电路进行布局布线的难度,同时,虽然将线宽和/厚度较小的导电层作为传输层,但是由于在传输层中可以大面积地铺设传输线,因此用于传输射频信号的传输线也能够具有较低的电阻率,从而保证了传输线具有较低的传输损耗和较好的传输质量。The radio frequency transmission device provided by the present invention sets a grounding layer for providing a reference ground voltage between a transmission layer for forming a transmission line and a signal layer for forming components and circuit connections, so that the grounding layer can effectively isolate the signal layer and the transmission layer, and therefore the transmission quality of the transmission line formed by the transmission layer will not be affected by the signal transmitted in the signal layer; in the radio frequency transmission device provided by each embodiment of the present invention, a conductive layer with a larger line width and/or thickness is used as a signal layer, so that the components and circuit connections formed in the signal layer can allow a larger current, reducing the difficulty of layout and wiring of the circuit. At the same time, although a conductive layer with a smaller line width and/or thickness is used as a transmission layer, since the transmission line can be laid over a large area in the transmission layer, the transmission line used to transmit the radio frequency signal can also have a lower resistivity, thereby ensuring that the transmission line has a lower transmission loss and better transmission quality.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

通过以下参照附图对本发明实施例的描述,本发明的上述以及其他目的、特征和优点将更为清楚。The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings.

图1示出了传统的射频传输装置的结构示意图。FIG. 1 shows a schematic structural diagram of a conventional radio frequency transmission device.

图2示出本发明第一实施例的射频传输装置的结构示意图。FIG. 2 is a schematic structural diagram of a radio frequency transmission device according to a first embodiment of the present invention.

图3示出本发明第二实施例的射频传输装置的结构示意图。FIG3 is a schematic structural diagram of a radio frequency transmission device according to a second embodiment of the present invention.

图4示出本发明第三实施例的射频传输装置的结构示意图。FIG. 4 is a schematic structural diagram of a radio frequency transmission device according to a third embodiment of the present invention.

图5示出本发明第四实施例的射频传输装置的结构示意图。FIG5 is a schematic structural diagram of a radio frequency transmission device according to a fourth embodiment of the present invention.

具体实施方式Detailed ways

以下将参照附图更详细地描述本发明。在各个附图中,相同的元件采用类似的附图标记来表示。为了清楚起见,附图中的各个部分没有按比例绘制。此外,在图中可能未示出某些公知的部分。The present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, the same elements are represented by similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale. In addition, some well-known parts may not be shown in the drawings.

在下文中描述了本发明的许多特定的细节,例如器件的结构、材料、尺寸、处理工艺和技术,以便更清楚地理解本发明。但正如本领域的技术人员能够理解的那样,可以不按照这些特定的细节来实现本发明。Many specific details of the present invention are described below, such as device structure, materials, dimensions, processing technology and techniques, so as to more clearly understand the present invention. However, as those skilled in the art will appreciate, the present invention may be implemented without following these specific details.

在本发明的描述中,“之上”是指更靠近顶层的位置,“之下”是指更靠近底层的位置。In the description of the present invention, “above” refers to a position closer to the top layer, and “below” refers to a position closer to the bottom layer.

本发明实施例的射频传输装置包括依次分布于顶层至底层的多个导电层,从顶层至底层依次分布的多个导电层的线宽和/或厚度呈下降趋势,例如,更靠近最底层的导电层相比于更靠近最顶层的导电层具有相同或者更小的线宽和/或厚度。通常,多个导电层分别由金属材料制成,相邻的两个导电层之间存在绝缘层,不同的导电层之间可以通过过孔互连。The radio frequency transmission device of the embodiment of the present invention includes a plurality of conductive layers sequentially distributed from the top layer to the bottom layer, and the line width and/or thickness of the plurality of conductive layers sequentially distributed from the top layer to the bottom layer show a decreasing trend, for example, the conductive layer closer to the bottom layer has the same or smaller line width and/or thickness than the conductive layer closer to the top layer. Generally, the plurality of conductive layers are respectively made of metal materials, an insulating layer is provided between two adjacent conductive layers, and different conductive layers can be interconnected through vias.

其中,多个导电层包括一个或多个第一信号层、一个或多个传输层以及接地层。The multiple conductive layers include one or more first signal layers, one or more transmission layers and a ground layer.

一个或多个传输层整体用于形成射频传输装置的传输线。当传输线由依次连续分布的多个传输层实现时,每两个相邻的传输层整体或部分并联,从而多个传输层能并联形成电阻率很低传输线,降低了传输损耗、提高了传输质量。One or more transmission layers are used as a whole to form a transmission line of a radio frequency transmission device. When the transmission line is realized by a plurality of transmission layers distributed in sequence, every two adjacent transmission layers are connected in parallel in whole or in part, so that a plurality of transmission layers can be connected in parallel to form a transmission line with very low resistivity, thereby reducing transmission loss and improving transmission quality.

每个第一信号层分别用于形成元件和/或电路连线,接地层用于形成接地线以提供参考地电位,其中,接地层位于各个传输层和各个第一信号层之间以隔离传输线与第一信号层中形成的元件和连线。Each first signal layer is used to form components and/or circuit connections, and the ground layer is used to form ground lines to provide a reference ground potential, wherein the ground layer is located between each transmission layer and each first signal layer to isolate the transmission lines from the components and connections formed in the first signal layer.

在一些优选的实施例中,多个导电层还包括一个或多个第二信号层,与各个第一信号层共同用于形成元件和连线。In some preferred embodiments, the plurality of conductive layers further include one or more second signal layers, which are used together with the first signal layers to form components and wirings.

基于此,下面参照附图对本发明的具体实施例进行详细说明。Based on this, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

图2示出本发明第一实施例的射频传输装置的结构示意图。FIG. 2 is a schematic structural diagram of a radio frequency transmission device according to a first embodiment of the present invention.

如图2所示,本发明第一实施例的射频传输装置100由依次分布于顶层至底层的多个导电层实现。As shown in FIG. 2 , the radio frequency transmission device 100 according to the first embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from the top layer to the bottom layer.

多个导电层包括第一信号层110、接地层120以及传输层130。位于顶层的导电层作为第一信号层110,位于次顶层的导电层作为接地层120,位于接地层120之下的任一个导电层作为传输层130。优选地,将位于底层或次底层的导电层作为传输层130。The multiple conductive layers include a first signal layer 110, a ground layer 120, and a transmission layer 130. The conductive layer at the top layer is used as the first signal layer 110, the conductive layer at the second top layer is used as the ground layer 120, and any conductive layer below the ground layer 120 is used as the transmission layer 130. Preferably, the conductive layer at the bottom layer or the second bottom layer is used as the transmission layer 130.

在本实施例中,由于接地层120位于第一信号层110之下、传输层130之上,因此,即使第一信号层110的线宽和/或厚度大于传输层130的线宽和/或厚度,接地以提供参考地电位的接地层120也能够有效地隔离第一信号层110和传输层130,使得由传输层130形成的传输线的传输质量不受第一信号层110的影响;位于顶层的导电层(作为第一信号层110)具有较大的线宽和厚度,则形成于第一信号层110中的电路元件和电路连线能够允许较大的电流,降低了对电路进行布局布线的难度;由于在传输层130中可以大面积地铺设传输线,因此,即使将最底层或次底层的导电层作为传输层130,也能够使传输线具有较低的电阻率,保证了传输线的传输质量。In the present embodiment, since the grounding layer 120 is located below the first signal layer 110 and above the transmission layer 130, even if the line width and/or thickness of the first signal layer 110 is greater than the line width and/or thickness of the transmission layer 130, the grounding layer 120 that is grounded to provide a reference ground potential can effectively isolate the first signal layer 110 and the transmission layer 130, so that the transmission quality of the transmission line formed by the transmission layer 130 is not affected by the first signal layer 110; the conductive layer located at the top layer (as the first signal layer 110) has a larger line width and thickness, so the circuit elements and circuit connections formed in the first signal layer 110 can allow a larger current, thereby reducing the difficulty of layout and wiring of the circuit; since the transmission line can be laid over a large area in the transmission layer 130, even if the bottom or second bottom conductive layer is used as the transmission layer 130, the transmission line can have a lower resistivity, thereby ensuring the transmission quality of the transmission line.

进一步地,在一些扩展的实施例中,多个导电层可以包括多个位于接地层120之上的第一信号层110。Furthermore, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 110 located above the ground layer 120 .

图3示出本发明第二实施例的射频传输装置的结构示意图。FIG3 is a schematic structural diagram of a radio frequency transmission device according to a second embodiment of the present invention.

如图3所示,本发明第二实施例的射频传输装置200由依次分布于顶层至底层的多个导电层实现。As shown in FIG. 3 , the radio frequency transmission device 200 according to the second embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from the top layer to the bottom layer.

多个导电层包括第一信号层210、接地层220以及多个传输层230。位于顶层的导电层作为第一信号层210,位于次顶层的导电层作为接地层220,位于接地层220之下的多个连续分布的导电层分别作为多个传输层230。其中,每两个位置相邻的传输层230通过互连实现至少部分并联,即各个传输层230上分别分布有多个互联节点,每两个上下相邻的传输层230上位置相应的互联节点电相连,使得每两个位置相邻的传输层230能够实现整体并联或局部并联,以降低传输线的传输损耗。优选地,每个传输层230上的互联节点均匀分布。The multiple conductive layers include a first signal layer 210, a ground layer 220, and multiple transmission layers 230. The conductive layer at the top layer serves as the first signal layer 210, the conductive layer at the second top layer serves as the ground layer 220, and the multiple continuously distributed conductive layers below the ground layer 220 serve as multiple transmission layers 230. Among them, every two adjacent transmission layers 230 are at least partially connected in parallel through interconnection, that is, each transmission layer 230 is respectively provided with multiple interconnection nodes, and the corresponding interconnection nodes on every two upper and lower adjacent transmission layers 230 are electrically connected, so that every two adjacent transmission layers 230 can be connected in parallel as a whole or partially, so as to reduce the transmission loss of the transmission line. Preferably, the interconnection nodes on each transmission layer 230 are evenly distributed.

在本实施例中,与上述实施例相同,接地层220能够有效地隔离第一信号层210和各个传输层230,使得由各个传输层230形成的传输线的传输质量不受第一信号层的影响;位于顶层的导电层(作为第一信号层210)具有较大的线宽和厚度,则形成于第一信号层210中的电路元件和电路连线能够允许较大的电流,降低了对电路进行布局布线的难度。In this embodiment, similar to the above-mentioned embodiment, the ground layer 220 can effectively isolate the first signal layer 210 and each transmission layer 230, so that the transmission quality of the transmission line formed by each transmission layer 230 is not affected by the first signal layer; the conductive layer located on the top layer (as the first signal layer 210) has a larger line width and thickness, so the circuit elements and circuit connections formed in the first signal layer 210 can allow a larger current, reducing the difficulty of layout and wiring of the circuit.

进一步地,在一些扩展的实施例中,多个导电层可以包括多个位于接地层220之上的第一信号层210。Furthermore, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 210 located above the ground layer 220 .

图4示出本发明第三实施例的射频传输装置的结构示意图。FIG. 4 is a schematic structural diagram of a radio frequency transmission device according to a third embodiment of the present invention.

如图4所示,本发明第三实施例的射频传输装置300由依次分布于顶层至底层的多个导电层实现。As shown in FIG. 4 , the radio frequency transmission device 300 according to the third embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from the top layer to the bottom layer.

多个导电层包括第一信号层310、接地层320、多个传输层330以及第二信号层340。位于顶层的导电层作为第一信号层310,位于次顶层的导电层作为接地层320,位于底层的导电层作为第二信号层340,位于接地层320和第二信号层340之间的多个连续分布的导电层作为多个传输层330。其中,每两个位置相邻的传输层330通过互连实现至少部分并联,即各个传输层330上分别分布有多个互联节点,每两个上下相邻的传输层330上位置相应的互联节点电相连,使得每两个位置相邻的传输层330能够实现整体并联或局部并联,以降低传输线的传输损耗。优选地,每个传输层330上的互联节点均匀分布。The multiple conductive layers include a first signal layer 310, a ground layer 320, multiple transmission layers 330, and a second signal layer 340. The conductive layer at the top layer serves as the first signal layer 310, the conductive layer at the second top layer serves as the ground layer 320, the conductive layer at the bottom layer serves as the second signal layer 340, and the multiple continuously distributed conductive layers between the ground layer 320 and the second signal layer 340 serve as multiple transmission layers 330. Among them, every two adjacent transmission layers 330 are at least partially connected in parallel through interconnection, that is, a plurality of interconnection nodes are respectively distributed on each transmission layer 330, and the corresponding interconnection nodes on every two upper and lower adjacent transmission layers 330 are electrically connected, so that every two adjacent transmission layers 330 can be connected in parallel as a whole or partially, so as to reduce the transmission loss of the transmission line. Preferably, the interconnection nodes on each transmission layer 330 are evenly distributed.

在本实施例中,与上述实施例相同,接地层320能够有效地隔离第一信号层310和各个传输层330,使得由各个传输层330形成的传输线的传输质量不受第一信号层的影响;位于顶层的导电层(作为第一信号层310)具有较大的线宽和厚度,则形成于第一信号层310中的电路元件和电路连线能够允许较大的电流,降低了对电路进行布局布线的难度;由于位于底层的导电层的线宽和/或厚度通常小于各个传输层330的线宽和/或厚度,因此,采用位于底层的导电层形成的第二信号层340中的信号对传输线的传输质量影响微弱。In this embodiment, similar to the above-mentioned embodiment, the ground layer 320 can effectively isolate the first signal layer 310 and each transmission layer 330, so that the transmission quality of the transmission line formed by each transmission layer 330 is not affected by the first signal layer; the conductive layer located at the top layer (as the first signal layer 310) has a larger line width and thickness, and the circuit elements and circuit connections formed in the first signal layer 310 can allow a larger current, reducing the difficulty of layout and wiring of the circuit; because the line width and/or thickness of the conductive layer located at the bottom layer is usually smaller than the line width and/or thickness of each transmission layer 330, the signal in the second signal layer 340 formed by the conductive layer located at the bottom layer has a slight effect on the transmission quality of the transmission line.

进一步地,在一些扩展的实施例中,多个导电层可以包括多个位于接地层320之上的第一信号层310,以及多个位于各传输层330之下的第二信号层340。Furthermore, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 310 located above the ground layer 320 , and a plurality of second signal layers 340 located below each transmission layer 330 .

图5示出本发明第四实施例的射频传输装置的结构示意图。FIG5 is a schematic structural diagram of a radio frequency transmission device according to a fourth embodiment of the present invention.

如图5所示,本发明第四实施例的射频传输装置400由依次分布于顶层至底层的多个导电层实现。As shown in FIG. 5 , the radio frequency transmission device 400 according to the fourth embodiment of the present invention is implemented by a plurality of conductive layers sequentially distributed from the top layer to the bottom layer.

多个导电层包括第一信号层410、接地层420、传输层430以及第二信号层440。位于顶层的导电层作为第一信号层410,位于次顶层的导电层作为接地层420,位于底层的导电层作为第二信号层440,位于第二信号层440与接地层420之间的任一导电层作为传输层430。优选地,将位于次底层的导电层作为传输层430。The multiple conductive layers include a first signal layer 410, a ground layer 420, a transmission layer 430, and a second signal layer 440. The conductive layer at the top layer is used as the first signal layer 410, the conductive layer at the second top layer is used as the ground layer 420, the conductive layer at the bottom layer is used as the second signal layer 440, and any conductive layer between the second signal layer 440 and the ground layer 420 is used as the transmission layer 430. Preferably, the conductive layer at the second bottom layer is used as the transmission layer 430.

在本实施例中,与上述实施例相同,接地层420能够有效地隔离第一信号层410和传输层430,使得由传输层430形成的传输线的传输质量不受第一信号层的影响;位于顶层的导电层(作为第一信号层410)具有较大的线宽和厚度,因此形成于第一信号层410中的电路元件和电路连线能够允许较大的电流,降低了对电路进行布局布线的难度;由于位于底层的导电层的线宽和/或厚度通常小于传输层430的线宽和/或厚度,因此,采用位于底层的导电层形成的第二信号层440中的信号对传输线的传输质量影响微弱。In this embodiment, similar to the above-mentioned embodiment, the ground layer 420 can effectively isolate the first signal layer 410 and the transmission layer 430, so that the transmission quality of the transmission line formed by the transmission layer 430 is not affected by the first signal layer; the conductive layer located on the top layer (as the first signal layer 410) has a larger line width and thickness, so the circuit elements and circuit connections formed in the first signal layer 410 can allow a larger current, reducing the difficulty of layout and wiring of the circuit; because the line width and/or thickness of the conductive layer located on the bottom layer is usually smaller than the line width and/or thickness of the transmission layer 430, the signal in the second signal layer 440 formed by the conductive layer located on the bottom layer has little effect on the transmission quality of the transmission line.

进一步地,在一些扩展的实施例中,多个导电层可以包括多个位于接地层420之上的第一信号层410,以及多个位于传输层430之下的第二信号层440。Furthermore, in some extended embodiments, the plurality of conductive layers may include a plurality of first signal layers 410 located above the ground layer 420 , and a plurality of second signal layers 440 located below the transmission layer 430 .

本发明各实施例提供的射频传输装置将用于提供参考地电压的接地层设置在用于形成传输线的传输层和用于形成元件和电路连线的信号层之间,从而接地层能够有效地将信号层和传输层隔离,因此由传输层形成的传输线的传输质量不会受到信号层中传输的信号的影响;在本发明各实施例提供的射频传输装置中,将线宽和/或厚度较大的导电层作为信号层,从而形成于信号层中的元件和电路连线能够允许较大的电流,降低了对电路进行布局布线的难度,同时,虽然将线宽和/厚度较小的导电层作为传输层,但是由于在传输层中可以大面积地铺设传输线,因此用于传输射频信号的传输线也能够具有较低的电阻率,从而保证了传输线具有较低的传输损耗和较好的传输质量。The radio frequency transmission device provided by each embodiment of the present invention sets a grounding layer for providing a reference ground voltage between a transmission layer for forming a transmission line and a signal layer for forming components and circuit connections, so that the grounding layer can effectively isolate the signal layer and the transmission layer, and therefore the transmission quality of the transmission line formed by the transmission layer will not be affected by the signal transmitted in the signal layer; in the radio frequency transmission device provided by each embodiment of the present invention, a conductive layer with a larger line width and/or thickness is used as a signal layer, so that the components and circuit connections formed in the signal layer can allow a larger current, reducing the difficulty of layout and wiring of the circuit. At the same time, although a conductive layer with a smaller line width and/or thickness is used as a transmission layer, since the transmission line can be laid over a large area in the transmission layer, the transmission line used to transmit the radio frequency signal can also have a lower resistivity, thereby ensuring that the transmission line has a lower transmission loss and better transmission quality.

应当说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

依照本发明的实施例如上文所述,这些实施例并没有详尽叙述所有的细节,也不限制该发明仅为所述的具体实施例。显然,根据以上描述,可作很多的修改和变化。本说明书选取并具体描述这些实施例,是为了更好地解释本发明的原理和实际应用,从而使所属技术领域技术人员能很好地利用本发明以及在本发明基础上的修改使用。本发明仅受权利要求书及其全部范围和等效物的限制。According to the embodiments of the present invention as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modified use based on the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims (7)

1. A radio frequency transmission device for radar, comprising a plurality of conductive layers sequentially distributed from a top layer to a bottom layer, wherein the plurality of conductive layers comprises:
one or more first signal layers, each of the first signal layers being for forming circuit elements and circuit connections other than transmission lines and ground lines, the transmission lines being for transmitting radio frequency signals;
One or more transmission layers integrally forming the transmission line, wherein the line width and/or thickness of each transmission layer is smaller than/equal to the line width and/or thickness of each first signal layer; and
A ground layer for forming the ground line to provide a reference ground potential, the ground layer being located between the one or more transmission layers and the one or more first signal layers to isolate the one or more transmission layers and the one or more first signal layers,
The line widths and/or thicknesses of the conductive layers sequentially distributed from the top layer to the bottom layer are in a decreasing trend.
2. The radio frequency transmission device for a radar according to claim 1, wherein the plurality of conductive layers further includes one or more second signal layers, which are used together with the one or more first signal layers to form circuit elements and circuit wirings other than the transmission line and the ground line,
The one or more transmission layers are located between the ground layer and the one or more second signal layers.
3. The radio frequency transmission device for radar according to claim 2, wherein a line width and/or a thickness of each of the second signal layers is equal to or less than a line width and/or a thickness of each of the transmission layers.
4. The radio frequency transmission device for radar according to claim 1, wherein the one or more transmission layers are distributed adjacently in order among the plurality of conductive layers, and the transmission layers adjacent to each two positions are integrally connected in parallel or partially connected in parallel by interconnection.
5. The radio frequency transmission device for radar according to claim 4, wherein each of the transmission layers has a plurality of interconnection nodes distributed uniformly, and the interconnection nodes corresponding to each two adjacent transmission layers are electrically connected.
6. The radio frequency transmission device for radar according to claim 1, wherein the conductive layer at a top layer serves as the first signal layer, and the conductive layer at a sub-top layer serves as the ground layer.
7. The radio frequency transmission device for radar according to claim 1, wherein the plurality of conductive layers are each made of a metal material.
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