CN108233980A - Radio frequency transmission device - Google Patents
Radio frequency transmission device Download PDFInfo
- Publication number
- CN108233980A CN108233980A CN201810050790.2A CN201810050790A CN108233980A CN 108233980 A CN108233980 A CN 108233980A CN 201810050790 A CN201810050790 A CN 201810050790A CN 108233980 A CN108233980 A CN 108233980A
- Authority
- CN
- China
- Prior art keywords
- layer
- layers
- signals
- radio frequency
- transmission device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 116
- 238000009826 distribution Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
Abstract
The invention discloses a kind of radio frequency transmission device, including being sequentially distributed multiple conductive layers in top layer to bottom, wherein, multiple conductive layers include：One or more first signals layers, each first signals layer are used to form circuit element and circuit connection except transmission line and ground wire；One or more transport layers, one or more transport layer formation are used for transmission the transmission line of radiofrequency signal, and the line width and/or thickness of each transport layer are more than or equal to the line width and/or thickness of each first signals layer；And ground plane, ground wire is used to form to provide ground reference, and ground plane is located between one or more transport layers and one or more first signals layers one or more transport layers and one or more first signals layers are isolated.The difficulty that radio frequency transmission device provided by the invention reduces placement-and-routing ensure that the transmission quality of transmission line.
Description
Technical field
The present invention relates to wireless communication field, more particularly, to a kind of radio frequency transmission device.
Background technology
In radar and wireless communication system, the characteristics of due to radiofrequency signal itself, it usually needs setting radio frequency transmission fills
It puts and radiofrequency signal is transmitted, radio frequency transmission device generally includes transmission line for transmitting radiofrequency signal and for providing ginseng
Examine the ground wire of ground potential.
In RF IC, radio frequency transmission device mainly multiple is interconnected by what is be sequentially distributed from top layer to bottom
Metal layer realize, such as a kind of existing integrated circuit technology can realize eight layers or more can interconnecting metal layer.Positioned at top layer
Metal layer usually in line width and thickness all higher than other metal layers, and positioned at bottom metal layer usually in line width and thickness
Upper below other metal layers.
Fig. 1 shows the structure diagram of traditional radio frequency transmission device.
As shown in Figure 1, in traditional radio frequency transmission device 10, in order to reduce the transmission loss of transmission line, generally use
Transmission line is formed, while ground wire is formed using the metal layer 12 positioned at bottom positioned at the metal layer 11 of top layer.
However, in order to reduce the interference to radiofrequency signal, other circuit connections and circuit module in system are separate as possible
Region where transmission line, the chip area for leading to RF IC be difficult reduce, and also increase placement-and-routing when
Between cost and space cost, make troubles for the design and producing of RF IC.
To solve the above-mentioned problems, the structure based on traditional radio frequency transmission device, a kind of prior art are used positioned at secondary
The metal layer of top layer forms transmission line, and uses the metal layer of top layer as signals layer for forming other circuit modules and company
Line.But it is this in the prior art, due in the manufacturing process of integrated circuit, positioned at top layer metal layer with positioned at time top
The metal layer of layer is compared, and usually has the line width and thickness of bigger, therefore, near the transmission line by the metal layer for being located at time top layer
Metal that is that large area will be placed with and transmitting other circuit signals, this will inevitably impact on the transmission of transmission line
Quality.
Another prior art is on the basis of traditional radio frequency transmission device, using the metal layer positioned at bottom as letter
Number floor forms ground connection to form other circuit modules and line using the metal layer positioned at second bottom or the metal layer of more top
Line so that ground wire isolation signals layer and can be used to form the top layer metallic layer of transmission line.But it is this in the prior art,
Since the metal layer for being located at bottom usually has minimum line width and thickness compared with other metal layers, using the bottom of positioned at
The signal link that the metal layer of layer is formed is limited to the ability to bear of electric current so that the radio frequency transmission device of this prior art
Using being restricted.
Therefore, expect a kind of new radio frequency transmission device so that related technical personnel are to other circuit connections and circuit
Module, which is laid out, not to be needed to avoid transmission line region, ensure the transmission quality of transmission line and cause transmission line during wiring
There can be certain current carrying capability with the circuit element except ground wire and circuit connection.
Invention content
In order to solve the above-mentioned problems of the prior art, the present invention provides a kind of radio frequency transmission device, can reduce
The difficulty of placement-and-routing so that related personnel is being laid out wiring to the circuit connection except transmission line and ground wire and element
When do not need to avoid the transmission line region of radio frequency transmission device, and reduce the requirement to current carrying capability, ensure
The transmission quality of transmission line.
The present invention provides a kind of radio frequency transmission device, including being sequentially distributed multiple conductive layers in top layer to bottom,
In, the multiple conductive layer includes：One or more first signals layers, each first signals layer be used to form transmission line and
Circuit element and circuit connection except ground wire, the transmission line are used for transmission radiofrequency signal；One or more transport layers, institute
It states one or more transport layers and the transmission line is integrally formed, the line width and/or thickness of each transport layer are more than or equal to each institute
State the line width and/or thickness of the first signals layer；And ground plane, the ground wire is used to form to provide ground reference, institute
It is one to be isolated between one or more of transport layers and one or more of first signals layers to state ground plane
Or multiple transport layers and one or more of first signals layers.
Preferably, the multiple conductive layer further includes one or more second signal layers, with one or more of first
Signals layer is provided commonly for forming the circuit element and circuit connection except the transmission line and the ground wire, one or more
A transport layer is between the ground plane and one or more of second signal layers.
Preferably, the line width of each second signal layer and/or thickness be less than or equal to each transport layer line width and/or
Thickness.
Preferably, one or more of transport layers adjacent distributions, and each two position successively in the multiple conductive layer
It puts the adjacent transport layer and realizes whole in parallel or part in parallel by interconnecting.
Preferably, each transport layer is respectively provided with the multiple interlink nodes being evenly distributed, the adjacent institute in each two position
The corresponding interlink node in position in transport layer is stated to be electrically connected.
The conductive layer of top layer is preferably located at as first signals layer, positioned at the conductive layer of secondary top layer
As the ground plane.
Preferably, the line width and/or thickness for the multiple conductive layer being sequentially distributed from top layer to bottom are on a declining curve.
Preferably, the multiple conductive layer is made of metal material respectively.
Radio frequency transmission device provided by the invention will be arranged on for the ground plane provided with reference to ground voltage and be used to form biography
It the transport layer of defeated line and is used to form between element and the signals layer of circuit connection, so as to which ground plane can be effectively by signals layer
It is isolated with transport layer, therefore the transmission quality of the transmission line formed by transport layer will not be by the shadow of the signal transmitted in signals layer
It rings；In the radio frequency transmission device provided in various embodiments of the present invention, using the larger conductive layer of line width and/or thickness as signal
Layer, element and circuit connection so as to be formed in signals layer can allow for larger electric current, reduce and circuit is laid out
The difficulty of wiring, meanwhile, although using line width and the/smaller conductive layer of thickness as transport layer, due to can in transport layer
To be laid with transmission line in large area, the transmission line for being accordingly used in transmitting radio frequency signal can also have relatively low resistivity, so as to
It ensure that transmission line has relatively low transmission loss and preferable transmission quality.
Description of the drawings
By referring to the drawings to the description of the embodiment of the present invention, above-mentioned and other purposes of the invention, feature and
Advantage will be apparent from.
Fig. 1 shows the structure diagram of traditional radio frequency transmission device.
Fig. 2 shows the structure diagrams of the radio frequency transmission device of first embodiment of the invention.
Fig. 3 shows the structure diagram of the radio frequency transmission device of second embodiment of the invention.
Fig. 4 shows the structure diagram of the radio frequency transmission device of third embodiment of the invention.
Fig. 5 shows the structure diagram of the radio frequency transmission device of fourth embodiment of the invention.
Specific embodiment
Hereinafter reference will be made to the drawings is more fully described the present invention.In various figures, identical element is using similar attached
Icon is remembered to represent.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.In addition, it may not show in figure
Go out certain well known parts.
Many specific details of the present invention, such as the structure of device, material, size, processing work is described hereinafter
Skill and technology, to be more clearly understood that the present invention.But it just as the skilled person will understand, can not press
The present invention is realized according to these specific details.
In the description of the present invention, " on " refer to position closer to top layer, " under " refer to position closer to bottom
It puts.
The radio frequency transmission device of the embodiment of the present invention includes being sequentially distributed multiple conductive layers in top layer to bottom, from top layer
The line width and/or thickness for the multiple conductive layers being sequentially distributed to bottom are on a declining curve, for example, the conductive layer closer to the bottom
There is identical or smaller line width and/or thickness compared to the conductive layer closer to top.In general, multiple conductive layer difference
It is made of metal material, it, can be mutual by via between different conductive layers there are insulating layer between adjacent two conductive layers
Even.
Wherein, multiple conductive layers include one or more first signals layers, one or more transport layers and ground plane.
One or more transport layers are integrally used to form the transmission line of radio frequency transmission device.When transmission line by continuously dividing successively
When multiple transport layers of cloth are realized, the adjacent transport layer of each two is in parallel in whole or in part, so as to which multiple transport layers can shape in parallel
Into resistivity very low transmission line, reduce transmission loss, improve transmission quality.
Each first signals layer is for respectively forming element and/or circuit connection, and ground plane is used to form ground wire to carry
Ground potential for reference, wherein, ground plane is between each transport layer and each first signals layer transmission line and first is isolated
The element and line formed in signals layer.
In some preferred embodiments, multiple conductive layers further include one or more second signal layers, with each first
Signals layer is provided commonly for forming element and line.
Based on this, specific embodiments of the present invention are described in detail with reference to the accompanying drawings.
Fig. 2 shows the structure diagrams of the radio frequency transmission device of first embodiment of the invention.
As shown in Fig. 2, the radio frequency transmission device 100 of first embodiment of the invention is by being sequentially distributed in the more of top layer to bottom
A conductive layer is realized.
Multiple conductive layers include the first signals layer 110, ground plane 120 and transport layer 130.Conductive layer positioned at top layer is made
For the first signals layer 110, for the conductive layer positioned at secondary top layer as ground plane 120, any one under ground plane 120 is conductive
Layer is used as transport layer 130.Preferably, using positioned at the conductive layer of bottom or second bottom as transport layer 130.
In the present embodiment, since ground plane 120 is located under the first signals layer 110, on transport layer 130, i.e.,
The line width of the first signals layer 110 and/or thickness is made to be more than the line width and/or thickness of transport layer 130, is grounded to provide reference ground electricity
The ground plane 120 of position can also be effectively isolated the first signals layer 110 and transport layer 130 so that the biography formed by transport layer 130
The transmission quality of defeated line is not influenced by the first signals layer 110；Conductive layer positioned at top layer has (as the first signals layer 110)
Larger line width and thickness, the then circuit element and circuit connection being formed in the first signals layer 110 can allow for larger electricity
Stream, reduces the difficulty that wiring is laid out to circuit；Since transmission line can be laid in large area in transport layer 130, because
This, even if using the conductive layer of the bottom or second bottom as transport layer 130, can also make transmission line have relatively low resistivity,
It ensure that the transmission quality of transmission line.
Further, in the embodiment of some extensions, multiple conductive layers can include multiple be located on ground plane 120
The first signals layer 110.
Fig. 3 shows the structure diagram of the radio frequency transmission device of second embodiment of the invention.
As shown in figure 3, the radio frequency transmission device 200 of second embodiment of the invention is by being sequentially distributed in the more of top layer to bottom
A conductive layer is realized.
Multiple conductive layers include the first signals layer 210, ground plane 220 and multiple transport layers 230.Positioned at the conduction of top layer
Layer is as the first signals layer 210, and the conductive layer positioned at secondary top layer is as ground plane 220, multiple companies under ground plane 220
The conductive layer of continuous distribution is respectively as multiple transport layers 230.Wherein, the adjacent transport layer 230 in each two position is real by interconnecting
It is now at least partly in parallel, i.e., multiple interlink nodes, the neighbouring transport layer of each two are distributed with respectively in each transport layer 230
The corresponding interlink node in position is electrically connected on 230 so that the adjacent transport layer 230 in each two position can realize it is whole in parallel or
Local parallel, to reduce the transmission loss of transmission line.Preferably, the interlink node in each transport layer 230 is uniformly distributed.
In the present embodiment, same as the previously described embodiments, ground plane 220 can be effectively isolated 210 He of the first signals layer
Each transport layer 230 so that the transmission quality of transmission line formed by each transport layer 230 is not influenced by the first signals layer；
Conductive layer (as first signals layer 210) positioned at top layer has larger line width and thickness, then is formed in the first signals layer 210
In circuit element and circuit connection can allow for larger electric current, reduce the difficulty that wiring is laid out to circuit.
Further, in the embodiment of some extensions, multiple conductive layers can include multiple be located on ground plane 220
The first signals layer 210.
Fig. 4 shows the structure diagram of the radio frequency transmission device of third embodiment of the invention.
As shown in figure 4, the radio frequency transmission device 300 of third embodiment of the invention is by being sequentially distributed in the more of top layer to bottom
A conductive layer is realized.
Multiple conductive layers include the first signals layer 310, ground plane 320, multiple transmitting layer 3s 30 and second signal layer 340.
Conductive layer positioned at top layer is as the first signals layer 310, and the conductive layer positioned at secondary top layer is as ground plane 320, positioned at bottom
Conductive layer is as second signal layer 340, multiple continuously distributed conductions between ground plane 320 and second signal layer 340
Layer is used as multiple transmitting layer 3s 30.Wherein, the adjacent transmitting layer 3 30 in each two position realizes at least partly parallel connection by interconnecting, i.e.,
Multiple interlink nodes are distributed on each transmitting layer 3 30 respectively, position is mutual accordingly on the neighbouring transmitting layer 3 30 of each two
Interlink point is electrically connected so that the adjacent transmitting layer 3 30 in each two position can realize whole in parallel or local parallel, be passed with reducing
The transmission loss of defeated line.Preferably, the interlink node on each transmitting layer 3 30 is uniformly distributed.
In the present embodiment, same as the previously described embodiments, ground plane 320 can be effectively isolated 310 He of the first signals layer
Each transmitting layer 3 30 so that the transmission quality of transmission line formed by each transmitting layer 3 30 is not influenced by the first signals layer；
Conductive layer (as first signals layer 310) positioned at top layer has larger line width and thickness, then is formed in the first signals layer 310
In circuit element and circuit connection can allow for larger electric current, reduce the difficulty that wiring is laid out to circuit；Due to
The line width and/or thickness of each transmitting layer 3 30 are usually less than positioned at the line width and/or thickness of the conductive layer of bottom, therefore, is used
Signal in the second signal layer 340 formed positioned at the conductive layer of bottom influences the transmission quality of transmission line faint.
Further, in the embodiment of some extensions, multiple conductive layers can include multiple be located on ground plane 320
The first signals layer 310 and multiple second signal layers 340 under each transmitting layer 3 30.
Fig. 5 shows the structure diagram of the radio frequency transmission device of fourth embodiment of the invention.
As shown in figure 5, the radio frequency transmission device 400 of fourth embodiment of the invention is by being sequentially distributed in the more of top layer to bottom
A conductive layer is realized.
Multiple conductive layers include the first signals layer 410, ground plane 420, transport layer 430 and second signal layer 440.It is located at
The conductive layer of top layer is as the first signals layer 410, and the conductive layer positioned at secondary top layer is as ground plane 420, positioned at the conduction of bottom
Layer is as second signal layer 440, and the either conductive layer between second signal layer 440 and ground plane 420 is as transport layer
430.Preferably, using positioned at the conductive layer of second bottom as transport layer 430.
In the present embodiment, same as the previously described embodiments, ground plane 420 can be effectively isolated 410 He of the first signals layer
Transport layer 430 so that the transmission quality of the transmission line formed by transport layer 430 is not influenced by the first signals layer；Positioned at top layer
Conductive layer (as first signals layer 410) there is larger line width and thickness, therefore the electricity being formed in the first signals layer 410
Circuit component and circuit connection can allow for larger electric current, reduce the difficulty that wiring is laid out to circuit；Due to being located at bottom
The line width and/or thickness of the conductive layer of layer are usually less than the line width and/or thickness of transport layer 430, therefore, using positioned at bottom
Signal in the second signal layer 440 that conductive layer is formed influences the transmission quality of transmission line faint.
Further, in the embodiment of some extensions, multiple conductive layers can include multiple be located on ground plane 420
The first signals layer 410 and multiple second signal layers 440 under the transport layer 430.
The radio frequency transmission device that various embodiments of the present invention provide will be arranged on use for the ground plane provided with reference to ground voltage
It in the transport layer for forming transmission line and is used to form between element and the signals layer of circuit connection, so as to which ground plane can be effectively
Signals layer and transport layer be isolated, therefore the transmission quality of the transmission line formed by transport layer will not be by transmitting in signals layer
The influence of signal；In the radio frequency transmission device provided in various embodiments of the present invention, the larger conductive layer of line width and/or thickness is made
For signals layer, element and circuit connection so as to be formed in signals layer can allow for larger electric current, reduce to circuit into
The difficulty of row placement-and-routing, meanwhile, although using line width and the/smaller conductive layer of thickness as transport layer, due to transmitting
It can be laid with transmission line in large area in layer, the transmission line for being accordingly used in transmitting radio frequency signal can also have relatively low resistance
Rate, so as to ensure that transmission line has relatively low transmission loss and preferable transmission quality.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this practical relationship or sequence.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
Also there are other identical elements in process, method, article or equipment including the element.
According to the embodiment of the present invention as described above, these embodiments are there is no all details of detailed descriptionthe, also not
It is only the specific embodiment to limit the invention.Obviously, as described above, can make many modifications and variations.This explanation
Book is chosen and specifically describes these embodiments, is in order to preferably explain the principle of the present invention and practical application, belonging to making
Technical field technical staff can be used using modification of the invention and on the basis of the present invention well.The present invention is only by right
The limitation of claim and its four corner and equivalent.
Claims (8)
1. a kind of radio frequency transmission device, including being sequentially distributed multiple conductive layers in top layer to bottom, wherein, the multiple conduction
Layer includes：
One or more first signals layers, each first signals layer are used to form the circuit elements except transmission line and ground wire
Part and circuit connection, the transmission line are used for transmission radiofrequency signal；
The transmission line, the line of each transport layer is integrally formed in one or more transport layers, one or more of transport layers
Wide and/or thickness is more than or equal to the line width and/or thickness of each first signals layer；And
Ground plane is used to form the ground wire to provide ground reference, and the ground plane is located at one or more of biographies
One or more of transport layers and one or more of are isolated between defeated layer and one or more of first signals layers
First signals layer.
2. radio frequency transmission device according to claim 1, wherein, the multiple conductive layer further includes one or more second
Signals layer is provided commonly for forming the circuit except the transmission line and the ground wire with one or more of first signals layers
Element and circuit connection,
One or more of transport layers are between the ground plane and one or more of second signal layers.
3. radio frequency transmission device according to claim 2, wherein, the line width and/or thickness of each second signal layer are small
In line width and/or thickness equal to each transport layer.
4. radio frequency transmission device according to claim 1, wherein, one or more of transport layers are in the multiple conduction
Adjacent distributions successively in layer, and the adjacent transport layer in each two position passes through to interconnect and realizes whole in parallel or part in parallel.
5. radio frequency transmission device according to claim 4, wherein, each transport layer be respectively provided be evenly distributed it is multiple
Interlink node, the corresponding interlink node in position is electrically connected in the adjacent transport layer in each two position.
6. radio frequency transmission device according to claim 1, wherein, the conductive layer positioned at top layer is as the described first letter
Number floor, the conductive layer positioned at secondary top layer is as the ground plane.
7. radio frequency transmission device according to claim 1, wherein, the multiple conduction being sequentially distributed from top layer to bottom
The line width and/or thickness of layer are on a declining curve.
8. radio frequency transmission device according to claim 1, wherein, the multiple conductive layer is made of metal material respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810050790.2A CN108233980A (en) | 2018-01-18 | 2018-01-18 | Radio frequency transmission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810050790.2A CN108233980A (en) | 2018-01-18 | 2018-01-18 | Radio frequency transmission device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108233980A true CN108233980A (en) | 2018-06-29 |
Family
ID=62667714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810050790.2A Pending CN108233980A (en) | 2018-01-18 | 2018-01-18 | Radio frequency transmission device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108233980A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114844519A (en) * | 2022-04-06 | 2022-08-02 | 杭州海康威视数字技术股份有限公司 | Isolating device for intrinsic safety circuit and non-intrinsic safety circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009224638A (en) * | 2008-03-18 | 2009-10-01 | Nec Corp | Transmission line structure of mounting substrate |
| CN202870676U (en) * | 2012-08-27 | 2013-04-10 | 百度在线网络技术（北京）有限公司 | Server mainboard |
| CN206611628U (en) * | 2017-03-02 | 2017-11-03 | 东莞市同川精密五金有限公司 | A kind of novel high-frequency impedance FPC plates |
| CN207706179U (en) * | 2018-01-18 | 2018-08-07 | 加特兰微电子科技(上海)有限公司 | Radio frequency transmission device |
-
2018
- 2018-01-18 CN CN201810050790.2A patent/CN108233980A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009224638A (en) * | 2008-03-18 | 2009-10-01 | Nec Corp | Transmission line structure of mounting substrate |
| CN202870676U (en) * | 2012-08-27 | 2013-04-10 | 百度在线网络技术（北京）有限公司 | Server mainboard |
| CN206611628U (en) * | 2017-03-02 | 2017-11-03 | 东莞市同川精密五金有限公司 | A kind of novel high-frequency impedance FPC plates |
| CN207706179U (en) * | 2018-01-18 | 2018-08-07 | 加特兰微电子科技(上海)有限公司 | Radio frequency transmission device |
Non-Patent Citations (3)
| Title |
|---|
| GUOAN WANG ET AL.: "Novel on-chip high performance slow wave structure using discontinuous microstrip lines and multi-layer ground for compact millimeter wave applications", 《2009 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE》 * |
| 屈峰成: "高速PCB板盲埋孔的信号特性研究", 《中国优秀硕士学位论文全文数据库信息科技》, no. 3 * |
| 李红 等: "浅析PCB设置接地回路导通孔对信号传输性能的影响", 《 数字化用户》, no. 15 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114844519A (en) * | 2022-04-06 | 2022-08-02 | 杭州海康威视数字技术股份有限公司 | Isolating device for intrinsic safety circuit and non-intrinsic safety circuit |
| CN114844519B (en) * | 2022-04-06 | 2023-10-10 | 杭州海康威视数字技术股份有限公司 | Isolation device for intrinsic safety circuit and non-intrinsic safety circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201878415U (en) | Multilayer circuit part and assembly thereof | |
| US5450278A (en) | Chip type capacitor for removing radio frequency noise | |
| US7109838B2 (en) | System for integrating a toroidal inductor in a semiconductor device | |
| US5525067A (en) | Ground plane interconnection system using multiple connector contacts | |
| CN101714681B (en) | Electro-magnetic bandgap structure | |
| US6422472B1 (en) | Memory card of the contactless type | |
| US8547677B2 (en) | Method for making internally overlapped conditioners | |
| US8154466B2 (en) | Antenna feed module | |
| US4203081A (en) | Passive circuit element for influencing pulses | |
| CN207910042U (en) | Transmission line and flat cable | |
| US6235997B1 (en) | LSI package with equal length transmission Lines | |
| CN102224566B (en) | Integrated capacitor with alternating layered segments | |
| CN102576657A (en) | Three dimensional inductor and transformer | |
| JPS59172250A (en) | Universal array | |
| CN102737840A (en) | Feedthrough multilayer capacitor | |
| CN207706179U (en) | Radio frequency transmission device | |
| CA2550882A1 (en) | Capacitor | |
| CN108233980A (en) | Radio frequency transmission device | |
| US7901248B2 (en) | Plug connector and multilayer board | |
| CN102761314B (en) | Single-chip power divider and manufacture method thereof and single-chip power combiner | |
| KR20050067183A (en) | Frequency-independent voltage divider | |
| DE102013213363A1 (en) | Ball grid array (BGA) and printed circuit board (PCB) video grid for reducing differential mode crosstalk between differential transmit and receive signal pairs | |
| CN113035864B (en) | Power supply arrangement structure, integrated circuit device, and electronic apparatus | |
| KR102360415B1 (en) | Radio Frequency (RF) Couplers | |
| CN104900720B (en) | Varactor structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |