CN108231635B - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
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- CN108231635B CN108231635B CN201711305975.5A CN201711305975A CN108231635B CN 108231635 B CN108231635 B CN 108231635B CN 201711305975 A CN201711305975 A CN 201711305975A CN 108231635 B CN108231635 B CN 108231635B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
The substrate processing device comprises a base, a substrate carrying platform, a plurality of lifting main collecting pieces, a first power piece and a lifting control piece. The substrate carrier is rotatably coupled to the base for holding and rotating the substrate. The plurality of lifting main collecting pieces are arranged at the periphery of the substrate carrying platform and used for collecting the processing liquid for processing the substrate. Each of the elevating main collecting members includes an elevating shaft and a treating liquid collecting ring. The lift shaft includes a lift wheel assembly. The lifting wheel component is used for driving the lifting shaft to lift. The processing liquid collecting ring is connected on the lifting shaft. The first power part is arranged on the base and used for providing power for the lifting type main collecting part so as to lift the lifting type main collecting part. The lifting control part is connected with the first power part to control the first power part to transmit power to the lifting wheel component corresponding to the lifting shaft of the lifting main collecting part.
Description
Technical Field
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of providing power to lift a plurality of collecting members by a power member and simplifying the operation of the apparatus.
Background
In semiconductor processing, a wafer processing apparatus is often used to etch or clean a wafer. As shown in fig. 1, the wafer processing apparatus 800 has a rotary platen 810, a liquid applicator 820, a plurality of liquid recovery rings 830, 831, 832, a plurality of first powered elevators 850, 851, 852 and a plurality of second powered elevators 860, 861, 862, each liquid recovery ring corresponding to a first powered elevator and a second powered elevator. The rotary stage 810 is used to fix the wafer W and rotate the wafer W. The liquid applying member 820 applies an etching liquid or a cleaning liquid to the rotating wafer W. The plurality of liquid recovery rings 830, 831, 832 are connected to the plurality of first power lifters 850, 851, 852 and the plurality of second power lifters 860, 861, 862, respectively. The liquid recovery ring 830 forms an inner recovery ring; the liquid recovery ring 831 forms a central recovery ring; the liquid recovery loop 832 forms an outer recovery loop. The inner recovery ring, the central recovery ring and the outer recovery ring are used for collecting different liquids thrown off by the rotating wafer W. The first power lifting pieces 850, 851 and 852 are used for being respectively matched with the second power lifting pieces 860, 861 and 862 to respectively control the lifting of the inner recovery ring, the central recovery ring and the outer recovery ring; this allows one of the recycling loops to be controlled to be raised to recycle the liquid. However, if the lifting of a recycling ring is controlled, the lifting speeds of the first power lifting members 850, 851, 852 and the second power lifting members 860, 861, 862 need to be the same and the power needs to be started simultaneously to smoothly lift each recycling ring. However, in practice, to make the lifting speeds of the first power lifter 850, 851, 852 and the second power lifter 860, 861, 862 consistent and start the power at the same time, a very precise software computer design or hardware control is required, otherwise, each lifter is difficult to operate individually or synchronously, and the precise control also consumes a lot of controller design cost, and when at least one of the first power lifter or the second power lifter is damaged, the power cannot be started at the same time or the lifting speeds are consistent, which may damage the recycling ring or other parts of the wafer processing apparatus.
In addition, as shown in fig. 2, some wafer processing apparatuses 900 may be designed to have a plurality of liquid recovery rings 930, 931, 932, a plurality of power lifters 950, 951, 952, and a plurality of connection rods 970, 971, 972. Both ends of each connecting rod 970, 971, 972 are connected to each liquid recovery ring 930, 931, 932, respectively. Each powered lifting member 950, 951, 952 is connected to a connecting rod 970, 971, 972, respectively. Therefore, when the power lifters 950, 951 and 952 respectively lift, the power lifters will drive the self-connected connecting rods 970, 971 and 972 to lift together, and drive the recovery rings connected with the connecting rods 970, 971 and 972 to lift. However, in this configuration, one power lifting member needs to be matched with one recycling ring, and a plurality of power lifting members need to be matched with a plurality of recycling rings correspondingly.
Therefore, there is a need for a new wafer processing apparatus that can provide power to lift and lower the recycling rings by a power member, and achieve the effect of simplifying the operation of the apparatus.
Disclosure of Invention
The present invention is directed to a substrate processing apparatus, which can provide power to lift a plurality of collecting members by a power member, and can simplify the operation of the apparatus.
To achieve the above objective, a substrate processing apparatus of the present invention includes a base, a substrate stage, a plurality of lifting main collecting members, a first power member, and a lifting control member. The substrate carrier is rotatably coupled to the base, and the substrate carrier is configured to hold and rotate the substrate. The plurality of lifting main collecting pieces are arranged at the periphery of the substrate carrying platform and used for collecting the processing liquid for processing the substrate. Each lifting main collecting part comprises at least one lifting shaft and a processing liquid collecting ring. The lift shaft includes a lift wheel assembly. The lifting wheel component is used for driving the lifting shaft to lift. The processing liquid collecting ring is connected on the lifting shaft. The first power part is arranged on the base and used for providing power for each lifting type main collecting part so as to enable each lifting type main collecting part to lift. The lifting control part is connected with the first power part to control the first power part to transmit power to the lifting wheel component corresponding to the lifting shaft of the lifting main collecting part.
According to an embodiment of the present invention, the number of the at least one lifting shaft of each lifting main collecting member is two, and the two lifting shafts are respectively disposed at two ends of the processing liquid collecting ring. The lifting control part controls the first power part to transmit power to the lifting wheel assemblies respectively corresponding to the two lifting shafts, so that the two lifting wheel assemblies drive the connecting treatment liquid collecting ring to lift together.
According to an embodiment of the present invention, each of the lifting wheel assemblies further comprises a lifting wheel ring; when power is transmitted to the lifting wheel ring of the lifting wheel assembly, the lifting shaft and the treatment fluid collecting ring which correspond to the lifting wheel ring are driven to lift.
According to an embodiment of the present invention, the lifting control member and each lifting wheel assembly transmit power through a transmission wheel structure as a transmission medium.
According to an embodiment of the present invention, the lifting wheel assembly of the lifting main collecting member further includes at least one power transmission wheel ring; the power is transmitted to the lifting wheel ring of the lifting wheel component of the other lifting main collecting piece through the power transmission wheel ring.
According to an embodiment of the present invention, the substrate processing apparatus further includes at least one power transmission wheel disposed between the lift wheel assemblies. The power transmission wheel includes at least one wheel ring. By means of the rotary transmission wheel ring, the power is transmitted to the lifting wheel ring of the lifting wheel component.
According to an embodiment of the present invention, at least one power transmission wheel is disposed between one of the lifting wheel assemblies of one of the lifting main collecting members and one of the lifting wheel assemblies of the other lifting main collecting member to transmit power.
According to an embodiment of the present invention, at least one power transmission wheel is disposed between two lifting wheel assemblies of one of the lifting main collecting members for transmitting power.
According to an embodiment of the present invention, the substrate stage further comprises a stage wall; wherein, a power transmission wheel ring is arranged at the periphery of the wall of the carrying platform.
According to an embodiment of the present invention, the substrate processing apparatus further includes at least one power transmission belt, and the lifting control member and each of the lifting wheel assemblies transmit power through the at least one power transmission belt as a medium.
According to an embodiment of the present invention, each of the power transmission belts communicates the elevation control member and the two elevation wheel assemblies of each of the elevation type main collecting members; the power transmission belt transmits power to the two lifting wheel assemblies, so that the two lifting wheel assemblies drive the treatment fluid collecting ring to lift together.
According to an embodiment of the present invention, the substrate processing apparatus further includes at least one power transmission wheel disposed between the two lifting wheel assemblies of one of the lifting main collectors for transmitting power.
According to an embodiment of the present invention, the lifting wheel ring is horizontally disposed; when the lifting wheel ring rotates, the lifting wheel assembly drives the lifting shaft connected with the lifting wheel ring to lift.
According to an embodiment of the invention, the lifting wheel ring of any lifting type main collecting part and the lifting wheel rings of other lifting type main collecting parts are respectively arranged at different horizontal heights; the lifting control piece rotates the lifting wheel ring on any horizontal height by power to drive the lifting main collecting piece connected with the lifting wheel ring on any horizontal height to lift.
According to an embodiment of the present invention, the lifting wheel assembly of the lifting main collecting member further includes at least one power transmission wheel ring; the power is transmitted to the lifting wheel ring of the lifting wheel assembly of the other lifting main collecting piece on one horizontal height through the power transmission wheel ring on one horizontal height.
According to an embodiment of the present invention, the substrate processing apparatus further includes at least one power transmission wheel disposed between the lift wheel assemblies. The at least one power transmission wheel comprises at least one rotating transmission wheel ring; the power is transmitted to the lifting wheel ring of the lifting wheel component on one of the horizontal levels through the transmission wheel ring on one of the horizontal levels.
According to an embodiment of the present invention, the lifting control member includes a plurality of control rings, each of the control rings is disposed at a different level, and the control rings at different levels are respectively used to drive the lifting rings of the lifting wheel assemblies of each lifting main collecting member to rotate, so as to drive the lifting main collecting members connected to the lifting rings at different levels to lift.
According to an embodiment of the present invention, the lifting control member further includes a power switching member; when the power switching component is communicated with the control wheel ring on any horizontal height, the control wheel ring rotates to transmit power to the lifting wheel assembly on the horizontal height.
According to an embodiment of the present invention, the lifting control member further includes a control wheel ring; the control wheel ring is used for moving to each horizontal height and rotating so as to transmit power to the lifting wheel assemblies on each horizontal height.
According to an embodiment of the present invention, when the lifting control member drives the lifting main collecting member to lift, the lifting control member sequentially drives the lifting main collecting member corresponding to the lifting wheel ring to lift by sequentially rotating the lifting wheel rings at different levels.
According to an embodiment of the present invention, when the lifting control member drives the lifting main collecting member to lift, the lifting control member simultaneously drives the lifting main collecting member corresponding to the lifting wheel ring to lift by simultaneously rotating the lifting wheel rings at different levels.
According to an embodiment of the present invention, each of the lifting main collectors further includes a support frame connecting both ends of the treatment liquid collecting ring and at least one lifting wheel assembly; when the lifting control member transmits power to at least one lifting wheel assembly, the treatment liquid collecting ring is driven to lift by the supporting frame.
According to an embodiment of the present invention, the substrate processing apparatus further includes a lifting sub-collector and a second power member. The lifting type auxiliary collecting piece is arranged on the periphery of the substrate carrying platform and used for collecting the processing liquid for processing the substrate. The second power part is arranged on the base and used for providing power for the lifting type auxiliary collecting part so as to lift the lifting type auxiliary collecting part.
Drawings
FIG. 1 is a cross-sectional view of a wafer processing apparatus of the prior art.
Fig. 2 is a cross-sectional view of another prior art wafer processing apparatus.
Fig. 3 is a partial schematic view of a substrate processing apparatus according to a first embodiment of the present invention.
Fig. 4 is a plan view of the respective lift wheel assemblies, the first power member, the lift control member, and the power transmission wheels of the substrate processing apparatus according to the first embodiment of the present invention.
Figure 5 is a schematic view of a first power member and lift wheel assembly of the first embodiment of the present invention.
Fig. 6 is a schematic view of a first power member and a lift control member of the first embodiment of the present invention.
Fig. 7 is a schematic view of a first power member and another aspect of the lift control member of the first embodiment of the present invention.
Fig. 8 is a partial schematic view of the substrate processing apparatus with the processing liquid collecting ring raised according to the first embodiment of the present invention.
Fig. 9 is a partial schematic view of a power transmission belt connecting a lift wheel assembly, a first power member and a stage wall in a substrate processing apparatus according to a second embodiment of the present invention.
Fig. 10 is a plan view of a power transmission belt connecting a power transmission wheel, a lift wheel assembly and a stage wall in a substrate processing apparatus according to a third embodiment of the present invention.
Fig. 11 is a schematic view of a substrate processing apparatus according to a fourth embodiment of the present invention.
Fig. 12 is a schematic view of a substrate processing apparatus according to a fifth embodiment of the present invention.
Wherein, the reference numbers:
the prior art is as follows:
Liquid recovery rings 830, 831, 832, 930, 931, 932
First power lifting member 850, 851, 852, 950, 951, 952
Second powered lifting members 860, 861, 862, 960, 961, 962
Wafer W
The invention comprises the following steps:
Lifting main collecting members 30, 30a, 30b, 30c, 30d, 30e, 30f, 30g, 30h, 30i
Lifting shafts 31, 31a, 31b, 31c, 91
The processing liquid collecting rings 32, 32a, 32b, 32c, 92
Lifting wheel assemblies 33, 33a, 33b, 33c, 33d, 33e, 33f, 93
Lifting wheel rings 331, 331a, 331b, 331c
Power-transfer rings 332, 332a, 332b
Supporting frames 34, 34a, 34b
Lifting control 40, 40a, 40b, 40c
Control rings 41, 42, 43, 44
Transfer rings 61, 61a, 61b, 61c
Lifting type auxiliary collecting part 90
Direction of movement A, B
Treatment liquid L
Substrate S
Section line ZZ
Detailed Description
In order to make the technical content of the present invention more comprehensible, preferred embodiments are described below.
Referring to fig. 3 to 8, a substrate processing apparatus according to a first embodiment of the present invention is described. FIG. 3 is a partial schematic view of a substrate processing apparatus according to a first embodiment of the present invention; fig. 4 is a plan view of respective lift wheel assemblies, first power members, lift control members, and power transmission wheels of the substrate processing apparatus according to the first embodiment of the present invention; FIG. 5 is a schematic view of a first power member and lift wheel assembly of the first embodiment of the present invention; FIG. 6 is a schematic view of a first power member and lift control member of the first embodiment of the present invention; FIG. 7 is a schematic view of a first power member and another aspect of the lift control member of the first embodiment of the present invention; fig. 8 is a partial schematic view of the substrate processing apparatus with the processing liquid collecting ring raised according to the first embodiment of the present invention.
As shown in fig. 3 and 4, in the first embodiment, the substrate processing apparatus 1 carries and rotates a substrate S and processes the substrate S by the processing liquid L supplied from the liquid feeding device, and the substrate processing apparatus 1 collects the processing liquid L thrown off by the rotating substrate S. The substrate processing apparatus 1 includes a base 10, a substrate stage 20, four lifting type main collecting members 30, 30a, 30b, 30c, a first power member 50, a lifting control member 40, and a plurality of power transmission wheels 60, 60a, 60b, 60c, 60 d.
The base 10 is a platform for carrying the substrate stage 20, four lifting main collectors 30, 30a, 30b, 30c, a first power member 50, a lifting control member 40, and a plurality of power transmission wheels 60, 60a, 60b, 60c, 60 d. The substrate stage 20 is rotatably connected to the base 10, and the substrate stage 20 is configured to fix and rotate the substrate S. The substrate stage 20 includes a stage wall 21, the stage wall 21 is connected to the base 10, the stage wall 21 surrounds a rotation axis of the substrate stage 20, and an outer wall surface of the stage wall 21 is connected to one of the power transmission wheels 60. The rotation axis of the substrate stage 20 may also be designed to have a lift mechanism to change the height of the substrate stage 20.
The elevating main collecting member is an annular collecting member having at least one pillar (i.e., an elevating shaft). In this embodiment, the four lifting main collectors 30, 30a, 30b, 30c are all ring-shaped collectors having two pillars. The four lifting main collecting pieces 30, 30a, 30b and 30c sequentially surround the periphery of the substrate carrying platform 20 from inside to outside, and can respectively or simultaneously lift to collect different processing liquids L thrown off by the rotating substrate S; however, the number of the lifting type main collectors 30, 30a, 30b, 30c is not limited to four, and may be changed according to design requirements. The elevating main collecting member 30 includes two elevating shafts 31 and a processing liquid collecting ring 32. The two lifting shafts 31 are shaft bodies that can be driven to extend and retract by rotation to change the height thereof to achieve a lifting effect. The lifting shaft 31 includes a lifting wheel assembly 33, and the lifting wheel assembly 33 respectively drives the lifting shaft 31 to rotate and extend, so as to drive the lifting shaft 31 to lift. The processing liquid collecting ring 32 is a circular ring structure and is connected to the two lifting shafts 31, and the processing liquid collecting ring 32 is used for collecting the processing liquid L thrown from the substrate S. The respective lift shafts 31 are respectively provided at both ends of the treatment liquid collecting ring 32; as such, when the two elevation shaft 31 are driven by the two elevation wheel assemblies 33 to change the height, the processing liquid collecting ring 32 can be lifted or lowered together from both ends of the processing liquid collecting ring 32. It should be noted that the lifting shaft 31 capable of being driven by rotation to extend and retract is a common structure disclosed in the art, and therefore, the extension and retraction mechanism thereof will not be described in detail.
As shown in fig. 3 and 5, in the first embodiment, four elevating main collecting members 30, 30a, 30b, 30c have substantially the same structure, and each of the four elevating main collecting members has two elevating shafts 31, 31a, 31b, 31c and a processing liquid collecting ring 32, 32a, 32b, 32 c; each lifting shaft 31, 31a, 31b, 31c has a lifting wheel assembly 33, 33a, 33b, 33c, respectively. And each of the processing liquid collecting rings 32, 32a, 32b, 32c is connected to the two elevating shafts 31, 31a, 31b, 31c, respectively. However, the difference between the four lifting main collectors 30, 30a, 30b, and 30c is that the lifting wheel assemblies 33, 33a, 33b, and 33c are respectively disposed at different levels or have different internal structures.
The lifting wheel assembly 33 of the lifting main collecting part 30 comprises a lifting wheel ring 331 and three power transmission wheel rings 332, 332a and 332 b; however, the number of power transmitting rings 332, 332a, 332b is not limited to three, and may be changed according to design requirements. The lifting wheel ring 331 is used for receiving the power generated by the first power member 50. The lifting rings 331, 331a, 331b, 331c are horizontally disposed. When the power of the first power member 50 is transmitted to the lifting wheel ring 331 to rotate the lifting wheel ring 331, the lifting wheel assembly 33 drives the lifting shaft 31 corresponding to the lifting wheel ring 331 to rotate and extend, so as to vertically lift and lower the treatment solution collecting ring 32. The other two lifting wheel assemblies 33a, 33b, 33c of the three lifting main collecting members 30a, 30b, 30c have no power transmission wheel rings, but only have lifting wheel rings 331a, 331b, 331c, respectively (when the lifting main collecting members have the need of power transmission, the power transmission wheel rings can be arranged, the invention is not limited to this embodiment). When the lifting wheel rings 331a, 331b, 331c rotate, the corresponding lifting shafts 31a, 31b, 31c are driven to rotate and extend, so as to vertically lift and lower the treatment solution collecting rings 32a, 32b, 32 c; and the lifting wheel rings 331, 331a, 331b, 331c of the two lifting wheel assemblies 33, 33a, 33b, 33c of any one lifting main collecting member 30, 30a, 30b, 30c and the lifting wheel rings of the two lifting wheel assemblies of the other lifting main collecting members are respectively arranged at different levels.
The power transmission rings 332, 332a, 332b are respectively disposed at different levels, and are sequentially located above the lifting ring 331 from low to high (the above-mentioned arrangement is provided for this embodiment; the number of the power transmission rings and the arrangement position between the power transmission rings and the lifting ring, the present invention is not limited to this embodiment), and each of the power transmission rings 332, 332a, 332b is used for receiving the power generated by the first power member 50. The power transmission wheel ring 332 and the lifting wheel rings 331a of the two lifting wheel assemblies 33a of the lifting main collecting piece 30a are positioned at the same horizontal height and are used for connecting the lifting wheel rings 331a of the two lifting wheel assemblies 33 a; the power transmission wheel ring 332a and the lifting wheel rings 331b of the two lifting wheel assemblies 33b of the lifting main collecting piece 30b are positioned at the same horizontal height and are used for connecting the lifting wheel rings 331b of the two lifting wheel assemblies 33 b; the power transmission wheel ring 332b and the lifting wheel rings 331c of the two lifting wheel assemblies 33c of the lifting main collecting piece 30c are positioned at the same horizontal height and are used for connecting the lifting wheel rings 331c of the two lifting wheel assemblies 33 c; that is, the lifting wheel rings 331, 331a, 331b, 331c of the two lifting wheel assemblies 33, 33a, 33b, 33c of any one of the lifting main collectors 30, 30a, 30b, 30c and the lifting wheel rings of the two lifting wheel assemblies of the other lifting main collectors are respectively disposed at different levels. By the power transmission rings 332, 332a, 332b, the power of the first power member 50 is transmitted to the lifting rings 331a, 331b, 331c of the lifting wheel assemblies 33a, 33b, 33c of the other lifting main collecting members 30a, 30b, 30c at the same level as the power transmission rings 332, 332a, 332 b. The lifting wheel rings 331, 331a, 331b, 331c and the power transmission wheel rings 332, 332a, 332b of the lifting wheel assemblies 33, 33a, 33b, 33c of the present invention are all transmission wheel structures, such as cams, gears, friction wheels or magnetic wheels, which can be used as a transmission medium to transmit power.
As shown in fig. 5, the first power member 50 is, for example, a motor, and the first power member 50 is connected to the lifting control member 40 and disposed on the base 10. The first power unit 50 is used for providing a power to each of the lifting main collecting units 30, 30a, 30b, 30c to lift each of the lifting main collecting units 30, 30a, 30b, 30 c.
The lifting control member 40 is electrically connected to an external computer (not shown) to be controlled by the external computer. The lifting control member 40 is connected with the first power member 50, the lifting control member 40 is used for controlling the first power member 50 to transmit power to the lifting wheel ring 331 and the three power transmission wheel rings 332, 332a and 332b of the lifting wheel assembly 33 of the lifting main collecting member 30, and then the power is transmitted to other lifting main collecting members 30a, 30b and 30c which are not directly contacted by the plurality of power transmission wheels 60, 60a, 60b, 60c and 60 d; therefore, the lifting control member 40 can transmit power to the lifting wheel assemblies 33, 33a, 33b and 33c corresponding to the lifting shafts 31, 31a, 31b and 31c of any one of the lifting main collecting members 30, 30a, 30b and 30c, so as to control the lifting of the lifting main collecting members 30, 30a, 30b and 30c receiving the power. The lifting control member 40 includes a plurality of control collars 41, 42, 43, 44, and the control collars 41, 42, 43, 44 are respectively disposed at different horizontal heights. The control wheel rings 41, 42, 43, 44 at different levels are used to drive the lifting wheel rings 331, 331a, 331b, 331c of the lifting wheel assemblies 33, 33a, 33b, 33c of the lifting main collecting members 30, 30a, 30b, 30c to rotate, so as to drive the lifting wheel rings 331, 331a, 331b, 331c at different levels to connect the lifting main collecting members 30, 30a, 30b, 30c to lift. Each control wheel ring 41, 42, 43, 44 is a transmission wheel structure, such as a cam, a gear, a friction wheel or a magnetic wheel, which can be used as a transmission medium to transmit power. The individual control rings 41, 42, 43, 44 shown in fig. 5 are designed to rotate autonomously; therefore, any one of the control wheel rings 41, 42, 43, 44 can be selected by an external computer to rotate by itself so as to transmit power to the lifting wheel assemblies 33, 33a, 33b, 33c at the same horizontal height.
However, the structure of the lifting control member can also be designed as the mode shown in fig. 6, the lifting control member 40a further includes a power switching member 49, and the power switching member 49 can move up and down along a moving direction a to communicate with the control wheel rings 41, 42, 43, 44 at any horizontal level and rotate the communicated control wheel rings 41, 42, 43, 44. For example, as shown in fig. 6, the power switching member 49 can be moved to connect the control wheel ring 41 at the lowest level, so that the control wheel ring 41 rotates to control the control wheel ring 41 to transmit power to the lifting wheel ring 331 of the lifting wheel assembly 33 at the same level, so that the lifting wheel assembly 33 receiving power drives the two lifting shafts 31 connected with the lifting wheel assembly 33 to lift together. Therefore, after the lifting control member 40a controls the first power member 50 to transmit power to the two lifting wheel assemblies of the lifting main collecting member at any level, the lifting wheel rings of the two lifting wheel assemblies receiving power can be rotated to drive the two lifting shafts connected with the two lifting wheel assemblies at the level to lift together.
However, the aspect of the lifting control member is not limited to the above, and as shown in fig. 7, the lifting control member 40b may be designed to include only one control wheel ring 41 a; the control wheel ring 41a is used for moving to any horizontal height along the moving direction B and rotating so as to transmit power to the lifting wheel assembly on the same horizontal height; for example, in fig. 7, the control wheel ring 41a is moved to the next lower level and rotated to transmit power to the lifting wheel assembly at the same level.
As shown in fig. 3 and 4, the plurality of power transmission wheels 60, 60a, 60b, 60c, 60d are transmission wheel structures having different sizes, such as cams, gears, friction wheels, or magnetic wheels, which can transmit power as a transmission medium. The power transmission wheel 60 is disposed between the two lifting wheel assemblies 33 of the lifting main collecting member 30 and is disposed around the periphery of the platform wall 21. The power transmission wheel 60 is configured to rotate relative to the stage wall 21 to transmit the power of the first power member 40 to the respective elevating wheel assemblies 33, 33a, 33b, and 33c on the right side of the substrate processing apparatus 1. The power transmission wheel 60a communicates the power transmission wheel 60 with the right elevation wheel assembly 33 of the substrate processing apparatus 1 to transmit the power transmitted from the power transmission wheel 60 to the respective elevation wheel assemblies 33, 33a, 33b, 33c of the right side of the substrate processing apparatus 1. The two power transmission wheels 60b are respectively disposed between the lifting wheel assemblies 33 and the lifting wheel assemblies 33a at the left and right sides of the substrate processing apparatus 1 to transmit power transmitted from the lifting wheel assemblies 33 to the lifting wheel assemblies 33 a. The two power transmission wheels 60c and the two power transmission wheels 60d are respectively positioned between the elevation wheel assemblies 33, 33b, 33c of the elevation main collectors 30, 30b, 30c on the left and right sides of the substrate processing apparatus 1 to transmit the power transmitted from the elevation wheel assemblies 33 to the elevation wheel assemblies 33b, 33 c. The aforementioned plurality of power transmission wheels are provided for this embodiment; the number of the power transmission wheels and the arrangement position between the power transmission wheels and the lifting main collecting member are not limited in this embodiment. The power transmission wheel 60 includes four transfer wheel rings 61, 61a, 61b, 61c provided at different levels, and the levels of the four transfer wheel rings 61, 61a, 61b, 61c correspond to the four control wheel rings 41, 42, 43, 44, respectively, so as to transmit power to the lifting wheel rings 331, 331a, 331b, 331c at different levels, respectively. The number and the horizontal height of the power transmission wheel provided with the rotary transmission wheel ring are set according to the lifting wheel ring needing power transmission, and the invention is not limited by the embodiment.
As shown in fig. 3, when the substrate processing apparatus 1 is used to collect the processing liquid L thrown from the substrate S, the external computer controls the elevation control member 40, so that the elevation control member 40 drives the elevation type main collecting members 30, 30a, 30b, and 30c to be elevated. In the present invention, as shown in fig. 5, if the lifting control member 40 is designed not to have an external power switching member independently installed, only the control rings 41, 42, 43, 44 capable of rotating autonomously are provided; the designated control wheel rings 41, 42, 43, 44 can be controlled by the external computer to individually or simultaneously rotate to individually or simultaneously drive the lifting wheel rings 331, 331a, 331b, 331c at different levels to rotate, so that the lifting main collecting members 30, 30a, 30b, 30c corresponding to the lifting wheel rings 331, 331a, 331b, 331c can be individually or simultaneously lifted. In this way, each of the lifting main collectors 30, 30a, 30b, and 30c can be lifted and lowered individually or simultaneously to collect the processing liquid L.
If the lift control member 40a is designed to have an external power switching member 49 separately provided, as shown in fig. 6, the external computer controls the power switching member 49 to move, thereby sequentially controlling the rotation of the control rings 41, 42, 43, 44. The control rings 41, 42, 43, and 44, which rotate in sequence, are in turn in communication with the lifting ring 331 of the lifting wheel assembly 33 on the left side of the substrate processing apparatus 1 and the power transmission rings 332, 332a, and 332b, and are also in communication with the lifting ring 331 of the lifting wheel assembly 33 on the right side of the substrate processing apparatus 1 and the power transmission rings 332, 332a, and 332b, respectively, via the power transmission wheels 60 and 60 a. The lifting ring 331 connected at the earliest time rotates at the earliest time to drive the lifting main collecting member 30 corresponding to the lifting ring 331 to lift (as shown in fig. 3), so that the lifted processing liquid collecting ring 32 can collect the processing liquid L. Then, as shown in fig. 3 to 5, the second connected power transmission wheel ring 332 also rotates, and drives the power transmission wheel 60b to drive the lifting wheel ring 331a of the lifting wheel assembly 33a to rotate, so as to drive the lifting main collecting member 30a corresponding to the lifting wheel ring 331a to lift. The third power transmission wheel 332a is also rotated to drive the power transmission wheel 60c to drive the lifting wheel 331b of the lifting wheel assembly 33b to rotate, so as to drive the lifting main collecting member 30b corresponding to the lifting wheel 331b to lift. Finally, the power transmission wheel 332b is also rotated, and the power transmission wheels 60c and 60d are driven to rotate the lifting wheel 331c of the lifting wheel assembly 33c, so as to drive the lifting main collecting member 30c corresponding to the lifting wheel 331c to lift, so that the lifted processing liquid collecting ring 32c can collect the processing liquid L (as shown in fig. 8). In this way, the respective elevating main collectors 30, 30a, 30b, and 30c can sequentially ascend and descend to collect the processing liquid L.
Referring to fig. 9, a substrate processing apparatus according to a second embodiment of the present invention is described. Fig. 9 is a partial schematic view of a power transmission belt connecting a lift wheel assembly, a first power member and a stage wall in a substrate processing apparatus according to a second embodiment of the present invention.
As shown in fig. 9, the second embodiment is different from the first embodiment in that the substrate processing apparatus 1a of the second embodiment does not include any power transmission wheel, the substrate processing apparatus 1a further includes three power transmission belts 70, 70a, 70b, and the substrate processing apparatus 1a has only three elevation type main collectors 30d, 30e, 30 f. The lifting wheel assemblies 33d, 33e, 33f of the lifting main collecting members 30d, 30e, 30f are shafts which can be rotated by the power transmission belts 70, 70a, 70 b. The power transmission belts 70, 70a, 70b are belt-shaped objects having power transmission function, such as belts, chain belts, steel belts, etc., and the power transmission belts 70, 70a, 70b are used to drive the lifting wheel assemblies 33d, 33e, 33f to rotate, respectively. The lifting control member 40a and the lifting wheel assemblies 33d, 33e, 33f of the respective lifting main collecting members 30d, 30e, 30f transmit power through three power transmission belts 70, 70a, 70b as a medium. A power transmission belt 70 positioned at the lowest level and communicating the elevation control member 40a and the two elevation wheel assemblies 33d of the elevation type main collecting member 30 d; a power transmission belt 70a located at the middle level and communicating the elevation control member 40a and the two elevation wheel assemblies 33e of the elevation main collection member 30 e; a power transmission belt 70b located at the highest level and communicating the elevation control member 40a and the two elevation wheel assemblies 33f of the elevation type main collecting member 30 f; thus, when the control rings of the elevation control member 40a are rotated at different heights, the power is transmitted to the power transmission belts 70, 70a, 70b at different heights, and then to the elevation wheel assemblies 33d, 33e, 33f to which the power transmission belts 70, 70a, 70b are connected. However, the number of the power transmission belts and the lifting main collecting members is not limited to three, and may be changed according to design requirements.
Hereinafter, reference is made to fig. 10 together with a substrate processing apparatus according to a third embodiment of the present invention. Fig. 10 is a plan view of a power transmission belt connecting a power transmission wheel, a lift wheel assembly and a stage wall in a substrate processing apparatus according to a third embodiment of the present invention.
As shown in fig. 10, the third embodiment is different from the second embodiment in that a substrate processing apparatus 1b of the third embodiment includes a plurality of power transmission wheels 60e, and the power transmission wheels 60e are rotatable long shafts. The plurality of power transmission wheels 60e connect the three power transmission belts 70, 70a, 70 b. The plurality of power transmission wheels 60e may transmit power together with the three power transmission belts 70, 70a, 70b, and the plurality of power transmission wheels 60e may adjust the arrangement direction of the three power transmission belts 70, 70a, 70b, so that the layout of the inner space of the substrate processing apparatus 1b may be more flexible.
Referring to fig. 11, a substrate processing apparatus according to a fourth embodiment of the present invention is described. Fig. 11 is a schematic view of a substrate processing apparatus according to a fourth embodiment of the present invention.
As shown in fig. 11, the fourth embodiment is different from the first embodiment in that the substrate processing apparatus 1c of the fourth embodiment has only three elevating main collectors 30g, 30h, 30i, and each of the elevating main collectors 30g, 30h, 30i has only one elevating shaft 31, 31a, 31b, one processing liquid collecting ring 32, 32a, 32b, one elevating wheel assembly 33, 33a, 33b, and one support frame 34, 34a, 34b, respectively. Each support bracket 34, 34a, 34b is connected between each treatment liquid collecting ring 32, 32a, 32b and each lifting wheel assembly 33, 33a, 33b, respectively. The number of control rings of the elevating control member 40c is also changed to three in accordance with the number of the elevating main collecting members 30g, 30h, and 30 i. When the lifting control member 40c transmits power to any one of the lifting wheel assemblies 33, 33a, 33b, the supporting frames 34, 34a, 34b connected to the lifting wheel assemblies 33, 33a, 33b drive the processing liquid collecting rings 32, 32a, 32b connected to the supporting frames 34, 34a, 34b to be lifted.
Referring to fig. 12, a substrate processing apparatus according to a fifth embodiment of the present invention is described. Fig. 12 is a schematic view of a substrate processing apparatus according to a fifth embodiment of the present invention.
As shown in fig. 12, the fifth embodiment is different from the first embodiment in that the substrate processing apparatus 1d of the fifth embodiment does not include the elevation type main collecting part 30c, and the substrate processing apparatus 1d further includes an elevation type sub-collecting part 90 and a second power part 80. The lifting type sub-collecting member 90 is disposed at the periphery of the substrate carrying platform 20, and the second power member 80 is used for independently providing a power to the lifting type sub-collecting member 90 so as to lift the lifting type sub-collecting member 90.
The elevating sub-collecting member 90 may include two elevating shafts 91, a processing liquid collecting ring 92, and two elevating wheel assemblies 93. The processing liquid collecting ring 92 is a circular ring structure, and is connected to the two lifting shafts 91, and the processing liquid collecting ring 92 is used for collecting the processing liquid L thrown from the substrate S. The two lifting wheel assemblies 93 are respectively connected to the two lifting shafts 91, and the two lifting wheel assemblies 93 are used for respectively driving the two lifting shafts 91 to rotate and extend so as to change the height. The second power member 80 is disposed on the base 10 for providing a power to the lifting wheel assembly 93 on the right side of the substrate processing apparatus 1d, so that the lifting wheel assembly 93 on the right side of the substrate processing apparatus 1d drives the connected lifting shaft 91 to rotate and the lifting sub-collecting member 90 is lifted. The power received by the right elevation wheel assembly 93 of the substrate processing apparatus 1d is also transmitted to the left elevation wheel assembly 93 of the substrate processing apparatus 1d by the power transmission wheels 60, 60a, 60b, 60c, and 60d, the elevation controller 40, and the elevation wheel assembly 33, so that the elevation shaft 91 connected to the left elevation wheel assembly 93 of the substrate processing apparatus 1d is rotated to generate an elevation effect. In an embodiment, the two lifting shafts 91 of the lifting sub-collecting member 90 can also be respectively configured with the second power member 80 to independently provide power for lifting (not shown, refer to fig. 12, the second power member 80 and the right lifting wheel assembly 93).
With the structure of the substrate processing apparatus 1, 1a, 1b, 1c, 1d of the present invention, it is possible to provide power to lift the plurality of collecting members by means of a power transmission wheel, a power transmission belt or a support frame, and a power member, so that the liquid collecting members can be lifted smoothly, and the internal space of the apparatus can be saved and the cost of a precise software computer design or hardware control can be saved.
It should be noted that the above-mentioned embodiments are only examples, and are not limited to the examples. For example, without departing from the basic framework of the invention, the scope of the claims should be determined by the claims that follow.
Claims (22)
1. A substrate processing apparatus, comprising:
a base;
a substrate carrier, rotatable to connect with the base, the substrate carrier for fixing and rotating a substrate; a plurality of lifting main collecting pieces which are arranged at the periphery of the substrate carrying platform and are used for collecting a treating fluid for treating the substrate, wherein each lifting main collecting piece comprises;
at least one lifting shaft, wherein each lifting shaft comprises a lifting wheel component which is used for driving the lifting shaft to lift, and the lifting wheel component further comprises a lifting wheel ring; and
a processing liquid collecting ring connected to the at least one lifting shaft; the first power part is arranged on the base and used for providing power for each lifting main collecting part so as to lift each lifting main collecting part; and
the lifting control piece is connected with the first power piece so as to control the first power piece to transmit the power to the lifting wheel component corresponding to the at least one lifting shaft of the at least one lifting main collecting piece;
the lifting wheel ring of any lifting main collecting part and the lifting wheel rings of other lifting main collecting parts are respectively arranged at different horizontal heights; the lifting control piece rotates the lifting wheel ring at any horizontal height by the power to drive the lifting main collecting piece connected with the lifting wheel ring at any horizontal height to lift.
2. The apparatus of claim 1, wherein the at least one elevating shaft of each of the elevating main collectors is two, and the two elevating shafts are respectively disposed at both ends of the processing liquid collecting ring; the lifting control piece controls the first power piece to transmit the power to the lifting wheel assemblies respectively corresponding to the two lifting shafts, so that the two lifting wheel assemblies drive the treatment fluid collecting ring to lift together.
3. The apparatus of claim 2, wherein the lifting shaft and the processing solution collecting ring corresponding to the lifting wheel ring are lifted and lowered when the power is transmitted to the lifting wheel ring of the lifting wheel assembly.
4. The apparatus of claim 3, wherein the lift controller and each lift wheel assembly transmit the power via a transmission wheel structure as a transmission medium.
5. The apparatus of claim 4, wherein the lift wheel assembly of a main lift collector further comprises at least one power transfer wheel ring; the power is transmitted to the lifting wheel ring of the lifting wheel component of the other lifting main collecting piece through the power transmission wheel ring.
6. The apparatus of claim 5, further comprising at least one power transmission wheel disposed between the lift wheel assemblies; the power transmission wheel comprises at least one transmission wheel ring; the power is transmitted to the lifting wheel ring of the lifting wheel assembly by the at least one transmission wheel ring.
7. The apparatus of claim 6, wherein the at least one power transmission wheel is disposed between one of the lift wheel assemblies of one of the lift type main collectors and one of the lift wheel assemblies of the other lift type main collector to transmit the power.
8. The apparatus of claim 6, wherein the at least one power transmission wheel is disposed between the two lifting wheel assemblies of one of the lifting main collectors to transmit the power.
9. The substrate processing apparatus of claim 6, wherein the substrate stage further comprises a stage wall; wherein a power transmission wheel ring is arranged on the periphery of the carrying platform wall.
10. The apparatus of claim 3, further comprising at least one power transmission belt, wherein the lift controller and each of the lift wheel assemblies transmit the power via the at least one power transmission belt.
11. The substrate processing apparatus of claim 10, wherein each power transmission belt communicates the elevation control member and the two elevation wheel assemblies of each elevation type main collector; the power transmission belt transmits the power to the two lifting wheel assemblies, so that the two lifting wheel assemblies drive the treatment liquid collecting ring to lift together.
12. The apparatus of claim 11, further comprising at least one power transmission wheel disposed between the two lift wheel assemblies of one of the lift type main collectors for transmitting the power.
13. The substrate processing apparatus of claim 3, wherein the lift ring is horizontally disposed; when the lifting wheel ring rotates, the lifting wheel assembly drives the lifting shaft connected with the lifting wheel ring to lift.
14. The apparatus of claim 13, wherein the lift wheel assembly of a main lift collector further comprises at least one power transfer wheel ring; the power is transmitted to the lifting wheel ring of the lifting wheel assembly of the other lifting main collecting piece on one horizontal height through the power transmission wheel ring on one horizontal height.
15. The apparatus of claim 14, further comprising at least one power transmission wheel disposed between the lift wheel assemblies; the at least one power transmission wheel comprises at least one rotating transmission wheel ring; the power is transmitted to the lifting wheel ring of the lifting wheel assembly on one of the horizontal levels through the transmission wheel ring on one of the horizontal levels.
16. The apparatus of claim 13, wherein the lift controller comprises a plurality of control rings, each of the control rings being disposed at a different level, wherein the control rings at different levels are respectively configured to drive the lift ring of the lift wheel assembly of each of the lift main collectors to rotate so as to lift the lift main collector connected to the lift ring at different levels.
17. The apparatus of claim 16, wherein the lift control further comprises a power switching member; when the power switching member is communicated with the control wheel ring on any horizontal height, the control wheel ring rotates to transmit the power to the lifting wheel assembly on the horizontal height.
18. The apparatus of claim 13, wherein the lift control further comprises a control wheel ring; the control wheel ring is used for moving to each horizontal height and rotating so as to transmit the power to the lifting wheel assembly on each horizontal height.
19. The apparatus of claim 13, wherein the lifting controller sequentially drives the lifting main collector corresponding to the lifting wheel ring to move up and down by sequentially rotating the lifting wheel rings at different levels while the lifting controller drives the lifting main collector to move up and down.
20. The apparatus of claim 13, wherein the elevation control member simultaneously drives the elevation main collecting member corresponding to the elevation wheel ring to be elevated by simultaneously rotating the elevation wheel rings at different levels when the elevation control member drives the elevation main collecting member to be elevated.
21. The substrate processing apparatus of claim 1, wherein each of the elevating main collectors further comprises a support frame connecting both ends of the processing liquid collecting ring and the at least one elevating wheel assembly; when the lifting control member transmits the power to the at least one lifting wheel assembly, the processing liquid collecting ring is driven to lift by the supporting frame.
22. The substrate processing apparatus of claim 1, further comprising an elevating sub-collector and a second power member; the lifting type auxiliary collecting piece is arranged at the periphery of the substrate carrying platform and is used for collecting the treating liquid for treating the substrate; the second power part is arranged on the base and used for providing power for the lifting type auxiliary collecting part so as to lift the lifting type auxiliary collecting part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662434511P | 2016-12-15 | 2016-12-15 | |
| US62/434,511 | 2016-12-15 |
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| CN108231635A CN108231635A (en) | 2018-06-29 |
| CN108231635B true CN108231635B (en) | 2020-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711305975.5A Active CN108231635B (en) | 2016-12-15 | 2017-12-11 | Substrate processing apparatus |
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| KR (1) | KR102101539B1 (en) |
| CN (1) | CN108231635B (en) |
| TW (3) | TWI656594B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2020077666A (en) | 2018-11-05 | 2020-05-21 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | Substrate processing apparatus, method of manufacturing semiconductor device, program, and recording medium |
| CN111211066B (en) * | 2018-11-22 | 2022-09-02 | 辛耘企业股份有限公司 | Fluid collecting device |
| TWI704093B (en) * | 2019-05-09 | 2020-09-11 | 辛耘企業股份有限公司 | Treatment liquid container |
| KR102620706B1 (en) * | 2020-07-31 | 2024-01-03 | 세메스 주식회사 | Substrate processing apparatus and substrate processing method for supplying and recovering liquid |
| CN114121737A (en) * | 2020-08-28 | 2022-03-01 | 中微半导体设备(上海)股份有限公司 | Wafer box device, machine table and wafer detection method |
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| KR100752246B1 (en) * | 2005-03-31 | 2007-08-29 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate treatment apparatus and substrate treatment method |
| JP2007019369A (en) * | 2005-07-11 | 2007-01-25 | Tokyo Electron Ltd | Substrate treatment apparatus and substrate treatment method |
| JP5312856B2 (en) * | 2008-06-27 | 2013-10-09 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| WO2012046397A1 (en) * | 2010-10-07 | 2012-04-12 | キヤノンアネルバ株式会社 | Substrate processing device |
| KR101570168B1 (en) * | 2014-06-30 | 2015-11-19 | 세메스 주식회사 | Apparatus for treating a substrate |
| KR101841342B1 (en) * | 2015-03-30 | 2018-03-22 | 시바우라 메카트로닉스 가부시끼가이샤 | Spin processor |
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2017
- 2017-12-05 TW TW106142577A patent/TWI656594B/en not_active IP Right Cessation
- 2017-12-11 TW TW106218351U patent/TWM565876U/en unknown
- 2017-12-11 CN CN201711305975.5A patent/CN108231635B/en active Active
- 2017-12-12 TW TW106218442U patent/TWM563654U/en not_active IP Right Cessation
- 2017-12-13 KR KR1020170171446A patent/KR102101539B1/en active IP Right Grant
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| JP2004265910A (en) * | 2003-02-03 | 2004-09-24 | Personal Creation Ltd | Fractional recovery system of liquid for processing substrate, processing system of substrate equipped with that system, and fractional recovery method of liquid for processing substrate |
| KR20110052348A (en) * | 2009-11-12 | 2011-05-18 | 세메스 주식회사 | Apparatus for processing substrate |
| CN203002884U (en) * | 2012-11-20 | 2013-06-19 | 东莞市正太合赢自动化设备有限公司 | Lifting device of edge spinning machine |
| US9377083B2 (en) * | 2013-05-28 | 2016-06-28 | Caleb Chung | Multiple-output transmission |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI656594B (en) | 2019-04-11 |
| KR102101539B1 (en) | 2020-04-17 |
| TWM565876U (en) | 2018-08-21 |
| TW201824444A (en) | 2018-07-01 |
| KR20180069723A (en) | 2018-06-25 |
| TWM563654U (en) | 2018-07-11 |
| CN108231635A (en) | 2018-06-29 |
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