CN108198892A - A kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell - Google Patents
A kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell Download PDFInfo
- Publication number
- CN108198892A CN108198892A CN201711405851.4A CN201711405851A CN108198892A CN 108198892 A CN108198892 A CN 108198892A CN 201711405851 A CN201711405851 A CN 201711405851A CN 108198892 A CN108198892 A CN 108198892A
- Authority
- CN
- China
- Prior art keywords
- preparation
- cigs
- film solar
- solar cell
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052700 potassium Inorganic materials 0.000 title claims abstract description 19
- 239000011591 potassium Substances 0.000 title claims abstract description 19
- 239000010409 thin film Substances 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 15
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
- 238000004544 sputter deposition Methods 0.000 claims description 18
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 238000005477 sputtering target Methods 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 9
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 5
- 230000035484 reaction time Effects 0.000 claims description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 abstract description 6
- 235000003270 potassium fluoride Nutrition 0.000 abstract description 3
- 239000011698 potassium fluoride Substances 0.000 abstract description 3
- 239000011669 selenium Substances 0.000 description 20
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 14
- 239000010408 film Substances 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- 229910052711 selenium Inorganic materials 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 230000009102 absorption Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010549 co-Evaporation Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000007914 intraventricular administration Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
- H01L31/0323—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2 characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
- H01L31/03928—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate including AIBIIICVI compound, e.g. CIS, CIGS deposited on metal or polymer foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Sustainable Energy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The present invention relates to a kind of preparation methods for mixing potassium flexible copper indium gallium selenide thin-film solar cell, belong to field of surface engineering technique.The present invention mainly generates smooth, fine and close, uniform high quality CIGS absorbed layers at a lower temperature using the realization of ion beam selenizing magnetron sputtering one-step method, reduces CIGS absorbed layer preparation temperatures, and simplify CIGS absorbed layer preparation processes;And before CIGS absorbed layers are grown, potassium fluoride initialization layer is first prepared, it realizes and potassium doping is carried out to CIGS absorbed layers, be conducive to improve the electric property of CIGS absorbed layers, the method for the invention realizes the preparation of the flexible CIGS solar battery of high conversion efficiency.
Description
Technical field
The present invention relates to a kind of preparation methods for mixing potassium flexible copper indium gallium selenide thin-film solar cell, belong to Surface Engineering skill
Art field.
Background technology
With the development that space, Near Space Flying Vehicles, unmanned plane and ground military intellectualities are equipped, energy resource supply system
System proposes solar cell many new requirements, such as:Lightweight, efficient and strong capability of resistance to radiation etc..Flexible copper and indium gallium
The photoelectric conversion efficiency of selenium thin-film solar cells Yin Qigao, strong capability of resistance to radiation, the battery performance of stabilization, good dim light are special
Property and low manufacture cost become current photovoltaic art research hot spot, it is considered to be most promising solar cell
One of.
Copper-indium-galliun-selenium film solar cell is generally inhaled by flexible polyimide substrate, back electrode, copper indium gallium selenide (CIGS)
Receive layer, buffer layer, transparent window layer and the several part compositions of top electrode.Wherein, for copper-indium-galliun-selenium film solar cell
Core film layer copper indium gallium selenide (CIGS) absorbed layer preparation there are many technology and method, it is most common to have three stage Co-evaporation
Selenizing method after method and CuInGa alloy firm pre-sputterings.Wherein, polynary three stage Co-evaporation method requirement must in film deposition process
Selenium amount need to be kept sufficient, while base reservoir temperature must be maintained at 400 DEG C~600 DEG C;And selenium after CuInGa alloy firm pre-sputterings
Change method must pass through selenization process, and selenizing temperature is at 550 DEG C or so.When preparing CIGS absorbed layers using above two method, base
Bottom will bear 400 DEG C~600 DEG C of high temperature, to ensure complete selenizing in CIGS absorbed layers, have CIGS absorbed layers
Ingredient and institutional framework, but this temperature be higher than polyimide substrate tolerable temperature, it is therefore necessary to develop new low temperature skill
Art carries out the low temperature depositing of high quality CIGS absorbed layers to realize on polyimide substrate.
Invention content
It is inhaled to reduce the preparation temperature of CIGS thin film solar cell core film layer CIGS absorbed layers and promote CIGS
The electric property of layer is received, the present invention provides a kind of preparation methods for mixing potassium flexible CIGS thin-film solar cells, utilize ion
Beam selenizing magnetron sputtering one-step method realizes the preparation of high quality CIGS absorbed layers on polyimide substrate, reduces CIGS absorbed layers
Preparation temperature, and simplify CIGS absorbed layer preparation processes;And before CIGS absorbed layers are grown, it is preset first to prepare potassium fluoride
Layer is realized and carries out potassium doping to CIGS absorbed layers, promotes the electric property of CIGS absorbed layers.
The purpose of the present invention is what is be achieved through the following technical solutions.
A kind of preparation method for mixing potassium flexible CIGS thin-film solar cells, the method step are as follows:
(1) back electrode is first prepared in substrate, then the substrate after deposition back electrode is placed in pressure no more than 2 × 10-3Pa
Vacuum chamber in, when the temperature of substrate being made to reach the temperature of 200 DEG C~300 DEG C and KaF evaporation sources reach 820 DEG C~850 DEG C,
1min~2min is evaporated, KaF initialization layers are formed on back electrode;
(2) after the substrate after deposition KaF initialization layers being heated to 250 DEG C~350 DEG C, magnetron sputtering is carried out, is utilized simultaneously
The Se ion beams that ion source generates carry out selenylation reaction, magnetron sputtering and selenylation reaction 30min~3h, on KaF initialization layers
Form CIGS middle layers;
Wherein, the distance between ion source and magnetic controlled sputtering target are 5cm~10cm, generate the work of the Se evaporators of Se steams
Make 175 DEG C~190 DEG C of temperature, into the Se steams and argon gas mixed gas in the plasma chamber of ion source, Se steams
Flow is 4sccm~9sccm, and the volume fraction of Se steams is 30%~50%, ion beam voltage 100V~400V, ion beam electricity
Flow 0.25A~1.2A;
When magnetic controlled sputtering target is CuGa alloys targets and In targets, sputtering power 50W~150W, operating air pressure 0.4Pa~
1.5Pa;
When magnetic controlled sputtering target is CuGa alloys targets and CuIn alloys targets, sputtering power 70W~100W, operating air pressure 0.8Pa
~1.5Pa;
When magnetic controlled sputtering target is CuInGa alloys targets, sputtering power 80W~150W, operating air pressure 0.1Pa~2.0Pa;
(3) in the substrate after depositing CIGS middle layers, buffer layer, transparent window layer and top electrode are sequentially depositing, i.e.,
It obtains mixing potassium flexible CIGS thin-film solar cells.
Technical solutions according to the invention are suitable for conventional flexible polymer substrate, are not limited to polyimides.It has reported
Copper-indium-galliun-selenium film solar cell in back electrode, buffer layer, transparent window layer and top electrode component and its phase
The preparation method answered be suitable for it is of the present invention mix potassium flexible CIGS thin-film solar cells, so in skill of the present invention
Component of back electrode, buffer layer, transparent window layer and top electrode and preparation method thereof is no longer done specifically in art scheme
It is bright.
Advantageous effect:
Utilize ion beam selenizing magnetron sputtering one-step method that can generate at a lower temperature in the present invention smooth, fine and close, equal
Even high quality CIGS absorbed layers are lived this is because ion beam selenizing can utilize the energy entrained by Se ions to increase its chemistry
Property, enhance response intensity, while the kinetic energy of Se ions can enhance the absorption, dissociation and diffusion on surface, so as to have
Conducive to CIGS thin film fast deposition at a lower temperature;In addition, before CIGS absorbed layers are grown, it is preset first to prepare potassium fluoride
Layer realizes that potassium doping is carried out to CIGS absorbed layers increases the particle in CIGS absorbed layers, and then promote the electricity of CIGS absorbed layers
Learn performance.The method of the invention reduces the preparation temperature of CIGS absorbed layers in the prior art, and simplifies CIGS absorptions
The preparation process of layer further improves the electrology characteristic of CIGS absorbed layers, it is achieved thereby that the flexible CIGS of high conversion efficiency
The preparation of solar cell.
Specific embodiment
The present invention is further elaborated With reference to embodiment, wherein, the method is equal unless otherwise instructed
For conventional method, the raw material can obtain unless otherwise instructed from open commercial sources.
Embodiment 1
One kind mix potassium flexible CIGS thin-film solar cells by Kapton substrate, Mo back electrodes, KaF initialization layers,
CIGS middle layers, CdS buffer layers, transparent window layer and Al upper electrode layers composition, specific preparation process are as follows:
(1) Kapton that thickness is 50 μm is placed in vacuum chamber, to vacuum chamber to vacuum intraventricular pressure
Strong is 2.0 × 10-4Pa then carries out argon ion bombardment processing with ion source to Kapton, is carried on the back with improving the Mo of deposition
Adhesive force of the electrode on Kapton;Wherein, argon flow amount 15sccm, ion beam discharge voltage be 280V, ion
Beam current is 1A;
(2) by argon ion bombardment treated Kapton is placed in vacuum degree less than 2 × 10-3In the vacuum chamber of Pa,
It is 10cm to adjust the distance between magnetic controlled sputtering target and Kapton, is first sputtered later in 1.6Pa sputtering pressures and 50W
Power dip accumulates the Mo films of 0.2 μm of a layer thickness, then deposits a thickness under 0.3Pa sputtering pressures and 70W sputtering powers
0.8 μm of Mo films of degree, wherein, Kapton temperature is room temperature during magnetron sputtering, and working gas is 4N high-purity argon gas,
The double-deck Mo films formed on Kapton are Mo back electrodes, resistivity 10-5Ω·cm;
(3) temperature that the Kapton after deposition Mo back electrodes is heated to 280 DEG C and KaF evaporation sources reaches
At 850 DEG C, 1min is evaporated, KaF initialization layers are formed on Mo back electrodes;
(4) by deposit KaF initialization layers after Kapton be heated to 350 DEG C after, 90W sputtering power and
Sputter CuGa alloys targets and CuIn alloys targets under the operating air pressure of 0.75Pa, the argon gas that purity is 4N is passed through magnetic control and splashed by when sputtering
It shoots at the target surface, while the plasma selenium Shu Jinhang selenylation reactions generated with ion source, magnetron sputtering and ion beam selenylation reaction
Time is 60min, and CIGS middle layers are formed on KaF initialization layers;
Wherein, the distance between ion source and magnetic controlled sputtering target are 10cm, generate the work temperature of the Se evaporators of Se steams
It is 180 DEG C to spend, and into the Se steams and argon gas mixed gas in the plasma chamber of ion source, the flow of Se steams is
The volume fraction of 6sccm, Se steam is 40%, ion beam voltage 300V, ion beam current 0.85A;
(5) first by 1mL mass fractions be 25% NH4OH is diluted with 100mL water, then the ammonium hydroxide measured after 35mL dilutions is molten
Liquid, and with 0.0806g CdCl2、0.304g NH2CSNH2With 0.32g NH4Tri- kinds of powder of Cl uniformly mix, and water is added to be configured to
200mL mixed solutions;Kapton after deposition CIGS middle layers is put into prepared mixed solution, then be placed in 75
DEG C constant temperature water bath in react 13min, take out Kapton, CdS buffer layers formed in CIGS middle layers;
(6) transparent window is deposited on the Kapton of magnetic control deposition CdS buffer layers using radio-frequency magnetron sputter method
Layer;Wherein, intrinsic ZnO uses ZnO ceramic targets, sputtering power 30W, sputtering pressure 1.0Pa, sedimentation time 7min;ZAO
Target is used as Al2O3The ZAO targets that the purity of doping 2.5at% is 4N, sputtering power 100W, sputtering pressure 0.8Pa,
Sedimentation time is 60min;
(7) using radio-frequency magnetron sputter method deposition transparent window layer Kapton on depositing Al top electrode, i.e.,
The preparation of potassium flexible CIGS thin-film solar cells is mixed described in completion;Wherein, in the deposition process of Al top electrodes, sputtering power is
300W, operating air pressure 0.5Pa, sedimentation time 30min.
In conclusion the foregoing is merely a prefered embodiment of the invention, it is not intended to limit the scope of the present invention.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in the present invention's
Within protection domain.
Claims (5)
1. a kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell, it is characterised in that:The method step is such as
Under:
(1) back electrode is first prepared in substrate, then the substrate after deposition back electrode is placed in pressure no more than 2 × 10-3Pa's is true
It in empty room, is evaporated by evaporation source of KaF, KaF initialization layers is formed on back electrode;
(2) using CuGa alloys targets and In targets as magnetic controlled sputtering target, using CuGa alloys targets and CuIn alloys targets as magnetic controlled sputtering target or
Person carries out magnetron sputtering using CuInGa alloys targets as magnetic controlled sputtering target in the substrate after depositing KaF initialization layers, at the same using from
The Se ion beams that component generates carry out selenylation reaction, and CIGS middle layers are formed on KaF initialization layers;
(3) in the substrate after depositing CIGS middle layers, be sequentially depositing buffer layer, transparent window layer and top electrode to get to
Mix potassium flexible CIGS thin-film solar cells.
2. a kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell according to claim 1, feature
It is:In KaF initialization layer preparation process, the temperature of substrate is 200 DEG C~300 DEG C, and the temperature of KaF evaporation sources is 820 DEG C~850
DEG C, evaporation time is 1min~2min.
3. a kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell according to claim 1, feature
It is:When preparing CIGS middle layers, base reservoir temperature is 250 DEG C~350 DEG C, and magnetron sputtering and selenylation reaction time are 30min
~3h;
The magnetic controlled sputtering target be CuGa alloys targets and In targets when, sputtering power be 50W~150W, operating air pressure for 0.4Pa~
1.5Pa;
When the magnetic controlled sputtering target is CuGa alloys targets and CuIn alloys targets, sputtering power is 70W~100W, and operating air pressure is
0.8Pa~1.5Pa;
The magnetic controlled sputtering target be CuInGa alloys targets when, sputtering power be 80W~150W, operating air pressure for 0.1Pa~
2.0Pa;
The distance between ion source and magnetic controlled sputtering target are 5cm~10cm, into the Se steams in the plasma chamber of ion source
Flow for 4sccm~9sccm, ion beam voltage is 100V~400V, and ion beam current is 0.25A~1.2A.
4. a kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell according to claim 3, feature
It is:Mixed gas into the gas in the plasma chamber of ion source for Se steams and argon gas, wherein, the volume of Se steams
Score is 30%~50%.
5. a kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell according to claim 3, feature
It is:The Se steams are generated by the Se evaporators that operating temperature is 175 DEG C~190 DEG C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711405851.4A CN108198892A (en) | 2017-12-22 | 2017-12-22 | A kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711405851.4A CN108198892A (en) | 2017-12-22 | 2017-12-22 | A kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108198892A true CN108198892A (en) | 2018-06-22 |
Family
ID=62583310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711405851.4A Pending CN108198892A (en) | 2017-12-22 | 2017-12-22 | A kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108198892A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108123001A (en) * | 2017-12-25 | 2018-06-05 | 北京铂阳顶荣光伏科技有限公司 | The preparation method of copper indium gallium selenium solar cell absorbed layer |
CN111129206A (en) * | 2018-10-31 | 2020-05-08 | 北京铂阳顶荣光伏科技有限公司 | Preparation method of CIGS thin film solar cell |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050028861A1 (en) * | 2002-02-14 | 2005-02-10 | Honda Giken Kogyo Kabushiki Kaisha | Light absorbing layer producing method |
CN104425648A (en) * | 2013-09-03 | 2015-03-18 | 中国电子科技集团公司第十八研究所 | Preparation method of flexible solar battery doped with sodium before formation of one-step-method absorption layer |
CN104538492A (en) * | 2014-12-11 | 2015-04-22 | 兰州空间技术物理研究所 | Copper indium gallium selenium thin film solar cell absorption layer thin film preparation method |
CN104600153A (en) * | 2014-12-11 | 2015-05-06 | 兰州空间技术物理研究所 | CIGS (Copper Indium Gallium Selenium) solar cell absorption layer production method |
CN105632903A (en) * | 2016-01-12 | 2016-06-01 | 苏州瑞晟纳米科技有限公司 | Sodium-potassium co-doping technology for preparing high-efficiency copper indium gallium selenide solar cell |
CN106783667A (en) * | 2017-02-23 | 2017-05-31 | 浙江尚越新能源开发有限公司 | Ensure the production system and its manufacture method of uniformity and the alkali doped of stability in flexible copper indium gallium selenide thin-film solar cell |
-
2017
- 2017-12-22 CN CN201711405851.4A patent/CN108198892A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050028861A1 (en) * | 2002-02-14 | 2005-02-10 | Honda Giken Kogyo Kabushiki Kaisha | Light absorbing layer producing method |
CN104425648A (en) * | 2013-09-03 | 2015-03-18 | 中国电子科技集团公司第十八研究所 | Preparation method of flexible solar battery doped with sodium before formation of one-step-method absorption layer |
CN104538492A (en) * | 2014-12-11 | 2015-04-22 | 兰州空间技术物理研究所 | Copper indium gallium selenium thin film solar cell absorption layer thin film preparation method |
CN104600153A (en) * | 2014-12-11 | 2015-05-06 | 兰州空间技术物理研究所 | CIGS (Copper Indium Gallium Selenium) solar cell absorption layer production method |
CN105632903A (en) * | 2016-01-12 | 2016-06-01 | 苏州瑞晟纳米科技有限公司 | Sodium-potassium co-doping technology for preparing high-efficiency copper indium gallium selenide solar cell |
CN106783667A (en) * | 2017-02-23 | 2017-05-31 | 浙江尚越新能源开发有限公司 | Ensure the production system and its manufacture method of uniformity and the alkali doped of stability in flexible copper indium gallium selenide thin-film solar cell |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108123001A (en) * | 2017-12-25 | 2018-06-05 | 北京铂阳顶荣光伏科技有限公司 | The preparation method of copper indium gallium selenium solar cell absorbed layer |
CN111129206A (en) * | 2018-10-31 | 2020-05-08 | 北京铂阳顶荣光伏科技有限公司 | Preparation method of CIGS thin film solar cell |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100413097C (en) | Process for preparing Cu-In-Ga-Se or Cu-In-Ga-S film solar battery obsorbing layer | |
US8956906B2 (en) | Method and device for producing a semiconductor layer | |
CN102347398B (en) | The sodium sputtering doping method of extensive CIGS base film photovoltaic material | |
TWI583811B (en) | A Cu-Ga sputtering target, a method for manufacturing the target, a light absorbing layer, and a solar cell using the light absorbing layer | |
CN101814553B (en) | Light-assistant method for preparing light absorption layer of copper-indium-gallium-selenium film solar cell | |
CN103165748B (en) | A kind of method preparing copper-zinc-tin-sulfur solar battery obsorbing layer thin film | |
WO2011107035A1 (en) | Method for preparing copper-indium-gallium-selenium film for solar cell photo-absorption layer by magnetron sputtering process | |
CN106917068A (en) | Solar battery obsorbing layer Sb is prepared based on magnetron sputtering and rear selenizing2Se3The method of film | |
CN105039909B (en) | A kind of photovoltaic material and preparation method thereof | |
CN102154622A (en) | Method for preparing copper-indium-gallium-selenium thin film serving as light absorbing layer of solar cell | |
CN108198892A (en) | A kind of preparation method for mixing potassium flexible copper indium gallium selenide thin-film solar cell | |
WO2013185506A1 (en) | Method for preparing copper indium gallium diselenide thin-film solar cell | |
CN103451599B (en) | A kind of have photo-thermal and work in coordination with the cadmium telluride of sending a telegraph/Tellurobismuthite integration nano structural material and method for making thereof | |
CN103474511A (en) | Preparation method of copper indium gallium selenide light absorption layer and copper indium gallium selenide film solar cell | |
CN102751387B (en) | Preparation method of Cu (In, ga) Se2thin film for absorption layer of thin film solar cell | |
CN105118877B (en) | A kind of preparation method of copper indium gallium sulphur selenium film material | |
CN106340554A (en) | CIGS/CdTe dual-junction laminated thin-film solar cell and preparation method thereof | |
CN110416367A (en) | A method of large-area uniformity CIGS thin film solar battery is prepared using In-Ga alloy evaporation source | |
CN104600153A (en) | CIGS (Copper Indium Gallium Selenium) solar cell absorption layer production method | |
CN102751381A (en) | Preparation method for copper indium selenium base film solar cell molybdenum electrode | |
CN106449812A (en) | Method sputtering tin target and copper sulfide target to prepare copper-tin-sulfur film and battery | |
CN106449810B (en) | A kind of CdTe/CIGS Gradient Absorptions layer film solar cell and preparation method thereof | |
CN105206707B (en) | A kind of preparation method of copper indium gallium selenium solar cell light absorbing zone thin film | |
CN105932093B (en) | A kind of preparation method of high quality CIGS thin film solar battery obsorbing layer | |
CN105810764B (en) | A kind of preparation method of copper-indium-galliun-selenium film solar cell photoelectric absorption conversion layer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180622 |
|
WD01 | Invention patent application deemed withdrawn after publication |